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1. 发明专利

JP2006212740A Polishing device 有权
标题翻译：抛光装置
公开(公告)号：JP2006212740A
公开(公告)日：2006-08-17
申请号：JP2005028506
申请日：2005-02-04
申请人： Fujikoshi Mach Corp , 不二越機械工業株式会社
发明人： MIYASHITA CHUICHI , KOYAMA HARUMICHI , NAKAMURA MITSUHIRO
IPC分类号： B24B37/08 , H01L21/304
CPC分类号： B24B37/08 , F16H57/10 , Y10T74/19981
摘要： PROBLEM TO BE SOLVED: To provide a polishing device enabling easy replacement of a collar. SOLUTION: The polishing device polishes a workpiece by an upper surface table and a lower surface table by engaging external teeth of a carrier for holding the workpiece, with internal teeth of an outer pin gear and external teeth of an inner pin gear respectively to rotate and revolve the carrier. At least one of the internal teeth of the outer pin gear and the external teeth of the inner pin gear is formed of a plurality of tooth parts 20, 30 provided at circumferentially constant spaces at the pin rings 11b, 12b and having pin bodies 22 fixed to the pin rings 11b, 12b and projected upward, and collars 23 formed in bottomed cylinder shape opened downward, provided with fitting parts 25 between themselves and the pin bodies 22 and rotatably fitted to the outer peripheries of the pin bodies 22. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供能够容易地更换套环的抛光装置。解决方案：抛光装置通过接合用于保持工件的载体的外齿与外销齿轮的内齿和内销齿轮的外齿接合而通过上表台和下表台对工件进行抛光旋转和旋转载体。外销齿轮的内齿和内销齿轮的外齿中的至少一个由设置在销环11b，12b的周向恒定空间处的多个齿部20,30形成，并且销体22固定与销环11b，12b并向上突出，并且形成为有底圆筒形状的套环23向下敞开，在它们与销体22之间设置有可旋转地装配到销主体22的外周的配合部分25。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2007069279A Method and tool for adhering polishing pad 有权
标题翻译：用于加工抛光垫的方法和工具
公开(公告)号：JP2007069279A
公开(公告)日：2007-03-22
申请号：JP2005256511
申请日：2005-09-05
申请人： Fujikoshi Mach Corp , 不二越機械工業株式会社
发明人： NAKAMURA YOSHIO , KOYAMA HARUMICHI
IPC分类号： B24B37/08 , B24B37/20 , H01L21/304
CPC分类号： B24D9/085 , B24B37/08
摘要： PROBLEM TO BE SOLVED: To easily and precisely perform the work of adhering a polishing pad on an upper surface plate of a both-side polishing device. SOLUTION: The polishing pad 10 is temporarily adhered to each polishing surface of the upper surface plate 30 and a lower surface plate 20 of the both-side polishing device. A roller device 200 having a roller body 230 rotatably provided at a shaft 220 mounted to a sun gear 80 and an internal tooth gear 70 and formed with a spiral projecting part 232 of a required width on an outside surface is mounted, and is mounted on the lower surface plate 20 in the radial direction. The upper surface plate 30 is lowered up to a position where the upper surface plate 30 is abutted on the roller body 230 by a supporting device 60. The upper and lower surface plates 30 and 20 are rotated at equal speed in mutual opposite directions, while pressurizing the roller body 230 by the upper surface plate 30, and polishing pad 10 is simultaneously adhered to the upper and lower surface plates 30 and 20. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了容易且精确地执行将抛光垫粘附在双面抛光装置的上表面板上的工作。解决方案：抛光垫10临时粘附到上表面板30的每个抛光表面和两面抛光装置的下表面板20。具有可旋转地设置在安装在太阳齿轮80上的轴220和内齿齿轮70上并且形成有外表面上所需宽度的螺旋突出部232的辊体230的滚筒装置200安装在下表面板20沿径向方向。上表面板30被降低到上表面板30通过支撑装置60抵靠在辊主体230上的位置。上表面板30和下表面板20以相等的相反方向旋转，同时通过上表面板30对辊主体230加压，并且抛光垫10同时粘附到上表面板30和下表面板20上。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2014000647A Work polishing device 有权
标题翻译：工作抛光装置
公开(公告)号：JP2014000647A
公开(公告)日：2014-01-09
申请号：JP2012138375
申请日：2012-06-20
申请人： Fujikoshi Mach Corp , 不二越機械工業株式会社
发明人： MOROZUMI YOICHI , KOYAMA HARUMICHI , KASUO MANABU , WADA MASAKI
IPC分类号： B24B37/30 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a work polishing device capable of miniaturizing and simplifying the device.SOLUTION: The work polishing device 10 includes: a surface plate 14 having a top surface attached with an abrasive cloth and rotating within a horizontal plane; and a top ring 16 disposed above the surface plate 14 so as to be movable vertically and rotatable within the horizontal plane and holding a carrier plate 52 in which a workpiece is held in the undersurface, between the top ring 16 and the surface plate 14 to press the workpiece on the surface of the surface plate 14. In the work polishing device 10, the top ring 16 is provided with a stopper 50 for catching and retaining the carrier plate 52 that is placed on the surface plate 14, moves with the rotation of the surface plate 14 and enters a lower surface side of the top ring 16, in a polishing position.
摘要翻译：要解决的问题：提供能够使装置小型化和简化的工件抛光装置。解决方案：抛光装置10包括：表面板14，其具有附接有研磨布并在水平面内旋转的顶表面; 以及设置在表面板14上方的顶环16，以便在水平面内可垂直移动并且可旋转，并且在顶环16和表面板14之间保持工件保持在下表面中的承载板52，在工作抛光装置10中，顶环16设置有用于捕获并保持放置在表面板14上的承载板52的止动件50，随着旋转并在抛光位置进入顶环16的下表面侧。

