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1. 发明专利

JP2010010213A Method of manufacturing polishing head and polishing device 有权
标题翻译：制造抛光头和抛光装置的方法
公开(公告)号：JP2010010213A
公开(公告)日：2010-01-14
申请号：JP2008164723
申请日：2008-06-24
申请人： Fujikoshi Mach Corp , Shin Etsu Handotai Co Ltd , 不二越機械工業株式会社 , 信越半導体株式会社
发明人： MASUMURA HISASHI , HASHIMOTO HIROMASA , MORITA KOJI , KISHIDA NORIZANE , ARAKAWA SATORU
IPC分类号： H01L21/304 , B24B37/04 , B24B37/30
CPC分类号： B24B37/32 , B24B37/042 , B24B37/24
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a polishing head, which can stably obtain fixed flatness, and to provide a polishing device. SOLUTION: The polishing head includes at least an annular rigid ring, a rubber film bonded to the rigid ring with uniform tension, an inner plate which is connected to the rigid ring and forms a space part together with the rubber film and the rigid ring, and a pressure adjusting mechanism for changing the pressure of the space part. The polishing head holds the back surface of a workpiece at the lower surface part of the rubber film, brings the surface of the workpiece into slidable contact with a polishing cloth stuck on a table and polishes it. The method of manufacturing the polishing head includes at least a step of executing a tension test based on the JIS K6251 of the rubber film before bonding the rubber film to the rigid ring and selecting the one whose value of inclination obtained by linearly approximating a stress-distortion curve for which distortion is within 5% is ≤10 MPa, wherein the selected rubber film whose value of the inclination is ≤10 MPa is used and bonded to the rigid ring to manufacture the polishing head. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够稳定地获得固定平坦度的抛光头的制造方法和提供抛光装置。解决方案：抛光头至少包括环形刚性环，具有均匀张力的刚性环结合的橡胶膜，与刚性环连接并与橡胶膜一起形成空间部分的内板，刚性环和用于改变空间部分的压力的压力调节机构。抛光头在橡胶膜的下表面部分保持工件的后表面，使工件的表面与粘在桌子上的抛光布滑动接触并进行抛光。制造抛光头的方法至少包括在将橡胶膜粘合到刚性环之前基于橡胶膜的JIS K6251执行张力试验的步骤，并且选择通过线性近似应力 - 变形率在5％以内的变形曲线为≤10MPa，其中使用倾斜值为≤10MPa的选定橡胶膜并将其结合到刚性环以制造抛光头。版权所有（C）2010，JPO＆INPIT

