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1. 发明专利

JP2009168365A Plate-like body cooling apparatus and heat treatment system 有权
标题翻译：板状冷却装置和热处理系统
公开(公告)号：JP2009168365A
公开(公告)日：2009-07-30
申请号：JP2008008013
申请日：2008-01-17
申请人： Espec Corp , エスペック株式会社
发明人： KANDA TOSHIRO
IPC分类号： F27D9/00 , C03B25/02 , F27D3/06 , G09F9/00
摘要： PROBLEM TO BE SOLVED: To provide a tabular body cooling apparatus capable of smoothly cooling a heat-treated tabular body, and a heat treatment system having the tabular body cooling apparatus.
SOLUTION: A tabular body arranging means 20 has a plurality of blowing means arranging parts 30 provided with blowing means 40 capable of blowing air toward a substrate W, every predetermined space. When putting in and out the substrate W to be cooled, a fork claw 13 of a transfer device 11 is inserted in an operation area 25 formed at the side of the blowing means arranging part 30, and operated. A support pin 23 for supporting the substrate W is therefore lowered by the height portion of the blowing means 40, and a space between the substrate W and the blowing means 40 can be reduced by that portion. The flow velocity of air flowing along the substrate W is thereby increased to enhance the cooling efficiency of the substrate W.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够平滑地冷却经热处理的片状体的片状体冷却装置，以及具有片状体冷却装置的热处理系统。解决方案：片状主体布置装置20具有多个吹风装置配置部分30，每个预定空间设置有能够朝向基板W吹送空气的吹风装置40。当放入和排出要冷却的基板W时，转印装置11的叉爪13插入形成在吹风装置配置部分30一侧的操作区域25中并被操作。因此，用于支撑基板W的支撑销23被吹送装置40的高度部分降低，并且可以通过该部分减小基板W和吹风装置40之间的空间。从而提高了沿衬底W流动的空气的流速，以提高衬底W的冷却效率。版权所有：（C）2009，JPO＆INPIT

2. 发明专利

JP2008032274A Heat treatment device 有权
标题翻译：热处理装置
公开(公告)号：JP2008032274A
公开(公告)日：2008-02-14
申请号：JP2006204100
申请日：2006-07-27
申请人： Espec Corp , エスペック株式会社
发明人： KANDA TOSHIRO , SAKONAKA KAZUHIRO , MURAKAMI HIDENORI
IPC分类号： F27B17/00 , F27D1/04 , F27D1/08
摘要： PROBLEM TO BE SOLVED: To provide a heat treatment device capable of inhibiting leakage of hot air from a heat treatment space inside of a heat treatment tank while reducing work loads in carrying and installing the heat treatment tank. SOLUTION: In the heat treatment device 1, the heat treatment tank 4 having an outer wall and an inner wall forming the rectangular parallelopiped heat treatment space inside of the outer wall, is formed by combining plural hollow wall panels 42, each wall panel 42 has a part corresponding to an angular portion of the heat treatment space, and is joined to the other wall panel 42 at a position shifted from the angular portion of the heat treatment space. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决的问题：提供一种能够抑制热空气从热处理槽内部的热处理空间泄漏的热处理装置，同时减少承载和安装热处理槽的工作负荷。解决方案：在热处理装置1中，通过组合多个中空壁板42而形成具有形成外壁的长方体形状的热处理空间的外壁和内壁的热处理槽4，每个壁面板42具有对应于热处理空间的角部的部分，并且在从热处理空间的角部偏移的位置处接合到另一壁板42。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2010133666A Heat treatment apparatus 有权
标题翻译：热处理设备
公开(公告)号：JP2010133666A
公开(公告)日：2010-06-17
申请号：JP2008311525
申请日：2008-12-05
申请人： Espec Corp , エスペック株式会社
发明人： KANDA TOSHIRO
IPC分类号： F27D5/00 , F27B5/06 , F27B17/00 , F27D1/18 , F27D3/06 , F27D3/12 , F27D7/04
摘要： PROBLEM TO BE SOLVED: To improve a heat treatment apparatus performing heat treatment of a glass substrate so as to develop a heat treatment apparatus capable of facilitating maintenance.
SOLUTION: A substrate replacement system 18 is arranged at an approximately center of a heat treatment chamber 12, and a placement shelf 16 is provided in the substrate replacement system 18. All step parts 23 of the placement shelf 16 have lack parts 37 where small beams 31 at central portions are lacked, and an open ceiling part 38 is formed by the lack parts 37. A worker can enter into the open ceiling part 38.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决的问题：为了改善对玻璃基板进行热处理的热处理装置，以开发能够便于维护的热处理装置。解决方案：基板更换系统18布置在热处理室12的大致中心处，并且在基板更换系统18中设置放置架16.所述放置架16的所有台阶部分23都缺少部件37 其中缺少中央部分的小梁31，并且由缺少部分37形成敞开的天花板部分38.工人可以进入开放天花板部分38。版权所有（C）2010，JPO＆INPIT

