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1. 发明专利

JP2013239530A Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：JP2013239530A
公开(公告)日：2013-11-28
申请号：JP2012110753
申请日：2012-05-14
申请人： Noda Screen:Kk , 株式会社野田スクリーン
发明人： OYAMADA SHIGEMASA , YOSHIZAWA MASAMITSU , OGAWA HIROYOSHI
IPC分类号： H01L23/12
CPC分类号： H01L24/07 , H01L23/147 , H01L23/15 , H01L23/49822 , H01L23/49827 , H01L23/49833 , H01L23/49838 , H01L23/50 , H01L23/60 , H01L23/64 , H01L24/06 , H01L25/0652 , H01L25/0657 , H01L2224/0401 , H01L2224/05554 , H01L2224/14133 , H01L2224/14135 , H01L2224/16225 , H01L2224/16227 , H01L2224/81815 , H01L2225/0652 , H01L2225/06572 , H01L2924/12032 , H01L2924/12036 , H01L2924/15321 , H01L2924/15788 , H01L2924/171 , H01L2924/351 , H05K1/141 , H05K3/368 , H05K2201/10378 , H05K2201/10515 , H05K2201/2036 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device which can use a general-purpose semiconductor chip which is microfabricated with less constraints of a wiring rule on a printed circuit board side, and which has high reliability in an electric junction part, and which can be manufactured at low cost.SOLUTION: A semiconductor device comprises a semiconductor chip, a relay substrate, a surface circuit pattern and a post array. The surface circuit pattern includes: a chip-side pad group which is formed on one surface of the relay substrate and connected to an external connection pad of the semiconductor chip; a relay interconnection group that leads to the chip-side pad group and expands and extends to an outer periphery side of the relay substrate; and a relay pad group that leads to an end of each relay interconnection on the side opposite to the chip-side pad. The post array includes a plurality of electrically-conducting paths formed to extend in a direction intersecting a surface of the relay substrate, in which the electrically-conducting paths are insulated by an insulation resin from each other, and ends of the electrically-conducting paths are connected to the relay pads and the other ends of the electrically-conducting paths on the side opposite to the relay substrate are connected to a printed circuit board side.
摘要翻译：要解决的问题：提供一种半导体器件，其可以使用在印刷电路板侧具有较少的布线规则限制的微制造的通用半导体芯片，并且其在电接合部分中具有高可靠性，并且其可以以低成本制造。解决方案：半导体器件包括半导体芯片，中继衬底，表面电路图案和柱阵列。表面电路图案包括：芯片侧焊盘组，其形成在中继基板的一个表面上并连接到半导体芯片的外部连接焊盘; 通过芯片侧焊盘组并且延伸并延伸到中继基板的外周侧的继电器互连组; 以及在与芯片侧焊盘相反的一侧通向每个继电器互连的端部的继电器焊盘组。支柱阵列包括多个导电路径，其形成为在与中继基板的表面相交的方向上延伸，其中导电路径由绝缘树脂彼此绝缘，并且导电路径的端部连接到继电器衬垫，并且与中继衬底相对的一侧的导电路径的另一端连接到印刷电路板侧。

2. 发明专利

JP2011100930A Protective insulation material for circuit board 审中-公开
标题翻译：电路板保护绝缘材料
公开(公告)号：JP2011100930A
公开(公告)日：2011-05-19
申请号：JP2009256221
申请日：2009-11-09
申请人： Noda Screen:Kk , 株式会社野田スクリーン
发明人： OSHIMA YASUHIRO , NISHIMATSU DAISUKE
IPC分类号： H05K3/28 , H01B3/30
摘要： PROBLEM TO BE SOLVED: To provide a protective insulation material capable of improving the electrical reliability of a circuit board and forming an insulating protective film having excellent smoothness.
SOLUTION: A protective insulation material for a circuit board includes a rubber-like elastic body resin containing an aromatic compound having a vinyl group and aliphatic hydrocarbon having a double bond as constitutional units, fluororesin selected from methacrylate resin containing fluorine and acrylate resin containing fluorine, tackifier resin, and a solvent. The protective insulation material is also characterized in that, when the content of the rubber-like elastic body resin is 100 pts.mass, the content of the fluororesin is 5 pts.mass or smaller, and the content of the tackifier resin is 10 pts.mass or larger.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供能够提高电路板的电可靠性并形成具有优异平滑度的绝缘保护膜的保护绝缘材料。电路板用保护绝缘材料包括含有具有乙烯基的芳族化合物和具有双键的脂族烃作为结构单元的橡胶状弹性体树脂，选自含氟的甲基丙烯酸酯树脂的氟树脂和丙烯酸酯树脂含氟，增粘树脂和溶剂。保护绝缘材料的特征还在于，当橡胶状弹性体树脂的含量为100质量份时，氟树脂的含量为5质量份以下，增粘树脂的含量为10个大于或等于版权所有（C）2011，JPO＆INPIT

