专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2007189035A Manufacturing method and manufacturing device of multilayer substrate 有权
标题翻译：多层基板的制造方法和制造装置
公开(公告)号：JP2007189035A
公开(公告)日：2007-07-26
申请号：JP2006005332
申请日：2006-01-12
申请人： Denso Corp , Noda Screen:Kk , 株式会社デンソー , 株式会社野田スクリーン
发明人： HARADA TOSHIICHI , HATTORI ATSUNORI
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer substrate, and a manufacturing device of a multilayer substrate which can control the deviation of position of a land, when manufacturing the multilayer substrate containing a thermoplastic resin film.
SOLUTION: The manufacturing method of a multilayer substrate serves for the lamination of two or more thermoplastic resin films 100 including the thermoplastic resin film 100 wherein an interlayer connection member 110 and a land 120 are formed. The method comprises a lamination process for laminating two or more thermoplastic resin films 100, an installation process for installing a land position correcter material 200 for correcting the position of the land 120 in at least one surface of the thermoplastic films 100 laminated at the lamination process, and a pressurization heating process for heating and the pressurizing together the thermoplastic resin film 100 and the land position correction material 200.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：制造含有热塑性树脂膜的多层基板时，提供一种多层基板的制造方法以及能够控制台阶位置的偏移的多层基板的制造装置。解决方案：多层基板的制造方法用于层压包含热塑性树脂膜100的两种或多种热塑性树脂膜100，其中形成层间连接构件110和焊盘120。该方法包括用于层压两种或更多种热塑性树脂膜100的层压方法，用于安装用于校正层压过程中层压的热塑性膜100的至少一个表面中的焊盘120的位置的焊盘位置校正器200的安装过程，以及加热和加热热塑性树脂膜100和焊盘位置校正材料200的加压加热方法。（C）2007，JPO＆INPIT

2. 发明专利

JP2007185685A Laser beam machining apparatus 审中-公开
标题翻译：激光加工设备
公开(公告)号：JP2007185685A
公开(公告)日：2007-07-26
申请号：JP2006005331
申请日：2006-01-12
申请人： Denso Corp , Noda Screen:Kk , 株式会社デンソー , 株式会社野田スクリーン
发明人： HARADA TOSHIICHI , KONDO KOJI , KAMIYA TETSUAKI , HATTORI ATSUNORI
IPC分类号： B23K26/14 , B23K26/00
摘要： PROBLEM TO BE SOLVED: To provide a laser beam machining apparatus capable of preventing deposition of dust generated during the laser beam machining on a workpiece. SOLUTION: The laser beam machining apparatus comprises: a laser beam apparatus 30 for allowing a workpiece 1 to be irradiated with laser beams; an air ejector 10 provided with an ejection hole 12 directed to a scan area of the workpiece 1 to be machined by laser beams to eject air to the scan area from the ejection hole 12; and a dust collector 20 for collecting the dust generated from the workpiece by laser beams. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够防止在激光加工过程中产生的粉尘沉积在工件上的激光束加工装置。解决方案：激光束加工设备包括：用于允许工件1被激光束照射的激光束设备30; 设置有喷射孔12的喷射孔12，喷射孔12被引导到工件1的扫描区域，以被激光束加工，以将喷射空气从喷射孔12喷射到扫描区域; 以及用于通过激光束收集从工件产生的灰尘的集尘器20。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2015014584A 生体検知器、車両用着座検知器およびシートベルト非着用警告システム有权
标题翻译：有机检测仪，汽车和座椅防护罩警报系统
公开(公告)号：JP2015014584A
公开(公告)日：2015-01-22
申请号：JP2013220112
申请日：2013-10-23
申请人：株式会社デンソー , Denso Corp
发明人： SAITO KEITA , SHIRAISHI YOSHIHIKO , YAZAKI YOSHITARO , TANAKA YASUHIRO , MIYAGAWA EIJIRO , SHIMIZU MOTONORI , HARADA TOSHIICHI , SAKAIDA ATSUSUKE , TANIGUCHI TOSHIHISA , GOKO MICHIHISA
IPC分类号： G01V9/00 , A47C7/62 , B60N2/90 , G01K17/08
CPC分类号： B60R22/48 , B60N2/002 , B60R21/01512 , B60R2022/4808 , G01K17/00 , G01K17/20 , G01K2205/00 , G01V9/005
摘要：【課題】従来よりも正確な生体の検知を可能とする。【解決手段】検知対象位置に存在する生体からの熱流束を検出できるように熱流束センサ10を配置する。そして、熱流束センサの検出結果と、検知対象位置に生体が存在する場合に検出されうる熱流束に応じて予め設定された判定基準とを比較して、生体の有無を判定する。そして、検出結果が判定基準を満たす場合、すなわち、熱流束センサで検出した熱流束が生体からの熱流束である場合に、生体有りと判定することで、従来よりも正確な生体の検知が可能となる。【選択図】図1
摘要翻译：要解决的问题：比常规方法更准确地检测生物体。解决方案：热通量传感器10被布置成检测存在于检测对象位置的生物体的热通量。然后，将热通量传感器的检测结果与当生物存在于检测对象位置时可以检测到的热通量预先设定的确定基准进行比较，从而确定生物体的存在/不存在。然后，当检测结果满足判定基准时，即，当由热通量传感器检测到的热通量是来自生物体的热通量时，确定存在生物体。因此，可以比常规方式更准确地检测生物体。

