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1. 发明专利

JP2007234734A Flexible printed circuit and its production process 审中-公开
标题翻译：柔性印刷电路及其生产工艺
公开(公告)号：JP2007234734A
公开(公告)日：2007-09-13
申请号：JP2006052044
申请日：2006-02-28
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： MORIYA HIDENORI , TSURUSAKI KOJI , NAKAO SATORU
IPC分类号： H05K1/02 , H05K3/00 , H05K3/28
摘要： PROBLEM TO BE SOLVED: To provide a flexible printed circuit (FPC) in which bending resistance at a bending part can be enhanced sharply, and to provide its production process.
SOLUTION: In an FPC formed by laminating at least an insulation film layer and a metal wiring layer, a bending groove is formed by mechanical technique at least at one position of the insulation film layer. The production process of FPC comprises a step for forming a desired circuit on the copper foil of a copper clad plate where a copper foil is laminated on one or both sides of the insulation film layer, a step for forming a bending groove by mechanical technique at least at one position of the insulation film layer, and a step for laminating a coverlay on the circuit forming surface after each step.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种挠曲印刷电路（FPC），其弯曲部分的弯曲阻力可以急剧增加，并提供其制造工艺。解决方案：在通过层压至少绝缘膜层和金属布线层形成的FPC中，通过机械技术在绝缘膜层的至少一个位置形成弯曲槽。 FPC的制造方法包括在铜箔板的铜箔上形成期望的电路的步骤，其中铜箔层叠在绝缘膜层的一侧或两侧，通过机械技术形成弯曲槽的步骤至少在绝缘膜层的一个位置处，以及在每个步骤之后在电路形成表面上层压覆盖层的步骤。版权所有（C）2007，JPO＆INPIT

2. 发明专利

JP2007227520A Flexible wiring board, and its manufacturing method 审中-公开
标题翻译：柔性接线板及其制造方法
公开(公告)号：JP2007227520A
公开(公告)日：2007-09-06
申请号：JP2006045075
申请日：2006-02-22
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： MORIYA HIDENORI , TSURUSAKI KOJI , NAKAO SATORU
IPC分类号： H05K1/02 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To provide a flexible wiring board which has neither deterioration of an insulating film layer nor deterioration of bending resistance in the case of recessing for bending, and to provide a manufacturing method of the board.
SOLUTION: The flexible wiring board 10 is mainly constituted of the insulating film layer 11 and a metal wiring layer 14. A bending groove 15 is formed on one face or both faces of the insulating film layer 11 by a laser. Thus, the flexible wiring board 10 in which it is not necessary to use strong alkaline chemical for etching the insulating film layer 11, and which has neither deterioration of the insulating film layer 11 nor deterioration of bending resistance can be manufactured.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种柔性布线板，其既不破坏绝缘膜层，也不会在弯曲凹陷的情况下的抗弯曲性劣化，并且提供板的制造方法。解决方案：柔性布线板10主要由绝缘膜层11和金属布线层14构成。通过激光在绝缘膜层11的一面或两面上形成弯曲槽15。因此，可以制造其中不需要使用强碱性化学品来蚀刻绝缘膜层11的柔性布线板10，并且既不破坏绝缘膜层11也不劣化耐弯曲性。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2007035717A Substrate for multilayer wiring board and manufacturing method thereof, multilayer printed wiring board, and manufacturing method thereof 审中-公开
标题翻译：多层布线基板及其制造方法，多层印刷布线及其制造方法
公开(公告)号：JP2007035717A
公开(公告)日：2007-02-08
申请号：JP2005213003
申请日：2005-07-22
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： MORIYA HIDENORI , TSURUSAKI KOJI , ITO SHOJI
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a base material for multilayer wiring board, a multilayer printed circuit board, and a manufacturing method of these elements in which rise of conductive resistance value, conductive failure, and lowering of connection reliability can be controlled during the processes to realize multilayer structure.
SOLUTION: In the manufacturing method of base material for multilayer wiring board, through-holes are formed to an insulating base material including a conductive layer to at least single surface, an acrylic adhesive coating liquid having viscosity of 5 to 50 poise is coated to the internal surface of the through-holes and is dried up, a buffer material formed of the acrylic adhesive agent having elasticity in the range of 10 to 5,000 MPa is provided to the internal surface of the through-holes, and the through-holes are filled with a conductive material. The multilayer printed circuit board is manufactured by laminating the base material for such multilayer wiring board to the other base material for multilayer wiring board via an interlayer bonding layer.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种多层布线基板的基材，多层印刷电路板以及这些元件的制造方法，其中可以控制导电电阻值的上升，导电故障和连接可靠性的降低在实现多层结构的过程中。解决方案：在多层布线基板的基材的制造方法中，将至少包含导电层的绝缘基材形成贯通孔至少为单面，粘度为5〜50泊的丙烯酸系粘合剂涂布液为涂覆到通孔的内表面并干燥，由通孔的内表面提供由10-5000MPa范围内的弹性的丙烯酸粘合剂形成的缓冲材料，孔填充有导电材料。多层印刷电路板是通过层叠粘合层将用于这种多层布线基板的基材层叠到多层布线基板的另一基材而制造的。版权所有（C）2007，JPO＆INPIT