3. 发明专利

JP2007046155A Film deposition method and film deposition apparatus 有权
标题翻译：膜沉积方法和膜沉积装置
公开(公告)号：JP2007046155A
公开(公告)日：2007-02-22
申请号：JP2006186767
申请日：2006-07-06
申请人： Noda Screen:Kk , 株式会社野田スクリーン
发明人： OGAWA HIROYOSHI , KAWASE AKIHIRO , WANG SHUQIANG
IPC分类号： C23C16/44 , H01G4/10 , H01G4/12 , H01L21/31
摘要： PROBLEM TO BE SOLVED: To provide a film deposition method and a film deposition apparatus capable of depositing a thin film of excellent quality in the atmosphere.
SOLUTION: In the film deposition method and the film deposition apparatus, aerosol is generated by atomizing a metal compound as a raw material by the ultrasonic vibration in a carrier gas, and the aerosol is heated and sprayed on a work to obtain a uniform film of excellent quality. According to the film deposition method and the film deposition apparatus, the film can be deposited in the atmosphere, and the film deposition can be performed in an open space without providing any film deposition chamber or the like. Thus, the line arrangement of manufacturing equipment is facilitated, and the manufacturing efficiency can be enhanced.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够在大气中沉积优质品质的薄膜沉积方法和成膜装置。解决方案：在成膜方法和成膜装置中，通过在载气中通过超声波振动将作为原料的金属化合物雾化而产生气溶胶，并且将气溶胶加热喷雾到工件上以获得均匀膜质量优良。根据膜沉积方法和成膜装置，可以将膜沉积在大气中，并且可以在开放空间中进行膜沉积，而不需要任何成膜室等。因此，制造设备的线路布置方便，并且可以提高制造效率。版权所有（C）2007，JPO＆INPIT

4. 发明专利

JP2004079584A Resin filling device 审中-公开
公开(公告)号：JP2004079584A
公开(公告)日：2004-03-11
申请号：JP2002233948
申请日：2002-08-09
申请人： Denso Corp , Noda Screen:Kk , 株式会社デンソー , 株式会社野田スクリーン
发明人： OGAWA HIROYOSHI , HATTORI ATSUNORI , YAZAKI YOSHITARO
IPC分类号： B05C5/00 , H05K3/28
摘要： PROBLEM TO BE SOLVED: To provide a resin filling device simplified in device structure, not high in manufacturing cost, and excellent in productivity.
SOLUTION: A sliding body 12 that slides on the surface of a printed wiring board 40 is provided with an air suction aperture 13a connected to an evacuation unit 20 and with a resin feed aperture 14a accommodating a resin. A via-hole 41 is connected to the air suction aperture 13a for evacuation for production of a vacuum therein, and then is connected to the resin feed aperture 14a for filling a resin R. Since what is required is the production of a vacuum only in the via-hole 41, time for evacuation is shortened greatly.
COPYRIGHT: (C)2004,JPO

5. 发明专利

JP2003023231A Method for forming electric circuit 有权
标题翻译：形成电路的方法
公开(公告)号：JP2003023231A
公开(公告)日：2003-01-24
申请号：JP2001204669
申请日：2001-07-05
申请人： Noda Screen:Kk , 株式会社野田スクリーン
发明人： OGAWA HIROYOSHI
IPC分类号： H05K3/00 , H01L23/12 , H05K3/10
摘要： PROBLEM TO BE SOLVED: To provide a method for forming an electric circuit easily.
SOLUTION: A table 21 movable up and down is disposed in a dispersion liquid produced by dispersing nanometer(nm) scale micro particles of metal into a fluorine based medium and then the micro particles of metal are metal bonded by lowering the table 21 while irradiating the dispersion liquid covering the table 21 with carbon dioxide laser light thus forming an electric circuit body 12.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：提供容易形成电路的方法。解决方案：将上下移动的工作台21配置在通过将纳米（nm）的鳞片状金属微粒分散在氟系介质中而制成的分散液中，然后通过下降台21将金属微粒金属接合，同时照射分散液用二氧化碳激光覆盖在桌子21上，从而形成电路体12。

