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1. 发明专利

JP2011243822A Flexible printed wiring board 审中-公开
标题翻译：柔性印刷接线板
公开(公告)号：JP2011243822A
公开(公告)日：2011-12-01
申请号：JP2010115981
申请日：2010-05-20
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： NISHIMURA SHINYA , SUGIYAMA SHUICHI
IPC分类号： H05K3/28 , B32B15/08 , C09J201/00
摘要： PROBLEM TO BE SOLVED: To provide a flexible printed wiring board simultaneously achieving both high adhesiveness of an adhesion layer relative to a resin film and high sliding characteristics at high temperature.SOLUTION: The flexible printed wiring board includes: a first resin film 1; a second resin film 2 facing the first resin film 1; an adhesion layer 3 provided between the first and second resin films 1 and 2; and a metal circuit layer 4 embedded in the adhesion layer 3. The adhesion layer 3 has a glass transition temperature of 80-99°C and a loss elastic modulus of 1.0 GPa or more.
摘要翻译：要解决的问题：提供一种柔性印刷线路板，同时实现粘合层相对于树脂膜的高粘附性和高温下的高滑动特性。解决方案：柔性印刷线路板包括：第一树脂膜1; 面向第一树脂膜1的第二树脂膜2; 设置在第一和第二树脂膜1和2之间的粘附层3; 和嵌入粘合层3中的金属电路层4.粘合层3的玻璃化转变温度为80-99℃，损耗弹性模量为1.0GPa以上。版权所有（C）2012，JPO＆INPIT

2. 发明专利

JP2008218576A Flexible printed board 审中-公开
标题翻译：柔性印刷板
公开(公告)号：JP2008218576A
公开(公告)日：2008-09-18
申请号：JP2007051930
申请日：2007-03-01
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： SUGIYAMA SHUICHI , ARAKI YUICHI
IPC分类号： H05K3/28 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To make a flexible printed board thinner, to reduce repulsive force, and to raise a high-temperature bending characteristic.
SOLUTION: An aramid resin film with the thickness of not more than 5 μm is adopted as a cover lay 4. The cover lay 4 is made to adhere onto the board 2 with the use of an adhesive layer 3 where the glass transition temperature is not less than 80°C and the thickness is not more than 15 μm.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了使柔性印刷板更薄，减少斥力，并提高高温弯曲特性。
解决方案：采用厚度不大于5μm的芳族聚酰胺树脂膜作为覆盖层4.通过使用粘合剂层3将覆盖层4粘附到板2上，其中玻璃化转变温度不低于80℃，厚度不大于15μm。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2005252180A Flexible printed wiring board 审中-公开
标题翻译：柔性印刷接线板
公开(公告)号：JP2005252180A
公开(公告)日：2005-09-15
申请号：JP2004064268
申请日：2004-03-08
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： SHINODA TATSUNORI , ICHIKAWA MASATERU , MIMURA SHOJI , SUGIYAMA SHUICHI , SENSO TOMOMITSU
IPC分类号： H05K3/28 , H05K3/26
摘要： PROBLEM TO BE SOLVED: To enhance the migration resistance of a flexible printed wiring board by a relatively simple method, wherein the flexible printed wiring board is obtained by gluing and curing a copper-clad laminate in which wiring circuits are formed and a coverlay film having an adhesive coat.
SOLUTION: The FPC which is obtained by gluing and curing the copper-clad laminate in which wiring circuits are formed and the coverlay film having an adhesive coat is immersed or cleaned in deionized water, and subsequently dried to enhance the migration resistance.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了通过相对简单的方法提高柔性印刷线路板的耐迁移性，其中柔性印刷线路板通过胶合和固化形成布线电路的覆铜层压板获得，并且覆盖膜具有粘合剂涂层。解决方案：通过胶粘和固化其中形成布线电路的覆铜层压板获得的FPC和具有粘合剂涂层的覆盖膜被浸入或清洁在去离子水中，随后干燥以提高耐迁移性。版权所有（C）2005，JPO＆NCIPI

4. 发明专利

JP2005123468A Film for electronic beam irradiation crosslink separation and method for manufacturing flexible printed circuit board using same 审中-公开
标题翻译：用于电子束辐照交错分离的膜片及使用其制造柔性印刷电路板的方法
公开(公告)号：JP2005123468A
公开(公告)日：2005-05-12
申请号：JP2003358130
申请日：2003-10-17
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： HIDA HIROSHI , SUZUKI ATSUSHI , SUGIYAMA SHUICHI , KONDO NAOKO
IPC分类号： G21K5/04 , H05K3/00 , H05K3/28
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a flexible printed circuit board (FPC) by hot pressing, which can remove a problem that a separating film made of a polymer material adheres to a copper wiring circuit of a copper-clad laminate (CCL) exposed from the opening of a cover lay film (CL) with an adhesive upon the manufacture of the film to avoid improper plating to the copper wiring circuit, and which also can eliminate a gap between the copper wiring circuit and the adhesive of the CL; and also to provide a separating film made of a polymer material subjected to electronic beam irradiation crosslinking, which can avoid adhesion to the copper wiring circuit of the CCL even when the manufacturing method is employed. SOLUTION: The separating film made of the polymer material used upon manufacture of a flexible printed circuit board by hot pressing is formed into a separating film subjected to electronic beam irradiation crosslinking. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：解决的问题：为了提供一种通过热压制造柔性印刷电路板（FPC）的方法，其可以消除由聚合物材料制成的分离膜粘附到铜 - 铜基板的铜布线电路的问题，覆盖层压板（CCL）在制造薄膜时从具有粘合剂的覆盖膜（CL）的开口暴露以避免对铜布线电路的不适当的电镀，并且还可以消除铜布线电路和 CL的粘合剂; 并且还提供由经受电子束照射交联的聚合物材料制成的分离膜，即使采用制造方法，也可以避免与CCL的铜布线电路的粘合。解决方案：通过热压制造柔性印刷电路板时使用的由聚合物材料制成的分离膜被形成为经受电子束照射交联的分离膜。版权所有（C）2005，JPO＆NCIPI

