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1. 发明专利

JP2007250966A Filler and substrate using it 有权
标题翻译：填充物和底物使用它
公开(公告)号：JP2007250966A
公开(公告)日：2007-09-27
申请号：JP2006074342
申请日：2006-03-17
申请人： Ngk Spark Plug Co Ltd , 日本特殊陶業株式会社
发明人： KAWAMURA AYAKO , WAKAZONO MAKOTO , MIYAJI MONICHI , KOJIMA TOSHIFUMI , TAKADA TOSHIKATSU
IPC分类号： H05K1/11 , H05K3/32
摘要： PROBLEM TO BE SOLVED: To provide a filler to be easily drilled without generating adhesion defects or cracks between the filler and a substrate. SOLUTION: The filler to be filled in at least one of a through-hole and a recess on the substrate contains at least a curing agent, an inorganic filler, an organic filler, and a liquid resin. Further, the filler is prepared characteristically in the form of liquid. By the filler, the linear thermal expansion coefficient difference of the substrate and the cured filler is low and the elastic modulus of excellent drilling workability is attained. Thus, the generation of the adhesion defects is suppressed between the substrate and the filler generated by the difference in the linear thermal expansion coefficient and the cracks by the elastic modulus. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供容易钻孔的填料，而不会在填料和基材之间产生粘合缺陷或裂纹。解决方案：填充在基板上的通孔和凹部中的至少一个中的填料至少含有固化剂，无机填料，有机填料和液体树脂。此外，填充剂以液体的形式特征性地制备。通过填料，基板和固化的填料的线性热膨胀系数差小，并且获得了优异的钻孔加工性的弹性模量。因此，通过线膨胀系数和裂纹的差异产生的基板和填料之间的粘合缺陷的产生被弹性模量抑制。版权所有（C）2007，JPO＆INPIT

2. 发明专利

JP2005084126A Electro-optical composite substrate, optical waveguide, and optical waveguide with optical element 审中-公开
标题翻译：电光复合基板，光波导和光学元件与光学元件
公开(公告)号：JP2005084126A
公开(公告)日：2005-03-31
申请号：JP2003313044
申请日：2003-09-04
申请人： Ngk Spark Plug Co Ltd , 日本特殊陶業株式会社
发明人： ONO TAKESHI , TAKADA TOSHIKATSU , KOJIMA TOSHIFUMI , ONO MASAKI , KAWAMURA AYAKO , HORIO TOSHIKAZU
IPC分类号： G02B6/42 , G02B6/122
摘要： PROBLEM TO BE SOLVED: To easily presume a cause of failure when optical transmission becomes impossible in an electro-optical composite substrate where an optical element is mounted in an optical waveguide and electronic circuit substrates are spliced. SOLUTION: In the electro-optical composite substrate where a light emitting elements 14 and a light receiving element 15 are mounted on one side of the optical waveguide 10; electronic circuit substrates 30a, 30b are laminated on the opposite side; and the light emitting element 14 and the electronic circuit substrate 30a, and the light receiving element 15 and the electronic substrate 30b are electrically connected to each other through via-wiring 22a, 22b, respectively, the optical waveguide 10 is provided with conductive layers 20a, 20b and are electrically connected to the via-wiring 22a, 22b. As a result of this, when an abnormality occurs in the optical transmission in the optical waveguide 10, it becomes possible to easily presume faulty points (separation or the like of electrically connected parts of an optical waveguide or failure of optical elements) by monitoring the signals inputted/outputted to/from each element 14, 15 via the conductive layers 20a, 20b. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了容易地假设在将光学元件安装在光波导中并且电子电路基板被接合的电光复合基板中进行光传输变得不可能的原因。解决方案：在发光元件14和光接收元件15安装在光波导10的一侧的电光复合基板中; 电子电路基板30a，30b层叠在相对侧上; 并且发光元件14和电子电路基板30a以及光接收元件15和电子基板30b分别通过通孔布线22a，22b彼此电连接，光波导10设置有导电层20a 20b并且电连接到通孔布线22a，22b。结果，当在光波导10中的光传输中发生异常时，可以容易地通过监视光波导10的故障点（光波导的电连接部分的分离等或光学元件的故障）经由导电层20a，20b输入/输出到每个元件14,15的信号。版权所有（C）2005，JPO＆NCIPI