4. 发明专利

JP2007333272A Rack, rack system, heat treatment device, and heat treatment system 审中-公开
标题翻译：机架，机架系统，热处理装置和热处理系统
公开(公告)号：JP2007333272A
公开(公告)日：2007-12-27
申请号：JP2006164198
申请日：2006-06-14
申请人： Espec Corp , エスペック株式会社
发明人： KANDA TOSHIRO
IPC分类号： F27B5/06 , F27B5/12 , F27B5/13 , F27D5/00
摘要： PROBLEM TO BE SOLVED: To provide a heat treatment device capable of highly densely mounting articles to be heated and heating the articles, and a heat treatment system with the heat treatment device.
SOLUTION: The heat treatment system 1 comprises a transfer device 2 and the heat treatment device 10. The heat treatment device 10 has a rack 30 inside a heat treatment chamber 13, and a plurality of shelf members 40 are attached in the vertical direction. The shelf members 40 are jointed by disposing vertical beams 42 in such a way as to orthogonally cross three parallel cross beams 41. A base plate can be taken in/out by inserting a hand part 3 of the transfer device 2 into the rack 30 along the vertical beams 42.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够高密度地安装待加热物品和加热物品的热处理装置，以及具有热处理装置的热处理系统。解决方案：热处理系统1包括转移装置2和热处理装置10.热处理装置10在热处理室13的内部具有支架30，多个搁板部件40安装在垂直方向方向。搁板构件40通过以垂直方向交叉的方式设置垂直梁42而被连接。三角平行横梁41可以通过将传送装置2的手部3插入到架30中而被引入/取出。垂直梁42.版权所有（C）2008，JPO＆INPIT

5. 发明专利

JP2004209612A Suction pad 有权
标题翻译：抽吸垫
公开(公告)号：JP2004209612A
公开(公告)日：2004-07-29
申请号：JP2003001399
申请日：2003-01-07
申请人： Espec Corp , エスペック株式会社
发明人： FUKUSHIMA AKIRA , KANDA TOSHIRO , KOTANI YOSHIHIKO
IPC分类号： B25J15/06 , B65G47/91 , B65G49/06 , B65G49/07 , B65H3/08 , F16B47/00 , H01L21/677 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To prevent a vacuum destruction of a suction pad supporting a glass substrate by vacuum suction. SOLUTION: The suction pad 1 comprises: a pad 2 provided with a supporting surface 22 to suck the lower surface W 1 of the substrate W with vacuum, and a cylindrical part 23 to be supported; a supporting case 3 to support the cylindrical part 23, packing 4; and the like. The lower end 23a of curved surface of the cylindrical part 23 is supported movably in a lateral direction X with the plane surface 31 of the supporting case 3, and at the same time, the cylindrical part 23 is restrained from large displacement with an inner ring 32. Further, the inclination of the pad is restrained with a space between the ring surface 24 of the pad and the upper end surface 33. The packing 4 seals a vacuum side 34b from an open air side 34a so that the packing 4 may not hinder the pad from moving. When the suction supporting surface of the pad is pulled by the heat-contracted substrate, the pad is moved in that direction. As a result, the supporting surface and substrate are not separated, and the vacuum destruction is surely prevented. COPYRIGHT: (C)2004,JPO&NCIPI
摘要翻译：要解决的问题：通过真空抽吸来防止支撑玻璃基板的吸盘的真空破坏。吸盘1包括：垫2，其设置有用于真空吸附基板W的下表面W 1 的支撑表面22和待支撑的圆柱形部分23; 用于支撑圆柱形部分23的支撑壳体3，包装4; 等等。圆筒部23的弯曲面的下端23a与支撑壳体3的平面31在横向方向X上可移动地支撑，同时，圆筒部23被内圈限制大位移此外，衬垫的倾斜度通过衬垫的环表面24与上端表面33之间的空间被限制。衬垫4将密封面34b从露天侧34a密封，使得衬垫4不能妨碍垫移动。当衬垫的吸力支撑表面被热收缩衬底拉动时，垫沿该方向移动。结果，支撑面和基板不分离，可靠地防止真空破坏。版权所有（C）2004，JPO＆NCIPI