5. 发明专利

JP2005089684A Non-halogen flame-retardant adhesive resin mixture and product relating to flexible printed circuit board produced by using the same 审中-公开
标题翻译：非卤素阻燃胶粘剂混合物及与使用该柔性印刷电路板的柔性印刷电路板相关的产品
公开(公告)号：JP2005089684A
公开(公告)日：2005-04-07
申请号：JP2003327695
申请日：2003-09-19
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： SENSO TOMOMITSU , SUGIYAMA SHUICHI , MORIYA HIDENORI , ICHIKAWA MASATERU , SHINODA TATSUNORI
IPC分类号： C08L63/00 , C08K3/22 , C08K3/34 , C08L13/00 , C08L21/00 , H05K1/03 , H05K3/28
摘要： PROBLEM TO BE SOLVED: To provide a non-halogen flame-retardant adhesive resin mixture to be used in products relating to flexible printed circuit board such as flexible copper-clad laminate, coverlay film, adhesive and flexible printed circuit board, free from phosphorus-based compound, having high flame-retardance without using halogen, and having high adhesive strength and especially improved migration resistance and insulation resistance and provide products relating to flexible printed circuit board produced by using the resin mixture.
SOLUTION: The non-halogen flame-retardant adhesive resin mixture is composed of 40-89 vol.% base resin composed of an epoxy resin, a hardener and a rubber material, 10-55 vol.% metal hydrate powder and 1-5 vol.% aluminum silicate powder.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供与柔性印刷电路板相关的产品中使用的无卤阻燃粘合剂树脂混合物，例如柔性覆铜层压板，覆盖膜，粘合剂和柔性印刷电路板，自由来自具有高阻燃性而不使用卤素的磷系化合物，并且具有高粘合强度，特别是提高的耐迁移性和绝缘电阻，并提供与通过使用树脂混合物制备的柔性印刷电路板相关的产品。解决方案：无卤素阻燃粘合剂树脂混合物由40-89体积％的由环氧树脂，硬化剂和橡胶材料组成的基础树脂，10-55体积％的金属水合物粉末和1 -5体积％硅酸铝粉末。版权所有（C）2005，JPO＆NCIPI

6. 发明专利

JPH09281015A MEASURING METHOD FOR DISSOLVED OXYGEN IN INSULATOR 失效
公开(公告)号：JPH09281015A
公开(公告)日：1997-10-31
申请号：JP8978296
申请日：1996-04-11
申请人： FUJIKURA LTD
发明人： UTSUNOMIYA SAERI , SUGIYAMA SHUICHI , SUGAWARA JUN
IPC分类号： G01N1/22 , G01N30/04 , G01N30/12
摘要： PROBLEM TO BE SOLVED: To obtain a method in which the amount of oxygen dissolved in an insulator at a cross-linked polyolefin insulated cable can be measured simply with a short-time operation, surely and without dispersion. SOLUTION: A sample S is put into a measuring container 10 in which an inert-gas introduction port 21 comprising a screw stopper 25 and an inert-gas- discharge-port and gas-sampling part 24 sealed with a rubber stopper 23 are formed. The air inside the container is substituted for an inert gas. The measuring container 10 is kept at a standstill for a definite time at a constant temperature. A needle is pierced into the rubber stopper 23, a gas is sampled, and the concentration of oxygen in the sampled gas is measured.

