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1. 发明专利

JP2004068740A Resin radiator tank 审中-公开
公开(公告)号：JP2004068740A
公开(公告)日：2004-03-04
申请号：JP2002230932
申请日：2002-08-08
申请人： Denso Corp , 株式会社デンソー
发明人： OKADA EIJI , SAKAI NORIYUKI , ONOE TSUTOMU
IPC分类号： F01P3/18 , F28F9/02
摘要： PROBLEM TO BE SOLVED: To provide a resin radiator tank capable of preventing generation of crack due to snow melting toner and reducing a cost.
SOLUTION: A radiator tank 110 indicated in (a) has a skin resin layer 11 to cover whole surface of a core resin layer 10 as indicated in (b) of a magnification illustration of A part. The core resin layer 10 is made of low cost polyamide 66 material and the skin resin layer 11 is made of polyamide 66/polyamide 612 blending material which is resistant to snow melting toner.
COPYRIGHT: (C)2004,JPO

2. 发明专利

JP2003326539A Resin molded product and manufacturing method therefor 审中-公开
标题翻译：树脂模制产品及其制造方法
公开(公告)号：JP2003326539A
公开(公告)日：2003-11-19
申请号：JP2002141065
申请日：2002-05-16
申请人： Denso Corp , 株式会社デンソー
发明人： OZAKA YUJI , SEKO MITSUMASA , ISHIGURO MANABU , ONOE TSUTOMU
IPC分类号： B29C39/26 , B29C39/02 , B29C39/22 , B29C39/38 , B29C44/04 , B29C44/34 , B29C44/58 , B29C45/56 , B29C45/73 , B29K105/04
CPC分类号： B29C44/0446 , B29C44/348 , B29C44/586 , B29C45/56 , B29C45/568 , B29C45/73 , B29C2045/7343 , Y10T428/13 , Y10T428/1352 , Y10T428/1376 , Y10T428/24504 , Y10T428/2495 , Y10T428/249953 , Y10T428/269
摘要： PROBLEM TO BE SOLVED: To provide a resin molded product capable of simplifying a manufacturing process and preventing a foamed resin molded product from becoming large-sized, and a manufacturing method therefor. SOLUTION: After a resin compound 20 containing a foaming agent is injected in the cavity 54 of a mold 5 as shown by Fig.-(a), a moving core part 53 is moved in the direction expanding the cavity 54. By this constitution, a highly foamed part 21 is formed at the expanded region of the cavity 54 to obtain a case 1 wherein the highly foamed part 21 and a low foamed part 22 are integrally formed. COPYRIGHT: (C)2004,JPO
摘要翻译：解决的问题：提供能够简化制造工序并防止发泡树脂成型体变大的树脂成型体及其制造方法。解决方案：如图 - （a）所示，将含有发泡剂的树脂化合物20注入模具5的空腔54之后，移动芯部53沿扩大空腔54的方向移动。通过在该构造中，在空腔54的扩张区域形成高度发泡部21，得到高发泡部21和低发泡部22一体形成的壳体1。版权所有（C）2004，JPO