3. 发明专利

JP2004341260A Optical element mounting package and optoelectric compound mounted wiring board 有权
公开(公告)号：JP2004341260A
公开(公告)日：2004-12-02
申请号：JP2003138011
申请日：2003-05-15
申请人： Ngk Spark Plug Co Ltd , 日本特殊陶業株式会社
发明人： ONO TAKESHI , TAKADA TOSHIKATSU , HORIO TOSHIKAZU , KAWAMURA AYAKO
IPC分类号： G02B6/42 , G02B6/122 , H01L21/60 , H01L23/12 , H01L31/12
CPC分类号： H01L2224/16225
摘要： PROBLEM TO BE SOLVED: To provide an optical element mounting package that is free from optical axis deviation between an optical element and an optical path changing part and that has small light transmission loss. SOLUTION: The optical element mounting package 10 is equipped with an optical element 61, an optical interposer 70, a base material 52, an optical path changing part 77, etc. The optical interposer 70 has a first end 72 that is arranged oppositely facing the light emitting face 64 of the optical element 61, a second end 73 that is positioned on the side opposite from the first end 72, and a plurality of light transmitting parts 74 that communicate with the first and the second end 72, 73. The optical path changing part 77 is installed on the second end 73 side of the optical interposer 70 to change, in a desired direction, the optical path of a light signal propagating through the light transmitting parts 74. COPYRIGHT: (C)2005,JPO&NCIPI

4. 发明专利

JP2004264382A Optical waveguide substrate and its manufacture method as well as opto-electronic composite packaging wiring substrate and its manufacture method 审中-公开
公开(公告)号：JP2004264382A
公开(公告)日：2004-09-24
申请号：JP2003052418
申请日：2003-02-28
申请人： Ngk Spark Plug Co Ltd , 日本特殊陶業株式会社
发明人： ONO TAKESHI , TAKADA TOSHIKATSU , KOJIMA TOSHIFUMI , HORIO TOSHIKAZU , KAWAMURA AYAKO
IPC分类号： G02B6/122 , H05K1/02
摘要： PROBLEM TO BE SOLVED: To provide an optical waveguide substrate capable of efficiently transmitting an optical signal because it is possible to minimize the transmission loss of light. SOLUTION: The optical waveguide substrate 10 is provided with a base material 11, a film 31 on which an optical waveguide is formed, optical elements 41, 43 and a protruded optical path transformation part 22. The film 31 has a core 33, a clad 34 and a through-hole 35 and is bonded on a principal surface 12 of the base material 11. The end 38 of the core 33 exists on the inner circumferential surface 39 of the through-hole 35. The optical elements 41, 43 are mounted on the film 31 and are optically connected with the optical waveguide. The protruded optical path transformation part 22 is formed on the principal surface 12 of the base material 11 and on the position in the through-hole 35, and transforms the optical path in which the optical signal is propagated to a desired direction. The shortest distance between the protruded optical path transformation part 22 and the inner circumferential surface 39 of the through-hole 35 is made to be ≥0 μm and ≤100 μm. COPYRIGHT: (C)2004,JPO&NCIPI

5. 发明专利

JP2005115190A Opto-electric composite wiring board and laminated optical waveguide structure 审中-公开
标题翻译： OPTO-ELECTRIC复合导线板和层压光波导结构
公开(公告)号：JP2005115190A
公开(公告)日：2005-04-28
申请号：JP2003351496
申请日：2003-10-10
申请人： Ngk Spark Plug Co Ltd , 日本特殊陶業株式会社
发明人： ONO TAKESHI , TAKADA TOSHIKATSU , KOJIMA TOSHIFUMI , ONO MASAKI , HORIO TOSHIKAZU , KAWAMURA AYAKO
IPC分类号： G02B6/122 , H05K1/02
摘要： PROBLEM TO BE SOLVED: To provide an opto-electric composite wiring board that can realize high density optical parallel transmission, that can be manufactured at a low cost because of little restrictions on materials and manufacturing methods, and that can be easily miniaturized. SOLUTION: The opto-electric composite wiring board 10 is equipped with a plurality of optical waveguide layers 30, 31, an optical component supporting substrate 11, and a positioning guide member 44 for example. The plurality of optical waveguide layers 30, 31 are arranged by being mutually stacked and are provided with a core 33, a clad 34, an optical path switching part 37, and a positioning hole 36 opening on the main face on the optical waveguide layer side. Light is made to enter or exit through the clad 34. The optical component supporting substrate 11 is provided with the substrate main face 12 and a positioning hole 21 on the substrate side. The positioning guide member 44 is fittingly supported relative to the respective positioning hole 36, 21 on the optical waveguide layer side and on the substrate side in the plurality of optical waveguide layers 30, 31. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够实现高密度光学并行传输的光电复合布线板，由于对材料和制造方法的限制少，可以以低成本制造，并且可以容易地小型化。光电复合布线板10例如配置有多个光波导层30,31，光学部件支撑基板11和定位引导部件44。多个光波导层30,31通过相互堆叠布置，并且设置有芯33，包层34，光路切换部37和在光波导层侧的主面上开口的定位孔36 。使光通过包层34进入或离开。光学部件支撑基板11在基板侧设置有基板主面12和定位孔21。定位导向构件44相对于多个光波导层30,31中的光波导层侧和基板侧的各个定位孔36,21配合支撑。版权所有（C）2005，JPO＆NCIPI

