专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2010201778A Cushion film for hot press 审中-公开
标题翻译：热压胶片
公开(公告)号：JP2010201778A
公开(公告)日：2010-09-16
申请号：JP2009049554
申请日：2009-03-03
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： KURIHARA TOSHIYASU , KOBAYASHI KAZUHARU
IPC分类号： B32B27/10 , B32B27/32 , H05K3/28
摘要： PROBLEM TO BE SOLVED: To provide a cushion film for a hot press, which improves the yield of a flexible printed circuit wiring board.
SOLUTION: This invention relates to the cushion film 10 for the hot press which is disposed between a cover lay 100 and a hot press plate 50 when a metal clad laminated sheet 200 having a metal circuit layer 7 formed on a base film 5 and a cover lay 100 are pressed using the hot press plate 50. The cushion film 10 for the hot press includes a resin film 1, and a paper layer 2 which is laminated integrally with the resin film 1 and formed of paper.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于热压机的缓冲膜，这提高了柔性印刷电路布线板的产量。解决方案：本发明涉及当在基膜5上形成金属电路层7的金属包覆层叠片200时，设置在盖板100和热压板50之间的热压用衬垫膜10 并且使用热压板50按压盖100。用于热压的缓冲膜10包括树脂膜1和与树脂膜1一体地形成并由纸形成的纸层2。版权所有（C）2010，JPO＆INPIT

2. 发明专利

JP2010199383A Substrate with adhesive, and flexible printed circuit wiring board 有权
标题翻译：带胶粘剂和柔性印刷电路板的基材
公开(公告)号：JP2010199383A
公开(公告)日：2010-09-09
申请号：JP2009043944
申请日：2009-02-26
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： YOSHINO KURODO , KOBAYASHI KAZUHARU
IPC分类号： H05K1/02 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a substrate with an adhesive and a flexible printed circuit wiring board sufficiently restraining the formation of fragments during the use of the flexible printed circuit wiring board. SOLUTION: The substrate 30 with the adhesive is formed by bonding an adhesive layer 16 comprising an adhesive, onto a substrate 7. The substrate 7 is composed of a first main surface 7a, a second main surface 7b on the side opposite to the first main surface 7a, and a side face 7c connecting the first main surface 7a to the second main surface 7b. The side face 7c is tapered from the second main surface 7b toward the first main surface 7a, and the adhesive layer 16 is bonded to the first main surface 7a. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了在使用柔性印刷电路布线板期间提供具有粘合剂和柔性印刷电路布线板的基板，从而充分地抑制碎片的形成。解决方案：具有粘合剂的基材30通过将包含粘合剂的粘合剂层16粘合到基底7上而形成。基底7由第一主表面7a，与第二主表面7b相对的第二主表面7b 第一主表面7a和将第一主表面7a连接到第二主表面7b的侧面7c。侧面7c从第二主表面7b朝向第一主表面7a渐缩，并且粘合剂层16接合到第一主表面7a。版权所有（C）2010，JPO＆INPIT

3. 发明专利

JP2008094647A Film deposition apparatus 审中-公开
标题翻译：胶片沉积装置
公开(公告)号：JP2008094647A
公开(公告)日：2008-04-24
申请号：JP2006276558
申请日：2006-10-10
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： GOTO KENJI , KAWASHIMA TAKUYA , KOBAYASHI KAZUHARU , SUZUKI YASUO
IPC分类号： C03C17/25 , B05B13/00
摘要： PROBLEM TO BE SOLVED: To provide a film deposition apparatus which can deposit a film having a uniform thickness and homogeneous characteristics on a surface to be treated by suppressing change of temperature of sprayed mist by controlling the flow of the sprayed mist.
SOLUTION: The film deposition apparatus 1 deposits a film on the surface to be treated of a body 2 to be treated by a spray heat-decomposition method and includes: a supporting means 11 for mounting the body to be treated; a temperature control means 11a for regulating the temperature of the body to be treated; and a discharge means 12a for spraying mist 3 formed from a raw material solution for the film toward the surface to be treated of the body to be treated. The discharge means 12 is arranged at the side or the upper part of the surface to be treated so that a discharge port 12a is located in the vicinity of the outer edge of the surface to be treated, and supplies mist so that the mist sprayed from the discharge port 12a moves along the surface to be treated, temperature-controlled by a heating means.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决的问题：提供一种成膜装置，其可以通过控制喷雾的流动来抑制喷雾的温度变化，从而在待处理的表面上沉积具有均匀厚度和均匀特性的膜。解决方案：成膜装置1通过喷雾热分解方法将待处理的物体2的表面上的膜沉积，并且包括：用于安装被处理体的支撑装置11; 用于调节被处理体的温度的温度控制装置11a; 以及用于将用于膜的原料溶液形成的雾3喷射到待处理体的待处理表面的排出装置12a。排出装置12布置在待处理表面的侧面或上部，使得排出口12a位于待处理表面的外边缘附近，并且提供雾，使得从排出口12a沿着待处理的表面移动，由加热装置进行温度控制。版权所有（C）2008，JPO＆INPIT