3. 发明专利

JP2007033411A Sensor device and method for manufacturing sensor device 有权
标题翻译：传感器装置和制造传感器装置的方法
公开(公告)号：JP2007033411A
公开(公告)日：2007-02-08
申请号：JP2005221512
申请日：2005-07-29
申请人： Denso Corp , 株式会社デンソー
发明人： TANAKA MASAAKI , ONOE TSUTOMU
IPC分类号： G01F1/692
CPC分类号： G01F1/6845 , H01L2224/05554 , H01L2224/48091 , H01L2224/48247 , H01L2224/48463 , H01L2224/49171 , H01L2924/10155 , Y10T29/49146 , Y10T29/49171 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a sensor device improved in detection accuracy and provide the sensor device. SOLUTION: The method for manufacturing a heat type flow sensor 100 comprises: a chip forming step of preparing a flow rate detecting chip 10 which is made up by forming a heater 14 on a thin-walled section 13 disposed in a substrate 11; a connection step of connecting a lead 20 to a wiring line 16 of the flow rate detecting chip 10; and a mold step of covering the connection section of the wiring line 16 and the lead 20 with a mold material 40 while exposing the thin-walled section 13 and the heater 14 by injecting the mold material 40 into a die assembly 200. In the mold step, the mold material 40 is injected in such a clamped state that a buffering member 50 which receives a pressure from an upper die 202 and is deformed thereby, is disposed on at least a portion of regions ranging from the thin-walled section 13 and the heater 14 to a boundary line formed by a region covered with the mold material 30 in the flow rate detecting chip 10. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决的问题：提供一种提高检测精度的传感器装置的制造方法，提供传感器装置。解决方案：制造热式流量传感器100的方法包括：制备流量检测芯片10的芯片形成步骤，该流量检测芯片10通过在设置在基板11中的薄壁部分13上形成加热器14 ; 将引线20连接到流量检测芯片10的布线16的连接步骤; 以及模具步骤，通过将模具材料40注入模具组件200中，同时通过模具材料40覆盖布线16和引线20的连接部分，同时暴露薄壁部分13和加热器14.在模具将模具材料40以这样一种夹紧状态注入，即从上模202接受压力并因此变形的缓冲构件50设置在从薄壁部13和加热器14到由流量检测芯片10中的模具材料30覆盖的区域形成的边界线。版权所有（C）2007，JPO＆INPIT

4. 发明专利

JP2006080350A Semiconductor device, and mounting structure thereof 审中-公开
标题翻译：半导体器件及其安装结构
公开(公告)号：JP2006080350A
公开(公告)日：2006-03-23
申请号：JP2004263755
申请日：2004-09-10
申请人： Denso Corp , 株式会社デンソー
发明人： YONEYAMA TAKAO , ONOE TSUTOMU , SUGIYAMA SATOSHI , SATO MOTOKAZU , DEKITA HIROYUKI
IPC分类号： H01L25/18 , H01L25/065 , H01L25/07
CPC分类号： H01L2224/16245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73204 , H01L2924/1305 , H01L2924/13091 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To make unnecessary bending work for a lead frame and realize a highly stable connecting configuration, when mounting on an external substrate a semiconductor device wherein a sensor chip and a circuit chip are laminated on each other and are connected electrically with each other. SOLUTION: With respect to the mounting structure of a semiconductor device 100 wherein a sensor chip 10 and a circuit chip 20 are so laminated on each other and are so connected electrically with each other as to mount the semiconductor device 100 on an external substrate 200, the plane-size of the circuit chip 20 is made larger in the direction of the external substrate surface than the one of the sensor chip 10, and the sensor chip 10 is laminated and mounted on the middle of the surface side of the circuit chip 20, and further in the periphery of the sensor chip 10 present in the surface of the circuit chip 20, the plate thickness of a lead frame 30 which is larger than the one of the sensor chip 10 is so machined partially and thinly as to connect the lead frame 30 with circuit chip 20, and moreover, the semiconductor device 100 is connected with the external substrate 200 via the lead frame 30. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了对引线框架进行不必要的弯曲加工并实现高度稳定的连接构造，当将外部基板上安装传感器芯片和电路芯片彼此层压并连接的半导体器件时彼此电气。解决方案：关于半导体器件100的安装结构，其中传感器芯片10和电路芯片20彼此层叠并且彼此电连接以将半导体器件100安装在外部基板200，电路芯片20的平面尺寸在外部基板表面的方向上比传感器芯片10的尺寸更大，并且传感器芯片10被层叠并安装在该基板200的表面侧的中间电路芯片20，并且在电路芯片20的表面中存在的传感器芯片10的周围，引线框架30的厚度比传感器芯片10的板的厚度被部分地和薄地加工成将引线框架30与电路芯片20连接，此外，半导体器件100经由引线框架30与外部基板200连接。版权所有（C）2006，JPO＆NCIPI