4. 发明专利

JP2010058341A Method of manufacturing base material for printed board 有权
标题翻译：制造印刷板材料的方法
公开(公告)号：JP2010058341A
公开(公告)日：2010-03-18
申请号：JP2008225112
申请日：2008-09-02
申请人： Denso Corp , 株式会社デンソー
发明人： HARADA TOSHIICHI , KONDO KOJI , YAZAKI YOSHITARO
IPC分类号： B29C43/24 , B29C43/28 , B32B27/04 , B32B27/12
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a base material for a printed board suitable for the printed board of multilayer structure collectively formed by heating while pressurized. SOLUTION: The method of manufacturing the base material 40 for the printed board, which is formed by integrating resin base materials 10, 11, 12 comprising a thermoplastic resin and a fabric base material 20 comprising a material having a melting point higher than that of the thermoplastic resin, and is used in the printed board of multilayer structure collectively formed by heating while pressurized, includes an integration process wherein the resin base materials and the fabric base material are supplied to paired rolls 60, 61, a laminate including the resin base materials and the fiber base material is sandwiched by the rolls in its laminating direction while the thermoplastic resin is softened by heating, the thermoplastic resin is impregnated into the fiber base material, so that the base material for the printed board in which the resin base material and the fiber base material are integrated. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种制造适合于通过在加压下加热而共同形成的多层结构的印刷电路板的印刷电路板的基材的方法。解决方案：制造用于印刷电路板的基材40的方法，其通过将包括热塑性树脂的树脂基材10,11,12和织物基材20整合而形成，该基材20包括熔点高于热塑性树脂用于通过加压而加热共同形成的多层结构的印刷电路板，包括将树脂基材和织物基材供给到成对辊60,61的一体化工序，树脂基材和纤维基材在层压方向上被辊夹持，同时通过加热软化热塑性树脂，将热塑性树脂浸渍到纤维基材中，使得其中树脂的基材基材和纤维基材一体化。版权所有（C）2010，JPO＆INPIT

