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    • 2. 发明专利
    • Inspecting method for compound semiconductor substrate
    • 复合半导体衬底的检查方法
    • JP2009238812A
    • 2009-10-15
    • JP2008079863
    • 2008-03-26
    • Covalent Materials CorpNational Institute For Materials Scienceコバレントマテリアル株式会社独立行政法人物質・材料研究機構
    • UCHIMARU TOMONORIKANAI HIDEYUKIKOMIYAMA JUNSUZUKI SHUNICHIOSADA MINORU
    • H01L21/66H01S5/00
    • PROBLEM TO BE SOLVED: To provide an inspecting method for a compound semiconductor substrate, in which quality is evaluated with high precision during inspection on a compound semiconductor substrate having a multilayer structure.
      SOLUTION: The inspecting method for the compound semiconductor substrate 10 having a buffer layer and a GaN layer stacked in order on a semiconductor substrate includes a step (S1) of exposing a cross section in the stacking direction of the buffer layer and GaN layer, a step (S2) of irradiating the exposed cross section with laser light and evaluating stress at three points of the buffer layer and GaN layer in the section, and the interface between the buffer layer and GaN layer, and a step (S3) of plotting stress values of the stress at the three points on a coordinate surface showing stress values on its longitudinal axis and measurement positions on its lateral axis, and determining whether the compound semiconductor substrate 10 is good or not based on positions of the three plotted points on the coordinate surface.
      COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:提供一种化合物半导体衬底的检查方法,其中在具有多层结构的化合物半导体衬底的检查期间以高精度评估质量。 解决方案:具有在半导体衬底上依次堆叠的缓冲层和GaN层的化合物半导体衬底10的检查方法包括:在缓冲层的层叠方向上暴露横截面的步骤(S1)和GaN 层,步骤(S2),用激光照射暴露的横截面,并评估该截面中的缓冲层和GaN层的三个点以及缓冲层和GaN层之间的界面的应力,以及步骤(S3) 绘制在坐标表面上的三个点上的应力的应力值,显示其纵轴上的应力值及其横轴上的测量位置,并且基于三个绘制点的位置来确定化合物半导体衬底10是否良好 在坐标面上。 版权所有(C)2010,JPO&INPIT
    • 5. 发明专利
    • METHOD FOR MEASURING PHONON WAVENUMBER OF 3C-SiC LAYER ON Si SUBSTRATE
    • 在Si衬底上测量3C-SiC层的on波的方法
    • JP2009218458A
    • 2009-09-24
    • JP2008062090
    • 2008-03-12
    • Covalent Materials Corpコバレントマテリアル株式会社
    • SHIRAI HIROSHIKOMIYAMA JUN
    • H01L21/66G01N21/35G01N21/3563H01L21/205
    • PROBLEM TO BE SOLVED: To provide a method for measuring a phonon wavenumber of a 3C-SiC layer on a heavily doped Si substrate, which can simply measure a phonon spectrum of the 3C-SiC layer in non-destruction, high accuracy and high resolution in regard to a wafer wherein the 3C-SiC layer is formed on a heavily doped Si substrate by using an infrared reflection method. SOLUTION: An infrared reflection spectrum obtained when P polarized light is made obliquely incident on a reflector and an infrared reflection spectrum obtained when P polarized light is made incident on the surface of a wafer wherein a 3C-SiC layer is formed on a Si substrate at the same angle as the above incident angle are measured, and a reflection spectrum which is a ratio of the infrared reflection spectrum of the wafer wherein the 3C-SiC layer is formed on the Si substrate to the infrared reflection spectrum of the reflector is calculated to find out wavenumbers of a TO mode and an LO mode of a T 2 phonon with wavenumber vector k of ≈0. COPYRIGHT: (C)2009,JPO&INPIT