5. 发明专利

JP2006281622A Double resin injection molding method, resin product molded by the method, and regulator case for alternator 审中-公开
标题翻译：双树脂注射成型方法，由该方法模制的树脂产品和用于替代物的调节剂
公开(公告)号：JP2006281622A
公开(公告)日：2006-10-19
申请号：JP2005104889
申请日：2005-03-31
申请人： Denso Corp , 株式会社デンソー
发明人： YANAGI MITSUNORI , ONOE TSUTOMU
IPC分类号： B29C45/14 , B29C33/12 , B29C45/26 , B29L9/00 , B29L31/34 , B60R16/03 , F02B67/00 , F02B77/00
CPC分类号： B29C45/0046 , B29C45/14065 , B29C45/14639 , B29C45/1671 , B60R16/0239
摘要： PROBLEM TO BE SOLVED: To provide a double resin injection molding method which can mold a regulator case 1 for an alternator as a secondary molding by fixing a primary molding 3 surely to the inside of a mold without using a presser pin by using a molten resin packing pressure efficiently.
SOLUTION: When the primary molding 3 is contacted with the molding wall parts 4b and 4c of a fixed mold 4 and a movable mold 5 in a plurality of spots to be positioned, and the molten resin is packed in a cavity W from a gate 11, the arrangement of the gate 11 is set so that the contact state of the primary molding 3 in relation to the molding wall parts 4b and 4c of the fixed mold 4 and the movable mold 5 is held by the molten resin packing pressure applied to the inside of the cavity W. Since the primary molding 3 is held by being contacted with the molding wall parts 4b and 4c of the fixed mold 4 and the movable mold 5, the regulator case 1 for the alternator can be molded by fixing the primary molding 3 surely to the inside of the cavity W without using the presser pin.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决问题的方案：提供一种双树脂注射成型方法，其可以通过将一次成型体3固定到模具内部而不使用压脚通过使用第二模制件来模制用于交流发电机的调节器壳体1作为二次模制熔融树脂包装压力有效。解决方案：当初级模制品3与待定位的多个点中的固定模具4和可移动模具5的模制壁部分4b和4c接触时，熔融树脂被包装在空腔W中门11，门11的布置被设定为使得一次模制品3相对于固定模具4和可移动模具5的模制壁部分4b和4c的接触状态被熔融树脂填充压力施加到空腔W的内部。由于通过与固定模具4的模制壁部分4b和4c以及可移动模具5接触来保持初级模制件3，所以用于交流发电机的调节器壳体1可以通过固定主要成型3一定要到腔W的内部，而不使用压脚。版权所有（C）2007，JPO＆INPIT

6. 发明专利

JP2006147852A Semiconductor device, and method and device for manufacturing the same 有权
标题翻译：半导体器件及其制造方法和器件
公开(公告)号：JP2006147852A
公开(公告)日：2006-06-08
申请号：JP2004335920
申请日：2004-11-19
申请人： Denso Corp , 株式会社デンソー
发明人： NAKAZAWA SHUSAKU , MIZUNO HIROAKI , ONOE TSUTOMU , NASU HIDEHISA
IPC分类号： H01L23/02 , H01L23/29
CPC分类号： H01L24/33 , H01L21/565 , H01L23/4334 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/072 , H01L2224/32245 , H01L2224/33 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2224/49171 , H01L2224/73215 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/181 , H01L2924/1815 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： PROBLEM TO BE SOLVED: To suppress the wearing of a member to be machined when cutting the heat radiation surface of a heat radiation plate for extending a life of the member to be machined, relating to a semiconductor device of which the semiconductor chip sandwiched between a pair of the heat radiation plates is sealed up with a mold resin. SOLUTION: A semiconductor device 100 comprises semiconductor chips 10 and 11, and a pair of heat radiation plates 20 and 30 arranged on both surfaces of the semiconductor chips 10 and 11 to sandwich the semiconductor chips 10 and 11. The entire device is so sealed with a mold resin 80 as to wrap it with heat radiation surfaces 20a and 30a of a pair of heat radiation plates 20 and 30 exposed from the mold resin 80. Side surfaces 20b and 30b of the heat radiation plates 20 and 30 and borders 20c and 30c between the side surfaces 20b and 30b and the heat radiation surfaces 20a and 30a are exposed from the mold resin 80 along the heat radiation surfaces 20a and 30a of the heat radiation plates 20 and 30. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了在切割加热辐射板的散热面以延长待加工构件的寿命时抑制待加工构件的磨损，涉及半导体芯片夹在一对散热板之间用模具树脂密封。解决方案：半导体器件100包括半导体芯片10和11以及布置在半导体芯片10和11的两个表面上以夹持半导体芯片10和11的一对散热板20和30。整个器件是用模制树脂80密封以将其与从模制树脂80暴露的一对散热板20和30的热辐射表面20a和30a包裹。散热板20和30的边缘20b和30b以及边界侧表面20b和30b与散热表面20a和30a之间的20c和30c沿着散热板20和30的散热表面20a和30a从模制树脂80露出。（C） 2006年，JPO＆NCIPI

