PROBLEM TO BE SOLVED: To provide a wiring board in which a wiring conductor is successfully protected by a fine and strong dam part formed in an outermost surface layer of a laminate and which has excellent reliability in connection with a semiconductor chip.SOLUTION: A wiring board 10 comprises a laminate 31 including a plurality of connection terminals 41 and a plurality of wiring conductors 62 as a conductor layer 24 in an outermost surface layer. Each wiring conductor 62 is arranged to pass between a plurality of connection terminal parts 41 for flip-chip mounting a semiconductor chip 51. A resin insulation layer 23 in the outermost surface layer of the laminate includes dam parts 63 and reinforcement parts 64. Each dam part 63 covers each wiring conductor 62. The reinforcement part 64 is formed between the adjacent connection terminal parts 41 to have a height lower than a height H3 of the dam part 63. Each reinforcement part 64 is joined to a lateral face of the dam part 63.