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1. 发明专利

JP2012094772A Conductive resin composition for electromagnetic wave shielding material for plasma display panel, method of producing electromagnetic wave shielding material for plasma display panel, and electromagnetic wave shielding material for plasma display panel 审中-公开
标题翻译：用于等离子体显示面板的电磁波屏蔽材料的导电树脂组合物，用于等离子体显示面板的电磁波屏蔽材料的制造方法和用于等离子体显示面板的电磁波屏蔽材料
公开(公告)号：JP2012094772A
公开(公告)日：2012-05-17
申请号：JP2010242566
申请日：2010-10-28
申请人： Dainippon Printing Co Ltd , Harima Chemicals Inc , ハリマ化成株式会社 , 大日本印刷株式会社
发明人： MIYAZAKI YUICHI , KIURA SHINYA , OISHI EIJI , OGAWA TAKAYUKI , OSAKO TAKEHISA , TERADA NOBUHITO , MATSUBA YORISHIGE
IPC分类号： H05K9/00 , C08K3/08 , C08L63/10 , H01B1/20 , H01B5/14 , H01B13/00
摘要： PROBLEM TO BE SOLVED: To provide a conductive resin composition for electromagnetic wave shielding material for plasma display panel which can form a pattern of fine line width with high accuracy, and can reveal excellent electromagnetic wave shielding performance even if the particle size of conductive fine particles is small.SOLUTION: The conductive resin composition for electromagnetic wave shielding material for plasma display panel contains (A) 75.0-90.0 mass% of conductive powder having an average primary particle size of 0.5-2.0 μm, (B) 4.0-7.0 mass% of acrylic resin having a weight-average molecular weight of 50,000-260,000, an epoxy equivalent of 284-946 g/eq, and a hydroxyl value of 58-155 mgKOH/g, and (C) 5.0-15.0 mass% of solvent, and has a viscosity of 30.0 Pa s or lower at a shear velocity of 500 s.
摘要翻译：解决的问题：提供一种等离子体显示面板的电磁波屏蔽材料用导电性树脂组合物，其可以高精度地形成细线宽的图案，并且即使将其粒径导电细颗粒小。解决方案：等离子体显示面板用电磁波屏蔽材料用导电性树脂组合物含有（A）75.0〜90.0质量％的平均一次粒径为0.5〜2.0μm的导电性粉末，（B）4.0〜7.0质量％的丙烯酸树脂，其重均分子量为50,000〜260,000，环氧当量为284-946g / eq，羟值为58-155mgKOH / g，（C）5.0-15.0质量％的溶剂，并且在500s / s的剪切速度下具有30.0Pa s或更低的粘度。版权所有（C）2012，JPO＆INPIT

2. 发明专利

JP2011057859A Low temperature-curable electroconductive paste 有权
标题翻译：低温可固化电焊膏
公开(公告)号：JP2011057859A
公开(公告)日：2011-03-24
申请号：JP2009209245
申请日：2009-09-10
申请人： Harima Chemicals Inc , ハリマ化成株式会社
发明人： OSAKO TAKEHISA , OGAWA TAKAYUKI , MATSUBA YORISHIGE
IPC分类号： C08L63/00 , C08K3/08 , C08K5/541 , C08K7/00 , H01B1/00 , H01B1/22
摘要： PROBLEM TO BE SOLVED: To provide an electroconductive paste thermally curable at ≤150°C, capable of forming an electroconductive film exhibiting excellent adhesiveness, for example, to the surface of a PET film or a polyimide film, and having flexibility and toughness, and suitable for the formation of a wiring layer of a flexible printed board.
SOLUTION: The electroconductive paste is obtained by selecting an acrylic resin having 284-946 epoxy equivalent, 58-155 hydroxy value, 30,000-170,000 molecular weight, and 10-55°C glass transition temperature as a resin component, and compounding 3-8 pts.mass of the acrylic resin, 0.1-1.5 pts.mass of a silane coupling agent and 8-25 pts.mass of an organic solvent having ≥150°C and ≤266°C boiling point under the normal pressure with 100 pts.mass of metallic silver powder.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种在≤150℃下可热固化的导电膏，其能够形成例如在PET膜或聚酰亚胺膜的表面上显示出优异的粘附性的导电膜，并且具有柔性和韧性好，适合形成柔性印刷电路板的布线层。导电糊是通过选择具有284-946环氧当量，58-155羟基值，30,000-170,000分子量和10-55℃玻璃化转变温度的丙烯酸树脂作为树脂组分而获得的，并且配混 3-8份丙烯酸树脂，0.1-1.5份硅烷偶联剂和8-25份有机溶剂，在常压下具有≥150℃和≤266℃沸点的有机溶剂， 100磅金属银粉。版权所有（C）2011，JPO＆INPIT