4. 发明专利

JP2004165196A Printed wiring board and conductor circuit forming method therefor 有权
公开(公告)号：JP2004165196A
公开(公告)日：2004-06-10
申请号：JP2002325820
申请日：2002-11-08
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： KOBAYASHI KAZUHARU , FUJINAMI HIDEYUKI , HIGUCHI REIJI
IPC分类号： C25D5/02 , C25D7/00 , H05K3/18 , H05K3/24
摘要： PROBLEM TO BE SOLVED: To form a conductor circuit with uniform thickness of plating irrespective of circuit pattern by eliminating unequal current density due to differences in circuit pattern such as circuit width and space between the circuits. SOLUTION: An insulated resist layer 22 is formed to form a conductor circuit on a plated underlayer 21 of a substrate. A conductor layer 24 is formed on the upper surface of the resist layer 22. The electrolytic plating is conducted under the condition that the conductive layer 24 and the plated underlayer 21 are connected in an equal potential. The resist layer 22 is removed after completion of the electrolytic plating. COPYRIGHT: (C)2004,JPO

5. 发明专利

JP2003298197A Flexible printed board, copper clad laminate, and protective sheet 审中-公开
标题翻译：柔性印刷板，铜箔层压板和保护板
公开(公告)号：JP2003298197A
公开(公告)日：2003-10-17
申请号：JP2002101636
申请日：2002-04-03
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： ARAI MASAHIKO , OKADA KENICHI , KOBAYASHI KAZUHARU , TANABE NOBUO
IPC分类号： C09J7/02 , C09J179/08 , C09J183/06 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a flexible printed board in which moisture resistance, heat resistance and flexibility are enhanced entirely.
SOLUTION: As a base film side adhesive layer 2 and a coverlay film side adhesive layer 4 for bonding a base film 1 or a coverlay film 5, a silane modified polyamideimide based adhesive containing silane modified polyamideimide resin is employed. As the silane modified polyamideimide resin, a product obtained by causing an alkoxysilane condensate containing glycidyloxy group to react on polyamideimide resin having a carboxyl group and/or an anhydride group at the end can be employed.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种柔软的印刷电路板，其中耐湿性，耐热性和柔性被完全提高。解决方案：采用含有硅烷改性聚酰胺酰亚胺树脂的硅烷改性聚酰胺酰亚胺系粘合剂作为底膜侧粘合剂层2和用于粘合基膜1或覆盖膜5的覆盖膜侧粘接层4。作为硅烷改性聚酰胺酰亚胺树脂，可以使用通过使含有缩水甘油氧基的烷氧基硅烷缩合物在末端具有羧基和/或酸酐基的聚酰胺酰亚胺树脂上反应而得到的产物。版权所有（C）2004，JPO

6. 发明专利

JP2003283078A Copper clad laminated board for flexible printed wiring board 审中-公开
标题翻译：铜箔层压板柔性印刷接线板
公开(公告)号：JP2003283078A
公开(公告)日：2003-10-03
申请号：JP2002084263
申请日：2002-03-25
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： KONO TSUKASA , KUROSAWA YUKIHIKO , TANABE NOBUO , KOBAYASHI KAZUHARU
IPC分类号： B32B15/08 , C08K9/02 , C08L101/00 , H05K1/03 , H05K1/11 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To form a copper plating layer easily and surely at the through hole part of a copper clad laminated board for a flexible printed wiring board. SOLUTION: A base film having a metal oxide film layer and added with 15-70 vol.% of conductive fine metal powder is employed in a plastic film becoming the base of a copper clad laminated board in a flexible printed wiring board. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：在用于柔性印刷线路板的铜包覆层压板的通孔部分，容易且可靠地形成镀铜层。解决方案：将具有金属氧化物膜层并添加了15〜70体积％的导电性细金属粉末的基膜用作成为柔性印刷电路板中的覆铜层压板的基材的塑料膜。版权所有（C）2004，JPO

7. 发明专利

JPH10220924A COOLING UNIT 失效
公开(公告)号：JPH10220924A
公开(公告)日：1998-08-21
申请号：JP3552097
申请日：1997-02-04
申请人： FUJIKURA LTD
发明人： JUMONJI SADAMITSU , AMANO SHIGERU , KOBAYASHI KAZUHARU
IPC分类号： F25B41/06
摘要： PROBLEM TO BE SOLVED: To provide a cooling unit, e.g. an air-conditioner, a refrigerator or a freezer, in which a thin resin layer is applied to the inner surface of a capillary tube. SOLUTION: In a cooling unit where a coolant circulates through a compressor 1, a condenser 2, a capillary tube 4 and a cooler 5, the capillary tube 4 is made of copper and applied, to the inner surface thereof, with a thin resin layer. Consequently, adhesion of impurities mixed into the coolant is prevented effectively and chemical reaction of the impurities to the inner surface of the tube is prevented effectively while sustaining the inside diameter of the tube at a substantially constant value resulting in an excellent air-conditioner, a refrigerator or a freezer strong against damage due to corrosion in which the cooling capacity is prevented from lowering.