6. 发明专利

JP2005085819A Photoelectric composite board, optical waveguide, and optical waveguide with optical element 审中-公开
标题翻译：光电复合板，光波导和具有光学元件的光波导
公开(公告)号：JP2005085819A
公开(公告)日：2005-03-31
申请号：JP2003313045
申请日：2003-09-04
申请人： Ngk Spark Plug Co Ltd , 日本特殊陶業株式会社
发明人： ONO TAKESHI , TAKADA TOSHIKATSU , KOJIMA TOSHIFUMI , ONO MASAKI , KAWAMURA AYAKO , HORIO TOSHIKAZU
IPC分类号： G02B6/42 , G02B6/122 , G02B6/43 , H01L31/12 , H05K1/02
CPC分类号： G02B6/43
摘要： PROBLEM TO BE SOLVED: To enable a fault to be easily repaired when the fault occurs in an photoelectric composite board composed of an optical waveguide mounted with optical elements and electronic circuit boards bonded thereto. SOLUTION: A light emitting device 14 and a light receiving device 15 are mounted on the one side of the optical waveguide 10, and electronic circuit boards 30a and 30b are laminated on the other side of the optical waveguide 10. The light emitting device 14 and the electronic circuit board 30a are electrically connected together with via interconnect lines 22a, and the light receiving device 15 and the electronic circuit board 30b are electrically connected together with via interconnect lines 22b for the formation of the photoelectric composite board. A pair of connectors 20a and 20b which are used for electrically connecting the via interconnect lines 22a and 22b at the side of the optical waveguide 10 to the electric interconnect lines of the electronic circuit boards 30a and 30b are provided to the optical waveguide 10 and the electronic circuit boards 30a and 30b. As the result, the optical waveguide 10 and the electronic circuit boards 30a, 30b can be made detachable, these components are detached when a fault occurs, and the fault can be repaired. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：在由安装有光学元件的光波导和与其结合的电子电路板的光电复合板中发生故障时，能够容易地修复故障。解决方案：发光器件14和光接收器件15安装在光波导10的一侧，并且电子电路板30a和30b层压在光波导10的另一侧。发光器件14和电子电路板30a与通孔布线22a电连接，并且光接收装置15和电子电路板30b通过用于形成光电复合板的通孔布线22b电连接在一起。将用于将光波导10一侧的通孔布线22a和22b电连接到电子电路板30a和30b的电互连线的一对连接器20a和20b设置到光波导10和电子电路板30a和30b。结果，光波导10和电子电路板30a，30b可以是可拆卸的，这些部件在故障发生时被分离，并且可以修复故障。版权所有（C）2005，JPO＆NCIPI