3. 发明专利

JP2006083377A Electrically conductive adhesive and method for producing article utilizing the electrically conductive adhesive 有权
标题翻译：电导电粘合剂及使用电导电胶粘剂生产物品的方法
公开(公告)号：JP2006083377A
公开(公告)日：2006-03-30
申请号：JP2005237302
申请日：2005-08-18
申请人： Harima Chem Inc , Toshiba Corp , ハリマ化成株式会社 , 株式会社東芝
发明人： OSAKO TAKEHISA , SHIOI NAOTO , ITO DAISUKE , GOTO HIDEYUKI , MATSUBA YORISHIGE , TATEYAMA KAZUKI , UKITA YASUNARI , SEGAWA MASAO , KIKUCHI TAKUO
IPC分类号： C09J201/00 , C09C1/62 , C09C3/08 , C09J5/00 , C09J9/02 , C09J11/00 , C09J163/00 , H01B1/00 , H01B1/22 , H01L21/52
CPC分类号： H01L24/73 , H01L2224/29 , H01L2224/2919 , H01L2224/29298 , H01L2224/32245 , H01L2224/45 , H01L2224/45015 , H01L2224/45144 , H01L2224/48247 , H01L2224/73265 , H01L2224/83192 , H01L2224/8384 , H01L2224/92247 , H01L2924/00013 , H01L2924/01005 , H01L2924/01029 , H01L2924/0103 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/0665 , H01L2924/10253 , H01L2924/181 , H01L2924/00 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2924/00012 , H01L2924/20752
摘要： PROBLEM TO BE SOLVED: To provide an electrically conductive adhesive capable of solvent dilution for giving good coating workability, capable of preventing a gas from forming, when a binder resin is heated and cured after mounting of parts, and capable of forming an electrically conductive joint excellent in both of thermal conductivity and electrical conductivity. SOLUTION: This electrically conductive adhesive contains an electrically conductive medium, a thermosetting resin as a binder resin component, and a solvent for adjusting a liquid viscosity as essential components, wherein 100 pts.wt. of a silver powder having an average particle diameter of a micrometer size is, for example, used as a main component, together with 1-10 pts.wt. of silver fine particles having an average particle diameter of a nanometer size, in the electrically conductive medium, and further 5-15 pts.wt. of the thermosetting resin and 10 pts.wt. or less of the solvent are together used in the adhesive. The adhesive having a mixing ratio of the components thus selected avoids formation of gas components, when the thermosetting resin is heated/cured, and therefore prevents formation of voids, and further realizes preparation of the electrically conductive joint excellent in the thermal conductivity and the electrical conductivity at the same time. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供能够进行溶剂稀释以提供良好的涂布可加工性的导电粘合剂，能够防止气体形成，当粘合剂树脂在部件安装之后被加热和固化，并且能够形成导电接头在导热性和导电性方面均优异。解决方案：该导电粘合剂包含导电介质，作为粘合剂树脂组分的热固性树脂和用于调节作为必需组分的液体粘度的溶剂，其中100重量份平均粒径为微米尺寸的银粉末，例如以1-10重量份为主成分。的导电介质中平均粒径为纳米尺寸的银微粒，再加入5-15重量份的热固性树脂和10重量份或更少的溶剂一起用于粘合剂中。具有这样选择的组分的混合比例的粘合剂避免形成气体组分，当热固性树脂被加热/固化时，因此防止形成空隙，并且进一步实现导热性和导电性优异的导电接头的制备电导率同时。版权所有（C）2006，JPO＆NCIPI