4. 发明专利

JP2005089684A Non-halogen flame-retardant adhesive resin mixture and product relating to flexible printed circuit board produced by using the same 审中-公开
标题翻译：非卤素阻燃胶粘剂混合物及与使用该柔性印刷电路板的柔性印刷电路板相关的产品
公开(公告)号：JP2005089684A
公开(公告)日：2005-04-07
申请号：JP2003327695
申请日：2003-09-19
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： SENSO TOMOMITSU , SUGIYAMA SHUICHI , MORIYA HIDENORI , ICHIKAWA MASATERU , SHINODA TATSUNORI
IPC分类号： C08L63/00 , C08K3/22 , C08K3/34 , C08L13/00 , C08L21/00 , H05K1/03 , H05K3/28
摘要： PROBLEM TO BE SOLVED: To provide a non-halogen flame-retardant adhesive resin mixture to be used in products relating to flexible printed circuit board such as flexible copper-clad laminate, coverlay film, adhesive and flexible printed circuit board, free from phosphorus-based compound, having high flame-retardance without using halogen, and having high adhesive strength and especially improved migration resistance and insulation resistance and provide products relating to flexible printed circuit board produced by using the resin mixture.
SOLUTION: The non-halogen flame-retardant adhesive resin mixture is composed of 40-89 vol.% base resin composed of an epoxy resin, a hardener and a rubber material, 10-55 vol.% metal hydrate powder and 1-5 vol.% aluminum silicate powder.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供与柔性印刷电路板相关的产品中使用的无卤阻燃粘合剂树脂混合物，例如柔性覆铜层压板，覆盖膜，粘合剂和柔性印刷电路板，自由来自具有高阻燃性而不使用卤素的磷系化合物，并且具有高粘合强度，特别是提高的耐迁移性和绝缘电阻，并提供与通过使用树脂混合物制备的柔性印刷电路板相关的产品。解决方案：无卤素阻燃粘合剂树脂混合物由40-89体积％的由环氧树脂，硬化剂和橡胶材料组成的基础树脂，10-55体积％的金属水合物粉末和1 -5体积％硅酸铝粉末。版权所有（C）2005，JPO＆NCIPI