2. 发明专利

JP2008110407A Polishing head and polishing device 有权
标题翻译：抛光头和抛光装置
公开(公告)号：JP2008110407A
公开(公告)日：2008-05-15
申请号：JP2006293206
申请日：2006-10-27
申请人： Fujikoshi Mach Corp , Shin Etsu Handotai Co Ltd , 不二越機械工業株式会社 , 信越半導体株式会社
发明人： MASUMURA HISASHI , KITAGAWA KOJI , MORITA KOJI , KISHIDA NORIZANE , ARAKAWA SATORU
IPC分类号： B24B37/005 , B24B37/04 , B24B37/30 , H01L21/304
CPC分类号： B24B37/30
摘要： PROBLEM TO BE SOLVED: To provide a polishing head etc. capable of producing a constant flatness stably. SOLUTION: The polishing head is equipped with a ring-shaped rigid ring, a rubber film bonded to the rigid ring with a uniform tension, a middle plate coupled with the rigid ring and forming a space together with the rubber film and the rigid ring, and a ring-shaped template installed at the periphery of the rubber film undersurface concentrically with the rigid ring and formed with an outside diameter greater than the inside diameter of the rigid ring, wherein the arrangement incorporated is such that the pressure in the space is changeable by a pressure adjusting mechanism and that polishing is performed with the reverse surface of a work held on the undersurface of the rubber film while the obverse surface of the work put in slide contact with a polishing cloth affixed onto a surface plate, characterized by that the inside diameter of the template is smaller than that of the rigid ring and the ratio of the inside diameter difference between the rigid ring and the template to the difference between the template inside diameter and outside diameter is between 26-45%, including the limits. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供能够稳定地产生恒定平坦度的抛光头等。
解决方案：抛光头配有环形刚性环，橡胶膜以均匀的张力粘合到刚性环上，中间板与刚性环结合并与橡胶膜一起形成空间，刚性环和环形模板，其安装在橡胶膜下表面的周边处，与刚性环同心地形成，其外径大于刚性环的内径，其中结合的装置使得空间可以通过压力调节机构改变，并且在保持在橡胶膜的下表面上的工件的反面进行抛光，同时工件的正面与固定在表面板上的抛光布滑动接触，其特征在于由于模板的内径小于刚性环的内径，刚性环与模板之间的内径差与d的比值模板内径和外径之间的差异在26-45％之间，包括极限。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2008093811A Polishing head and polishing device 审中-公开
标题翻译：抛光头和抛光装置
公开(公告)号：JP2008093811A
公开(公告)日：2008-04-24
申请号：JP2006280991
申请日：2006-10-16
申请人： Fujikoshi Mach Corp , Shin Etsu Handotai Co Ltd , 不二越機械工業株式会社 , 信越半導体株式会社
发明人： MASUMURA HISASHI , KITAGAWA KOJI , MORITA KOJI , KISHIDA NORIZANE , ARAKAWA SATORU
IPC分类号： B24B37/04 , B24B37/30 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a polishing head furnished with a backing pad and a template from which the template is hardly peeled off in polishing a workpiece, etc. SOLUTION: This polishing head has a carrier 15 of at least a disc type and to hold a back surface of the workpiece W, the backing pad 12 stuck to a lower surface part of the carrier and to hold the workpiece on a workpiece holding surface of the carrier and the ring type template 13 arranged on a peripheral part of the lower surface part of the carrier and to surround the edge part of the workpiece and polishes the workpiece by holding the workpiece on the workpiece holding surface of the carrier and sliding a surface of the workpiece on the abrasive cloth stuck to a surface plate. The template is arranged adjacent to the packing pad and is stuck the lower surface part of the carrier not through the packing pad. The polishing device is furnished with this polishing head. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有背衬垫和模板的抛光头，在抛光工件等时模板几乎不从其中剥离。解决方案：该抛光头具有载体15，其处于至少一种盘型并且保持工件W的后表面，背衬垫12粘附到载体的下表面部分并将工件保持在载体的工件保持表面上，并将环形模板13保持在一个并且围绕工件的边缘部分的周边部分并且围绕工件的边缘部分并且通过将工件保持在载体的工件保持表面上来抛光工件，并将工件的表面滑动到粘附在表面上的研磨布上盘子。模板靠近包装垫布置，并且将载体的下表面部分卡住而不是穿过包装垫。抛光装置配有该抛光头。版权所有（C）2008，JPO＆INPIT

4. 发明专利

JP2008103568A Polishing head, polishing device, and workpiece removal method 有权
标题翻译：抛光头，抛光装置和工件拆卸方法
公开(公告)号：JP2008103568A
公开(公告)日：2008-05-01
申请号：JP2006285372
申请日：2006-10-19
申请人： Fujikoshi Mach Corp , Shin Etsu Handotai Co Ltd , 不二越機械工業株式会社 , 信越半導体株式会社
发明人： MASUMURA HISASHI , KITAGAWA KOJI , MORITA KOJI , KISHIDA NORIZANE , ARAKAWA SATORU
IPC分类号： H01L21/304 , B24B37/04 , B24B37/30
摘要： PROBLEM TO BE SOLVED: To provide a polishing head or the like that allows a workpiece to be easily, safely, and surely removed from a polishing cloth by elevating the polishing head holding the workpiece without forming a groove in the polishing cloth or without overhanging the polishing head from a surface plate. SOLUTION: The polishing head 11 has a disk-like carrier 13 having an annular protruding part 13a and a carrier latching part 13b respectively formed at its peripheral edge part, a disk-like head body 12 having an annular head-body latching part 12a formed to its outside, a diaphragm 14 coupling the head body and the carrier with each other, and a spacer 15 formed at the carrier latching part and/or at a part of the head-body latching part while being located between the carrier latching part and the head-body latching part. When the head body is elevated, the carrier latching part and/or the head-body latching part are/is brought into contact with the spacer so as to remove the workpiece W from the polishing cloth while inclinedly lifting the carrier. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种通过升高保持工件的抛光头而不在抛光布中形成凹槽来允许工件容易地，安全地并且可靠地从抛光布移除的抛光头等，或者而不会使抛光头从表面板悬垂。解决方案：抛光头11具有圆盘状载体13，其具有分别形成在其周边部分处的环形突出部分13a和载体闩锁部分13b，盘状头部主体12具有环形头部本体闩锁形成在其外部的部分12a，将头部主体和托架彼此联接的隔膜14，以及形成在托架闩锁部分和/或头部本体闩锁部分的一部分的间隔件15，同时位于托架闩锁部分和头体锁定部分。当头体升高时，托架闩锁部分和/或头部本体闩锁部分与间隔件接触，以便在倾斜地提升托架的同时从抛光布上移除工件W. 版权所有（C）2008，JPO＆INPIT

