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1. 发明专利

JP2007073327A Oxide superconductive conductor 有权
标题翻译：氧化物超导体导体
公开(公告)号：JP2007073327A
公开(公告)日：2007-03-22
申请号：JP2005258927
申请日：2005-09-07
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： KANEKO NAOTAKA , IIJIMA YASUHIRO , KAKIMOTO KAZUTOMI , SUDO YASUNORI , ICHIKAWA MASATERU
IPC分类号： H01B12/06 , C23C14/02 , C23C14/06 , C23C14/08 , C23C14/28 , C23C14/48 , C30B29/22 , H01B13/00
CPC分类号： Y02E40/642
摘要： PROBLEM TO BE SOLVED: To provide an oxide superconductive conductor having excellent superconductivity characteristics by improving the surface roughness of a metal substrate by electrolytic polishing or chemical polishing. SOLUTION: In this oxide superconductive conductor, a polycrystalline intermediate thin film is provided by an ion beam assist method on the metal substrate which comprises a Ni-Cr alloy and the surface of which is polished by electrolytic polishing or chemical polishing, and an oxide superconductive conductor thin film is provided on the polycrystalline intermediate thin film. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决的问题：通过电解抛光或化学抛光提高金属基板的表面粗糙度，提供具有优异的超导特性的氧化物超导体。解决方案：在该氧化物超导导体中，通过离子束辅助法在金属基体上提供多晶中间薄膜，该金属基底包括Ni-Cr合金，其表面通过电解抛光或化学抛光抛光，以及在多晶中间薄膜上设置氧化物超导导体薄膜。版权所有（C）2007，JPO＆INPIT

2. 发明专利

JP2005251958A Flexible printed wiring board and bracket cable 审中-公开
标题翻译：柔性印刷接线板和支架电缆
公开(公告)号：JP2005251958A
公开(公告)日：2005-09-15
申请号：JP2004060024
申请日：2004-03-04
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： ICHIKAWA MASATERU
IPC分类号： H05K9/00 , H01B7/08 , H01B7/17 , H05K1/02
摘要： PROBLEM TO BE SOLVED: To provide a flexible printed wiring board (FPC) which has flexibility and whose shielding ability of an electromagnetic wave is improved.
SOLUTION: In the FPC, an electromagnetic wave shielding layer 200 formed of knit where metal wire is knitted and mesh-like porous metal foil by pressing work of metal foil is installed on at least one side of the FPC. Satisfactory ion-proof migration property is obtained with low air tightness from desired flexibility and knit-like structure and porous structure by adopting the knit and mesh-like porous metal foil.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种具有柔性的柔性印刷布线板（FPC），并且其电磁波的屏蔽能力得到改善。解决方案：在FPC中，FPC的至少一侧安装有由金属线编织的针织物形成的电磁波屏蔽层200和通过金属箔的压制加工的网状多孔金属箔。通过采用针织和网状多孔金属箔，从所需的柔性和针织结构和多孔结构获得具有低气密性的令人满意的离子迁移性能。版权所有（C）2005，JPO＆NCIPI

3. 发明专利

JP2005072275A Printed-wiring board and manufacturing method thereof 审中-公开
标题翻译：印刷电路板及其制造方法
公开(公告)号：JP2005072275A
公开(公告)日：2005-03-17
申请号：JP2003300516
申请日：2003-08-25
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： SHINODA TATSUNORI , ICHIKAWA MASATERU , MIMURA SHOJI , SUGIYAMA SHUICHI , SENSO TOMOMITSU
IPC分类号： H05K3/28 , H05K1/02
摘要： PROBLEM TO BE SOLVED: To improve migration resistance properties without working on the composition itself of an insulating base having a circuit layer for composing a printed-wiring board and a cover material having an adhesive layer.
SOLUTION: The printed-wiring board (1) is composed by laminating the cover material (21) having the adhesive layer (22) on the insulating base (11) having the circuit layer (14) made of copper. In the printed-wiring board (1), benzotriazole (23) is dipped into the adhesive layer (22).
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提高耐迁移性能，而不对具有用于构成印刷电路板的电路层的绝缘基底和具有粘合剂层的覆盖材料的组合物本身进行加工。解决方案：印刷电路板（1）通过将具有粘合剂层（22）的覆盖材料（21）层压在具有由铜制成的电路层（14）的绝缘基底（11）上而构成。在印刷电路板（1）中，将苯并三唑（23）浸入粘合剂层（22）中。版权所有（C）2005，JPO＆NCIPI