5. 发明专利

JP2009266966A Apparatus for manufacturing printed circuit board 有权
标题翻译：制造印刷电路板的装置
公开(公告)号：JP2009266966A
公开(公告)日：2009-11-12
申请号：JP2008112988
申请日：2008-04-23
申请人： Denso Corp , 株式会社デンソー
发明人： TAKEUCHI SATOSHI , SAKAIDA ATSUSUKE , TANIGUCHI TOSHIHISA , HARADA TOSHIICHI , CHIBA MAKI
IPC分类号： H05K3/46
CPC分类号： B30B15/061 , B30B15/024 , H05K3/4611 , H05K3/4614 , H05K3/4632 , H05K2201/0129 , H05K2201/0133 , H05K2203/065 , H05K2203/068
摘要： PROBLEM TO BE SOLVED: To provide an apparatus for manufacturing a printed circuit board that improves the number of times for reuse of a buffer member, which is provided to reduce variations of pressure applied to each part of a laminate.
SOLUTION: In the apparatus, a pressing die includes a lower pressing part wherein a buffer member is disposed between the surface of a laminate and the lower pressing part, an upper pressing part which has a portion facing the other surface of the laminate and a portion facing the buffer member and is away from the buffer member at least in pre-heat-pressing state, and a circular frame which surrounds a whole area of a side surface of the buffer member and is integrated with only the lower pressing part at least upon heat pressing. Before pressing and heating, the laminate, a second pressing part, and the buffer member define an escape space therebetween for escaping the buffer member. A lip is arranged on a surface facing the surface of the laminate while protruding from the frame toward the laminate, and it is deformed following the deformation of the buffer member caused by pressing and comes in contact with the upper pressing part facing the buffer member.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于制造印刷电路板的装置，其提高缓冲构件的再利用次数，其用于减少施加到层压体的每个部分的压力的变化。解决方案：在该装置中，压模包括下压部，其中缓冲部件设置在层叠体的表面和下挤压部之间，上压部，其具有面向层叠体的另一表面的部分以及面向缓冲构件并且至少在预热状态下远离缓冲构件的部分，以及围绕缓冲构件的侧表面的整个区域的圆形框架，并且仅与下部按压部分至少在热压时。在加压和加热之前，层压体，第二按压部分和缓冲部件在其间限定了用于逸出缓冲部件的逸出空间。在从框架朝向层叠体突出的同时，在与层压体的表面相对的表面上设置有唇部，并且随着缓冲构件由于按压而变形而变形，并且与上部按压部件面向缓冲构件接触。版权所有（C）2010，JPO＆INPIT

6. 发明专利

JP2005053076A Manufacturing method of multilayered substrate and hot press 有权
标题翻译：多层基板和热压机的制造方法
公开(公告)号：JP2005053076A
公开(公告)日：2005-03-03
申请号：JP2003286145
申请日：2003-08-04
申请人： Denso Corp , 株式会社デンソー
发明人： HARADA TOSHIICHI
IPC分类号： B29C43/02 , B29C43/52 , B29C65/02 , B29L9/00 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayered substrate capable of shortening a heating time, and a hot press.
SOLUTION: A laminate 50, which is obtained by laminating an insulating layer and a conductor layer, is arranged between a pair of the hot press plates 20a and 20b of the hot press 10 and heated and pressed from both upper and under surfaces thereof by the hot press plates 20a and 20b to manufacture the multilayered substrate. At this time, the laminate 50 is heated and pressed in a state that an auxiliary plate 30, which is excellent in heat conductivity and has length not obstructing the pressure to the laminate 50 by the hot press plates 20a and 20b, is arranged to the side surface of the laminate 50 and first cushioning materials 40, which are excellent in heat conductivity and can be deformed upon the reception of the pressure from the hot press plates 20a and 20b, are arranged between the end surfaces of the auxiliary plate 30 and the hot press plates 20a and 20b. By this constitution, the heat of the hot press plates 20a and 20b is transmitted to the laminate 50 from the side surface thereof through the first cushioning materials 40 and the auxiliary plate 30 to shorten a heating time.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供能够缩短加热时间的多层基板的制造方法和热压机。解决方案：通过层叠绝缘层和导体层获得的层压体50被布置在热压机10的一对热压板20a和20b之间，并从上表面和下表面通过热压板20a和20b制造多层基板。此时，层压体50被加热并按照热传导性优异的辅助板30，其长度不会受到热压板20a，20b的阻碍层压体50的压力的状态而被设置在在辅助板30的端面和辅助板30的端面之间配置有导热性优异且受热压板20a，20b接收压力而变形的层叠体50的侧面和第一缓冲材料40 热压板20a和20b。通过这种结构，热压板20a和20b的热量从其侧表面通过第一缓冲材料40和辅助板30传递到叠层50，以缩短加热时间。版权所有（C）2005，JPO＆NCIPI