6. 发明专利

JP2010048467A Plate cooling device and heat treatment system 审中-公开
标题翻译：板式冷却装置和热处理系统
公开(公告)号：JP2010048467A
公开(公告)日：2010-03-04
申请号：JP2008213208
申请日：2008-08-21
申请人： Espec Corp , エスペック株式会社
发明人： KANDA TOSHIRO
IPC分类号： F27D9/00 , C03B25/02 , H01J7/24
摘要： PROBLEM TO BE SOLVED: To provide a plate cooling device smoothly cooling plates subjected to heat treatment and a heat treatment system equipped with the plate cooling device. SOLUTION: The plate cooling device 10 includes a plate arrangement part 15 in which a substrate W as a cooling target is arranged; a pair of blowout ports 30, 30 arranged to sandwich the substrate W disposed in the plate arrangement part 15 from lateral sides and having air blowout directions opposing to each other; air blowers 17 for blowing air to the blowout ports 30, 30; and a control part for controlling the air blowers 17. The substrate W arranged in the plate arrangement part 15 is cooled by the air blown out of the pair of blowout ports 30, 30. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种平板冷却装置平滑地进行热处理的冷却板和配备有板冷却装置的热处理系统。解决方案：板冷却装置10包括布置有作为冷却对象的基板W的板配置部15; 一对排出口30,30，其布置成从侧面夹着设置在板配置部15中的基板W，并具有彼此相对的空气吹出方向; 用于向吹出口30,30吹送空气的鼓风机17; 以及用于控制鼓风机17的控制部分。布置在板装配部分15中的基板W被从一对吹出口30,30吹出的空气冷却。版权所有（C）2010，JPO＆INPIT

7. 发明专利

JP2007139234A Heat treatment apparatus 审中-公开
标题翻译：热处理设备
公开(公告)号：JP2007139234A
公开(公告)日：2007-06-07
申请号：JP2005330544
申请日：2005-11-15
申请人： Espec Corp , エスペック株式会社
发明人： KANDA TOSHIRO , NAGANO YUKIO , ASHIDA KENJI
IPC分类号： F27D5/00
摘要： PROBLEM TO BE SOLVED: To provide a heat treatment apparatus capable of stacking in a high density state and heat-treating the objects to be heated.
SOLUTION: The heat treatment apparatus 1 is provided with a rack 10 in the interior of a heating chamber 3a. Multiple shelf members 20 are stacked in a frame member 11 of the rack 10. The shelf member 20 has a base part 21, and placement part 22b with a relative position, with respect to the base part 21 deviated upward. When the shelf members 20 are stacked vertically, a gap allowing placement of a substrate W is formed between placement parts 22b, 22b. A region, allowing the insertion and withdrawal of a robot hand, is formed on a side of the placement part 22b.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够以高密度状态堆叠并对被加热物进行热处理的热处理装置。解决方案：热处理设备1在加热室3a的内部设置有齿条10。多个搁架构件20堆叠在架子10的框架构件11中。搁架构件20具有基部21和相对于基部21向上偏移的相对位置的放置部22b。当搁板构件20垂直堆叠时，在放置部分22b，22b之间形成允许放置衬底W的间隙。在放置部22b的一侧形成有允许机器人手的插入和取出的区域。版权所有（C）2007，JPO＆INPIT

8. 发明专利

JP2007085702A Glass substrate treating device, glass substrate treating system and glass substrate treating method 审中-公开
标题翻译：玻璃基板处理装置，玻璃基板处理系统和玻璃基板处理方法
公开(公告)号：JP2007085702A
公开(公告)日：2007-04-05
申请号：JP2005278272
申请日：2005-09-26
申请人： Espec Corp , エスペック株式会社
发明人： KANDA TOSHIRO , NAGANO YUKIO , ASHIDA KENJI
IPC分类号： F27B9/36 , F27B9/10 , F27B9/24 , F27D7/04 , F27D11/02 , G02F1/13
CPC分类号： Y02P40/57
摘要： PROBLEM TO BE SOLVED: To provide a glass substrate treating device miniaturizable in outline by shortening a heat treating time of a glass substrate to reduce the storage number of glass. SOLUTION: The glass substrate treating device 1 has a heating chamber 2 whose six sides are covered with heat insulating walls 3 formed of a well-known heat insulating material. An exhaust duct 21 is mounted to the heating chamber 2. The exhaust duct 21 is connected to the top face of the heating chamber 2. A substrate placing member 30 and a plurality of halogen heaters 31 are provided in the heating chamber 2. The glass substrate 32 is heated mainly by the halogen heaters 31. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决的问题：通过缩短玻璃基板的热处理时间来缩小玻璃的储存数量来提供可缩小的玻璃基板处理装置。玻璃基板处理装置1具有加热室2，该加热室6的六边被由公知的绝热材料形成的绝热壁3覆盖。排气管21安装在加热室2上。排气管21与加热室2的顶面连接。在加热室2内设置基板载置件30和多个卤素加热器31。基板32主要由卤素加热器31加热。版权所有（C）2007，JPO＆INPIT