4. 发明专利

JP2005012064A Copper alloy plated coated film and multilayer printed wiring board 审中-公开
标题翻译：铜合金涂层膜和多层印刷接线板
公开(公告)号：JP2005012064A
公开(公告)日：2005-01-13
申请号：JP2003176230
申请日：2003-06-20
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： ICHIKAWA MASATERU
IPC分类号： H05K1/09 , C22C9/00 , C22C9/02 , H05K1/02 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a copper alloy plated coated film excellent in thermal shock resistance, and further provide a copper alloy plated coated film for a through hole without the generation of any crack or the like by forming the copper alloy plated coated film over through holes in a double sided flexible printed wiring board and a multilayered wiring board. SOLUTION: The copper alloy plated coated film is a copper alloy plated coated film containing at least one kind of Sn or silver by 0.05 to 1.0% by weight with a remaining part comprising copper and inevitable impurities. Further, the multilayer printed wiring board is a multilayer printed wiring board where a copper alloy plated coated film is applied to the through hole in the multilayer printed wiring board. Further, the copper alloy plated coated film is a multilayer printed wiring board having a ≥15 μm thickness. Furthermore, the multilayer printed wiring board is a double-sided flexible printed wiring board, and a multilayer printed wiring board where the thickness of the copper alloy plated coated film is ≥5 μm. Consequently, there are satisfied all characteristics of thermal shock resistance, conductivity, and costs. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供耐热冲击性优异的铜合金镀覆膜，并且还通过形成镀铜铜合金来形成用于通孔的铜合金镀膜，而不产生任何裂纹等涂布在双面柔性印刷线路板和多层布线板上的通孔上。镀铜合金镀膜是含有0.05〜1.0重量％的至少一种Sn或银的铜合金镀膜，剩余部分含有铜和不可避免的杂质。此外，多层印刷线路板是在多层印刷线路板中的通孔上施加铜合金镀膜的多层印刷线路板。另外，铜合金镀膜是厚度≥15μm的多层印刷布线板。此外，多层印刷线路板是双面柔性印刷线路板，其中铜合金镀膜的厚度为≥5μm的多层印刷线路板。因此，满足耐热冲击性，导电性和成本的所有特性。版权所有（C）2005，JPO＆NCIPI

5. 发明专利

JP2004216480A Actuator arm and surface treatment method 审中-公开
公开(公告)号：JP2004216480A
公开(公告)日：2004-08-05
申请号：JP2003004729
申请日：2003-01-10
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： ICHIKAWA MASATERU , MIMURA SHOJI
IPC分类号： B23H5/08 , C23F1/00 , C23F3/03 , C25F3/16 , C25F3/20
摘要： PROBLEM TO BE SOLVED: To provide an actuator arm for driving a hard disk, which is formed of an aluminum alloy, has no burrs or minute flaws on a surface thereof caused by forming work, has no unevenness on the surface, and is high in cleanliness and dimensional accuracy; and to provide a surface treatment method for manufacturing the actuator arm of this kind, which can be carried out in a relatively short period of time.
SOLUTION: The actuator arm for driving a hard disk is formed of the aluminum alloy and fabricated such that a burr size at a corner portion is set to 300 μm or less and a root width of the burr to 50 μm or less. The surface of the actuator arm is subjected to electrolytic polishing and then chemical polishing by using a mixed aqueous solution containing a phosphoric acid and a nitric acid at a temperature of 80 to 110 °C.
COPYRIGHT: (C)2004,JPO&NCIPI

