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1. 发明专利

JP2013239604A Wiring board 有权
标题翻译：接线板
公开(公告)号：JP2013239604A
公开(公告)日：2013-11-28
申请号：JP2012112016
申请日：2012-05-16
申请人： Ngk Spark Plug Co Ltd , 日本特殊陶業株式会社
发明人： NISHIDA TOMOHIRO , MORI SEIJI , WAKAZONO MAKOTO
IPC分类号： H05K3/28
CPC分类号： H05K3/28 , H01L21/563 , H05K1/11 , H05K3/3436 , H05K3/3452 , H05K2201/09881 , H05K2201/10977 , H05K2203/025 , H05K2203/0783
摘要： PROBLEM TO BE SOLVED: To obtain a wiring board capable of improving flowability of an underfill material filled in a gap between an electronic component and the wiring board.SOLUTION: A wiring board according to the present invention has a laminate on which one or more insulation layers and conductor layers are laminated. The wiring board comprises: plural connection terminals isolated from each other on the laminate; a filling member filled between the plural connection terminals, and contacting at least one part of each side face of the plural connection terminals; and a solder resist layer laminated on the laminate and having an opening for exposing the plural connection terminals. Surface roughness of the filling member is rougher than that of an upper face of the solder resist layer.
摘要翻译：要解决的问题：获得能够改善填充在电子部件和布线板之间的间隙中的底部填充材料的流动性的布线板。解决方案：根据本发明的布线板具有层压体，其上具有一个或多个绝缘体层和导体层被层压。布线板包括：在层压板上彼此隔离的多个连接端子; 填充部件，填充在所述多个连接端子之间，并且与所述多个连接端子的每个侧面的至少一部分接触; 以及层叠在所述层叠体上并具有用于使所述多个连接端子露出的开口的阻焊层。填充构件的表面粗糙度比阻焊层的上表面更粗糙。

