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1. 发明专利

JP2014187367A Semiconductor manufacturing device engineering system 有权
标题翻译： SEMICONDUCTOR MANUFACTURING DEVICE ENGINEERING SYSTEM
公开(公告)号：JP2014187367A
公开(公告)日：2014-10-02
申请号：JP2014070496
申请日：2014-03-28
申请人： Ebara Corp , 株式会社荏原製作所
发明人： KOGURE NAOAKI , TSUJIMURA MANABU , ISOBE SOICHI , OIKAWA FUMITOSHI , SUGITA KENICHI , SONE CHUICHI , MINAMI YOSHIO
IPC分类号： H01L21/02 , B08B1/04 , B24B37/34 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To reduce utility of power and the like at operation stop.SOLUTION: A semiconductor wafer W is held between a polishing pad 16 attached to a rotary surface plate 17 of a CMP device 1 and a top ring 18, and relatively rotated and polished. A rinse water flow rate adjustment valve 13 is provided in a rinse water supply pipe 11, and pure water is intermittently supplied to the polishing pad 16 in a polishing part 2 to keep it in a humid condition. The polished semiconductor wafer W is held by cleaning sponge rollers 26 and 27, cleaned, and transported to a cleaning part 3. The rinse water supply pipes 12a and 12b are provided with rinse water flow rate adjustment valves 14 and 14, and pure water is intermittently supplied to the cleaning sponge rollers 26 and 27 to keep them in a humid condition. When a supply interval of the pure water is defined as t minutes, and a supply duration time period of the pure water for each time is defined as dt seconds, the following formula (1): dt=20{1.6-exp(-0.01783 t)}, and the following formula (2): 10≤t≤30 are satisfied.
摘要翻译：要解决的问题：减少操作停止时的功率等的实用性。解决方案：将半导体晶片W保持在附接到CMP装置1的旋转表面板17的抛光垫16和顶环18之间，旋转和抛光。冲洗水流量调节阀13设置在冲洗水供给管11中，并将纯水间歇地供给到抛光部2中的研磨垫16，使其处于潮湿状态。抛光的半导体晶片W由清洁海绵辊26和27保持，清洁并运送到清洁部分3.冲洗水供应管12a和12b设置有漂洗水流量调节阀14和14，纯水是间歇地供应到清洁海绵辊26和27以使它们保持在潮湿状态。当纯水的供给间隔定义为t分钟，并且每次将纯水的供应持续时间段定义为dt秒时，下式（1）：dt = 20 {1.6-exp（-0.01783 t）}，满足下式（2）：10≤t≤30。