6. 发明专利

JP2007141505A Flexible flat cable terminal part 有权
标题翻译：柔性平面电缆端子部分
公开(公告)号：JP2007141505A
公开(公告)日：2007-06-07
申请号：JP2005330067
申请日：2005-11-15
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： ICHIKAWA MASATERU , NAOE KUNIHIRO , MIMURA SHOJI , YAMAMOTO KAZUHIRO
IPC分类号： H01B7/08 , C22C5/04 , H01B7/00 , H01R13/03
摘要： PROBLEM TO BE SOLVED: To provide a flexible flat cable terminal part, having superior corrosion resistance and proper insertion/removal characteristics, without generation of cracks after inserting/removing, or without marked increase in the contact resistance, even if it is exposed to air. SOLUTION: In this flexible flat cable terminal part, a nickel plated layer with a thickness of 0.3-5.0 μm and a palladium-based alloy plated layer with a thickness of 0.03-1.0 μm are formed, in this order, on copper or an copper alloy wiring of a flexible flat cable terminal part fitted at least with a connector. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种柔性扁平电缆端子部件，具有优异的耐腐蚀性和适当的插入/移除特性，在插入/移除之后不产生裂纹，或者没有接触电阻的显着增加，即使是暴露于空气中解决方案：在该柔性扁平电缆端子部分中，依次形成厚度为0.3-5.0μm的镀镍层和厚度为0.03-1.0μm的钯基合金电镀层，铜或者至少装配有连接器的柔性扁平电缆端子部件的铜合金布线。版权所有（C）2007，JPO＆INPIT

7. 发明专利

JP2006319269A Flexible printed wiring board terminal or flexible flat cable terminal 审中-公开
标题翻译：柔性印刷接线板端子或柔性平面电缆端子
公开(公告)号：JP2006319269A
公开(公告)日：2006-11-24
申请号：JP2005142892
申请日：2005-05-16
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： ICHIKAWA MASATERU , NAOE KUNIHIRO , MIMURA SHOJI , TODA YUNIE
IPC分类号： H05K1/09 , H01B7/00 , H01B7/08 , H05K3/28
摘要： PROBLEM TO BE SOLVED: To provide an FPC terminal or an FFC terminal with excellent corrosion resistance (outward appearance and electric characteristics) of copper wires or the like and causing no whisker, by preventing the corrosion to the copper wires or the like in the FPC terminal and the FFC terminal including a plating layer of pure tin or tin alloy not including lead on the wires of copper or copper alloy.
SOLUTION: The task above is solved by adopting the FPC or FFC terminal that is connector-connected to the FPC or FFC wherein the plating layer of pure tin or tin alloy not including lead is formed on the wires of copper or copper alloy, and an intermetallic compound diffusion layer including copper and tin is formed by applying heat treatment to the plating layer, the thickness of the remaining plating layer including pure tin or tin alloy not including lead after being subjected to the heat treatment is less than 0.20 μm and a corrosion preventing agent layer is formed to the terminal after the heat treatment.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供铜线等的优异的耐腐蚀性（外观和电气特性）的FPC端子或FFC端子，并且不产生晶须，通过防止对铜线等的腐蚀在FPC端子和FFC端子中，包括在铜或铜合金线上不含铅的纯锡或锡合金的镀层。解决方案：通过采用与FPC或FFC连接器连接的FPC或FFC端子来解决上述任务，其中在铜或铜合金的导线上形成不含铅的纯锡或锡合金的镀层并且通过对镀层进行热处理形成包含铜和锡的金属间化合物扩散层，在经受热处理之后，包括不含铅的纯锡或锡合金的剩余镀层的厚度小于0.20μm 并且在热处理后向终端形成防腐剂层。版权所有（C）2007，JPO＆INPIT