8. 发明专利

JPH059348A CROSSLINKABLE POLYETHYLENE COMPOSITION AND ELECTRICAL CABLE USING THE SAME 失效
公开(公告)号：JPH059348A
公开(公告)日：1993-01-19
申请号：JP19084091
申请日：1991-07-05
申请人： FUJIKURA LTD
发明人： TANAKA IZUMI , NIWA TOSHIO , NAKAYAMA SHIRO , KOBAYASHI KAZUHARU , OOYOSHI TAKAE , SUGIYAMA NAOMI
IPC分类号： C08L23/04 , C08L23/00 , H01B3/44 , H01B13/14
摘要： PURPOSE:The title composition consisting of PE having a specific ratio of terminal vinyl group to vinylidene group to give high degree of crosslinking without increasing the amount of a crosslinking agent or raising crosslinking temperature. CONSTITUTION:An ethylene homopolymer or a copolymer copolymerized with

9. 发明专利

JP2007153701A Heat ray reflection glass, film forming apparatus and film forming method 审中-公开
标题翻译：热射线反射玻璃，薄膜成型装置和薄膜成型方法
公开(公告)号：JP2007153701A
公开(公告)日：2007-06-21
申请号：JP2005353485
申请日：2005-12-07
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： GOTO KENJI , KAWASHIMA TAKUYA , KOBAYASHI KAZUHARU
IPC分类号： C03C17/25 , F24C15/04
摘要： PROBLEM TO BE SOLVED: To provide a heat ray reflection glass provided with a thin film having excellent heat ray reflection performance to near infrared ray ranging at least in 1,500-2,500 nm wave length and comprising a material capable of being supplied stably and inexpensively.
SOLUTION: The heat ray reflection glass comprising a fluorine-containing tin oxide film (FTO film) having ≥30% reflectance to 2,000 nm near infrared ray is arranged on one or both surfaces of a material to be treated which comprises a glass member.
COPYRIGHT: (C)2007,JPO&INPIT

10. 发明专利

JP2006269501A Printed wiring board and electronic circuit device 审中-公开
标题翻译：印刷线路板和电子电路设备
公开(公告)号：JP2006269501A
公开(公告)日：2006-10-05
申请号：JP2005081697
申请日：2005-03-22
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： SHIBATA HIDEYUKI , KOBAYASHI KAZUHARU
IPC分类号： H05K1/02 , H01L21/60 , H01L23/12
CPC分类号： H01L2224/16225
摘要： PROBLEM TO BE SOLVED: To provide a printed wiring board in which, even when a circuit pattern is miniaturized using "a semi-additive method", adhesion strength of the circuit pattern is ensured to an insulating base material, and the circuit pattern is prevented from being peeled off from the insulating material in processes after the formation of the circuit pattern such as a terminal plating process and the mounting process of an electronic component or the like, or is prevented from being peeled off from the insulating material in a usage environment after completion of mounting. SOLUTION: The printed wiring board includes the insulating base material 1 consisting of an insulating material; the circuit pattern 2 consisting of a conductive material and formed on the surface of the insulating base material 1; and a cover layer 4 consisting of an insulating material and formed on the insulating base material to cover the circuit pattern 2, and having an opening 6 corresponding to a mounting position 5 of an electronic component 101 in this circuit pattern 2; and a metallic layer 7 formed on a portion corresponding to the opening 6 of at least the cover layer 4 of the rear surface of the insulating material 1, and having a film thickness of ≥5 μm. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种印刷电路板，其中即使使用“半添加方法”使电路图案小型化，也可以确保绝缘基材的电路图案的粘附强度，并且电路在形成诸如端子电镀工艺和电子部件等的电路图案的电路图案之后的工艺中，防止图案从绝缘材料剥离，或者防止从绝缘材料剥离完成安装后的使用环境。解决方案：印刷电路板包括由绝缘材料构成的绝缘基材1; 电路图案2由导电材料构成并形成在绝缘基材1的表面上; 以及由绝缘材料构成的覆盖层4，其形成在绝缘基材上以覆盖电路图案2，并且具有与该电路图案2中的电子部件101的安装位置5对应的开口6; 以及金属层7，其形成在与绝缘材料1的至少覆盖层4的开口6相对应的部分上，膜厚度≥5μm。版权所有（C）2007，JPO＆INPIT

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式