7. 发明专利

JP2008263240A Photoelectric conversion module 有权
标题翻译：光电转换模块
公开(公告)号：JP2008263240A
公开(公告)日：2008-10-30
申请号：JP2008199270
申请日：2008-08-01
申请人： Ngk Spark Plug Co Ltd , 日本特殊陶業株式会社
发明人： ONO MASAKI , TAKADA TOSHIKATSU , KOJIMA TOSHIFUMI , ONO TAKESHI , HORIO TOSHIKAZU , KAWAMURA AYAKO
IPC分类号： H01S5/022 , H01L31/02
CPC分类号： H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/30107 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a photoelectric conversion module whose entire height is easily reduced, which optically couples optical components and other components in high precision, and which can be relatively simply manufactured. SOLUTION: The photoelectric conversion module 41 is equipped with a first laminate substrate 51, optical elements 17, guide pins 31 as optical coupling members, a semiconductor integrated circuit device 18 for driving the optical elements, and the like. The first laminate substrate 51 has a multilayer substrate obtained by laminating a plurality of insulating layers 52 in the direction orthogonal to the thickness direction of a wiring board 11 for mounting the module. A plurality of bump pads 79 are provided on the lower surface of the multilayer substrate. A cavity 143 for the optical elements are provided on the side surface of the multilayer substrate. The optical elements 17 are mounted on the side surface of the first laminate substrate 51 while accommodated in the cavity 143 for the optical elements. The guide pins 31 are provided on the side surface of the first laminate substrate 51, and make a positional reference when the optical elements 17 and the other components 21 to be optically coupled thereto are aligned on their optical axes. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种整体高度容易降低的光电转换模块，其以高精度光学耦合光学部件和其它部件，并且可以相对简单地制造。光电转换模块41配备有第一层叠基板51，光学元件17，作为光耦合部件的引导销31，用于驱动光学元件的半导体集成电路装置18等。第一层压基板51具有通过在与布线板11的厚度方向正交的方向上层叠多个绝缘层52而获得的多层基板，用于安装模块。在多层基板的下表面上设置有多个凸点焊盘79。用于光学元件的空腔143设置在多层基板的侧表面上。光学元件17安装在第一层压基板51的侧表面上，同时容纳在用于光学元件的空腔143中。导向销31设置在第一层压基板51的侧面上，并且当光学元件17和与光学结合的其它部件21在其光轴上对准时，进行位置参考。版权所有（C）2009，JPO＆INPIT

8. 发明专利

JP2006066705A Photoelectric conversion module and junction body of laminate substrate 有权
标题翻译：层状基片的光电转换模块和接头体
公开(公告)号：JP2006066705A
公开(公告)日：2006-03-09
申请号：JP2004248486
申请日：2004-08-27
申请人： Ngk Spark Plug Co Ltd , 日本特殊陶業株式会社
发明人： ONO MASAKI , TAKADA TOSHIKATSU , KOJIMA TOSHIFUMI , ONO TAKESHI , HORIO TOSHIKAZU , KAWAMURA AYAKO
IPC分类号： H01L31/12 , H01L31/0232 , H01L33/48 , H01S5/022
CPC分类号： H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/30107 , H01L2924/3025 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a photoelectric conversion module capable of easily attaining low height as a whole, performing optical coupling between an optical component and another component at high accuracy and allowed to be comparatively simply manufactured.
SOLUTION: The photoelectric conversion module 41 is provided with a laminate substrate junction body 40, an optical element 17, an optical coupling member 31, and so on. The laminate substrate junction body 40 is provided with a first laminate substrate 51 obtained by laminating a plurality of insulating layers 52 and a second laminate substrate 61 obtained by laminating a plurality of insulating layers 62. The first and second laminate substrates 51, 61 are joined with each other in a state that the lamination directions of the insulating layers 52, 62 are intersected at right angles and electrically connected. The optical element 17 is mounted on the first laminate substrate 51. The optical coupling member 31 is formed on the first laminate substrate 51. The optical coupling member 31 becomes a positional reference for matching the optical axis of the optical element 17 with that of another component 21 to be optically coupled with the optical element 17.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供能够容易地实现低高度整体的光电转换模块，以高精度执行光学部件与另一部件之间的光耦合并且允许相对简单地制造。解决方案：光电转换模块41设置有层叠基板连接体40，光学元件17，光耦合部件31等。层压基板连接体40设置有通过层叠多个绝缘层52而获得的第一层叠基板51和通过层叠多个绝缘层62而获得的第二层叠基板61.第一和第二层叠基板51,61连接彼此以绝缘层52,62的层叠方向成直角相交并电连接的状态。光学元件17安装在第一层叠基板51上。光耦合部件31形成在第一层叠基板51上。光耦合部件31成为将光学元件17的光轴与另一光学元件17的光轴匹配的位置基准组件21与光学元件17光学耦合。版权所有：（C）2006，JPO＆NCIPI