5. 发明专利

JP2008093810A Retainer ring, polishing head and polishing device 审中-公开
标题翻译：保持环，抛光头和抛光装置
公开(公告)号：JP2008093810A
公开(公告)日：2008-04-24
申请号：JP2006280990
申请日：2006-10-16
申请人： Fujikoshi Mach Corp , Shin Etsu Handotai Co Ltd , 不二越機械工業株式会社 , 信越半導体株式会社
发明人： MASUMURA HISASHI , MORITA KOJI , ARAKAWA SATORU , NAKAMURA YOSHIO
IPC分类号： B24B37/04 , B24B37/30 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a retainer ring to hold an edge part of a workpiece and to pressurize an abrasive cloth in a circumference of the workpiece and capable of polishing the workpiece by maintaining surface flatness high at low cost, etc. SOLUTION: This retainer ring arranged in the circumference of a region to hold the workpiece of a polishing head to polish the workpiece by sliding a surface of the workpiece on the abrasive cloth adhered on a surface -plate by holding a back surface of the workpiece and to hold the edge part of the workpiece and to pressurize the abrasive cloth is constituted of a tenacious resin made resin ring arranged to surround the edge part of the workpiece and a ceramic ring arranged outside of the resin ring, one of the resin ring and the ceramic ring has a recessed part and the other has a protruded part, and the retainer ring is fixed as the recessed part and the protruded part are fitted on each other. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种保持环，用于保持工件的边缘部分并且对工件的圆周上的研磨布加压并且能够以低成本等保持高的表面平坦度来抛光工件。解决方案：该保持环布置在区域的圆周中，以保持抛光头的工件，以通过将粘附在表面板上的研磨布上的工件的表面滑动到工件的表面上，从而保持工件的后表面工件并保持工件的边缘部分并对研磨布加压，由设置成围绕工件的边缘部分的坚固的树脂树脂环和布置在树脂环外侧的陶瓷环构成，树脂之一环和陶瓷环具有凹部，另一方具有突出部，并且保持环固定为凹部，突出部彼此嵌合。版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2011167819A Polishing head and polishing device 有权
标题翻译：抛光头和抛光装置
公开(公告)号：JP2011167819A
公开(公告)日：2011-09-01
申请号：JP2010035255
申请日：2010-02-19
申请人： Fujikoshi Mach Corp , Shin Etsu Handotai Co Ltd , 不二越機械工業株式会社 , 信越半導体株式会社
发明人： HASHIMOTO HIROMASA , MORITA KOJI , ARAYA TAKASHI , KISHIDA NORIZANE , ARAKAWA SATORU
IPC分类号： B24B37/30 , H01L21/304
CPC分类号： B24B37/30 , B24B37/32 , H01L21/02024
摘要： PROBLEM TO BE SOLVED: To provide a polishing head and a polishing device which can provide a stable and constant high flatness, a high polishing uniformity and a work having few micro particles of 45 nm or larger and can be used in a rough polishing process and a finish polishing process in polishing the work. SOLUTION: The polishing head includes at least a rubber film held by a disk shaped intermediate plate and an annular guide ring provided on a periphery of the rubber film in a lower part of a polishing head body. A back surface of the work is held on a lower surface part of the rubber film and a front surface of the work is allowed to come into sliding contact with a polishing cloth stuck on a stool to polish the work. In the polishing head, a base member is provided which is connected to the polishing head body through an elastic film by preventing a lower surface of the guide ring from coming into contact with the polishing cloth during a polishing operation to hold the guide ring and the intermediate plate. The base member is restrained from being displaced in an axial direction due to a contact of part of its upper surface with the polishing head body and can be displaced in a radial direction by the elastic film during the polishing operation. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种可以提供稳定且恒定的高平坦度，高抛光均匀性的抛光头和抛光装置，以及具有45nm或更小的微小颗粒的工件，并且可以用于粗糙度抛光工艺和精加工抛光工艺。解决方案：抛光头至少包括由盘形中间板保持的橡胶膜和在抛光头本体的下部设置在橡胶膜的周边上的环形引导环。工件的后表面被保持在橡胶膜的下表面部分上，并且允许工件的前表面与粘在便器上的抛光布滑动接触以对工件进行抛光。在抛光头中，提供了一种基底构件，其通过防止在抛光操作期间引导环的下表面与抛光布接触而通过弹性膜连接到抛光头本体，以保持引导环和中间板。由于其上表面的一部分与抛光头本体的接触，基体被抑制在轴向方向上的位移，并且在抛光操作期间可以通过弹性膜在径向方向上位移。版权所有（C）2011，JPO＆INPIT

