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1. 发明专利

JPS6490743A PACKAGING MATERIAL FOR ELECTRONIC PARTS CUSTODY BAGS 失效
公开(公告)号：JPS6490743A
公开(公告)日：1989-04-07
申请号：JP24926387
申请日：1987-10-02
申请人： FUJITSU LTD , FUJIMORI KOGYO CO
发明人： OTAGURO HIROYUKI , SHINJO MAMORU , HIRATA JUNICHI
IPC分类号： H01B17/64 , B32B7/02 , B32B7/12 , B32B15/08 , B65D85/38 , B65D85/86
摘要： PURPOSE:To obtain a packaging material having an excellent antistatic property, stable air-tightness and stable moisture vapor resistance, by forming an antistatic layer on the outside of a synthetic resin film layer and an air-tight and moisture-vapor- resistant layer inside of the said synthetic resin film layer, and laminating in turn the said synthetic resin film layer as the outermost layer, a synthetic resin film layer having a metal foil and a hot-glueable resin layer. CONSTITUTION:A packaging material 10 used for manufacturing electronic parts custody bags is the material made by laminating in turn a synthetic resin film layer 1, having an antistatic layer 1A formed on its outside and an air-tight and moisture- vapor-resistant layer 1B formed on its inside, as the outermost layer, a synthetic resin layer 3 having a metal foil 3A and a hot-glueable resin layer 4. The synthetic resin film layer 1 is a film of polyester, nylon etc., and the antistatic layer 1A is made by solving an antistatic agent such as anionic activator and the like in a solvent to make a solution and coating the surface of the said synthetic resin film layer 1 with the solution. The air-tight and moisture-vapor-resistant layer 1B is formed by coating the opposite side to the antistatic layer 1A of the synthetic resin film layer 1 with polyvinyliden chloride. For the antistatic purpose, carbon black, a various kinds of surfactants etc. may be added to and mixed with the heat bonding resin layer 4.

2. 发明专利

JPH05243701A 失效
公开(公告)号：JPH05243701A
公开(公告)日：1993-09-21
申请号：JP4322392
申请日：1992-02-28
申请人： FUJITSU LTD
发明人： TERAUCHI HIDEAKI , SHINJO MAMORU , HODOZUKA MASAO , KOJIMA SETSUO
IPC分类号： H01R13/40 , H05K1/11 , H05K3/46 , H01R9/09
摘要： PURPOSE:To achieve good conductive connection between annular contacts by using a ring having slit and a relatively thin wall portion opposite the slit, thereby causing the ring to elastically deform so that the ring an absorb the step in the hole diameter of the annular contacts when the ring is inserted into a through-hole. CONSTITUTION:A ring 1 has two protruding parts 4 for circuit conduction which are symmetrically formed at an angle of 180 degrees on both sides of a slit 3 of the ring 1. In the inner surface portion of the ring intermediately of the circumference connecting both protruding parts 4, in other words, in the inner surface portion of the ring which is facing (directly opposed to) the slit 3 extending in the axial direction of the ring 1 at an angle of 180 degrees, the ring 1 has a belt-like longitudinal groove 6 extending in the axial direction, the wall thickness of which is thinner than the remaining ring portion. For this, both side portions in the longitudinal direction (axial direction) of the ring can reduce the diameter independently of each other. (figuratively speaking, it can elastically deform in the shape of a trumpet), so that the ring 1 is put in good contact and engagement with corresponding contacts.

3. 发明专利

JPH04337693A PATTERN CUTTING STRUCTURE FOR PRINTED BOARD 失效
公开(公告)号：JPH04337693A
公开(公告)日：1992-11-25
申请号：JP10951191
申请日：1991-05-15
申请人： FUJITSU LTD
发明人： TERUYA YOSHIHIRO , SHINJO MAMORU , HOSOYA KIMIO
IPC分类号： H05K3/22 , H05K3/46
摘要： PURPOSE:To provide a pattern cutting structure of a printed board in which adjacent pattern or a lower layer pattern is not damaged in the structure of a pattern formed on a surface of the board. CONSTITUTION:A plurality of stripes of cutouts 55 of a fine width crossing a pattern 2 are provided at a desired interval on a cutting area 50 of the pattern 2 formed on a surface of a printed board 1.