7. 发明专利

JP2005019474A Method of producing multilayer substrate, and multilayer substrate 有权
标题翻译：生产多层基板的方法和多层基板
公开(公告)号：JP2005019474A
公开(公告)日：2005-01-20
申请号：JP2003178603
申请日：2003-06-23
申请人： Denso Corp , 株式会社デンソー
发明人： HARADA TOSHIICHI , SHIN KEIICHI , MORI TAKAYUKI
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a method of producing a multilayer substrate in which positional shift of a conductor pattern accompanying the flowing of a resin in the plane direction can be reduced, and to provide a multilayer substrate being formed by that method.
SOLUTION: A laminate 10 of a plurality of a single side conductor pattern films 1 is heated and pressed and bonded to a resin film 2 thus forming a multilayer substrate 20. In the hot press process, a second cushion member 50 of a specified thickness exhibiting cushion effect is interposed between the peripheral part 11 of the laminate 10 and a hot press plate 30. The peripheral part 11 is pressed earlier than the central part 12 and compressed with a higher pressure as compared with the central part 12. Consequently, the flow of softened resin in the direction from the central part 12 to the peripheral part 11 can be controlled and positional shift of the conductor pattern 3 can be reduced.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：解决问题的方案：提供一种制造多层基板的方法，其中可以减少伴随树脂在平面方向上的流动的导体图案的位置偏移，并且提供通过该方法形成的多层基板。解决方案：多个单侧导体图案膜1的层压体10被加热并粘合到树脂膜2上，从而形成多层基板20.在热压过程中，第二缓冲构件50 在层叠体10的周缘部11和热压板30之间插入具有缓冲效果的规定厚度。周边部11比中央部12稍早压制，与中央部12相比被压缩。因此，可以控制从中心部分12到周边部分11的方向上的软化树脂的流动，并且可以减少导体图案3的位置偏移。版权所有（C）2005，JPO＆NCIPI

8. 发明专利

JP2003347738A Multilayer wiring board and method for its manufacture 有权
标题翻译：多层布线板及其制造方法
公开(公告)号：JP2003347738A
公开(公告)日：2003-12-05
申请号：JP2002158040
申请日：2002-05-30
申请人： Denso Corp , 株式会社デンソー
发明人： HARADA TOSHIICHI , HASE FUMIO , AZUMA MASANAO , OKADA MASAO , SAEGUSA HISAMI
IPC分类号： H05K3/46 , H01L23/12
摘要： PROBLEM TO BE SOLVED: To provide a multilayer wiring board which ensures reliability in interlayer connection, while achieving high density in a wiring pattern, and provide a method for its manufacturing. SOLUTION: The multilayer wiring board 101 has an arrangement wherein resin films 23 and wiring patterns 22 are alternately stacked. In order to establish an electrical connection between the wiring patterns 22 which are adjacent to each other in the stacking direction, via holes 24 provided in the resin film 23 are filled with conductive compositions 51. In connecting the conductive compositions 51 through lands 22a in the wiring patterns 22 throughout a plurality of the resin films 23, a limit is set in the number of the conductive compositions 51 to be formed coaxially, and when the number exceeds the limit, the excess conductive compositions 51 are formed at positions deviated from the coaxially positioned conductive compositions 51. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供确保层间连接的可靠性的同时在布线图案中实现高密度的多层布线板，并提供其制造方法。解决方案：多层布线板101具有树脂膜23和布线图案22交替堆叠的布置。为了在层叠方向上彼此相邻的布线图案22之间建立电连接，在树脂膜23中设置的通孔24被导电组合物51填充。在将导电组合物51通过在多个树脂膜23中的布线图案22，设定同时形成的导电性组合物51的数量的限制，当数量超过极限时，过量的导电性组合物51形成在同轴的位置导电组合物51.版权所有（C）2004，JPO