    • 要解决的问题:提供一种用于测量重掺杂Si衬底上的3C-SiC层的声子波数的方法,其可以简单地以非破坏性的方式测量3C-SiC层的声子谱,高精度 并且通过使用红外反射法在重掺杂的Si衬底上形成3C-SiC层的晶片的高分辨率。 解决方案:当P偏振光被倾斜地入射到反射器上时获得的红外反射光谱和当P偏振光入射到其上形成3C-SiC层的晶片的表面上获得的红外反射光谱 测量与上述入射角成相同角度的Si衬底,反射光谱,其中在Si衬底上形成3C-SiC层的晶片的红外反射光谱与反射器的红外反射光谱之比 被计算为找出具有≈0的波数向量k的T 2 声子的TO模式和LO模式的波数。 版权所有(C)2009,JPO&INPIT
    • 7. 发明专利
    • Compound semiconductor device
    • 化合物半导体器件
    • JP2007266151A
    • 2007-10-11
    • JP2006086844
    • 2006-03-28
    • Covalent Materials Corpコバレントマテリアル株式会社
    • KOMIYAMA JUNABE YOSHIHISASUZUKI SHUNICHINAKANISHI HIDEO
    • H01L29/12H01L21/336H01L29/739H01L29/78
    • PROBLEM TO BE SOLVED: To provide a highly efficient compound semiconductor device with less energy loss. SOLUTION: An n-type low carrier concentration layer 2 with a carrier concentration as ≥10 11 /cm 3 and ≤10 16 /cm 3 , a p-type layer 3 with the carrier concentration as ≥10 11 /cm 3 and ≤10 21 /cm 3 , and an n-type high carrier concentration layer 4 with the carrier concentration ≥10 16 /cm 3 and ≤10 21 /cm 3 , are sequentially laminated on a low resistance substrate 1. The respective layers 2-4 are made to be 3C-SiC single crystal with the fault density of not more than 10 4 /cm 2 concerning a micropipe, a double-positioning domain, an anti-phase domain, a stacking fault, and a twin band. The compound semiconductor device also includes: a gate insulating film 5 which contacts at least the p-type layer 3, a control electrode 6 which contacts the gate insulating film 5 and is electrically separated from the respective layers 2-4, an upper electrode 7 which contacts at least the p-type layer 3 and the n-type high carrier concentration layer 4, and a lower electrode 8 which contacts the low resistance substrate 1. COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:提供具有较少能量损失的高效化合物半导体器件。

      解决方案:载流子浓度为≥10 11 / cm 3 和≤10 16 的n型低载流子浓度层2 载体浓度为≥10 11 / cm 3 和≤10 21

      的p型层3, / SP> / cm 3 / SP>,载流子浓度≥10 16 / cm 3的n型高载流子浓度层4和≤ 10 21 / cm 3 顺序层压在低电阻基板1上。各层2-4被制成3C-SiC单晶,其故障密度 关于微管,双定位域,反相域,堆垛层错和双频带的不超过10 4 / cm 2 。 复合半导体器件还包括:至少与p型层3接触的栅极绝缘膜5,与栅极绝缘膜5接触并与各层2-4电气分离的控制电极6,上部电极7 其至少接触p型层3和n型高载流子浓度层4,以及与低电阻基板1接触的下电极8.版权所有(C)2008,JPO&INPIT

    • 8. 发明专利
    • Nitride semiconductor substrate
    • 氮化物半导体基板
    • JP2011258782A
    • 2011-12-22
    • JP2010132558
    • 2010-06-10
    • Covalent Materials Corpコバレントマテリアル株式会社
    • YOSHIDA AKIRAKOMIYAMA JUNABE YOSHIHISAOISHI KOJIERIGUCHI KENICHISUZUKI SHUNICHI
    • H01L21/338H01L29/778H01L29/812
    • PROBLEM TO BE SOLVED: To form a nitride semiconductor layer having normally-off operation between an intermediate layer and a device active layer, capable of achieving higher threshold voltage.SOLUTION: A nitride semiconductor substrate comprises: an intermediate layer that is formed on an Si single-crystal substrate, and is composed of a laminate structure of nitride semiconductors; a region 1 that is formed on the intermediate layer, and is composed of a nitride semiconductor having a composition of AlGaN (0≤x≤0.05), a thickness of 200 nm or more to 2000 nm or less, and a carbon concentration of 1×10atoms/cmor more to 1×10atoms/cmor less; a region 2 that is formed on the region 1, and is composed of a nitride semiconductor having a composition of AlGaN (0.1≤y≤1), a thickness of 0.2 nm or more to 100 nm or less, and a carbon concentration of 1×10atoms/cmor more to 1×10atoms/cmor less; and a device active layer of a nitride semiconductor formed on the region 2.
