专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2005150462A Conductive paste and method for manufacturing substrate using the same 审中-公开
标题翻译：导电胶浆及其制造方法
公开(公告)号：JP2005150462A
公开(公告)日：2005-06-09
申请号：JP2003386919
申请日：2003-11-17
申请人： Harima Chem Inc , Matsushita Electric Ind Co Ltd , ハリマ化成株式会社 , 松下電器産業株式会社
发明人： KAWAGUCHI ISAO , FUJISHIMA YOSHIKAZU , TAKENAKA AKIRA , GOTO HIDEYUKI , SAITO HIROSHI , OSAKO TAKEHISA
IPC分类号： H05K1/09 , H01B1/22 , H01B13/00 , H05K3/20
摘要： PROBLEM TO BE SOLVED: To solve the problem that a conductive paste filling a trench loses its volume in a drying step.
SOLUTION: The conductive paste 56 comprises a powder of metal particles and a binder and, therein, the metal powder content is increased and a lubricating layer is formed around a metal particle. The lubricating layer formed around the metal particle enables the paste 56 even in a case of high metal powder content, to roll easily and fill up a trench 54 densely, whereby reduction in the volume of the conductive paste 56 in a drying step 35 is decelerated and the number of repetitions from a printing step 32 to the drying step 35 is lessened.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了解决在干燥步骤中填充沟槽的导电浆料失去其体积的问题。解决方案：导电浆料56包括金属颗粒和粘合剂的粉末，其中金属粉末含量增加，并且在金属颗粒周围形成润滑层。在金属颗粒周围形成的润滑层使得即使在金属粉末含量高的情况下，浆料56也可以容易地滚动并且密集地填充沟槽54，从而减少干燥步骤35中的导电浆料56的体积减少并且从打印步骤32到干燥步骤35的重复次数减少。版权所有（C）2005，JPO＆NCIPI

2. 发明专利

JP2005019436A Method of manufacturing wiring board 审中-公开
标题翻译：制造接线板的方法
公开(公告)号：JP2005019436A
公开(公告)日：2005-01-20
申请号：JP2003177968
申请日：2003-06-23
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： TAKENAKA AKIRA , FUJISHIMA YOSHIKAZU
IPC分类号： H05K3/20
摘要： PROBLEM TO BE SOLVED: To solve the problem that the dielectric breakdown voltage between patterns is deteriorated by the remaining refuse of conductive paste.
SOLUTION: A method of manufacturing wiring board includes a sticking step 25 of sticking a supporting film 23 coated with an adhesive 24 to the lower surface of a screen 21 having wiring patterns formed of through holes 22, and a packing step of packing the conductive paste 26 in the through holes 22 from the upper surface of the screen 21 after the sticking step 25. Consequently, the dielectric breakdown voltage between the wiring patterns can be improved.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了解决图案之间的介电击穿电压由于导电浆料的剩余拒绝而劣化的问题。解决方案：制造布线板的方法包括：将涂覆有粘合剂24的支撑膜23粘贴到具有由通孔22形成的布线图案的筛网21的下表面的粘附步骤25以及填充步骤来自屏幕21的上表面的通孔22中的导电膏26在粘贴步骤25之后。因此，可以提高布线图案之间的介电击穿电压。版权所有（C）2005，JPO＆NCIPI

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式