2. 发明专利

JP2013070102A Exhaust device of substrate processing apparatus, and system 审中-公开
标题翻译：基板加工装置的排气装置和系统
公开(公告)号：JP2013070102A
公开(公告)日：2013-04-18
申请号：JP2013008534
申请日：2013-01-21
申请人： Ebara Corp , 株式会社荏原製作所
发明人： KOGURE NAOAKI , TSUJIMURA MANABU , ISOBE SOICHI , OIKAWA FUMITOSHI , SUGITA KENICHI , SONE CHUICHI , MINAMI YOSHIO
IPC分类号： H01L21/304 , B24B37/34
摘要： PROBLEM TO BE SOLVED: To reduce a utility such as power used when operation is stopped.SOLUTION: In the exhaust device of the substrate processing apparatus, a semiconductor wafer W is held between a polishing pad 16 and a top ring 18 mounted on a rotary surface plate 17 of a CMP device 1, and is relatively rotated to polish the wafer W. A rinse water flow rate regulating valve 13 is provided in a rinse water supply pipe 11, and pure water is intermittently supplied to the polishing pad 16 in a polishing portion 2 to maintain the polishing pad in a wet state. In a washing portion 3, the polished semiconductor wafer W is sandwiched between washing sponge rollers 26 and 27, and is washed and is conveyed. Rinse water flow rate regulating valves 14 and 14 are provided in rinse water supply pipes 12a and 12b, and pure water is intermittently supplied to the washing sponge rollers 26 and 27 to maintain the washing sponge rollers in a wet state. If a pure water supply interval is set to be t minutes and a pure water continuous supply period of time of each time is set to be dt seconds, the exhaust device satisfies the following expression (1): dt=20{1.6-exp(-0.01783t)} and the expression (2): 10≤t≤30.
摘要翻译：要解决的问题：减少操作停止时使用的功率等效用。解决方案：在基板处理装置的排气装置中，将半导体晶片W保持在抛光垫16和安装在CMP装置1的旋转表面板17上的顶环18之间，并相对旋转至抛光冲洗水流量调节阀13设置在冲洗水供给管11中，并且在抛光部2中间歇地向抛光垫16供给纯水，以将抛光垫保持在湿润状态。在洗涤部分3中，抛光的半导体晶片W夹在洗涤海绵辊26和27之间，并被洗涤并被输送。冲洗水流量调节阀14和14设置在冲洗水供给管12a和12b中，并且将纯净水间歇地供给到洗涤海绵辊26和27，以将洗涤海绵辊保持在湿润状态。如果将纯水供给间隔设定为t分钟，将每次的纯水连续供给时间段设定为dt秒，则排气装置满足下式（1）：dt =20ä1.6-exp（ -0.01783t）}和表达式（2）：10≤t≤30。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2012107343A Anode holder, and plating apparatus 有权
标题翻译：阳极灯座和电镀设备
公开(公告)号：JP2012107343A
公开(公告)日：2012-06-07
申请号：JP2012040902
申请日：2012-02-28
申请人： Ebara Corp , 株式会社荏原製作所
发明人： YAHAGI MITSUTOSHI , ABE KENICHI , ARAKI YUJI , MINAMI YOSHIO , NAGAYUMI TOMOYASU
IPC分类号： C25D17/12 , C25D17/00
摘要： PROBLEM TO BE SOLVED: To provide an anode holder that reliably allows an anode to be energized, facilitates replacement of the anode and improves the efficiency of operation time in replacing the anode.SOLUTION: The anode holder 10 includes: an anode holder base 11 for storing the anode 5; and an anode mask 13 that is mounted on the front surface side of the anode holder base 11 and partially covers the anode 5.
摘要翻译：要解决的问题：为了提供可靠地允许阳极通电的阳极保持器，便于更换阳极并且提高更换阳极时的操作时间的效率。阳极保持器10包括：用于存储阳极5的阳极保持器基座11; 以及阳极掩模13，其安装在阳极保持器基座11的前表面侧并部分地覆盖阳极5.版权所有（C）2012，JPO＆INPIT

4. 发明专利

JP2010084235A Plating apparatus 审中-公开
标题翻译：电镀设备
公开(公告)号：JP2010084235A
公开(公告)日：2010-04-15
申请号：JP2010008086
申请日：2010-01-18
申请人： Ebara Corp , 株式会社荏原製作所
发明人： TAKEMURA TAKASHI , SAITO NOBUTOSHI , KURIYAMA FUMIO , YOSHIOKA JUNICHIRO , HORIE KUNIAKI , MINAMI YOSHIO , KAMODA KENJI
IPC分类号： C25D7/12 , C25D5/02 , H01L21/60
CPC分类号： H01L2224/1146 , H01L2224/1147 , H01L2924/01078
摘要： PROBLEM TO BE SOLVED: To provide a wholly compacted plating apparatus that employs a dipping method in which air bubbles can be relatively easily liberated, and that can automatically form a plated film suitable for forming a protruding electrode such as a bump. SOLUTION: The plating apparatus has a plurality of plating tanks 414a, 414b and 414c, and the plated film is formed on a surface of a substrate sequentially in different plating tanks, while a single plating power source 416 passes an electric current between the substrate and an anode of the plating tank in which the substrate has been stored. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种采用其中相对容易释放气泡的浸渍方法的全压制电镀装置，并且可以自动形成适于形成诸如凸块的突出电极的电镀膜。电镀装置具有多个电镀槽414a，414b和414c，并且电镀膜顺序地形成在不同电镀槽中的基板的表面上，而单个电镀电源416之间通过电流所述基板和所述基板已被储存在所述镀槽中的阳极。版权所有（C）2010，JPO＆INPIT

