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1. 发明专利

JPS6490743A PACKAGING MATERIAL FOR ELECTRONIC PARTS CUSTODY BAGS 失效
公开(公告)号：JPS6490743A
公开(公告)日：1989-04-07
申请号：JP24926387
申请日：1987-10-02
申请人： FUJITSU LTD , FUJIMORI KOGYO CO
发明人： OTAGURO HIROYUKI , SHINJO MAMORU , HIRATA JUNICHI
IPC分类号： H01B17/64 , B32B7/02 , B32B7/12 , B32B15/08 , B65D85/38 , B65D85/86
摘要： PURPOSE:To obtain a packaging material having an excellent antistatic property, stable air-tightness and stable moisture vapor resistance, by forming an antistatic layer on the outside of a synthetic resin film layer and an air-tight and moisture-vapor- resistant layer inside of the said synthetic resin film layer, and laminating in turn the said synthetic resin film layer as the outermost layer, a synthetic resin film layer having a metal foil and a hot-glueable resin layer. CONSTITUTION:A packaging material 10 used for manufacturing electronic parts custody bags is the material made by laminating in turn a synthetic resin film layer 1, having an antistatic layer 1A formed on its outside and an air-tight and moisture- vapor-resistant layer 1B formed on its inside, as the outermost layer, a synthetic resin layer 3 having a metal foil 3A and a hot-glueable resin layer 4. The synthetic resin film layer 1 is a film of polyester, nylon etc., and the antistatic layer 1A is made by solving an antistatic agent such as anionic activator and the like in a solvent to make a solution and coating the surface of the said synthetic resin film layer 1 with the solution. The air-tight and moisture-vapor-resistant layer 1B is formed by coating the opposite side to the antistatic layer 1A of the synthetic resin film layer 1 with polyvinyliden chloride. For the antistatic purpose, carbon black, a various kinds of surfactants etc. may be added to and mixed with the heat bonding resin layer 4.

2. 发明专利

JP2004288455A Electric connector 有权
公开(公告)号：JP2004288455A
公开(公告)日：2004-10-14
申请号：JP2003078301
申请日：2003-03-20
申请人： Fujitsu Ltd , Tyco Electronics Amp Kk , タイコエレクトロニクスアンプ株式会社 , 富士通株式会社
发明人： KIMURA TAKESHI , ORUI KAZUYA , SHIMIZU KUNIHIKO , OTAGURO HIROYUKI , TAKADA MICHIAKI
IPC分类号： H01R12/00 , H01R13/62 , H01R13/64 , H01R13/648 , H01R12/32 , H01R12/22
CPC分类号： H01R12/7064 , H01R12/585 , H05K2201/09145 , H05K2201/2009
摘要： PROBLEM TO BE SOLVED: To improve reliability of mounting on a main base plate of an electric connector with a plurality of sub base plates arrayed and fixed. SOLUTION: The electric connector is provided with a plurality of terminals each having a press-fit part to be inserted into a through-hole fitted to the main base plate and a plurality of sub base plates 120 having land patterns 123 connected to the terminals and contact parts to be connected to counterpart connectors, of which, the land patterns 123 prevent buckling of the sub base plates 120 of the terminals biting into the sub base plates 120 at the time of insertion of the press-fit parts into the through-holes of the main base plate, by a conductor being extended close by an end edge 124 of an insulator at the terminal side. COPYRIGHT: (C)2005,JPO&NCIPI

3. 发明专利

JP2004288453A Electric connector assembly 审中-公开
公开(公告)号：JP2004288453A
公开(公告)日：2004-10-14
申请号：JP2003078284
申请日：2003-03-20
申请人： Fujitsu Ltd , Tyco Electronics Amp Kk , タイコエレクトロニクスアンプ株式会社 , 富士通株式会社
发明人： KIMURA TAKESHI , ORUI KAZUYA , SHIMIZU KUNIHIKO , OTAGURO HIROYUKI , TAKADA MICHIAKI
IPC分类号： H01R13/64 , H01R13/629 , H01R13/631 , H01R12/16
CPC分类号： H01R13/629 , H01R12/7005
摘要： PROBLEM TO BE SOLVED: To enable to start insertion-coupling with fairly rough positioning to realize a high-accuracy insertion-coupling concerning an electric connector assembly consisting of a first connector with a plurality of base plates arrayed and fixed and a second connector equipped with a female terminal insertion-coupled with the first connector.
SOLUTION: Provided with a rough guide mechanism (a first projection guide part 132 and a second projection guide part 134 as well as a first recess guide part 222 and a second recess guide part 224) relatively roughly guiding insertion-coupling at its initial period of the first connector 100 and the second connector 200 and a precise guide mechanism (a chamfering 122 of the base plates 120 and a tapered part 221 of a housing 220) relatively precisely guiding the insertion-coupling at a step in which the insertion-coupling of the first connector and the second connector is advanced.
COPYRIGHT: (C)2005,JPO&NCIPI

