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1. 发明专利

JP2014118595A Copper alloy for electronic and electrical equipment, copper alloy thin sheet for electronic and electrical equipment, and electroconductive component for electronic and electrical equipment and terminal 有权
标题翻译：电子电器铜合金，电子电气设备铜合金薄板，电子电气设备和终端用电磁元件
公开(公告)号：JP2014118595A
公开(公告)日：2014-06-30
申请号：JP2012273697
申请日：2012-12-14
申请人： Mitsubishi Materials Corp , 三菱マテリアル株式会社 , Mitsubishi Shindoh Co Ltd , 三菱伸銅株式会社
发明人： MAKI KAZUMASA , MORI HIROYUKI , YAMASHITA DAIKI
IPC分类号： C22C9/04 , C22F1/00 , C22F1/02 , C22F1/08 , H01B1/02 , H01B5/02
摘要： PROBLEM TO BE SOLVED: To provide a copper alloy excellent in stress relaxation performance and high strength, and excellent various properties such as bendability and conductivity as a Cu-Zn-Sn based copper alloy for an electronic and electrical equipment electroconductive component such as a connector and other terminal materials.SOLUTION: A copper alloy contains Zn of over 2 mass% and less than 23 mass%, Sn of 0.1 mass% or more and 0.9 mass% or less, Ni of 0.05 mass% or more and less than 1.0 mass%, Fe of 0.001 mass% or more and less than 0.10 mass%, P of 0.005 mass% or more and 0.1 mass% or less and the balance Cu with inevitable impurities, satisfies, by atom ratio, 0.002≤Fe/Ni
摘要翻译：要解决的问题：提供一种应力松弛性能和高强度优异的铜合金以及诸如连接器之类的电子和电气设备导电部件的Cu-Zn-Sn系铜合金的各种性能如弯曲性和导电性其他终端材料。解决方案：铜合金含有超过2质量％且小于23质量％的Zn，0.1质量％以上且0.9质量％以下的Sn，0.05质量％以上且小于1.0质量％的Ni ％，Fe为0.001质量％以上且小于0.10质量％，P为0.005质量％以上且0.1质量％以下，余量为不可避免的杂质，以原子比计为0.002≤Fe/ Ni <1.5 ，3 <（Ni + Fe）/ P <15和0.3

2. 发明专利

JP2014047418A Method for introducing proper amount of reactive gas into vacuum vapor deposition device 有权
标题翻译：将真空气体转移到真空蒸发器沉积装置中的方法
公开(公告)号：JP2014047418A
公开(公告)日：2014-03-17
申请号：JP2012193606
申请日：2012-09-03
申请人： Mitsubishi Shindoh Co Ltd , 三菱伸銅株式会社
发明人： KOUCHI TETSUYA , KOWATA AKIRA
IPC分类号： C23C14/24
摘要： PROBLEM TO BE SOLVED: To provide a method for introducing a proper amount of reactive gas into a vacuum vapor deposition device that does not lower manufacture efficiency even if the amount of evaporated metal greatly varies, especially, if the amount of evaporated metal greatly decreases.SOLUTION: A vacuum vapor deposition device which introduces a proper amount of reactive gas according to the amount of metal evaporated from a vapor deposition material vessel and deposits a metal compound thin film on a film base detects the absolute pressure in the device, and then controls the amount of reactive gas introduced into the device so that the detected value of the absolute pressure reaches a set value while introducing a certain amount of reactive gas which is 20-70% of a reference amount into the device.
摘要翻译：要解决的问题：为了提供一种在真空蒸镀装置中引入适量的反应性气体的方法，即使蒸发的金属的量大大地变化也不降低制造效率，特别是如果蒸发的金属的量大大降低。解决方案：根据从气相沉积材料容器蒸发的金属的量引入适量的反应气体并在金属基底上沉积金属化合物薄膜的真空气相沉积装置检测装置中的绝对压力，然后控制引入到装置中的反应气体的量，使得绝对压力的检测值达到设定值，同时将一定量的基准量的反应气体引入装置。