4. 发明专利

JP2005150462A Conductive paste and method for manufacturing substrate using the same 审中-公开
标题翻译：导电胶浆及其制造方法
公开(公告)号：JP2005150462A
公开(公告)日：2005-06-09
申请号：JP2003386919
申请日：2003-11-17
申请人： Harima Chem Inc , Matsushita Electric Ind Co Ltd , ハリマ化成株式会社 , 松下電器産業株式会社
发明人： KAWAGUCHI ISAO , FUJISHIMA YOSHIKAZU , TAKENAKA AKIRA , GOTO HIDEYUKI , SAITO HIROSHI , OSAKO TAKEHISA
IPC分类号： H05K1/09 , H01B1/22 , H01B13/00 , H05K3/20
摘要： PROBLEM TO BE SOLVED: To solve the problem that a conductive paste filling a trench loses its volume in a drying step.
SOLUTION: The conductive paste 56 comprises a powder of metal particles and a binder and, therein, the metal powder content is increased and a lubricating layer is formed around a metal particle. The lubricating layer formed around the metal particle enables the paste 56 even in a case of high metal powder content, to roll easily and fill up a trench 54 densely, whereby reduction in the volume of the conductive paste 56 in a drying step 35 is decelerated and the number of repetitions from a printing step 32 to the drying step 35 is lessened.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了解决在干燥步骤中填充沟槽的导电浆料失去其体积的问题。解决方案：导电浆料56包括金属颗粒和粘合剂的粉末，其中金属粉末含量增加，并且在金属颗粒周围形成润滑层。在金属颗粒周围形成的润滑层使得即使在金属粉末含量高的情况下，浆料56也可以容易地滚动并且密集地填充沟槽54，从而减少干燥步骤35中的导电浆料56的体积减少并且从打印步骤32到干燥步骤35的重复次数减少。版权所有（C）2005，JPO＆NCIPI

5. 发明专利

JP2009123607A Low resistivity conductive paste 有权
标题翻译：低电阻导电胶
公开(公告)号：JP2009123607A
公开(公告)日：2009-06-04
申请号：JP2007298165
申请日：2007-11-16
申请人： Harima Chem Inc , ハリマ化成株式会社
发明人： OSAKO TAKEHISA , SHIOI NAOTO
IPC分类号： H01B1/22 , C09D5/00 , C09D7/12 , C09D133/00 , C09D161/06 , C09D161/12 , C09D201/00 , H01B1/00
摘要： PROBLEM TO BE SOLVED: To provide a conductive paste utilizing silver particles as a conductive filler, which can be hardened at a curing temperature of 200°C or less, and in which a binder resin itself shows flexibility of a certain level or more, and at the same time, the apparent volume specific resistivity of the conductive paste cured layer obtained can be reduced to at least 10 μΩcm (20°C) or less.
SOLUTION: This is the conductive paste in which a conductive filler component is uniformly mixed in a liquid binder resin composition, and its composition is selected in a range of the liquid binder composition in which a binder resin component having a thermosetting resin component as a main component 0.5-6 parts by mass, an organic compound having acidic group 0.5-6 parts by mass, and a polar solvent 2-15 parts by mass are contained as an indispensable constituent against the conductive filler component having silver particles of average particle size 1 μm-8 μm as a main component 100 parts by mass.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种使用银颗粒作为导电填料的导电糊料，其可以在200℃或更低的固化温度下硬化，并且其中粘合剂树脂本身显示出一定水平的柔韧性或更多地，同时所获得的导电糊固化层的表观体积电阻率可以降低至至少10μΩcm（20℃）或更低。解决方案：这是导电填料组分在液体粘合剂树脂组合物中均匀混合的导电浆料，其组成是在具有热固性树脂组分的粘合剂树脂组分的液体粘合剂组合物的范围内选择的作为0.5-6质量份的主要成分，含有0.5-6质量份的酸性基团的有机化合物和2-15质量份的极性溶剂作为对具有平均粒径的银颗粒的导电填料组分的不可缺少的成分粒径1μm〜8μm为主成分100质量份。版权所有（C）2009，JPO＆INPIT