9. 发明专利

JP2009281653A Heat treatment apparatus 有权
标题翻译：热处理设备
公开(公告)号：JP2009281653A
公开(公告)日：2009-12-03
申请号：JP2008133512
申请日：2008-05-21
申请人： Espec Corp , エスペック株式会社
发明人： KANDA TOSHIRO
IPC分类号： F27D7/06 , F27B17/00 , H01J9/227
摘要： PROBLEM TO BE SOLVED: To provide a heat treatment apparatus hardly causing leakage of produced gas or sublimates, generated by heat treatment accompanying opening and closing of a conversion port.
SOLUTION: Four conversion ports 18a-18d are vertically arranged on a front face 13b of a heat treatment chamber 13 comprising the heat treatment apparatus 1. An exhaust port 21 is provided on a bottom face 13a of the heat treatment chamber 13, and an exhaust apparatus 11 is connected to it. In the exhaust apparatus 11, output is enhanced during a period wherein the conversion ports 18c, 18d provided in an upper region X2 are in opened states than during a period wherein the conversion ports 18a, 18b provided in a region X1 in a bottom face 13a side of the heat treatment chamber 13 are in opened states. When the conversion ports 18c, 18d are in the opened states, therefore, a hydrostatic pressure of the region X2 is the same or lower than an outside air pressure Pc, and the leakage of air including the produced gas is prevented.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种几乎不会由于转换口的打开和关闭而通过热处理而产生的产生的气体或升华物的泄漏的热处理装置。解决方案：四个转换口18a-18d垂直地布置在包括热处理设备1的热处理室13的前表面13b上。排气口21设置在热处理室13的底面13a上，排气装置11与其连接。在排气装置11中，在设置在上部区域X2中的转换端口18c，18d处于打开状态的期间，输出增强，其中设置在底面13a中的区域X1中的转换端口18a，18b 热处理室13的一侧处于打开状态。因此，当转换口18c，18d处于打开状态时，区域X2的静水压力与外部空气压力Pc相同或更低，并且防止包括所产生的气体的空气泄漏。版权所有（C）2010，JPO＆INPIT

10. 发明专利

JP2010133647A Heat treatment device 有权
标题翻译：热处理装置
公开(公告)号：JP2010133647A
公开(公告)日：2010-06-17
申请号：JP2008310270
申请日：2008-12-04
申请人： Espec Corp , エスペック株式会社
发明人： KANDA TOSHIRO , SAKONAKA KAZUHIRO
IPC分类号： F27D7/02 , F27B17/00 , F27D7/06 , F27D19/00
摘要： PROBLEM TO BE SOLVED: To improve a heat treatment device for performing heat treatment of a heated object such as a substrate by hot air, and develop a heat treatment device capable of suppressing temperature fluctuation within a heating chamber accompanying opening/closing of an opening/closing door.
SOLUTION: An exhaust duct 30 is provided in a heat treatment chamber, and an air blower 8 is provided in the middle of the exhaust duct 30. To discharge gas generated when the substrate is heated to outside, the air blower 8 is operated all the time. Although pressure within the heat treatment device 1 tends to become negative pressure, a state where a pressure difference is hardly generated between inside and outside of the heat treatment device 1 can be achieved by providing a ventilation device 61. Accordingly, the heat treatment device 1 includes a pressure sensor for sensing internal pressure, feeds back a signal of the pressure sensor to an actuator 73 and adjusts an effective opening of the ventilation device 61 by moving a sheet 66 upwardly so as to control ventilation amount.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了改善用于通过热空气对诸如基板的被加热物体进行热处理的热处理装置，并且开发出能够抑制加热室内随着打开/关闭的温度波动的热处理装置一个开/关门。解决方案：排气管道30设置在热处理室中，并且在排气管道30的中间设置鼓风机8.为了将衬底被加热到外部时产生的气体排出，鼓风机8是一直运行尽管热处理装置1内的压力趋向于变为负压，但是可以通过设置通风装置61来实现热处理装置1的内部和外部之间几乎不产生压力差的状态。因此，热处理装置1 包括用于感测内部压力的压力传感器，将压力传感器的信号反馈到致动器73，并通过向上移动片材66来调节通风装置61的有效开口，从而控制通风量。版权所有（C）2010，JPO＆INPIT

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