7. 发明专利

JP2010247254A Method of preparing polishing head and polishing apparatus 审中-公开
标题翻译：抛光头和抛光装置的制备方法
公开(公告)号：JP2010247254A
公开(公告)日：2010-11-04
申请号：JP2009097382
申请日：2009-04-13
申请人： Fujikoshi Mach Corp , Shin Etsu Handotai Co Ltd , 不二越機械工業株式会社 , 信越半導体株式会社
发明人： HASHIMOTO HIROMASA , MASUMURA HISASHI , MORITA KOJI , ARAYA TAKASHI , KISHIDA NORIZANE , ARAKAWA SATORU
IPC分类号： B24B37/30
CPC分类号： B24B37/30
摘要： PROBLEM TO BE SOLVED: To provide a method of preparing a polishing head and a polishing apparatus with which constant flatness and polishing allowance uniformity can be stably obtained in polishing a workpiece. SOLUTION: The method of preparing a polishing head comprises at least a step of gluing to a rigid ring a rubber film made of rubber having 40-90° of hardness in JIS A scale, and a step of selecting the rubber film while the rigid ring with the rubber file glued thereto is coupled with an intermediate plate, the bottom surface part of the rubber film having the flatness of 40 μm or less as measured in the peripheral direction of the part where the bottom end surface of the rigid ring is glued to. The rigid ring with the selected rubber film having the flatness of 40 μm or less glued thereto and the intermediate plate coupled to the rigid ring are used for the polishing head. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种制备抛光头和抛光装置的方法，其可以在抛光工件时稳定地获得恒定的平坦度和抛光余量均匀性。＆lt; P＆gt;解决方案：制备抛光头的方法至少包括以下步骤：将刚性环胶合到由JIS A标准具有40-90度硬度的橡胶制成的橡胶膜和选择橡胶膜的步骤粘合有橡胶件的刚性环与中间板连接，橡胶膜的底表面部分具有在刚性环的底端表面的部分周向测量的40μm或更小的平坦度粘在一起将具有40μm或更小的平坦度的选定的橡胶膜的刚性环与粘合到刚性环的中间板用于抛光头。版权所有（C）2011，JPO＆INPIT

8. 发明专利

JP2009107094A Workpiece polishing head, and polishing apparatus having the workpiece polishing head 有权
标题翻译：工件抛光头和抛光机具有工件抛光头
公开(公告)号：JP2009107094A
公开(公告)日：2009-05-21
申请号：JP2007283864
申请日：2007-10-31
申请人： Fujikoshi Mach Corp , Shin Etsu Handotai Co Ltd , 不二越機械工業株式会社 , 信越半導体株式会社
发明人： MASUMURA HISASHI , MORITA KOJI , HASHIMOTO HIROMASA , ARAKAWA SATORU , KISHIDA NORIZANE
IPC分类号： B24B37/30 , B24B41/06 , H01L21/304
CPC分类号： B24B37/30 , B24B41/06
摘要： PROBLEM TO BE SOLVED: To provide a polishing head suppressing a surface defect such as flaws to the minimum, and polishing a workpiece stably and homogeneously to its outer circumference in a rubber-chuck type polishing head, and also to provide a polishing apparatus equipped with the polishing head. SOLUTION: In the polishing head, a rubber film is formed into a boot-shaped structure so that a fixed position on an intermediate plate is apart from the side of a workpiece holding portion, a trailing end portion of the boot-shaped rubber film is formed into an O-ring shape, and the rubber film is supported in the intermediate plate by reducing the contact area between the intermediate plate and the rubber film to the minimum. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供将诸如瑕疵的表面缺陷抑制到最小的抛光头，并且在橡胶卡盘型抛光头中稳定且均匀地抛光工件的外周，并且还提供抛光装备有抛光头的装置。解决方案：在抛光头中，橡胶膜形成为靴形结构，使得中间板上的固定位置离开工件保持部分的侧面，靴形的后端部分橡胶膜形成为O形环，并且通过将中间板和橡胶膜之间的接触面积减小到最小，将橡胶膜支撑在中间板中。版权所有（C）2009，JPO＆INPIT