4. 发明专利

JPH08111587A WIRING BOARD STRUCTURE, MANUFACTURE THEREOF, AND SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH08111587A
公开(公告)日：1996-04-30
申请号：JP24520694
申请日：1994-10-11
申请人： FUJITSU LTD
发明人： AZUMAGUCHI YUTAKA , HOSOGAI MASAO , OTAGURO HIROYUKI , NOKIMURA HITOSHI , HIDA KATSUHARU
IPC分类号： H05K1/11 , H01L21/48 , H01L23/12 , H01L23/495 , H05K1/02 , H05K1/03 , H05K1/05 , H05K3/06 , H05K3/38 , H05K3/40 , H05K3/46
摘要： PURPOSE: To provide a wiring board structure where voids are prevented from being produced so as not to cause a via connection failure and to lessen the wiring board in reliability and any selective limitations are not imposed on metal materials and film forming processes required for manufacturing and realizing the wiring board. CONSTITUTION: A wiring board is equipped with a board 21 formed of material corroded by a prescribed solution, a conductive layer 23 which comes partially into contact with the board 21 and is etched by a specific solution, and an insulating layer 22 which comes into contact with both the board 21 and the conductive layer 23 and protects the board 21 against corrosion caused by etching done for obtaining the conductive layer 23.

5. 发明专利

JPH07307962A MOUNTING STRUCTURE OF CIRCUIT BOARD 失效
公开(公告)号：JPH07307962A
公开(公告)日：1995-11-21
申请号：JP31141494
申请日：1994-12-15
申请人： FUJITSU LTD
发明人： OTAGURO HIROYUKI , ASHIDA TAKAYUKI , NOKIMURA HITOSHI , NAKAJIMA HIDENAO , WATANABE YOSHIKI , FUJITA SHUHEI
IPC分类号： H04B10/00 , G02B6/00 , G02B6/42 , G02B6/43 , H04L12/70 , H04Q1/14 , H05K7/14 , H05K7/20 , H04L12/28
摘要： PURPOSE:To prevent the degradation of strength of a circuit board, to secure the latitude of wiring design to the board and also to prevent the degradation of the wiring capacity by eliminating drilling to the board when a device using an optical module is mounted on the board. CONSTITUTION:Both ends of the board 101 conduct by means of an electric connector 103, and a second electric connector 107 of an individual part mounting board 102 is connected to the connector 103 on the inner surface side of the board 101. Meanwhile a light/electricity converter device 11 which constructs a subscribe optical module 104 is connected to the connector 103 on the outer surface side of the board 101. An optical connector 105 constructing the module 104 is connected to the device 11. Then a subscriber line optical cable 53 is connected to the connector 105. In such a constitution, the optical signal received from the cable 53 is converted into an electric signal and transmitted to the board 102 without forming any hole for passage of the cable 53.

6. 发明专利

JPH0430497A PRINTED WIRING BOARD UNIT 失效
公开(公告)号：JPH0430497A
公开(公告)日：1992-02-03
申请号：JP13415390
申请日：1990-05-25
申请人： FUJITSU LTD
发明人： OTAGURO HIROYUKI , NOKIMURA HITOSHI , UEHARA EIKO
IPC分类号： H05K3/46
摘要： PURPOSE:To make a printed wiring board unit small in size by a method wherein a heat dissipating block is provided only to a position correspondent to a semiconductor component, and I/O sections are provided to the surface of an insulating board on which the heat dissipating block is bonded. CONSTITUTION:I/O pins 46 used for electrically connecting a semiconductor module 48 with a printed wiring board can be arranged not only on the periphery of the insulating board 32 but also on the comparatively inside part of the board 32. Therefore, pads or the like used for electrically connecting the module 48 with the wiring board 44 are not required to be provided outside the component mounting area of the module 48, so that the board 44 can be made small in size. The thickness of a printed wiring board unit conforms to that of the module 48, so that it can be formed thinner than usual. A heat dissipating block 42 is provided only to a part of the board 32 where semiconductor component is provided, so that a base is small in area, and when the block 42 is bonded to the board 32, air bubbles are hardly induced in adhesive agent and a printed wiring board can be prevented from deteriorating in heat dissipating property due to the air bubbles concerned.