2. 发明专利

JP2007084796A Filler for through hole and multilayer printed circuit board 有权
标题翻译：填充通孔和多层印刷电路板
公开(公告)号：JP2007084796A
公开(公告)日：2007-04-05
申请号：JP2006220330
申请日：2006-08-11
申请人： Ngk Spark Plug Co Ltd , 日本特殊陶業株式会社
发明人： KOJIMA TOSHIFUMI , WAKAZONO MAKOTO
IPC分类号： C08G59/54 , H01L23/12 , H05K1/11 , H05K3/28 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a filler for through holes capable of providing a cured product excellent in heat resistance and imparting sufficient pot life, and a multilayer printed circuit board having the cured product. SOLUTION: The filler comprises (1) a liquid epoxy resin having a benzene ring in the structure, (2) a powdery imidazole derivative having a 1-6C alkyl group on a carbon at second position of an imidazole ring and having a substituent having a diaminotriazine structure on nitrogen at first position of the imidazole ring and (3) an inorganic filler (silica, etc.). The multilayer printed circuit board 100 has a cured product 20 composed of filler for main through hole packing the interior of a through hole 10. In the cured product, a first conductive layer 30 for covering a surface exposed from the through hole can be provided, and a solder part 70 having 5 mass% lead content can be provided. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够提供耐热性优异并且具有足够的适用期的固化产物的通孔填料和具有固化产物的多层印刷电路板。解决方案：填料包括（1）在结构中具有苯环的液体环氧树脂，（2）在咪唑环的第二位置的碳上具有1-6C烷基的粉末状咪唑衍生物，其具有在咪唑环的第一位置的氮上具有二氨基三嗪结构的取代基和（3）无机填料（二氧化硅等）。多层印刷电路板100具有由贯通孔10内部的主通孔填充用填料构成的固化物20.在固化物中，可以设置用于覆盖从通孔露出的表面的第一导电层30，并且可以提供具有5质量％铅含量的焊料部70。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2014093512A Wiring board and manufacturing method of the same 有权
标题翻译：接线板及其制造方法
公开(公告)号：JP2014093512A
公开(公告)日：2014-05-19
申请号：JP2012245250
申请日：2012-11-07
申请人： Ngk Spark Plug Co Ltd , 日本特殊陶業株式会社
发明人： HAYASHI TAKAHIRO , NAGAI MAKOTO , ITO TATSUYA , MORI SEIJI , WAKAZONO MAKOTO , NISHIDA TOMOHIRO
IPC分类号： H01L23/12 , H05K3/28 , H05K3/46
CPC分类号： H05K3/4007 , H01L21/4846 , H01L23/49822 , H01L23/49827 , H01L23/49894 , H01L24/81 , H01L2224/10175 , H01L2224/1134 , H01L2224/1146 , H01L2224/131 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/16227 , H01L2224/16237 , H01L2224/8114 , H01L2224/81411 , H01L2224/81444 , H01L2224/81455 , H01L2224/81464 , H01L2224/81815 , H01L2924/12042 , H01L2924/1517 , H01L2924/15311 , H01L2924/15312 , H01L2924/15313 , H01L2924/15787 , H01L2924/15788 , H01L2924/1579 , H01L2924/381 , H01L2924/3841 , H05K1/0298 , H05K1/0366 , H05K3/28 , H05K3/3452 , H05K3/4661 , H05K3/4688 , H05K2201/09845 , H05K2201/09881 , H05K2201/10674 , H01L2924/00015 , H01L2924/00014 , H01L2924/014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a wiring board in which a wiring conductor is successfully protected by a fine and strong dam part formed in an outermost surface layer of a laminate and which has excellent reliability in connection with a semiconductor chip.SOLUTION: A wiring board 10 comprises a laminate 31 including a plurality of connection terminals 41 and a plurality of wiring conductors 62 as a conductor layer 24 in an outermost surface layer. Each wiring conductor 62 is arranged to pass between a plurality of connection terminal parts 41 for flip-chip mounting a semiconductor chip 51. A resin insulation layer 23 in the outermost surface layer of the laminate includes dam parts 63 and reinforcement parts 64. Each dam part 63 covers each wiring conductor 62. The reinforcement part 64 is formed between the adjacent connection terminal parts 41 to have a height lower than a height H3 of the dam part 63. Each reinforcement part 64 is joined to a lateral face of the dam part 63.
摘要翻译：要解决的问题：提供一种布线基板，其中布线导体被形成在层叠体的最外表面层中的细小且强大的坝部成功地保护，并且与半导体芯片相关联的可靠性优异。解决方案：布线板10包括层叠体31，其包括多个连接端子41和作为最外表面层中的导体层24的多个布线导体62。每个布线导体62布置成在多个用于倒装芯片安装半导体芯片51的连接端子部分41之间通过。层压体的最外表面层中的树脂绝缘层23包括坝部件63和加强件64.每个坝部分63覆盖每个布线导体62.加强部分64形成在相邻的连接端子部分41之间，具有低于坝部63的高度H3的高度。每个加强部分64连接到坝部分的侧面 63。

4. 发明专利

JP2013239603A Wiring board 有权
标题翻译：接线板
公开(公告)号：JP2013239603A
公开(公告)日：2013-11-28
申请号：JP2012112015
申请日：2012-05-16
申请人： Ngk Spark Plug Co Ltd , 日本特殊陶業株式会社
发明人： NISHIDA TOMOHIRO , MORI SEIJI , WAKAZONO MAKOTO
IPC分类号： H05K3/34 , H01L23/12 , H05K3/28
CPC分类号： H05K1/0213 , H01L23/49811 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L2924/0002 , H05K1/111 , H05K3/244 , H05K3/28 , H05K3/3452 , H05K2201/09881 , H05K2201/099 , H05K2203/0571 , H05K2203/0588 , H01L2924/00012 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a wiring board capable of preventing short-circuit between connection terminals, and coping with a narrow pitch of the connection terminals.SOLUTION: A wiring board according to the present invention has a laminate on which one or more insulation layers and conductor layers are laminated. The wiring board comprises: plural connection terminals isolated from each other on the laminate; and a filling member filled between the plural connection terminals. A contact face contacting the filling member, and an isolation face not contacting the filling member on upper side than the contact face and on a lower side than an upper face of the filling member, are formed on side faces of the plural connection terminals.
摘要翻译：要解决的问题：提供一种能够防止连接端子之间短路并且应对连接端子的窄间距的布线板。解决方案：根据本发明的布线板具有层压体，其上具有一个或多个绝缘体层和导体层被层压。布线板包括：在层压板上彼此隔离的多个连接端子; 以及填充构件，其填充在所述多个连接端子之间。在多个连接端子的侧面上形成有与填充部件接触的接触面以及与接触面上方相比不与填充部件接触的隔离面以及比填充部件的上表面更靠下方的接触面。