5. 发明专利

JP2008004750A Manufacturing method for multiplayer printed wiring board 审中-公开
标题翻译：多层印刷线路板的制造方法
公开(公告)号：JP2008004750A
公开(公告)日：2008-01-10
申请号：JP2006172616
申请日：2006-06-22
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： MORIYA HIDENORI , TSURUSAKI KOJI , NAKAO SATORU
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a multiplayer printed wiring board that is structured to require less manufacturing steps to achieve higher productivity, and to be resistant to defects; and to provide a manufacturing method therefor.
SOLUTION: The multilayer printed wiring board 30 comprises printed wiring boards 20 that are laminated on one or both surfaces of a flexible printed wiring board 10 as outermost layers. The flexibility of a flexure is maintained by forming grooves 24 for bending in the printed wiring boards 20 as the outermost layers.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种多人印刷线路板，其被构造成需要较少的制造步骤以实现更高的生产率并且能够抵抗缺陷; 并提供其制造方法。解决方案：多层印刷线路板30包括层压在作为最外层的柔性印刷线路板10的一个或两个表面上的印刷线路板20。通过在作为最外层的印刷电路板20中形成用于弯曲的凹槽24来维持弯曲的柔性。版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2005132860A Nonhalogen flame-retardant adhesive resin mixture, metal-clad laminate for flexible printed circuit, cover lay film and flexible printed circuit 审中-公开
标题翻译：非卤化物阻燃粘合剂混合物，柔性印刷电路用金属层压板，覆盖膜和柔性印刷电路
公开(公告)号：JP2005132860A
公开(公告)日：2005-05-26
申请号：JP2003367119
申请日：2003-10-28
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： SENSO TOMOMITSU , SUGIYAMA SHUICHI , MORIYA HIDENORI , ICHIKAWA MASATERU , SHINODA TATSUNORI
IPC分类号： C09J7/02 , C09J11/04 , C09J11/06 , C09J109/00 , C09J133/00 , C09J163/00 , H05K1/03 , H05K3/28
摘要： PROBLEM TO BE SOLVED: To provide a nonhalogen flame-retardant adhesive resin mixture useful for use as an adhesive in an FPC (flexible printed circuit) in relation to the nonhalogen flame-retardant adhesive resin mixture having excellent flame retardance, adhesion and migration resistance.
SOLUTION: The nonhalogen flame-retardant adhesive resin mixture is composed of 89-45 vol.% of a base resin composed of at least an epoxy resin, a curing agent and a rubber component, 10-50 vol.% of a nitrogen-containing compound and 1-5 vol.% of aluminum silicate. Thereby, the excellent flame retardance, adhesion and migration resistance are obtained by compounding the nitrogen-containing compound which is a nonhalogen flame retardant and the aluminum silicate.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种非卤素阻燃性粘合剂树脂混合物，其用于与FPC（柔性印刷电路）中的粘合剂相关的非卤素阻燃粘合剂树脂混合物，其具有优异的阻燃性，粘附性和迁移阻力。解决方案：非卤素阻燃粘合剂树脂混合物由至少由环氧树脂，固化剂和橡胶组分组成的基础树脂的89-45体积％，10-50体积％的含氮化合物和1-5体积％的硅酸铝。因此，通过配合作为非卤素阻燃剂的含氮化合物和硅酸铝，可以获得优异的阻燃性，粘合性和耐迁移性。版权所有（C）2005，JPO＆NCIPI

7. 发明专利

JP2005089685A Non-halogen flame-retardant adhesive resin mixture and product relating to flexible printed circuit board produced by using the same 审中-公开
标题翻译：非卤素阻燃胶粘剂混合物及与使用该柔性印刷电路板的柔性印刷电路板相关的产品
公开(公告)号：JP2005089685A
公开(公告)日：2005-04-07
申请号：JP2003327696
申请日：2003-09-19
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： SENSO TOMOMITSU , SUGIYAMA SHUICHI , MORIYA HIDENORI , ICHIKAWA MASATERU , SHINODA TATSUNORI
IPC分类号： C08L63/00 , C08K3/34 , C08K5/55 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a non-halogen flame-retardant adhesive resin mixture to be used in products relating to flexible printed circuit board such as flexible copper-clad laminate, coverlay film, adhesive and flexible printed circuit board, and having flame-retardance without using halogen, high adhesive strength and especially improved migration resistance and insulation resistance and provide products relating to flexible printed circuit board produced by using the resin mixture. SOLUTION: The non-halogen flame-retardant adhesive resin mixture is composed of 40-89 vol.% base resin composed of an epoxy resin, a hardener and a rubber material, 10-55 vol.% boron compound powder and 1-5 vol.% aluminum silicate powder. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于与柔性印刷电路板有关的产品中使用的非卤素阻燃粘合剂树脂混合物，例如柔性覆铜层压板，覆盖膜，粘合剂和柔性印刷电路板，以及具有阻燃性，不使用卤素，高粘合强度，特别是提高的耐迁移性和绝缘电阻，并提供与通过使用树脂混合物制造的柔性印刷电路板相关的产品。解决方案：无卤素阻燃粘合剂树脂混合物由40-89体积％的由环氧树脂，硬化剂和橡胶材料组成的基础树脂，10-55体积％的硼化合物粉末和1 -5体积％硅酸铝粉末。版权所有（C）2005，JPO＆NCIPI