5. 发明专利

JP2003247098A PLATING DEVICE 审中-公开
公开(公告)号：JP2003247098A
公开(公告)日：2003-09-05
申请号：JP2002044978
申请日：2002-02-21
申请人： EBARA CORP
发明人： MINAMI YOSHIO
IPC分类号： C25D7/12 , C25D21/08 , H01L21/02
摘要： PROBLEM TO BE SOLVED: To provide a plating device which can reduce the load on a plating solution by reducing the volume of the plating solution which is adhered to a substrate holder and taken out of a plating tank. SOLUTION: In the plating device to perform the plating which has the substrate holder 18 to seal an outer peripheral part and a back side of the substrate in an airtight manner, expose a face side thereof and hold the substrate, and immerses the substrate holder 18 in the plating solution held in the plating tank (a plating unit 38), a cleaning device 410 is provided, which blows a fluid toward the substrate holder 18 above the plating tank (the plating unit 38) to clean off the plating solution stuck to the substrate holder 18, and returns the plating solution to the plating tank (the plating unit 38). COPYRIGHT: (C)2003,JPO

6. 发明专利

JPH03217665A HIGH PRESSURE PUMP 失效
公开(公告)号：JPH03217665A
公开(公告)日：1991-09-25
申请号：JP1270290
申请日：1990-01-24
申请人： EBARA CORP
发明人： MINAMI YOSHIO , YOKOI KEIJI
IPC分类号： F04B53/00
摘要： PURPOSE:To prevent wear dust from being mixed with discharge fluid from a pump by providing a spill back line through which a part of fluid is discharged out at the discharge stroke of the pump, and thereby discharging wear dust which is produced during the discharge stroke, out of the pump through the spill back line. CONSTITUTION:Since fluid sucked in a pump 20 stirs the inside of a pump chamber (C) while wear dust adhered onto the surface of a planger 2 and wear dust which comes into the pump chamber (c) from the back face of a seal, are brought into a condition where they float in the fluid within the pump chamber (c). In this case, fluid is supplied to the pump chamber (c) through an over-flow line 32 during a suction stroke and a standby stroke, surplus fluid is discharged out of the pump 20 so that wear dust will never be mixed with discharge fluid. Furthermore, a spill back line 38 through which a part of fluid to be discharged out is discharged out of the pump, is provided for the discharge stroke of the pump 20, and the port of the line 38 is formed at a place close to a high pressure seal so that wear dust thereby flows into the line 38 before it comes up to a discharge port.

7. 发明专利

JP2010185122A Member for passing electric current to anode holder, and anode holder 有权
标题翻译：将电流通入阳极支架和阳极支架的会员
公开(公告)号：JP2010185122A
公开(公告)日：2010-08-26
申请号：JP2009031526
申请日：2009-02-13
申请人： Ebara Corp , 株式会社荏原製作所
发明人： KAMIMURA KENJI , SAITO NOBUTOSHI , MINAMI YOSHIO
IPC分类号： C25D17/12 , C25D7/12 , C25D17/10 , C25D21/00
摘要： PROBLEM TO BE SOLVED: To provide a member for passing an electric current to an anode holder, which can uniformly pass the electric current over the whole anode, can uniformly dissolve the anode and can stably hold the anode, and to provide an anode holder. SOLUTION: The member 1 for passing the electric current to the anode holder, which is used in a plating apparatus in which a substrate and the anode are vertically arranged in a plating tank so as to face each other, and supplies the electric current to the anode 5, includes: a contact member 2 which can come in contact with substantially the entire surface of the rear face of the anode 5 and is made from a discoidal electroconductive material; and a connecting member 3 which connects the contact member 2 with a power feeding part of the plating apparatus and is made from an electroconductive material. The connecting member 3 extends from the center of the rear face of the face at which the contact member 2 comes in contact with the anode 5. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了使能够均匀地使整个阳极上的电流通过阳极保持器的电流的构件能够均匀地溶解阳极并且可以稳定地保持阳极，并且提供一种阳极座
解决方案：用于将电流传递到阳极保持器的构件1，其用于将基板和阳极垂直布置在电镀槽中以彼此面对的电镀设备中，并将电电流到阳极5包括：接触构件2，其可以与阳极5的背面的基本上整个表面接触并且由盘状导电材料制成; 以及连接构件3，其将接触构件2与电镀装置的供电部分连接并由导电材料制成。连接构件3从接触构件2与阳极5接触的面的背面的中心延伸。（C）2010，JPO＆INPIT