6. 发明专利

JP2008141121A Passive element sheet, and semiconductor package 审中-公开
标题翻译：被动元件片和半导体封装
公开(公告)号：JP2008141121A
公开(公告)日：2008-06-19
申请号：JP2006328341
申请日：2006-12-05
申请人： Noda Screen:Kk , 株式会社野田スクリーン
发明人： OGAWA HIROYOSHI , WANG SHUQIANG
IPC分类号： H01L23/12
摘要： PROBLEM TO BE SOLVED: To provide a technique capable of arranging a passive element such as a capacitor at a position closer to a semiconductor chip built in a semiconductor package and easily arranging the passive element such as a capacitor at a desired position.
SOLUTION: The passive element sheet is composed by laminating a conductor layer and a dielectric layer on a base material, the dielectric layer is formed of the thin film of a metal oxide, and the thin film of the metal oxide is formed by generating aerosol by atomizing raw material liquid for which a metal compound containing a metal to be the raw material of the metal oxide is dissolved in a solvent in a carrier gas by ultrasonic vibrations, heating the aerosol and then blowing the aerosol to the base material while heating the base material. The semiconductor package is composed by mounting a semiconductor chip on a substrate, and the passive element sheet is mounted between the substrate and the semiconductor chip.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够在靠近半导体封装中的半导体芯片的位置处布置诸如电容器的无源元件并且将诸如电容器的无源元件容易地布置在期望位置的技术。解决方案：无源元件片通过在基材上层叠导体层和电介质层而构成，电介质层由金属氧化物的薄膜形成，金属氧化物的薄膜由通过将通过超声波振动将作为金属氧化物的原料的含有金属的金属化合物的原料液雾化在载体气体中的溶剂中而产生气溶胶，加热气溶胶，然后将气溶胶吹送到基材，同时加热基材。半导体封装通过将半导体芯片安装在基板上而将无源元件片安装在基板和半导体芯片之间。版权所有（C）2008，JPO＆INPIT

7. 发明专利

JP2008004689A Light-emitting diode package 有权
标题翻译：发光二极管封装
公开(公告)号：JP2008004689A
公开(公告)日：2008-01-10
申请号：JP2006171478
申请日：2006-06-21
申请人： Noda Screen:Kk , 株式会社野田スクリーン
发明人： OGAWA HIROYOSHI
IPC分类号： H01L33/32 , H01L33/50 , H01L33/54 , H01L33/56 , H01L33/62 , H01L33/64
摘要： PROBLEM TO BE SOLVED: To provide an LED package capable of highly efficient heat radiation and ensuring stable color conversion and transmitted light quantity.
SOLUTION: A refrigerant R is sealed in the inside of a case member 30 covering an LED chip 20. A phosphor P is diffused in the refrigerant R. According to this configuration, heat exchange occurs between the heat-generating LED chip 20 and the refrigerant R therearound, and heat convection occurs in the refrigerant R. The heat is transmitted by the heat convection to the case member 30, and is radiated in the ambient air via the case member 30. In this way, highly efficient heat radiation can be possible. Further, since the heat convection causes uniformity of diffusion in the refrigerant R of the phosphor P, the stable color conversion and transmitted light quantity can be ensured. Still further, since no special countermeasure is required for uniform diffusion of the phosphor P in manufacturing steps, the manufacturing steps can be simplified.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供能够高效散热并确保稳定的颜色转换和透射光量的LED封装。解决方案：制冷剂R被密封在覆盖LED芯片20的壳体构件30的内部。荧光体P在制冷剂R中扩散。根据该结构，发热LED芯片20 和制冷剂R，并且在制冷剂R中发生热对流。热量通过热对流传递到壳体构件30，并且经由壳体构件30辐射到环境空气中。以这种方式，高效的热辐射可以。此外，由于热对流引起荧光体P的制冷剂R中的扩散的均匀性，因此可以确保稳定的颜色转换和透射光量。此外，由于在制造工序中荧光体P的均匀扩散不需要特别的对策，因此可以简化制造工序。版权所有（C）2008，JPO＆INPIT

