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1. 发明专利

JP2003163195A SUBSTRATE TREATMENT UNIT 审中-公开
公开(公告)号：JP2003163195A
公开(公告)日：2003-06-06
申请号：JP2001360834
申请日：2001-11-27
申请人： EBARA CORP
发明人： ITO KENYA , INOUE KATSUTAKA
IPC分类号： H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a substrate treatment unit in which fine particles on the surface of the substrate, especially fine particles entering recesses formed the surface, can be removed sufficiently. SOLUTION: The substrate treatment unit comprises a mechanism 5 for supporting a substrate W, an oscillator 3 having a first face 11 disposed oppositely to the surface WA of the substrate supported by the supporting mechanism, pips 6, 28 and 29 for supplying treatment liquid Q between the surface of the substrate and the first face of the oscillator, and a shaker 2 for shaking the oscillator in the direction along the surface of the substrate. COPYRIGHT: (C)2003,JPO

2. 发明专利

JP2003100687A SUBSTRATE TREATING DEVICE AND ITS CLEANING METHOD 审中-公开
公开(公告)号：JP2003100687A
公开(公告)日：2003-04-04
申请号：JP2001289522
申请日：2001-09-21
申请人： EBARA CORP
发明人： FUKUNAGA AKIRA , INOUE KATSUTAKA
IPC分类号： B08B3/02 , B08B3/08 , H01L21/304 , H01L21/306
摘要： PROBLEM TO BE SOLVED: To make the hydrophilic properties of constituent members using hydrophilic members (hydrophilic members) of a substrate treating device maintainable without removing the members from the device nor stopping the device. SOLUTION: The substrate treating device has a substrate holding section 12 which rotates a substrate W while holding the substrate W and treats the substrate W held by means of the section 12 by supplying a treating liquid. The device uses hydrophilic members 40a-40d on at least the surfaces of the constituent members 16, 18, 22, and 24 to which the treating liquid adheres at the time of treating the substrate W by supplying the treating liquid. At the same time, the device is provided with a cleaning solution supply section 42 which supplies the treating liquid to the surfaces of the members 40a-40d.

3. 发明专利

JP2002280344A SUBSTRATE PROCESSOR 失效
公开(公告)号：JP2002280344A
公开(公告)日：2002-09-27
申请号：JP2001075665
申请日：2001-03-16
申请人： EBARA CORP
发明人： ITO KENYA , INOUE KATSUTAKA
IPC分类号： B08B1/04 , B08B3/02 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a substrate processor capable of simultaneously performing a processing, such as scrub washing to the front surface and back surface of a substrate without damaging the circuits formed on the substrate. SOLUTION: This substrate processor is provided with a rotation support body 7 for supporting and rotating a disk-like substrate W having the front surface Wa and the back surface Wb, a first roll 1 which is in slidable contact with the front surface Wa, while being rotated around a first rotary axis Ax1 and a second roll 2 to be in slidable contact with the back surface Wb, and while being rotated around a second rotary axis Ax2 provided facing the first roll 1, so as to hold the substrate W therebetween, for which the second rotary axis Ax2 is almost parallel to the first rotary axis Ax1. At least one of the first roll 1 and the second roll 2 is constituted, so as to make the length in the direction of the rotary axis Ax1 or Ax2 of the roll at a part, to be in slidable contact cover only the outer peripheral part of the substrate W.

4. 发明专利

JP2004084056A Electroless plating apparatus and post-electroless plating cleaning method 有权
公开(公告)号：JP2004084056A
公开(公告)日：2004-03-18
申请号：JP2003024944
申请日：2003-01-31
申请人： Ebara Corp , 株式会社荏原製作所
发明人： KATAKABE ICHIRO , INOUE KATSUTAKA , O CHIKAAKI , TAKAGI DAISUKE
IPC分类号： B08B1/04 , C23C18/16 , C23C18/32 , H01L21/00 , H01L21/288 , H01L21/304
CPC分类号： H01L21/67051 , B08B1/04 , C23C18/1632 , C23C18/1689 , C23C18/1893 , C23C18/32 , C23C18/50 , H01L21/67046
摘要： PROBLEM TO BE SOLVED: To provide a technique for removing particles of Co and Ni produced by electroless plating and present on a silicon thermal oxidation film after formation of Cu wiring without affecting the wiring. SOLUTION: An electroless plating apparatus where electroless plating is applied to the surface of wiring in an electronic circuit substrate formed with fine circuit patterns by electroconductive metal wiring is provided with: a substrate transfer means; a loading station arranged in association with the substrate transfer means; one or more electroless plating cells 5 arranged in association with the substrate transfer apparatuses 3a, 3b and 3c; and cleaning devices 6 and 7 arranged in association with the substrate transfer apparatuses and performing cleaning in which cleaning members move to the same direction to scrub substrate surfaces, or cleaning in which the cleaning members rotationally move to a horizontal direction to scrub the substrate surfaces and/or solution cleaning. The particles of Co and Ni produced by electroless plating are removed without affecting the wiring. COPYRIGHT: (C)2004,JPO