6. 发明专利

JP2005093741A Solid electrolytic capacitor and manufacturing method thereof 有权
标题翻译：固体电解电容器及其制造方法
公开(公告)号：JP2005093741A
公开(公告)日：2005-04-07
申请号：JP2003325468
申请日：2003-09-18
申请人： Harima Chem Inc , Nippon Chemicon Corp , Ulvac Japan Ltd , Vacuum Metallurgical Co Ltd , ハリマ化成株式会社 , 日本ケミコン株式会社 , 株式会社アルバック , 真空冶金株式会社
发明人： ENDO KAZUYOSHI , OSAKO TAKEHISA , GOTO HIDEYUKI , MATSUBA YORISHIGE , ODA MASAAKI
IPC分类号： H01G9/028 , H01G9/00 , H01G9/04 , H01G9/14
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a solid electrolytic capacitor which enables further reduction of ESR.
SOLUTION: A solid electrolytic layer consisting of a conductive polymer is formed on a capacitor element of a sintered body formed by sintering valve metal powder and having an anode oxide film on the surface thereof. Silver paste formed by mixing silver powder particles with mean particle diameter of 0.2-20 μm, silver nano-particles with mean particle diameter of 1-100 nm, and a predetermined binder is applied on the conductive polymer layer, and is sintered in the temperature range of 150-350°C to form a conductive layer.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够进一步减少ESR的固体电解电容器的制造方法。解决方案：在通过烧结阀金属粉末并在其表面上具有阳极氧化膜形成的烧结体的电容器元件上形成由导电聚合物组成的固体电解质层。通过将平均粒径为0.2〜20μm的银粉末，平均粒径为1-100nm的银纳米颗粒和预定的粘合剂混合而形成的银浆料涂覆在导电聚合物层上，并在温度范围为150-350℃，形成导电层。版权所有（C）2005，JPO＆NCIPI

7. 发明专利

JP2001270987A AQUEOUS POLYAMIDE RESIN EMULSION AND ITS MANUFACTURING METHOD 失效
公开(公告)号：JP2001270987A
公开(公告)日：2001-10-02
申请号：JP2000086273
申请日：2000-03-27
申请人： HARIMA CHEMICALS INC
发明人： TERADA NOBUHITO , OSAKO TAKEHISA , MATSUBA YORISHIGE
IPC分类号： C08J3/03 , C08J3/075 , C08L33/02 , C08L77/06 , C09D5/00 , C09D5/02 , C09D157/00 , C09D177/06
摘要： PROBLEM TO BE SOLVED: To obtain an aqueous emulsion of a polyamide resin which exhibits a low viscosity at normal temperatures and excels in long time dispersion stability and has a high solids content and improved mechanical strength by utilizing a novel substance different from conventionally used amino acids. SOLUTION: The stabilized aqueous polyamide resin emulsion is obtained by emulsifying a polyamide resin with a polymeric emulsifier to be obtained by the emulsion polymerization of an α, β-ethylenically unsaturated monomer having at least one carboxylic acid which renders the acid value of a resin component 30-350 or the polymeric emulsifier and a surface active agent and more specifically, the method of manufacturing the same comprises melting the polyamide resin, adding and mixing an alcohol with the melt, cooling the mixture, then adding a mixture of a surface active agent and water to the resulting mixture at