9. 发明专利

JP2015046498A 多層プリント基板およびその製造方法有权
标题翻译：多层印刷板及其制造方法
公开(公告)号：JP2015046498A
公开(公告)日：2015-03-12
申请号：JP2013176946
申请日：2013-08-28
申请人：株式会社デンソー , Denso Corp
发明人： HARADA TOSHIICHI , ISHIKAWA YOSHICHIKA
IPC分类号： H05K3/46 , H01L23/12
CPC分类号： H05K3/4617 , H01L2224/16225 , H05K1/025 , H05K1/186 , H05K3/4697
摘要：【課題】多層プリント基板に高周波回路を形成する場合のインピーダンスを加味した回路設計の容易化を図る。【解決手段】2枚の樹脂フィルム101、102を、導体パターン11が形成されていない面10b同士が向かい合うに積層し、他の樹脂フィルム103を、導体パターン11が形成された面10aと導体パターン11が形成されていない面10bとが向かい合うように積層する際に、他の樹脂フィルム103として、それぞれの樹脂厚さd3が全て同じものを用い、2枚の樹脂フィルム101、102として、2枚の樹脂厚さd1、d2の合計が他の樹脂フィルムの1枚分の樹脂厚さd3と同じものを用いる。これによれば、隣り合う樹脂フィルム10の導体パターン11同士の間の誘電体厚さを揃えることができ、インピーダンスを求める計算を容易に行うことができ、回路設計の容易化が可能となる。【選択図】図2
摘要翻译：要解决的问题：为了便于在多层印刷电路板上形成高频电路时考虑阻抗的电路设计。解决方案：当两个树脂膜101,102层压时，使得其上形成的不具有导体图案11的表面10b彼此面对和其他树脂膜103层叠，使得形成有导体图案11的表面10a和其上形成有导体图案11的表面10b彼此面对，使用具有相同树脂厚度d3的树脂膜作为其它树脂膜103 使用其中膜厚d1，d2的树脂膜的总厚度等于其它树脂膜之一的树脂厚度d3的树脂膜作为两个树脂膜101,102。因此，电介质的厚度可以使相邻的树脂膜10的导体图案11的材料彼此一致，并且可以容易地计算阻抗，使得电路设计可以是 ted。

10. 发明专利

JP2010087429A Multilayered circuit board and its manufacturing method 有权
标题翻译：多层电路板及其制造方法
公开(公告)号：JP2010087429A
公开(公告)日：2010-04-15
申请号：JP2008257764
申请日：2008-10-02
申请人： Denso Corp , 株式会社デンソー
发明人： HARADA TOSHIICHI , KONDO KOJI , YAZAKI YOSHITARO , WATABE KAZUMASA , MIYAGAWA EIJIRO
IPC分类号： H05K3/46 , H05K1/11 , H05K3/40
摘要： PROBLEM TO BE SOLVED: To provide a multilayered circuit board for satisfactorily securing connection reliability and preventing deterioration of use efficiency of the board by suppressing lowering of wiring density, and provide its manufacturing method. SOLUTION: There is provided a multilayered circuit board wherein bottomed holes J1c, J1d having conductor patterns P1c, P1d each formed as a bottom on one surface thereof are formed in resin films 40c, 40d made of thermoplastic resin 1, and the resin films 40c, 40d including conductive paste 4 filled in the bottomed holes J1c, J1d are layered, reversed on the way; and these films are mutually stuck together by heating and pressurization and the conductive paste 4 is sintered to permit the conductor patterns P1c, P1d to be mutually electrically connected. The multilayered circuit board is constructed herein such that the mutually opposing bottomed holes J1c, J1d in the two resin films 40c, 40d reversed on the way have two stages of diameter holes J1ac, J1ad on the bottom side and large diameter holes J1bc, J1bd on open sides. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种多层电路板，用于通过抑制布线密度的降低来令人满意地确保连接可靠性并防止板的使用效率的劣化，并提供其制造方法。解决方案：提供一种多层电路板，其中，在由热塑性树脂1制成的树脂膜40c，40d中形成有在其一个表面上形成为底部的导体图案P1c，P1d的有底孔J1c，J1d，树脂填充在有底孔J1c，J1d中的包括导电膏4的膜40c，40d在路上被层叠，反转; 并且通过加热和加压将这些膜相互粘合在一起，并且导电膏4被烧结以允许导体图案P1c，P1d彼此电连接。多层电路板的构造是这样构成的：两个树脂膜40c，40d中相互相对的有底孔J1c，J1d在路径上反转，在底面上具有两段直径的孔J1ac，J1ad，大直径的孔J1bc，J1bd在敞开的一面。版权所有（C）2010，JPO＆INPIT

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式