8. 发明专利

JP2007189035A Manufacturing method and manufacturing device of multilayer substrate 有权
标题翻译：多层基板的制造方法和制造装置
公开(公告)号：JP2007189035A
公开(公告)日：2007-07-26
申请号：JP2006005332
申请日：2006-01-12
申请人： Denso Corp , Noda Screen:Kk , 株式会社デンソー , 株式会社野田スクリーン
发明人： HARADA TOSHIICHI , HATTORI ATSUNORI
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer substrate, and a manufacturing device of a multilayer substrate which can control the deviation of position of a land, when manufacturing the multilayer substrate containing a thermoplastic resin film.
SOLUTION: The manufacturing method of a multilayer substrate serves for the lamination of two or more thermoplastic resin films 100 including the thermoplastic resin film 100 wherein an interlayer connection member 110 and a land 120 are formed. The method comprises a lamination process for laminating two or more thermoplastic resin films 100, an installation process for installing a land position correcter material 200 for correcting the position of the land 120 in at least one surface of the thermoplastic films 100 laminated at the lamination process, and a pressurization heating process for heating and the pressurizing together the thermoplastic resin film 100 and the land position correction material 200.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：制造含有热塑性树脂膜的多层基板时，提供一种多层基板的制造方法以及能够控制台阶位置的偏移的多层基板的制造装置。解决方案：多层基板的制造方法用于层压包含热塑性树脂膜100的两种或多种热塑性树脂膜100，其中形成层间连接构件110和焊盘120。该方法包括用于层压两种或更多种热塑性树脂膜100的层压方法，用于安装用于校正层压过程中层压的热塑性膜100的至少一个表面中的焊盘120的位置的焊盘位置校正器200的安装过程，以及加热和加热热塑性树脂膜100和焊盘位置校正材料200的加压加热方法。（C）2007，JPO＆INPIT

9. 发明专利

JP2006179945A Apparatus for filling in hole of circuit board 审中-公开
标题翻译：用于填充电路板孔的装置
公开(公告)号：JP2006179945A
公开(公告)日：2006-07-06
申请号：JP2006030205
申请日：2006-02-07
申请人： Noda Screen:Kk , 株式会社野田スクリーン
发明人： HOSOMI KAZUNORI , OGAWA HIROYOSHI
IPC分类号： H05K3/28 , B05C5/00
摘要： PROBLEM TO BE SOLVED: To provide an apparatus for filling in hole of circuit board which is higher in productivity than a conventional apparatus and can reduce cost.
SOLUTION: In an apparatus for filling in hole of a circuit board 100, an ink discharge head 30 forms an ink into a drop and discharges it from a nozzle 33A to fill in a through-hole 101 opened on a surface of the circuit board 100 with the drop of the ink. This improves the productivity and can reduce the cost, in comparison to filling in hole by conventional screen printing.
COPYRIGHT: (C)2006,JPO&NCIPI

10. 发明专利

JP2004058400A Vacuum printing device 有权
公开(公告)号：JP2004058400A
公开(公告)日：2004-02-26
申请号：JP2002218450
申请日：2002-07-26
申请人： Noda Screen:Kk , 株式会社野田スクリーン
发明人： KAWAKITA HIROSHI , OGAWA HIROYOSHI
IPC分类号： B41F15/12 , B41F15/08 , H01L21/56
摘要： PROBLEM TO BE SOLVED: To provide a vacuum printing device capable of printing even on a resin containing volatile substances like a solvent and a photosetting resin in a vacuum atmosphere and excellent in productivity. SOLUTION: The vacuum printing device feeds resin to a printed circuit board P in a vacuum atmosphere with a resin feeding mechanism 41. An excess resin rubbed by a squeegee 42 is collected on the resin recovery table 51 of a resin discharging device 50, while, the resin adhered on the squeegee 42 is rubbed with a squeegee adhered resin removing mechanism 52. The excess resin within a vacuum printing chamber 11, thus recovered, is moved into a resin discharging chamber 13 with a lifting device 61 and is removed by opening a door, keeping the vacuum printing chamber 11 in a hermetic condition. COPYRIGHT: (C)2004,JPO

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