7. 发明专利

JP2004090239A Resin molding mold 有权
标题翻译：树脂模具
公开(公告)号：JP2004090239A
公开(公告)日：2004-03-25
申请号：JP2002250809
申请日：2002-08-29
申请人： Denso Corp , Toyota Motor Corp , トヨタ自動車株式会社 , 株式会社デンソー
发明人： MOROOKA MASAYOSHI , KAYANO HISASHI , ONOE TSUTOMU , SHIMAZAKI HIROSHI
IPC分类号： B29C45/27 , B29K105/12
摘要： PROBLEM TO BE SOLVED: To provide a resin molding mold which can control the breakage of fibers incorporated as a reinforcing material in a resin at the branching point of a resin supply channel.
SOLUTION: At the branching point 20 where the resin supply channel is branched from a sprue 2 to runners 3, in the inner wall in the extension direction of the sprue 2, an approximately semi-spherical recess 21 for changing the flow direction of a resin is formed. Since the resin flows separately and smoothly while sneaking into the recess 21, the sharp change of the flow direction of the resin is controlled to control the increase in shearing stress, and a space necessary for the rotation etc., of the fibers can be secured when the shearing stress is applied to the fibers.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种可以控制在树脂供应通道的分支点处树脂中作为增强材料引入的纤维的断裂的树脂模塑模具。解决方案：在树脂供给通道从浇口2分支到浇道3的分支点20处，在浇口2的延伸方向的内壁中，形成用于改变流动方向的近似半球形的凹部21 形成树脂。由于树脂在滑入凹部21时分开且平稳地流动，所以控制树脂的流动方向的急剧变化以控制剪切应力的增加，并且可以确保纤维的旋转等所需的空间当剪切应力施加到纤维上时。版权所有（C）2004，JPO

8. 发明专利

JP2003326551A Molding method for hollow resin product and mold therefor 有权
标题翻译：中空树脂产品和模具的成型方法
公开(公告)号：JP2003326551A
公开(公告)日：2003-11-19
申请号：JP2002135468
申请日：2002-05-10
申请人： Denso Corp , 株式会社デンソー
发明人： ICHIKAWA MASATO , KAYANO HISASHI , ONOE TSUTOMU , OSADA KIYOSHI
IPC分类号： B29C45/33 , B29C45/10 , B29C45/14 , B29C45/16 , B29C45/26 , B29L22/00
摘要： PROBLEM TO BE SOLVED: To provide a molding method for a hollow resin product capable of manufacturing the hollow resin product at every shot and capable of preventing a mold for manufacturing the hollow product from becoming large- sized.
SOLUTION: In primary molding, a fixed mold 2, a movable mold 3 and the inside mold 4 provided between the fixed mold 2 and the movable mold 3 so as to advance and retreat are used to form a pair of half hollow molded objects Ch so as to have abutting parts Cha. In secondary molding, the fixed mold 2 and the movable mold 3 are used to abut the abutting parts Cha and these abutting parts Cha are abutted mutually and bonded by a molten resin to obtain the hollow molded object C from a pair of the half hollow molded objects. The molds are clamped in the direction almost crossing the abutting direction of the abutting parts Cha at a right angle.
COPYRIGHT: (C)2004,JPO
摘要翻译：解决的问题：提供一种能够在每次喷射时制造中空树脂产品的中空树脂产品的模制方法，并且能够防止用于制造中空产品的模具变大。解决方案：在一次成型中，使用固定模具2，可移动模具3和设置在固定模具2和可动模具3之间以进退的内模4形成一对半中空成型对象Ch，以便具有邻接部分。在二次成型中，固定模具2和可动模具3用于邻接抵接部分Cha，并且这些抵接部分Cha相互抵靠并由熔融树脂粘合，以从一对半中空模塑制品对象模具沿着与邻接部分Cha的邻接方向成直角的方向被夹紧。版权所有（C）2004，JPO