7. 发明专利

JPH03263394A RESTORATION OF MULTILAYER CIRCUIT BOARD 失效
公开(公告)号：JPH03263394A
公开(公告)日：1991-11-22
申请号：JP6155990
申请日：1990-03-13
申请人： FUJITSU LTD
发明人： OTAGURO HIROYUKI
IPC分类号： H05K3/46
摘要： PURPOSE:To restore not only a conductor pattern on the uppermost layer but also a pattern on a lower layer by a method wherein at least two desired places on a surface insulating layer are irradiated with a laser, holes reaching the conductor pattern on the lower layer are made, a connecting route connecting the holes is formed on the surface of the surface insulating layer, and a restoration pattern composed of a thick film is formed on the surface insulating layer. CONSTITUTION:Two places whose connection is required on a surface insulating layer 70 are first irradiated with a laser; holes 81, 82 reaching a conductor pattern 50 on the uppermost layer are made. A conductor paste is screen-printed by using a mask provided with a pattern which bypasses pads 90 and which connects the holes 81, 82; and after that, it is baked. A via 81A formed in the hole 81 is connected to a via 82A formed in the hole 82. A restoration pattern 80 composed of a thick film is formed. That is to say, without exfoliating the surface insulating layer 70, a starting hole for a via 9 is made in the surface insulating layer 70 and in an insulating layer at a lower layer as required; the starting hole is filled with a conductor paste; and the via 9 is formed and the restoration pattern 80 is formed. Thereby, the restoration pattern 80 can be formed easily and at a low cost.

8. 发明专利

JPS63213989A METHOD OF DIRECTING MOUNTING DIRECTION OF POLARIZED COMPONENT 失效
公开(公告)号：JPS63213989A
公开(公告)日：1988-09-06
申请号：JP4845687
申请日：1987-03-02
申请人： FUJITSU LTD
发明人： YOKOYAMA TORU , SHIRAI MAMORU , OTAGURO HIROYUKI
IPC分类号： H05K13/00 , H05K1/02

9. 发明专利

JPS62186587A METHOD FOR MOUNTING ELECTRONIC PARTS ON CIRCUIT BOARD 失效
公开(公告)号：JPS62186587A
公开(公告)日：1987-08-14
申请号：JP2822586
申请日：1986-02-12
申请人： FUJITSU LTD
发明人： YOKOYAMA TORU , SHIRAI MAMORU , OTAGURO HIROYUKI
IPC分类号： H05K1/02 , H05K1/18

10. 发明专利

JPS6188624A Optical signal transmitting and receiving device 失效
标题翻译：光信号发射和接收设备
公开(公告)号：JPS6188624A
公开(公告)日：1986-05-06
申请号：JP20835784
申请日：1984-10-05
申请人： Fujitsu Ltd
发明人： YOKOYAMA TORU , SHIRAI MAMORU , OTAGURO HIROYUKI
IPC分类号： H05K9/00 , H04B10/00 , H04B10/112 , H05K1/00 , H05K1/02 , H04B9/00
CPC分类号： H04B10/803 , H05K1/0218 , H05K1/0298
摘要： PURPOSE:To improve the S/N of a receiving circuit by providing an optical transmission circuit on the single side of a printed distribution board containing a shielding layer and an optical reception circuit on the other side of the distribution board respectively. CONSTITUTION:A circuit which converts an electric signal into an optical signal is set on a single side of a printed distribution board by means of said distribution board containing a shielding layer L3 as a substrate. At the same time, a photodetecting element which receives an optical signal and converts it into an electric signal is set on the other side of the distribution board together with a circuit which amplifies the received electric signal. The circuits having a large amount of current consumption and set at the transmission side are separated from the circuits provided at the reception side and set on both sides of the distribution board. Therefore the reception circuit is isolated electrostatically from the transmission circuit. In such a way, the S/N is improved.
摘要翻译：目的：通过在分配板的另一侧分别在包含屏蔽层和光接收电路的印刷配线板的单面上提供光传输电路来提高接收电路的信噪比。构成：将电信号转换为光信号的电路通过包含屏蔽层L3作为基板的所述分配板设置在印刷配线板的单面上。同时，将接收光信号并将其转换成电信号的光电检测元件与放大接收的电信号的电路一起设置在配电板的另一侧。具有大量电流消耗且设置在发送侧的电路与设置在接收侧的电路分离并设置在配电板的两侧。因此，接收电路是从传输电路静电隔离的。以这种方式，S / N得到改善。

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