    • 要解决的问题:为了形成能够实现更高阈值电压的中间层和器件有源层之间具有常关操作的氮化物半导体层。 解决方案:氮化物半导体衬底包括:形成在Si单晶衬底上的中间层,由氮化物半导体的叠层结构构成; 形成在中间层上的区域1,由具有组成为Al 1-x 的氮化物半导体构成的区域1, SB> N(0≥x≥0.05),厚度为200nm以上至2000nm以下,碳浓度为1×10原子/ cm×SP 3 或更小到1×10 21 atoms / cm 3 或更小; 形成在区域1上的区域2,由具有组成为Al 1-y的氮化物半导体构成的区域2, SB> N(0.1≥y≥1),厚度为0.2nm以上至100nm以下,碳浓度为1×10 6原子/ cm 2 SP 3 或更小到1×10 21 atoms / cm 3 或更小; 以及形成在区域2上的氮化物半导体的器件有源层。版权所有(C)2012,JPO&INPIT
    • 9. 发明专利
    • Crystallinity evaluation method of epitaxial layer of hetero epitaxial wafer
    • 异质外延层外延层的结晶评估方法
    • JP2011066360A
    • 2011-03-31
    • JP2009218090
    • 2009-09-18
    • Covalent Materials Corpコバレントマテリアル株式会社
    • SHIRAI HIROSHIKOMIYAMA JUNABE YOSHIHISA
    • H01L21/66H01L21/205
    • PROBLEM TO BE SOLVED: To provide a method for evaluating the crystallinity of a compound semiconductor layer epitaxial-grown, in a simple manner, on a substrate by the value of LO-phonon band wave number of an infrared light. SOLUTION: By having a compound semiconductor crystal layer irradiated with an infrared beam by means of an infrared reflection method or an infrared transmission method, the LO-phonon band wave number is measured, and a residual stress of the semiconductor compound crystal layer is measured, based on a distortion in a direction vertical to a growth surface of X-ray diffraction about each of a plurality of samples, and the crystallinity of each semiconductor compound crystal layer of the plurality of samples is evaluated by using an AFM image. Among the samples which are decided as having crystallinity is superior by the evaluation, the sample whose LO-phonon band wave number is lowest is set as a reference value. When the LO-phonon band wave number acquired by irradiating the compound semiconductor crystal layer of evaluation object with the infrared light by means of the infrared reflection method or the infrared transmission method exceeds the reference value, the compound semiconductor crystal layer of evaluation object is decided as having superior crystallinity by the crystallinity evaluation method of the compound semiconductor crystal layer. COPYRIGHT: (C)2011,JPO&INPIT
    • 要解决的问题:提供一种通过红外光的LO-声子带波数的值,以简单的方式在衬底上评估外延生长的化合物半导体层的结晶度的方法。 解决方案:通过利用红外反射法或红外线透射法对红外光束照射化合物半导体晶体层,测量LO声子带波数,并且半导体化合物晶体层的残留应力 基于与多个样品中的每一个相邻的X射线衍射的生长面的垂直方向的变形,并且通过使用AFM图像来评价多个样品的各半导体化合物晶体层的结晶度。 通过评价判断为具有结晶性的样品中,将LO-声子带波数最低的样品设定为基准值。 当通过用红外反射法或红外线透射法用红外光照射评估对象的化合物半导体晶体层而获得的LO声子波段数超过基准值时,决定评估对象的化合物半导体晶体层 通过化合物半导体晶体层的结晶度评价方法具有优异的结晶度。 版权所有(C)2011,JPO&INPIT
    • 10. 发明专利
    • Nitride semiconductor epitaxial substrate
    • 氮化物半导体外延衬底
    • JP2010251738A
    • 2010-11-04
    • JP2010071381
    • 2010-03-26
    • Covalent Materials Corpコバレントマテリアル株式会社
    • OISHI KOJIKOMIYAMA JUNERIGUCHI KENICHIABE YOSHIHISAYOSHIDA AKIRASUZUKI SHUNICHI
    • H01L21/338C30B29/38H01L21/205H01L29/778H01L29/812H01L33/32H01S5/323
    • PROBLEM TO BE SOLVED: To provide a nitride semiconductor epitaxial substrate having a buffer structure with excellent manufacturing efficiency, wherein cracking of a device active layer is suppressed and while improvement in crystallinity such as reduction in dislocation density is achieved, warpage accompanying film thickening of a nitride semiconductor is suppressed. SOLUTION: The nitride semiconductor epitaxial substrate includes: an Si substrate 1; a first multilayer buffer region 3, wherein an Al a Ga 1-a N (0.9≤a≤1.0) single-crystal layer 31 of 2 to 10 nm in thickness and an Al b Ga 1-b N (0≤b≤0.1) single-crystal layer 32 of 10 to 30 nm in thickness are alternately and repeatedly laminated; a second multilayer buffer region 4, wherein an Al c Ga 1-c N (0.9≤c≤1.0) single-crystal layer 41 of 2 to 10 nm in thickness and an Al d Ga 1-d N (0≤d≤0.1) single-crystal layer 42 of 200 to 500 nm in thickness are alternately and repeatedly laminated; a GaN single-crystal layer 5; and an Al x Ga 1-x N (0≤x≤1) single-crystal layer 6. COPYRIGHT: (C)2011,JPO&INPIT
    • 要解决的问题:为了提供具有优良制造效率的缓冲结构的氮化物半导体外延基板,其中抑制了器件活性层的裂纹,并且在获得诸如位错密度降低的结晶度的改善的同时,伴随膜的翘曲 氮化物半导体的增厚被抑制。 解决方案:氮化物半导体外延衬底包括:Si衬底1; 第一多层缓冲区域3,其中厚度为2至10nm的Al(SB)a N a(0.9≤a≤1.0)单晶层31和 交替重复地层叠10〜30nm厚度的Al b N(0≤b≤0.1)单晶层32, 第二多层缓冲区域4,其中厚度为2至10nm的AlSiBeNi(0.9≤c≤1.0)单晶层41和 交替重复地层叠厚度为200〜500nm的Al d Ga(1≤d≤N≤0.0≤0.1)单晶层42, GaN单晶层5; 和(C)2011,JPO&INPIT(C)2011(日本专利)< SB>< SB>