9. 发明专利

JP2003014553A Temperature sensor and its manufacturing method 有权
标题翻译：温度传感器及其制造方法
公开(公告)号：JP2003014553A
公开(公告)日：2003-01-15
申请号：JP2001195372
申请日：2001-06-27
申请人： Denso Corp , 株式会社デンソー
发明人： ARAI TAKESHI , KONDO KOJI , HARADA TOSHIICHI , ONOE TSUTOMU
IPC分类号： G01K7/02
摘要： PROBLEM TO BE SOLVED: To provide a temperature sensor having a plurality of independent thermocouples whose manufacturing process is not complex and whose costs can be reduced, and to provide a manufacturing method of the temperature sensor.
SOLUTION: First, a one-sided conductor pattern film 11 where a copper wire-like conductor pattern 12 is formed on one surface of a resin film 13 by etching and conductive paste 50 is filled into a via hole 14, and a one-sided conductor pattern film 21 where a nickel wire-like conductor pattern is formed on one surface of a resin film 23 by etching are stacked alternately and are heat-pressed, thus bonding each of the conductor pattern films 11 and 21, at the same time forming a coupling section where a pair of conductor patterns 11 and 21 is electrically connected. Then, the tip side is eliminated up to a position where the coupling section 60 is exposed, thus obtaining a temperature sensor 10 having a plurality of independent paired thermocouples.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：提供一种温度传感器，其具有多个独立的热电偶，其制造过程不复杂并且其成本可以降低，并且提供温度传感器的制造方法。解决方案：首先，通过蚀刻和导电膏50在树脂膜13的一个表面上形成铜线状导体图案12的单面导体图案膜11被填充到通孔14中，并且单面通过蚀刻在树脂膜23的一个表面上形成镍线状导体图案的导体图案膜21交替堆叠并被热压，从而接合每个导体图案膜11和21，同时形成其中一对导体图案11和21电连接的耦合部分。然后，将尖端侧消除到连接部60露出的位置，得到具有多个独立成对的热电偶的温度传感器10。

10. 发明专利

JP2003245980A METHOD FOR JOINING RESIN PRODUCT 审中-公开
公开(公告)号：JP2003245980A
公开(公告)日：2003-09-02
申请号：JP2002333968
申请日：2002-11-18
申请人： DENSO CORP
发明人： ICHIKAWA MASATO , NAKAYAMA TOSHIAKI , KAYANO HISASHI , ONOE TSUTOMU , ISHIGURO MANABU
IPC分类号： B29C45/00 , B29C65/00 , B29C65/42 , B29C65/70 , B29L23/00 , B29L24/00 , F02M35/10 , F02M35/104
摘要： PROBLEM TO BE SOLVED: To prevent a molded product from being deformed or damaged when it is formed and increase the weld strength. SOLUTION: In the method for joining a plurality of molded products 6 and 7 manufactured by a separate process, through a forming process, first only the surfaces 10 and 11 of the joint part 12 of the molded products 6 and 7 to be joined together are heated and then a resin 13 for forming is injected into the joint part 12. COPYRIGHT: (C)2003,JPO

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