4. 发明专利

JPH04168790A FORMATION OF REFLOW SOLDER LAYER 失效
公开(公告)号：JPH04168790A
公开(公告)日：1992-06-16
申请号：JP29569990
申请日：1990-11-01
申请人： FUJITSU LTD
发明人： ICHIHARA YASUHIRO , SHINJO MAMORU
IPC分类号： B23K1/00 , H05K3/24 , H05K3/34
摘要： PURPOSE:To apply a many sort small quantity production to a circuit board and to reduce its cost by dipping in a high melting point solder tank, forming a high melting point solder layer element, and sequentially superposing lower melting point solder layer el.ements thereon to form a solder layer. CONSTITUTION:A circuit board 1 in which pads 2 are arranged to be formed, is dipped in a solder tank 30-1 containing high melting point solder 31 of melted state to form a solder layer element 41 on the pads 2. Then, it is dipped in a solder tank 30-2 containing intermediate melting point solder 32 to form a second solder layer element 42 on the element 41. Similarly, a third solder layer element 43 made of low melting point solder is formed on the element 42. The thicknesses of the elements 41-43 are about 100mum. Thus, a solder layer 40 having about 300mum of thickness is formed. Circuit components are placed on the layer 40, heated to the melting point or higher of the element 41 and soldered.

5. 发明专利

JPH04162543A TOOL FOR BONDING INNER LEAD 失效
公开(公告)号：JPH04162543A
公开(公告)日：1992-06-08
申请号：JP28776390
申请日：1990-10-25
申请人： FUJITSU LTD
发明人： TEJIMA YASUHIRO , SHINJO MAMORU
IPC分类号： H01L21/603 , H01L21/60
摘要： PURPOSE:To correspond to the variation of the kinds of IC chips by composing the title tools of tool assemblies, in which a plurality of tools corresponding to the IC chips having different size are brought independently to a displaceable state in the axial direction and assembled in a coaxial manner, and a mechanism selecting the tool to be operated in the tool assemblies. CONSTITUTION:A tool 20 is installed to a device bonding the inner lead sections of leads on tape carriers 5, 12 with pads on IC chips 1A, 1B through thermocompression bonding, and consists of a tool assembly 25, in which a plurality of tools 22, 24, in which each thermocompression bonding section 22a, 24b is formed in mutually different dimensional shapes corresponding to one IC chip in the IC chips 1A, 1B having different size, are brought independently displaceable manner in the axial 23 direction and assembled in a coaxial shape, and mechanisms 26, 26d, 22d, 24c, 27, etc., selecting the tool to be operated in the tool assemblies 25. Accordingly, the inner lead sections can be bonded with two kinds or more of the IC chips having different size through thermocompression bonding by one tool.

6. 发明专利

JPH0198289A CONNECTING METHOD FOR ELECTROLYTIC CAPACITOR WITH POWER SOURCE 失效
公开(公告)号：JPH0198289A
公开(公告)日：1989-04-17
申请号：JP25678487
申请日：1987-10-12
申请人： FUJITSU LTD
发明人： MIYAZAKI TAKAHIRO , UEKI YOICHI , WASHIO TOSHIFUMI , SHINJO MAMORU , NAKAJIMA HIDENAO
IPC分类号： H05K1/18 , H05K1/02 , H05K1/11 , H05K3/34
摘要： PURPOSE:To reduce the available temperature of an electrolytic capacitor and to enhance the reliability and life of a power source by forming printed wirings near the terminal position of the capacitor in a meshlike pattern, and connecting the terminals of the capacitor to the ends of conduction wirings provided by branching it from the wirings. CONSTITUTION:A main circuit is formed as printed wirings 2 with broad width on a printed circuit substrate 1, the vicinity of the position of the terminal 4 of an electrolytic capacitor 3 is formed in a meshlike pattern 5 by forming, for example, holes each having 3mm of sides at an interval of 6mm, and the area of the pattern 5 covers at least the mounting area of the capacitor 3. Further, the terminal 4 of the capacitor 3 is connected to the end of conduction wirings 6 branched from the wirings 3 of the main circuit. In this case, the mounting area of the capacitor 3 is so separated as not to be superposed on the wirings 2, and a heat conduction from the wirings 3 can be reduced.