8. 发明专利

JP2002363793A SUBSTRATE HOLDER AND PLATING DEVICE 失效
公开(公告)号：JP2002363793A
公开(公告)日：2002-12-18
申请号：JP2001167369
申请日：2001-06-01
申请人： EBARA CORP
发明人： MINAMI YOSHIO
IPC分类号： C25D17/06 , C25D17/08 , H01L21/288 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide a substrate holder capable of surely preventing leakage of a plating liquid from a space between a seal ring and a support to which the seal ring is attached, or the like. SOLUTION: In the substrate holder which holds a substrate so as to be freely attached and detached by disposing the substrate between a fixed holding member and a seal packing attached to a movable holding member, and pressing the seal packing mentioned above toward the fixed holding member mentioned above, the seal packing above is attached to the movable holding member above by engaging an engaging part provided at the seal packing and an engaging part provided at the movable holding member to each other.

9. 发明专利

JPH09158702A COOLING HOLE RE-MACHINING METHOD OF ENGINE PARTS, AND COOLING HOLE RE-MACHINING DEVICE TO BE USED IN THE METHOD 失效
公开(公告)号：JPH09158702A
公开(公告)日：1997-06-17
申请号：JP32089695
申请日：1995-12-08
申请人： ISHIKAWAJIMA HARIMA HEAVY IND , EBARA CORP
发明人： MASAKI AKITATSU , SATO TAKESHI , SHINOHARA KENICHI , NISHIGORI KENJI , MINAMI YOSHIO
IPC分类号： B23P17/00 , F01D5/18 , F01D25/00 , F02C7/00
摘要： PROBLEM TO BE SOLVED: To re-machine cooling holes with excellent workability and accuracy without deteriorating the adhesivity of a coating layer in the vicinity of an opening part of the cooling holes. SOLUTION: After the heat resistant coating is executed to an engine parts (turbine blade 1) in which a large number of cooling holes 2 are formed, an opening edge part of the cooling holes is re-machined to the prescribed dimension, the fluid of very high pressure flow out from a cooling fluid feed passage 3 which is provided in the engine parts (turbine blade 1) and communicated with the cooling holes 2 outward of the cooling holes 2 to remove the coating material entered into the opening edge part.

10. 发明专利

JPH07148665A WASTE LIQUID DISPOSAL DEVICE FOR WATER JET MACHINING DEVICE 失效
公开(公告)号：JPH07148665A
公开(公告)日：1995-06-13
申请号：JP32102093
申请日：1993-11-26
申请人： EBARA CORP
发明人： SUZUKI YASUHIKO , KOIWAI HIDEO , MINAMI YOSHIO
IPC分类号： B24C9/00
摘要： PURPOSE:To recover abrasive accumulated in a water jet receiving tank without the interruption of water jet and manual help so as to easily improve water quality before the discharge of waste liquid and to enable disposal without producing secondary waste while preventing the wear and damage of the impeller and the like of a pump. CONSTITUTION:A waste liquid disposal device for a water jet machining device is provided with a water receiving tank 5 for receiving a solid-liquid mixed fluid from a nozzle 22, ejectors 8, 18, a separator 12, a small tank 17, and precipitators 1, 20. Supernatant liquid in the precipitator 1 is sucked by a centrifugal pump 2 and fed to the water receiving tank 5 and the small tank 17. In the water receiving tank 5, the supernatant liquid is sprayed (23) to wash away waste liquid and solid containing abrasive stuck to a bottom plate 9 and sucked together with the solid containing abrasive by the ejector 8 so as to be fed to the separator 12. In the small tank 17, the supernatant liquid is sucked by the ejector 18 together with solid containing abrasive sunk to the bottom part and fed to the separator 12.

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