4. 发明专利

JP2007105854A Method for adhering grinding pad, and fixture for adhering grinding pad 有权
标题翻译：用于加工研磨垫的方法和用于加工研磨垫的装置
公开(公告)号：JP2007105854A
公开(公告)日：2007-04-26
申请号：JP2005301330
申请日：2005-10-17
申请人： Fujikoshi Mach Corp , 不二越機械工業株式会社
发明人： NAKAMURA YOSHIO , KOYAMA HARUMICHI
IPC分类号： B24B37/08 , B24B37/12 , B24B37/20 , H01L21/304
CPC分类号： B24B7/17 , B24B37/08 , B24D9/085
摘要： PROBLEM TO BE SOLVED: To facilitate an operation for adhering a grinding pad to upper and lower surface plates. SOLUTION: This method for adhering a grinding pad in a double-sided grinding device comprises a step for setting a carrier dedicated for adhering a pad fixed while a roller device 48 for pressurizing the grinding pad is positioned in a through hole in a manner that the roller device 48 is directed to a radial direction of upper and lower surface plates 14, 16, a step for making the upper and lower surface plates 14 and 16 relatively approach to each other and nipping the roller device 48 by the upper and lower surface plates 14, 16 with a predetermined pressuring force, and a step for rotating the upper and lower surface plates 14, 16 in opposite directions at identical speed, and pressing and adhering the grinding pad to grinding faces of the upper and lower surface plates 14, 16 by the roller device 48. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了便于将研磨垫粘附到上表面板和下表面板上的操作。解决方案：用于将研磨垫粘合在双面研磨装置中的方法包括：将用于加压研磨垫的辊装置48定位在通孔中的专用于固定的垫的固定用托架的步骤辊装置48指向上表面板14和下表面板16的径向的方式，使上表面板14和下表面板16相互靠近并将辊装置48夹在上面和下表面板14和16的步骤下表面板14,16具有预定的加压力，以及用于以相同的速度沿相反方向旋转上表面板14和下表面板16的步骤，并将研磨垫按压并粘附到上表面板和下表面板的研磨面 14，16由辊装置48.版权所有（C）2007，JPO＆INPIT