5. 发明专利

JP2007250966A Filler and substrate using it 有权
标题翻译：填充物和底物使用它
公开(公告)号：JP2007250966A
公开(公告)日：2007-09-27
申请号：JP2006074342
申请日：2006-03-17
申请人： Ngk Spark Plug Co Ltd , 日本特殊陶業株式会社
发明人： KAWAMURA AYAKO , WAKAZONO MAKOTO , MIYAJI MONICHI , KOJIMA TOSHIFUMI , TAKADA TOSHIKATSU
IPC分类号： H05K1/11 , H05K3/32
摘要： PROBLEM TO BE SOLVED: To provide a filler to be easily drilled without generating adhesion defects or cracks between the filler and a substrate. SOLUTION: The filler to be filled in at least one of a through-hole and a recess on the substrate contains at least a curing agent, an inorganic filler, an organic filler, and a liquid resin. Further, the filler is prepared characteristically in the form of liquid. By the filler, the linear thermal expansion coefficient difference of the substrate and the cured filler is low and the elastic modulus of excellent drilling workability is attained. Thus, the generation of the adhesion defects is suppressed between the substrate and the filler generated by the difference in the linear thermal expansion coefficient and the cracks by the elastic modulus. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供容易钻孔的填料，而不会在填料和基材之间产生粘合缺陷或裂纹。解决方案：填充在基板上的通孔和凹部中的至少一个中的填料至少含有固化剂，无机填料，有机填料和液体树脂。此外，填充剂以液体的形式特征性地制备。通过填料，基板和固化的填料的线性热膨胀系数差小，并且获得了优异的钻孔加工性的弹性模量。因此，通过线膨胀系数和裂纹的差异产生的基板和填料之间的粘合缺陷的产生被弹性模量抑制。版权所有（C）2007，JPO＆INPIT

6. 发明专利

JP2014216423A 配線基板、配線基板の製造方法审中-公开
标题翻译：接线板，制造接线板的方法
公开(公告)号：JP2014216423A
公开(公告)日：2014-11-17
申请号：JP2013091490
申请日：2013-04-24
申请人：日本特殊陶業株式会社 , Ngk Spark Plug Co Ltd
发明人： HAYASHI TAKAHIRO , WAKAZONO MAKOTO , TOYOSHIMA TAKESHI , NAGAI MAKOTO , ORIGUCHI MAKOTO
IPC分类号： H05K3/34
CPC分类号： H05K1/144 , H01L24/05 , H05K3/0014 , H05K3/3452 , H05K3/3489 , H05K2201/099 , H05K2203/0577 , H05K2203/0594
摘要：【課題】半田ボールが搭載される開口近傍の表面に傾斜面を有し、開口内にフラックスが供給されやすい配線基板及び配線基板の製造方法を提供すること。【解決手段】本発明に係る配線基板は、絶縁層及び導体層がそれぞれ1層以上積層された積層体と、前記積層体上に形成された複数の接続端子と、前記積層体上に積層され、前記複数の接続端子を各々露出する複数の第1の開口を有する第1の樹脂層と、前記第1の樹脂層上に積層され、前記複数の接続端子を各々露出し、前記複数の第1の開口よりも開口径が小さい複数の第2の開口を有する第2の樹脂層と、を備え、前記第2の樹脂層は、前記複数の第2の開口近傍の表面が、前記複数の第2の開口に向かうにしたがって前記積層体に近づく傾斜面を有することを特徴とする。【請求項2】【選択図】図1
摘要翻译：要解决的问题：为了提供一种布线板以及制造布线板的方法，其中在安装有焊球的开口附近的表面上设置斜面，使得易于供应通量开口。解决方案：布线板包括层叠体，绝缘层和导体层分别通过至少一层层叠，形成在层叠体上的多个连接端子，层叠在第一树脂层上的第一树脂层并且包含多个用于暴露多个连接端子的第一开口和层叠在第一树脂层上并且包含多个第二开口的第二树脂层，该第二开口的孔小于多个第一开口用于分别暴露多个连接端子。第二树脂层具有倾斜，其中靠近多个第二开口的表面接近多个第二开口的层叠体。