7. 发明专利

JPS63146346A ENCLOSED CONTAINER 失效
公开(公告)号：JPS63146346A
公开(公告)日：1988-06-18
申请号：JP29279586
申请日：1986-12-08
申请人： FUJITSU LTD
发明人： YAMAGUCHI SUKETSUGU , SHINJO MAMORU , KUROKI KATSUNORI , MASAKI AKIKO
IPC分类号： H01M2/10 , H01M2/12 , H01M10/52
摘要： PURPOSE:To easily and inexpensively remove gases generated from a battery by disposing a hydrogen absorptive medium on an upper part of a space which is formed between a partition plate and a side wall in a container. CONSTITUTION:In order that hydrogen gas absorptive structure of an enclosed container is formed, a hydrogen absorptive medium 17 is disposed on an upper part of a space which is formed between a partition plate 12-5 and a side wall 12-2 in the container 12. The air containing a hydrogen gas generated from a battery 6 is circulated in the container 12 by operating a heat exchanger 3, and this air is stagnated in the space between the partition plate 12-5 and the side wall 12-2 in order to raise hydrogen which is small in specific weight. When hydrogen is absorbed or reduced into water by a hydrogen absorptive medium 17 disposed there, hydrogen in the circulating air can be removed.

8. 发明专利

JPS6236515A DIP BOILING TYPE COOLING APPARATUS 失效
公开(公告)号：JPS6236515A
公开(公告)日：1987-02-17
申请号：JP17733285
申请日：1985-08-12
申请人： FUJITSU LTD
发明人： SHINJO MAMORU , KUROKI KATSUNORI , HIRAKAWA TAKAAKI
IPC分类号： H01L23/44 , G01C15/02 , H05K7/20
摘要： PURPOSE:To facilitate vaporization and liquefaction of a refrigerant and thereby to increase a cooling effect by a construction wherein a vapor phase chamber into which vapor generated from the refrigerant is introduced is divided into two chambers by a partition wall and this partition wall is provided with pressurizing means to reduce a pressure in a liquid side vapor phase chamber. CONSTITUTION:In an apparatus in which a refrigerant 8 is filled up in a liquid phase chamber 2 and a substance 6 to be cooled is dipped in said refrigerant 8 to be cooled down, a vapor phase chamber into which the refrigerant vaporized to be in vapor phase is introduced is partitioned by a partition wall 1 to be divided into a liquid phase side vapor phase chamber 13 and a non liquid phase vapor phase chamber 14. Moreover, a pressurizing transfer means 12 is provided in said partition wall 11 so as to put the liquid phase side vapor phase chamber 13 in a state of reduced pressure and the non liquid phase side vapor phase chamber in a pressurized state. This construction facilitates the vaporization and boiling of the refrigerant 8 and also the liquefaction of refrigerant vapor, thus increasing a cooling effect.

9. 发明专利

JP2002313998A SEMICONDUCTOR DEVICE 审中-公开
公开(公告)号：JP2002313998A
公开(公告)日：2002-10-25
申请号：JP2002102827
申请日：2002-04-04
申请人： FUJITSU LTD
发明人： AZUMAGUCHI YUTAKA , KUMAI TOSHIO , TEJIMA YASUHIRO , SHINJO MAMORU , KOBAYASHI YASUSHI , SEKIYA YUKIO , IGARASHI SHUZO , ICHIHARA YASUHIRO
IPC分类号： H01L23/12
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device and a wiring board which enable a user to check the soldering state between the BGA-type semiconductor device or the like having a terminal (electrode) therein and the wiring board easily and accurately. SOLUTION: In the semiconductor device which has a solder bump at the specified face of a package, the pitch between the solder bumps positioned in such positions that they can be observed from outside the semiconductor device in the vicinity of the outermost periphery of the specified face of the package is made narrower than the pitch between other pitches.

10. 发明专利

JP2002289745A SEMICONDUCTOR DEVICE AND WIRING BOARD 审中-公开
公开(公告)号：JP2002289745A
公开(公告)日：2002-10-04
申请号：JP2002004698
申请日：2002-01-11
申请人： FUJITSU LTD
发明人： AZUMAGUCHI YUTAKA , KUMAI TOSHIO , TEJIMA YASUHIRO , SHINJO MAMORU , KOBAYASHI YASUSHI , SEKIYA YUKIO , IGARASHI SHUZO , ICHIHARA YASUHIRO
IPC分类号： H05K3/34 , H01L21/60 , H01L23/12
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device and a wiring board having constitution whose soldered state of the semiconductor device and the wiring board having terminals inside of the BGA type semiconductor device or the like can be accurately and easily confirmed. SOLUTION: A through hole 37 is provided on the package 38, and a conductor 39 such as copper having a patter part shown therein and on the face is provided. Four lead-out patterns 39a, 39b, 39c and 39d extending in four orthogonal directions from ring-like lands being a part of a ring-like bump 42 and the conductor 39 are formed on the circumference of the through hole 37 on the rear face of the package 38. The patterns 39a-39d have a function for improving inspection precision of a soldered state by an X-ray transmission image.

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