5. 发明专利

JP2003007666A Substrate-cleaning device 审中-公开
标题翻译：基板清洗装置
公开(公告)号：JP2003007666A
公开(公告)日：2003-01-10
申请号：JP2001195267
申请日：2001-06-27
申请人： Ebara Corp , 株式会社荏原製作所
发明人： ITO KENYA , INOUE KATSUTAKA
IPC分类号： H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a substrate-cleaning device which can clean a substrate in a cleaning time shorter than that of a pencil type prior art scrub cleaning device, in which a cleaning tool cleans a substrate, while being rocked by a rocking arm.
SOLUTION: The substrate-cleaning device, which cleans a substrate 11 rotatably held by a substrate-holding/rotating mechanism 12, with the use of a cleaning tool 14 slidably contacted with a surface of the substrate, includes a first axis A passed through the center of the cleaning tool 14, a second axis B parallel to a first axis A, a cleaning tool revolving mechanism for causing the cleaning tool 14 to revolve around a second axis B, and a cleaning tool revolving mechanism, causing the cleaning tool 14 to revolve about the first axis.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：提供一种基板清洁装置，其清洁时间短于铅笔型现有技术洗刷装置的清洗时间，其中清洁工具清洗基板，同时被摇臂摇动。解决方案：使用与基板的表面可滑动接触的清洁工具14，清洁由基板保持/旋转机构12可旋转地保持的基板11的基板清洁装置包括穿过基板保持/旋转机构12的第一轴线A 清洁工具14的中心，平行于第一轴线A的第二轴线B，用于使清洁工具14围绕第二轴线B旋转的清洁工具旋转机构，以及清洁工具回转机构，围绕第一轴旋转。

6. 发明专利

JP2001053047A CLEANING EQUIPMENT FOR SEMICONDUCTOR SUBSTRATE AND CLEANING METHOD THEREOF 失效
公开(公告)号：JP2001053047A
公开(公告)日：2001-02-23
申请号：JP22935699
申请日：1999-08-13
申请人： EBARA CORP , TOSHIBA CORP
发明人： TOMITA HIROSHI , NADAHARA SOICHI , SHIRAKASHI MICHIHIKO , ITO KENYA , INOUE KATSUTAKA
IPC分类号： B08B3/12 , H01L21/304 , H01L21/306
摘要： PROBLEM TO BE SOLVED: To remove contaminate adhering to the front and rear surfaces of a semiconductor substrate efficiently. SOLUTION: The equipment consists of a single ultrasonic wave oscillating nozzle which is placed near the circumferential end of a Si wafer 1 to be cleaned apart from the Si wafer 1 and which supplies a cleaning solution 5 onto the front and rear surfaces of the Si wafer 1, an ultrasonic oscillator 6 which applies ultrasonic waves to the front and rear surfaces of the Si wafer 1, and four drive rollers 2 which are arranged in contact with the circumferential end of the Si wafer 1 and rotate as they remain pressed against the circumferential end of the Si wafer, by which the Si wafer 1 is held and rotated.

7. 发明专利

JP2004235216A Substrate processor and substrate processing method 有权
标题翻译：基板处理器和基板处理方法
公开(公告)号：JP2004235216A
公开(公告)日：2004-08-19
申请号：JP2003018792
申请日：2003-01-28
申请人： Ebara Corp , 株式会社荏原製作所
发明人： KAJITA SHINJI , KATAKABE ICHIRO , ONO HARUKO , INOUE KATSUTAKA , TAKEDA SACHIKO
IPC分类号： H01L21/306 , H01L21/00 , H01L21/304
CPC分类号： H01L21/67051
摘要： PROBLEM TO BE SOLVED: To prevent contamination of a substrate due to a substrate processing liquid, mist and the like, and to make continuously performable a series of chemical processings including spin drying of the substrate with the same device.
SOLUTION: The processor is provided with a substrate holder 16 holding and rotating the substrate, a spatter prevention cup 18 surrounding a periphery of the substrate W held by the substrate holder 16 and preventing spatter of substrate processing liquid supplied to the substrate W, and a scattering prevention cup cleaning part 44 cleaning the inner wall face of the scattering prevention cup 18. The scattering prevention cup 18 can freely move upward/downward among a lower substrate transfer position, an upper scattering prevention position and a cleaning position between them.
COPYRIGHT: (C)2004,JPO&NCIPI
摘要翻译：要解决的问题：为了防止由于基板处理液体，雾等引起的基板的污染，并且使得能够连续地执行一系列化学处理，包括用相同的装置旋转基板的干燥。解决方案：处理器设置有保持和旋转基板的基板保持器16，围绕由基板保持器16保持的基板W的周边的防溅杯18，并防止提供给基板W的基板处理液的飞溅以及清除散射防止杯18的内壁面的散射防止杯清洁部44.防散射杯18可以在下基板转印位置，上部散射防止位置和它们之间的清洁位置之间自由移动。版权所有（C）2004，JPO＆NCIPI