7. 发明专利

JP2014063932A Wiring board and manufacturing method of the same 有权
标题翻译：接线板及其制造方法
公开(公告)号：JP2014063932A
公开(公告)日：2014-04-10
申请号：JP2012208987
申请日：2012-09-21
申请人： Ngk Spark Plug Co Ltd , 日本特殊陶業株式会社
发明人： HAYASHI TAKAHIRO , NAGAI MAKOTO , MORI SEIJI , NISHIDA TOMOHIRO , WAKAZONO MAKOTO , ITO TATSUYA
IPC分类号： H05K3/46 , H01L23/12
CPC分类号： H05K1/111 , G03F7/038 , G03F7/20 , G03F7/2024 , G03F7/30 , H01L23/49822 , H01L2224/16237 , H05K1/0298 , H05K3/3436 , H05K3/3452 , H05K3/4644 , H05K2201/09409 , H05K2201/09427 , H05K2201/09709 , H05K2201/09845 , H05K2201/099 , H05K2201/10674 , H05K2203/058 , H05K2203/0594 , H05K2203/1476
摘要： PROBLEM TO BE SOLVED: To provide a wiring board having excellent connection reliability with a semiconductor chip.SOLUTION: An organic wiring board 10 comprises a first build-up layer 31 formed on a board principal surface 11 side, in which resin insulation layers 21, 22 and a conductor layer 24 are laminated. The conductor layer 24 in the outermost layer of the first build-up layer 31 includes a plurality of connection terminal parts 41 for flip-chip mounting a semiconductor chip. Each of the plurality of connection terminal parts 41 is exposed through an opening 43 in a solder resist layer 25. Each connection terminal part 41 includes a connection region 51 of the semiconductor chip and a wiring region 52 which extends from the connection region 51 in a plane direction. The solder resist layer 25 includes lateral face covering parts 55 for covering lateral faces of the connection terminal part 41 and a convex wall part 56 which is integrally formed with the lateral face covering parts 55 and projects so as to cross the connection region 51.
摘要翻译：要解决的问题：提供一种与半导体芯片具有优异的连接可靠性的布线板。解决方案：有机布线板10包括形成在板主表面11侧上的第一堆积层31，其中树脂绝缘层21， 22和导体层24层叠。第一堆叠层31的最外层中的导体层24包括用于半导体芯片的倒装芯片安装的多个连接端子部41。多个连接端子部41中的每一个通过阻焊层25中的开口43露出。每个连接端子部分41包括半导体芯片的连接区域51和从连接区域51延伸的布线区域52 平面方向阻焊层25包括用于覆盖连接端子部41的侧面的侧面覆盖部55和与侧面覆盖部55一体形成的突出壁部56，并且突出以与连接部51交叉。

8. 发明专利

JP2009194105A Through-hole filler and multilayer wiring board 审中-公开
标题翻译：通孔填料和多层接线板
公开(公告)号：JP2009194105A
公开(公告)日：2009-08-27
申请号：JP2008032323
申请日：2008-02-13
申请人： Ngk Spark Plug Co Ltd , 日本特殊陶業株式会社
发明人： WAKAZONO MAKOTO , KOJIMA TOSHIFUMI
IPC分类号： H05K3/28 , C08G59/24 , C09K3/10 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a through-hole filler that achieves both of high filling properties to through-holes and high adhesiveness between an obtained cured body and a through-hole upper conductor layer in a well-balanced manner, and a multilayer wiring board using the same. SOLUTION: The through-hole filler contains a curing resin including a first epoxy resin (BPA) and a second epoxy resin having lower viscosity than that of the first epoxy resin, and an inorganic filler (for example, silica). The second epoxy resin is cyclohexanedimethanol diglycidyl ether or the like and/or its oligomer. The multilayer wiring board 100 is provided with a core substrate 1, which has each through-hole formed with an inner-wall face conductor 6 making the surface and the rear face conductive to each other and in which the inside of each through-hole is filled with a cured body 2, a first conductor layer 3 arranged on the surface of the core substrate and tightly adhered to the exposed face of the cured body 2, and a buildup insulating layer 4 laminated on the surface where the first conductor layer 3 is formed. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够以良好平衡的方式在获得的固化体和通孔上导体层之间实现通孔的高填充性和高粘合性的通孔填料，以及使用其的多层布线板。解决方案：通孔填料含有包含第一环氧树脂（BPA）和粘度低于第一环氧树脂的第二环氧树脂的固化树脂和无机填料（例如二氧化硅）。第二环氧树脂是环己烷二甲醇二缩水甘油醚等和/或其低聚物。多层布线板100设置有芯基板1，芯基板1具有形成有内壁面导体6的各通孔，内壁面导体6使表面和后面彼此导通，并且其中每个通孔的内部为填充有固化体2的第一导体层3，配置在芯基板的表面上并且牢固地粘附到固化体2的露出面的第一导体层3和层压在第一导体层3的表面上的积层绝缘层4 形成。版权所有（C）2009，JPO＆INPIT