9. 发明专利

JP2005317934A Component support substrate and its manufacturing method, and optical device 有权
标题翻译：组件支持基板及其制造方法和光学器件
公开(公告)号：JP2005317934A
公开(公告)日：2005-11-10
申请号：JP2005078682
申请日：2005-03-18
申请人： Ngk Spark Plug Co Ltd , 日本特殊陶業株式会社
发明人： KAWAMURA AYAKO , TAKADA TOSHIKATSU , KOJIMA TOSHIFUMI , ONO TAKESHI , ONO MASAKI , HORIO TOSHIKAZU
IPC分类号： G02B6/42 , H05K1/02 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a component support substrate which has a high reliability due to a good adhesion in a resin-filled portion and can make a very precise alignment of components. SOLUTION: The component support substrate 10 comprises a substrate 11, the resin-filled portion 22, a component support body 24, etc. The substrate 11 has a hole 21 to be filled which has an opening opened to a first principal plane 12. The resin-filled portion 22 is located inside the hole 21 to be filled, and has an engagement hole 23 opened to the first principal plane 12. The component support body 24 is fixed by being engaged with the engagement hole 23, and can support another component 31 by portions projecting from the engagement hole 23. The hole 21 to be filled has the unevenness on the inner wall surface. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种由于树脂填充部分中的良好粘附性而具有高可靠性的部件支撑基板，并且可以非常精确地对准部件。＆lt; P＆gt;解决方案：部件支撑基板10包括基板11，树脂填充部22，部件支撑体24等。基板11具有要被填充的孔21，该孔具有通向第一主平面的开口树脂填充部分22位于要填充的孔21内部，并且具有与第一主平面12开口的接合孔23.部件支撑体24通过与接合孔23接合而固定，并且可以从接合孔23突出地支撑另一部件31。待填充的孔21在内壁表面上具有凹凸。版权所有（C）2006，JPO＆NCIPI

10. 发明专利

JP2005084165A Electro-optical composite wiring structure, structure comprising optical element mounting substrate, optical waveguide layer, and optical path conversion component; structure comprising optical element mounting substrate and optical path conversion component; structure comprising optical path conversion component and optical waveguide layer; optical path conversion component comprising alignment structure; and micro lens array comprising alignment structure 有权
标题翻译：电光复合导线结构，包含光学元件安装基板，光波导层和光路转换组件的结构; 结构包含光学元件安装基板和光路转换组件; 包含光学路径转换组件和光波导层的结构; 包含对准结构的光学路径转换组件; 和微透镜阵列包括对准结构
公开(公告)号：JP2005084165A
公开(公告)日：2005-03-31
申请号：JP2003313626
申请日：2003-09-05
申请人： Ngk Spark Plug Co Ltd , 日本特殊陶業株式会社
发明人： ONO TAKESHI , HORIO TOSHIKAZU , KAWAMURA AYAKO , KOJIMA TOSHIFUMI
IPC分类号： G02B6/42 , G02B6/122 , H05K1/02
摘要： PROBLEM TO BE SOLVED: To provide an electro-optical composite wiring structure which permits exact alignment of an optical axis without deviation and has little optical transmission loss. SOLUTION: This electro-optical composite wiring structure 10 comprises an optical element mounting substrate 41, an electric wiring substrate 11, an optical waveguide layer 61, an optical path conversion component 71, and an alignment guide member 31. The optical element mounting substrate 41 has an optical element mounting substrate body 42 formed with recesses 48 for alignment of the optical element mounting substrate side. The electric wiring substrate 11 has an electric wiring substrate body 22 formed with the recesses 48 for alignment of the optical element mounting susbtrate side. The optical waveguide layer 61 has an optical waveguide layer body 62 formed with recesses 68 for alignment of the optical waveguide side. The optical path conversion component 71 has an optical path conversion component body 72 formed with recesses 78 for alignment of the optical path conversion component side. Guide members 31 for alignment can be fitted with the above recesses 11, 41, 61, 71. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种允许光轴精确对准而不偏差且光传输损耗小的电光复合布线结构。解决方案：该电光复合布线结构10包括光学元件安装基板41，电布线基板11，光波导层61，光路转换部件71和对准引导部件31.光学元件安装基板41具有形成有用于对准光学元件安装基板侧的凹部48的光学元件安装基板主体42。电布线基板11具有形成有用于对准光学元件安装支架侧的凹部48的电布线基板主体22。光波导层61具有形成有用于对准光波导侧的凹部68的光波导层体62。光路转换部件71具有形成有用于对准光路转换部件侧的凹部78的光路转换部件主体72。用于对准的导向构件31可以装配有上述凹槽11,41,61,71。版权所有（C）2005，JPO＆NCIPI

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