8. 发明专利

JP2005132860A Nonhalogen flame-retardant adhesive resin mixture, metal-clad laminate for flexible printed circuit, cover lay film and flexible printed circuit 审中-公开
标题翻译：非卤化物阻燃粘合剂混合物，柔性印刷电路用金属层压板，覆盖膜和柔性印刷电路
公开(公告)号：JP2005132860A
公开(公告)日：2005-05-26
申请号：JP2003367119
申请日：2003-10-28
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： SENSO TOMOMITSU , SUGIYAMA SHUICHI , MORIYA HIDENORI , ICHIKAWA MASATERU , SHINODA TATSUNORI
IPC分类号： C09J7/02 , C09J11/04 , C09J11/06 , C09J109/00 , C09J133/00 , C09J163/00 , H05K1/03 , H05K3/28
摘要： PROBLEM TO BE SOLVED: To provide a nonhalogen flame-retardant adhesive resin mixture useful for use as an adhesive in an FPC (flexible printed circuit) in relation to the nonhalogen flame-retardant adhesive resin mixture having excellent flame retardance, adhesion and migration resistance.
SOLUTION: The nonhalogen flame-retardant adhesive resin mixture is composed of 89-45 vol.% of a base resin composed of at least an epoxy resin, a curing agent and a rubber component, 10-50 vol.% of a nitrogen-containing compound and 1-5 vol.% of aluminum silicate. Thereby, the excellent flame retardance, adhesion and migration resistance are obtained by compounding the nitrogen-containing compound which is a nonhalogen flame retardant and the aluminum silicate.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种非卤素阻燃性粘合剂树脂混合物，其用于与FPC（柔性印刷电路）中的粘合剂相关的非卤素阻燃粘合剂树脂混合物，其具有优异的阻燃性，粘附性和迁移阻力。解决方案：非卤素阻燃粘合剂树脂混合物由至少由环氧树脂，固化剂和橡胶组分组成的基础树脂的89-45体积％，10-50体积％的含氮化合物和1-5体积％的硅酸铝。因此，通过配合作为非卤素阻燃剂的含氮化合物和硅酸铝，可以获得优异的阻燃性，粘合性和耐迁移性。版权所有（C）2005，JPO＆NCIPI

9. 发明专利

JP2005129739A Rigid flexible printed board and its manufacturing method 审中-公开
标题翻译：刚性柔性印刷板及其制造方法
公开(公告)号：JP2005129739A
公开(公告)日：2005-05-19
申请号：JP2003363966
申请日：2003-10-24
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： SHINODA TATSUNORI , ICHIKAWA MASATERU , MIMURA SHOJI , SUGIYAMA SHUICHI , SENSO TOMOMITSU
IPC分类号： H05K1/02 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To improve the migration resistance of a flexible substrate in a rigid flexible printed board.
SOLUTION: In the rigid flexible printed board constituted of laminating rigid substrates (40), (50) on both the surfaces of the flexible substrate (10), through holes (air holes) (46), (56) pierced only through the rigid substrates (40), (50) are formed on the rigid substrates (40), (50).
COPYRIGHT: (C)2005,JPO&NCIPI

10. 发明专利

JP2005089685A Non-halogen flame-retardant adhesive resin mixture and product relating to flexible printed circuit board produced by using the same 审中-公开
标题翻译：非卤素阻燃胶粘剂混合物及与使用该柔性印刷电路板的柔性印刷电路板相关的产品
公开(公告)号：JP2005089685A
公开(公告)日：2005-04-07
申请号：JP2003327696
申请日：2003-09-19
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： SENSO TOMOMITSU , SUGIYAMA SHUICHI , MORIYA HIDENORI , ICHIKAWA MASATERU , SHINODA TATSUNORI
IPC分类号： C08L63/00 , C08K3/34 , C08K5/55 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a non-halogen flame-retardant adhesive resin mixture to be used in products relating to flexible printed circuit board such as flexible copper-clad laminate, coverlay film, adhesive and flexible printed circuit board, and having flame-retardance without using halogen, high adhesive strength and especially improved migration resistance and insulation resistance and provide products relating to flexible printed circuit board produced by using the resin mixture. SOLUTION: The non-halogen flame-retardant adhesive resin mixture is composed of 40-89 vol.% base resin composed of an epoxy resin, a hardener and a rubber material, 10-55 vol.% boron compound powder and 1-5 vol.% aluminum silicate powder. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于与柔性印刷电路板有关的产品中使用的非卤素阻燃粘合剂树脂混合物，例如柔性覆铜层压板，覆盖膜，粘合剂和柔性印刷电路板，以及具有阻燃性，不使用卤素，高粘合强度，特别是提高的耐迁移性和绝缘电阻，并提供与通过使用树脂混合物制造的柔性印刷电路板相关的产品。解决方案：无卤素阻燃粘合剂树脂混合物由40-89体积％的由环氧树脂，硬化剂和橡胶材料组成的基础树脂，10-55体积％的硼化合物粉末和1 -5体积％硅酸铝粉末。版权所有（C）2005，JPO＆NCIPI

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