9. 发明专利

JP2005203764A Multi-layer wiring board 有权
标题翻译：多层接线板
公开(公告)号：JP2005203764A
公开(公告)日：2005-07-28
申请号：JP2004363433
申请日：2004-12-15
申请人： Ngk Spark Plug Co Ltd , 日本特殊陶業株式会社
发明人： KOJIMA TOSHIFUMI , WAKAZONO MAKOTO
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a multi-layer wiring board where cracks or delamination are hardly caused on a lid like conductor covering an opening of a through hole portion and a conductor portion of its surrounding and which is excellent in connection reliability.
SOLUTION: A core substrate 12 constituting the multi-layer wiring board 11 has a through hole portion 15. The through hole portion 15 is constructed so that a through hole conductor 17 is located on the inside wall surface of the through hole 16 of a diameter ≤200 μm. An inter layer dielectric layer 31, 32 are located on a side of first main surface 13 and side of second main surface 14 of the core substrate 12. The wiring layers 23, 24 are located on the surface of the inter layer dielectric layers 31, 32. A curing agent 18 of a filling material is filled into the through hole 15. The lid like conductors 21, 23 cover the opening portion of the through hole 15. The linear expansion value of the harding agent 18 of filling material is 1.2% or less in a temperature range from a room temperature and to a temperature of solder flow.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种多层布线基板，其在覆盖通孔部分的开口和周围的导体部分的盖状导体上几乎不产生裂纹或分层，并且其连接可靠性优异。构成多层布线基板11的芯基板12具有贯通孔部15.通孔部15构成为贯通孔16的内壁面上设有贯通孔导体17 直径≤200μm。层间电介质层31,32位于芯基板12的第一主表面13和第二主表面14的一侧。布线层23,24位于层间电介质层31的表面上，填充材料的固化剂18填充到通孔15中。盖状导体21,23覆盖通孔15的开口部分。填充材料的硬化剂18的线膨胀值为1.2％或者在从室温到焊料流的温度的温度范围内。版权所有（C）2005，JPO＆NCIPI

10. 发明专利

JP2004055888A Production of filling and multilayer wiring board using it as well as multilayer wiring board 审中-公开
公开(公告)号：JP2004055888A
公开(公告)日：2004-02-19
申请号：JP2002212489
申请日：2002-07-22
申请人： Ngk Spark Plug Co Ltd , 日本特殊陶業株式会社
发明人： KOJIMA TOSHIFUMI , WAKAZONO MAKOTO , TAKADA TOSHIKATSU
IPC分类号： C08K7/16 , C08L63/00 , H05K1/11 , H05K3/28 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a filling which is excellent in adhesion strength between the filling put in a through hole and a conductor layer formed in the upper surface of the filling and can reduce the occurrence of delamination, cracks or the like of a conductor layer laminated in the upper surface of the filling, an insulation layer, a solder resist layer, etc., in a thermal-shock test and a pressure cooker test, etc., a multilayer wiring board using it and the multilayer wiring board. SOLUTION: The filling comprises a filler, a thermosetting resin and a curing agent, and is thermally set at a prescribed temperature. In the filling, the thermosetting resin and the hardener are miscible in a temperature region which is lower than the thermosetting temperature. A through hole formed in a wiring substrate is filled with the filling, and a multilayer wiring board is formed by forming a conductor layer and an insulation layer one by one in an exposed surface of the filling. COPYRIGHT: (C)2004,JPO

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