5. 发明专利

JP2012000741A Method and apparatus for dressing polishing pad 有权
标题翻译：用于抛光抛光垫的方法和装置
公开(公告)号：JP2012000741A
公开(公告)日：2012-01-05
申请号：JP2010140995
申请日：2010-06-21
申请人： Fujikoshi Mach Corp , 不二越機械工業株式会社
发明人： KOYAMA HARUMICHI
IPC分类号： B24B53/007 , B24B37/00 , B24B53/017 , B24B53/02 , B24B53/095
CPC分类号： B24B37/08 , B24B53/017
摘要： PROBLEM TO BE SOLVED: To provide a method for dressing a polishing pad that can attain nearly constant polishing rate for each of batches, perform polishing work accurately, reduce the number of times of performing dressing operations using a correction grind stone, improve work efficiency, and extend a service life of a polishing pad.SOLUTION: The method for dressing a polishing pad, which is used to polish the surface of a work by pressing the work onto the polishing pad fixed on turning surface plates 14 and 15 with supplying a polishing liquid thereto and adjust the surface condition thereof by using a grind stone, includes a step of dressing the polishing pad by following and moving a dressing grind stone 26 along the uneven surface of the polishing pad in the radial direction of the polishing pad while supplying high-pressure cleaning water to the polishing pad and cleaning the polishing pad after the polishing of the work.
摘要翻译：要解决的问题：为了提供一种用于修整每个批次可以获得几乎恒定的抛光速率的抛光垫的方法，精确地进行抛光加工，减少使用校正磨石进行修整操作的次数，改进工作效率，延长抛光垫的使用寿命。解决方案：一种用于修整抛光垫的方法，其用于通过将工件压在固定在转动表面板14和15上的抛光垫上并通过向其提供抛光液体来调节表面状态来抛光工件的表面通过使用磨石，包括通过沿抛光垫的径向沿研磨垫的不平坦表面沿着抛光修整研磨石26并且向抛光垫提供高压清洁水来移动抛光垫的步骤，抛光后抛光垫并清理抛光垫。版权所有（C）2012，JPO＆INPIT

6. 发明专利

JP2008055577A Double sided polishing machine 有权
标题翻译：双面抛光机
公开(公告)号：JP2008055577A
公开(公告)日：2008-03-13
申请号：JP2006237830
申请日：2006-09-01
申请人： Fujikoshi Mach Corp , 不二越機械工業株式会社
发明人： KANDA TOMOKI , KOYAMA HARUMICHI , TAKEUCHI MASAHIRO , MOROZUMI YOICHI
IPC分类号： B24B57/02 , B24B37/00
CPC分类号： B24B37/015 , B24B37/08 , B24B57/02
摘要： PROBLEM TO BE SOLVED: To provide a double sided polishing machine capable of controlling an amount of supplying slurry to a lower platen with a simple mechanism.
SOLUTION: The double sided polishing machine comprises the lower platen 32, an upper platen 36, a carrier 44 which is disposed between the lower platen 32 and the upper platen 36, and has a through-hole for holding a workpiece, a driving unit 40 for driving to rotate the upper and lower platens 32, 36, carrier driving units 46, 48 for driving to rotate the carrier 44, a slurry supply source 64, ring-shaped ducts 54, 56 where the slurry is supplied from the slurry supply source 64, and supply pipe 78 for making the slurry flow down on the polishing face of the lower platen 32. The plurality of ring-shaped gutters 54, 56 are coaxially disposed on the upper platen 32. The slurry is supplied to each polishing zones corresponding to the coaxial polishing zone of the lower platen 32 from each ring-shaped gutters of the plurality of coaxial ring-shaped gutters 54, 56 via the supply pipe 78.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够以简单的机构将供给浆料供给到下压盘的量的双面抛光机。
解决方案：双面抛光机包括下压板32，上压板36，设置在下压板32和上压板36之间的托架44，并具有用于保持工件的通孔，驱动单元40，用于驱动旋转上下台板32,36，用于驱动以使托架44旋转的托架驱动单元46,48，浆料供应源64，环形管道54,56，其中浆液从浆料供应源64和用于使浆料在下压板32的抛光面上向下流动的供应管78.多个环形槽54,56同轴地设置在上压板32上。浆料被供应到每个通过供应管78，从多个同轴环形槽45,56的每个环形槽沟对应于下压板32的同轴抛光区的抛光区。（C）2008，JPO＆INPIT

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