7. 发明专利

JPH08235948A MANUFACTURE OF ENAMEL WIRE 失效
公开(公告)号：JPH08235948A
公开(公告)日：1996-09-13
申请号：JP3741395
申请日：1995-02-24
申请人： FUJIKURA LTD
发明人： ONO AKINOBU , AMANO SHIGERU , WATABE TOSHIHITO , SAWAMOTO TAKEHITO , OKA HIDEAKI , SUGIYAMA SHUICHI
IPC分类号： B05D3/10 , H01B13/16
摘要： PURPOSE: To easily manufacture an enamel wire of superior quality at high speed by using liquid having less vaporization heat than liquid coolant as a cleaning agent and has a reducing property. CONSTITUTION: A hard drawn copper wire 12 which is drawn from a delivery bobbin 11 is made into a high temperature annealed copper wire 15, passed through a cooling tank 16 filled with industrial water, and made into the cooled annealed copper wire 17. Secondarily, the wire 17 is passed through a cleaning tank 18 filled with alcohol and after its surface is cleaned, it is naturally dried and at the same time dried by a heating fan completely for the time till it reaches an enamel paint tank 20. The wire 17 is introduced to the enamel paint tank 20 via a guide roller 25 so as to be coated with the enamel paint, after that it is passed through a metal die 21 so as to remove excess enamel, and then passed through a high-temperature baking furnace 22 so that the enamel paint on the wire 17 is baked. Liquid which has less vaporization heat than liquid coolant is used for cleaning agent so that baking speed of the enamel can be greatly heightened.

8. 发明专利

JPH08176247A RESIN COMPOSITION AND INSULATED WIRE 失效
公开(公告)号：JPH08176247A
公开(公告)日：1996-07-09
申请号：JP32342194
申请日：1994-12-26
申请人： FUJIKURA LTD
发明人： SUGIYAMA SHUICHI , ONO AKINOBU , KOBAYASHI KAZUHARU , SAWAMOTO TAKEHITO
IPC分类号： C08K3/16 , C08F290/00 , C08F299/06 , C08G18/67 , C08K5/09 , C08K5/56 , C08L75/00 , C08L75/16 , C09D175/14 , C09D175/16 , H01B3/30
摘要： PURPOSE: To enable an insulated wire having an insulating layer formed from an ultraviolet-curable urethane acrylate resin to be soldered at a low temp. in a short time. CONSTITUTION: 100 pts.wt. ultraviolet-curable urethane acrylate resin is compounded with 1-10 pts.wt. inorg. metal compd. (e.g. zinc chloride or iron chloride) or organometallic compd. (e.g. dibutyltin dilaurate, cobalt naphthenate, or iron 2-ethylhexoate), then applied to a conductor 1, and cured by irradiating with ultraviolet ray, thus forming an insulating layer 2.

9. 发明专利

JP2007103623A Flexible circuit wiring board and its electronic apparatus 审中-公开
标题翻译：柔性电路接线板及其电子设备
公开(公告)号：JP2007103623A
公开(公告)日：2007-04-19
申请号：JP2005290819
申请日：2005-10-04
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： IINUMA KOICHI , SUGIYAMA SHUICHI , SAKURAI HIROFUMI , WATANABE SEN , ARAKI YUICHI
IPC分类号： H05K1/03 , H05K3/28
摘要： PROBLEM TO BE SOLVED: To provide a flexible circuit wiring board which is excellently flexible with low repulsion and is suitable, especially, to be connected to the mobile part of a driving mechanism in an electronic apparatus.
SOLUTION: The flexible circuit wiring board 10 is suitable to be connected to the mobile part of the electronic apparatus, including an insulating film substrate 11; and a circuit interconnection layer 12 arranged on the insulating film substrate 11. The insulating film substrate 11 is made of aramid having the elastic modulus of not less than 5 GPa and the thickness of 1-10 μm.
COPYRIGHT: (C)2007,JPO&INPIT

10. 发明专利

JP2005154511A Nonhalogen flame-retardant adhesive composition and its use 审中-公开
标题翻译：非卤素阻燃胶粘剂组合物及其用途
公开(公告)号：JP2005154511A
公开(公告)日：2005-06-16
申请号：JP2003392712
申请日：2003-11-21
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： SUGIYAMA SHUICHI , SENSO TOMOMITSU , SHINODA TATSUNORI
IPC分类号： B32B15/08 , C09J9/00 , C09J113/00 , C09J161/28 , C09J163/00 , H05K1/03 , H05K3/28
摘要： PROBLEM TO BE SOLVED: To obtain a nonhalogen flame-retardant adhesive composition having excellent flame retardance, adhesiveness and migration resistance, a copper-clad laminate for a flexible printed wiring board, a flexible printed board and a cover lay film for a flexible printed wiring board using the adhesive composition.
SOLUTION: The nonhalogen flame-retardant resin composition comprises a base resin 11 composed of at least an epoxy resin, a curing agent and carboxy group-containing rubber, surface-treated melamine cyanurate particles 10 in the ratio of the melamine cyanurate particles to the total of the base resin and the melamine cyanurate particles of 15-55 mass%.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了获得具有优异的阻燃性，粘合性和耐迁移性的非卤素阻燃性粘合剂组合物，用于柔性印刷线路板的覆铜层压板，柔性印刷电路板和用于使用粘合剂组合物的柔性印刷线路板。解决方案：非卤素阻燃树脂组合物包括由至少环氧树脂，固化剂和含羧基的橡胶组成的基础树脂11，表面处理的三聚氰胺氰脲酸酯颗粒10的三聚氰胺氰尿酸酯颗粒总共为15-55质量％的基础树脂和三聚氰胺氰脲酸酯颗粒。版权所有（C）2005，JPO＆NCIPI

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