9. 发明专利

JP2008100295A Polishing head and polishing apparatus 审中-公开
标题翻译：抛光头和抛光装置
公开(公告)号：JP2008100295A
公开(公告)日：2008-05-01
申请号：JP2006282833
申请日：2006-10-17
申请人： Fujikoshi Mach Corp , Shin Etsu Handotai Co Ltd , 不二越機械工業株式会社 , 信越半導体株式会社
发明人： MASUMURA HISASHI , KITAGAWA KOJI , MORITA KOJI , KISHIDA NORIZANE , ARAKAWA SATORU
IPC分类号： B24B37/005 , B24B37/04 , B24B37/30 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a rubber chuck type polishing head, etc. which can apply a uniform polishing load to the whole of a workpiece without being affected by the stiffness and the flatness of a core plate. SOLUTION: The polishing head is at least composed of a nearly disk shape core plate, and a rubber film covering at least the lower surface portion and the side surface portion of the core plate, and has a space surrounded with the core plate and the rubber film, and is configured so as to change the pressure in the space by means of a pressure adjusting mechanism, and holds the back side surface of a workpiece on the lower surface portion of the rubber film, and polishes the front side surface of the workpiece by bringing the front side surface of the workpiece into sliding contact with a polishing cloth stuck on a surface plate, wherein the core plate and the rubber film do not completely contact on the whole of at least the lower surface portion of the core plate so as to have some clearance between them. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够在不影响芯板的刚度和平坦度的情况下对整个工件施加均匀的抛光载荷的橡胶卡盘式抛光头等。解决方案：抛光头至少由几乎圆盘形的芯板和至少覆盖芯板的下表面部分和侧表面部分的橡胶膜组成，并且具有被芯板包围的空间和橡胶膜，并且被构造成通过压力调节机构改变空间中的压力，并且将工件的背面保持在橡胶膜的下表面部分上，并且对前表面进行抛光通过使工件的前侧表面与粘贴在表面板上的研磨布滑动接触，其中芯板和橡胶膜在芯的至少下表面部分的整体上不完全接触，板之间有一些间隙。版权所有（C）2008，JPO＆INPIT

10. 发明专利

JP2004349571A Deice and method for polishing wafer 审中-公开
公开(公告)号：JP2004349571A
公开(公告)日：2004-12-09
申请号：JP2003146705
申请日：2003-05-23
申请人： Shin Etsu Handotai Co Ltd , 信越半導体株式会社
发明人： KAWAZUMI MASANORI , MORITA KOJI
IPC分类号： B24B37/00 , B24B37/32 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a device and a method for polishing a wafer by which the deterioration of haze due to long-term use of a polishing cloth can be prevented, the service life thereof can be made longer, and the wafer can be polished at an appropriate hase level in finish polishing. SOLUTION: The polishing device 10a is provided with a polishing plate 14 where a polishing cloth is adhered to the surface thereof, a polishing head 18 that holds one surface of a wafer W to be polished to a holding surface 16a and brings the other surface thereof to the polishing cloth 12, and a head driving mechanism that drives the polishing head 18 to polish the other surface thereof by the polishing cloth 12. A holder 17 for controlling the supply amount of a polishing agent is provided adjacent to the outer circumference of the polishing head 18 at a specified distance d, and the holder 17 is provided with a contact surface in contact with the polishing cloth 12. COPYRIGHT: (C)2005,JPO&NCIPI

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