8. 发明专利

JP2002212535A HOT-MELT POLYAMIDE ADHESIVE AND POLYAMIDE RESIN SHEET- SHAPED MOLDED PRODUCT 失效
公开(公告)号：JP2002212535A
公开(公告)日：2002-07-31
申请号：JP2001013238
申请日：2001-01-22
申请人： HARIMA CHEMICALS INC , NITTA GELATIN KK
发明人： MATSUBA YORISHIGE , TERADA NOBUHITO , OSAKO TAKEHISA , MORIMOTO TAKASHI , MAEDA ICHIRO
IPC分类号： C08G69/34 , C09J5/06 , C09J177/00 , C09J177/06
摘要： PROBLEM TO BE SOLVED: To provide a tenacious hot-melt polyamide adhesive applicable in low-temperature coating and having high heatproof adhesivity, and a polyamide resin sheet-shaped molded product using the hot-melt polyamide adhesive. SOLUTION: The hot-melt polyamide adhesive consists of a polyamide resin having a melt viscosity of 2,000-6,000 mPa.s, and a softening point of >=80 deg.C and =300% at 23 deg.C. The adhesive can be coated on a base material at a temperature of 150-170 deg.C and has excellent adhesive strength.

9. 发明专利

JP2001270946A AQUEOUS DISPERSION OF ETHYLENE/VINYL ALCOHOL COPOLYMER AND ITS MANUFACTURING METHOD 失效
公开(公告)号：JP2001270946A
公开(公告)日：2001-10-02
申请号：JP2000084451
申请日：2000-03-24
申请人： HARIMA CHEMICALS INC
发明人： HATA NORIAKI , OSAKO TAKEHISA
IPC分类号： C08J3/03 , C08J3/075 , C08L29/04
摘要： PROBLEM TO BE SOLVED: To provide an aqueous dispersion of an ethylene/vinyl alcohol copolymer excellent in shelf stability by adding to a copolymer solution an easily available chemical or compound as a dispersion stabilizer for the purpose of inhibiting deposition of fine polymer particles and to provide a method for manufacturing the dispersion. SOLUTION: The aqueous dispersion of an ethylene/vinyl alcohol copolymer wherein a surfactant is added as a dispersion stabilizer is manufactured, for example, by a series of following process; dissolving under heat a dispersion copolymer in a aqueous alcoholic solvent; adding thereto a surfactant as a dispersion stabilizer; depositing by cooling fine particles having a uniform particle size; further stirring for dispersing the fine particle and finally removing the alcohol in the aqueous alcoholic solvent under reduced pressure.

10. 发明专利

JP2003270184A MANUFACTURING METHOD OF SENSING FILM FOR GAS SENSOR 审中-公开
公开(公告)号：JP2003270184A
公开(公告)日：2003-09-25
申请号：JP2002072343
申请日：2002-03-15
申请人： DENSO CORP , HARIMA CHEMICALS INC , ULVAC CORP
发明人： TOTOKAWA SHINJI , MATSUBA YORISHIGE , MISAWA YOSHIHISA , GOTO HIDEYUKI , OSAKO TAKEHISA , ODA MASAAKI , SAITO NORIYASU , SUZUKI TOSHIHIRO , ABE TOMOYUKI
IPC分类号： G01N27/12
摘要： PROBLEM TO BE SOLVED: To simply form a sensing film for a gas sensor having an excellent sensor characteristic such as sensitivity or responsiveness, in a manufacturing method of the sensing film for the gas sensor formed by sintering particles comprising a metal or a metal oxide on a base material. SOLUTION: The particles 100 in the nanometer order, a dispersant 110 for preventing aggregation of the particles 100, and a scavenger 120 for trapping the dispersant 110 at the sintering time are mixed together in a solvent 130, to thereby prepare a paste body 140, and the paste body 140 is applied on the base material and sintered, to thereby form the sensing film. COPYRIGHT: (C)2003,JPO

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