8. 发明专利

JP2003124180A SUBSTRATE PROCESSOR 审中-公开
公开(公告)号：JP2003124180A
公开(公告)日：2003-04-25
申请号：JP2001317865
申请日：2001-10-16
申请人： EBARA CORP
发明人： ITO KENYA , KAMEZAWA MASAYUKI , INOUE KATSUTAKA , KIHARA SACHIKO
IPC分类号： H01L21/683 , C23F1/00 , H01L21/00 , H01L21/304 , H01L21/306 , H01L21/3213 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To provide a substrate processor where all parts of a substrate required to be processed can be processed in short time and the invasion of processing liquid into the parts of the substrate, which are not required to be processed, can be prevented. SOLUTION: The processor is provided with a substrate holding part 1 holding and rotating the substrate W, a lower face processing part 2 supplying processing liquid to the lower face of the substrate W held by the substrate holding part 1 and processing the lower face of the substrate W, an outer peripheral edge processing part 3 supplying processing liquid to the outer peripheral edge of the substrate held by the substrate holding part 1 and processing the outer peripheral edge of the substrate W, a processing liquid supply part 4 supplying processing liquid to the lower face processing part 2 and the outer peripheral edge processing part 3, and a gas supply source 5 supplying prescribed gas to the upper face of the substrate W held by the substrate holding part 1.

9. 发明专利

JP2001007069A SUBSTRATE CLEANER 失效
公开(公告)号：JP2001007069A
公开(公告)日：2001-01-12
申请号：JP17122399
申请日：1999-06-17
申请人： EBARA CORP
发明人： SOTOZAKI HIROSHI , ATO KOJI , INOUE KATSUTAKA , INOUE TATSUO
IPC分类号： H01L21/304 , B08B1/00 , B08B1/04 , B08B3/02 , H01L21/00
摘要： PROBLEM TO BE SOLVED: To enable selection of scrub cleaning and/or liq. jet cleaning, shorten the cleaning time to improve treatment efficiency, simplify structure and controls and eliminate the need for special self-cleaning facilities, even in a cleaner having both scrub cleaning means and liq. jet cleaning means. SOLUTION: This cleaner comprises a scrub cleaning means 10 for cleaning a wafer W with a cleaning tool 15 contacted thereto, a liq. jet cleaning means 30 for cleaning the wafer W with a cleaning liq. jetted to the wafer from a nozzle 31, an oscillating means 50 for oscillating both the scrub and jet cleaning means 10 and 30 over the wafer W at the same time and a driving means 17 for moving the cleaning tool 15 up vertically to make contact with and leaves from the wafer W surface. Either the cleaning tool 15 or a nozzle 31 is moved up vertically and the tool 15 is oscillated from the position to contact the wafer W surface to the outer side face of the wafer W and moved down to clean the outer side face of the wafer W. The tool 15 is lowered to a position, where the cleaning liq. jetting from the nozzle 31 contacts the tool 15, thereby to make the tool 15 conduct self cleaning.

10. 发明专利

JP2005109362A Processing liquid, and substrate processing method and apparatus using processing liquid 审中-公开
标题翻译：处理液和基板处理方法和使用处理液的装置
公开(公告)号：JP2005109362A
公开(公告)日：2005-04-21
申请号：JP2003343875
申请日：2003-10-01
申请人： Ebara Corp , 株式会社荏原製作所
发明人： KATAKABE ICHIRO , FUKUNAGA AKIRA , INOUE KATSUTAKA
IPC分类号： C23C18/16 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a processing liquid and a substrate processing method and apparatus using the processing liquid whereby any water mark can be suppressed from being formed on the surface of a low-permittivity material (low-k material).
SOLUTION: The processing liquid is the one for processing the substrate wherein a low-permittivity material is exposed to the external at least in a portion of the surface thereof. The processing liquid has at least a hydrophilic group and a hydrophobic group respectively in its one molecule, and includes an organic substance having volatility at a room temperature.
COPYRIGHT: (C)2005,JPO&NCIPI

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