8. 发明专利

JP2007059777A Multilayered printed circuit board and method for manufacturing the same 审中-公开
标题翻译：多层印刷电路板及其制造方法
公开(公告)号：JP2007059777A
公开(公告)日：2007-03-08
申请号：JP2005245655
申请日：2005-08-26
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： MORIYA HIDENORI , TAKAHASHI KATSUHIKO , ITO SHOJI , TSURUSAKI KOJI
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To reduce a conduction resistance value of a conductor that fills a through-hole in a double-faced board and copper foil, to improve reliability in connection between layers, and to prevent the breakage of a dielectric material.
SOLUTION: A multilayered printed circuit board 1 is constituted such that at least one sheet of single-sided boards 20, 30 is laminated one by one on both sides of the double-faced board 10, a conductor 18 is coated on the surface of the foil 12 around the through-hole 14 of the board 10, the coating range of the conductor 18 that coats the surface of the foil 12 is of a width w from the outer periphery of the through-hole 14 in the board 10 of 10-50 μm.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了降低填充双面板和铜箔中的通孔的导体的导通电阻值，以提高层之间的连接的可靠性，并且防止介电材料的断裂。解决方案：多层印刷电路板1被构造成使得至少一片单面板20,30在双面板10的两侧一个接一个地层叠，导体18被涂覆在箔片12的表面围绕板10的通孔14，涂覆在箔片12的表面上的导体18的涂覆范围与板10中的通孔14的外周的宽度w 为10-50微米。版权所有（C）2007，JPO＆INPIT

9. 发明专利

JP2006173200A Rigid-flex multilayer printed wiring board and its manufacturing method 审中-公开
标题翻译： RIGID-FLEX多层印刷接线板及其制造方法
公开(公告)号：JP2006173200A
公开(公告)日：2006-06-29
申请号：JP2004360306
申请日：2004-12-13
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： MORIYA HIDENORI , TAKAHASHI KATSUHIKO , TSURUSAKI KOJI , DOJO KAZUYUKI
IPC分类号： H05K3/46 , H05K9/00
摘要： PROBLEM TO BE SOLVED: To provide a rigid-flex multilayer printed wiring board which can prevent a shield member formed on the outer surface of an inner-layer substrate from being transferred onto an outer-layer substrate and delaminated from the inner-layer substrate at the time of removing the outer-layer substrate to form a flexible portion, and also to provide its manufacturing method.
SOLUTION: The rigid-flex multilayer printed wiring board consists of a rigid portion having a rigidity and the flexible portion having a flexibility, with the rigid portion having a multilayer structure. On a region of an inner-layer FPC 30 shared by the rigid portion and the flexible portion which serves for the flexible portion, the shield member 40A (40B) and a protection member 70A (70B) formed of the same material as that of the shield member are stacked in order.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：解决的问题：提供一种刚性柔性多层印刷线路板，其能够防止形成在内层基板的外表面上的屏蔽部件被转印到外层基板上并与内层基板分层，在去除外层基板时形成柔性部分，并提供其制造方法。解决方案：刚性柔性多层印刷线路板由具有刚性的刚性部分和具有柔性的柔性部分组成，刚性部分具有多层结构。在由刚性部分共享的内层FPC 30的区域和用于柔性部分的柔性部分的区域中，屏蔽构件40A（40B）和保护构件70A（70B）形成为与屏蔽构件按顺序堆叠。版权所有（C）2006，JPO＆NCIPI

10. 发明专利

JP2005112910A Non-halogen flame-retardant adhesive resin admixture and flexible printed circuit board-related product obtained using the same 审中-公开
标题翻译：非卤化物阻燃胶粘剂粘合剂和柔性印刷电路板相关产品
公开(公告)号：JP2005112910A
公开(公告)日：2005-04-28
申请号：JP2003345770
申请日：2003-10-03
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： SENSO TOMOMITSU , SUGIYAMA SHUICHI , MORIYA HIDENORI , ICHIKAWA MASATERU , SHINODA TATSUNORI
IPC分类号： B32B15/08 , C09J7/00 , C09J11/00 , C09J109/02 , C09J121/00 , C09J163/00 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a non-halogen flame-retardant adhesive resin admixture used for flexible printed circuit board-related products such as flexible copper-clad laminates, cover-lay films, adhesives or flexible printed circuit boards which is non-halogen and flame-retardant and exhibits high adhesive strength and excellent insulation resistance and migration properties, and flexible printed circuit board-related products using the same.
SOLUTION: The non-halogen flame-retardant adhesive resin admixture comprises 45-90 vol% of a base resin comprising an epoxy resin, a curing agent and a rubbery material and 10-55 vol% of a boron compound powder.
COPYRIGHT: (C)2005,JPO&NCIPI

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