3. 发明专利

JP2013104110A Copper alloy sheet with deformed cross section having reduced anisotropy of bending and having excellent stress relaxation resistance and method for producing the same 有权
标题翻译：具有减少的弯曲的各向异性并且具有优异的应力松弛电阻的具有变形的交叉部分的铜合金片及其制造方法
公开(公告)号：JP2013104110A
公开(公告)日：2013-05-30
申请号：JP2011249945
申请日：2011-11-15
申请人： Mitsubishi Shindoh Co Ltd , 三菱伸銅株式会社
发明人： KUMAGAI JUNICHI , ABE YOSHIO , SUKUMODA SHUNROKU , HIRANO NAOTAKE , OKAMURA TSUTOMU
IPC分类号： C22C9/00 , B21B1/08 , B21D1/05 , C22F1/00 , C22F1/08 , H01B1/02 , H01B5/02 , H01B13/00
摘要： PROBLEM TO BE SOLVED: To provide a Cu-Cr-Zr based copper alloy sheet with a deformed cross section which has reduced anisotropy of bending, has satisfactory stress relaxation resistance and has excellent dimensional accuracy, and a method for producing the same.SOLUTION: In the copper alloy sheet with a deformed cross section, a thick part and a thin part are arranged in a width direction. The copper alloy sheet has a composition composed of, by mass, 0.05 to 0.2% Zr and 0.2 to 0.4% Cr, and the balance Cu with inevitable impurities. Regarding its bendability as a ratio between the minimum bend radius R at which cracks are not generated in a 90° W bending test in accordance with JIS H 3110 and the sheet thickness, t (R/t), provided that the bendability in a Bad Way direction (R/t) is defined as Rand the bendability in a Good Way direction is defined as R, R/Ris 0.8 to 1.7, and (the GOS1 of the thin part)/(the GOS2 of the thick part) observed by an EBSD method by a scanning electron microscope with a backscattered electron diffraction image system is 0.9 to 1.4.
摘要翻译：要解决的问题：为了提供具有减小的弯曲各向异性的具有变形横截面的Cu-Cr-Zr基铜合金板，具有良好的耐应力松弛性并且具有优异的尺寸精度及其制造方法。解决方案：在具有变形横截面的铜合金板中，厚度部分和薄部分沿宽度方向布置。铜合金板具有以质量计0.05〜0.2％的Zr和0.2〜0.4％的Cr，余量为Cu的不可避免的杂质。关于其弯曲性，作为在根据JIS H 3110的90°W弯曲试验中不产生裂纹的最小弯曲半径R与板厚度t（R / t）之间的比率，条件是弯曲性在Bad 方向方向（R / t）被定义为R 2 ，而Good Way方向的弯曲度被定义为R 1 R 2 / R 1 为0.8〜1.7，（薄部分的GOS1）/（厚的GOS2 部分）通过具有背散射电子衍射图像系统的扫描电子显微镜通过EBSD方法观察到为0.9〜1.4。版权所有（C）2013，JPO＆INPIT

4. 发明专利

JP2013089611A Manufacturing method of metalization film capacitor 有权
标题翻译：金属化膜电容器的制造方法
公开(公告)号：JP2013089611A
公开(公告)日：2013-05-13
申请号：JP2011225518
申请日：2011-10-13
申请人： Mitsubishi Shindoh Co Ltd , 三菱伸銅株式会社
发明人： KUMAGAI JUNICHI , KOUCHI TETSUYA , DOI YASUSHI
IPC分类号： H01G4/18 , H01G4/015 , H01G4/252
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a metalization film capacitor having high reliability of Metallikon connection.SOLUTION: In the manufacturing method of a metalization polymer film capacitor, at least one kind of fatty acid amide compound selected from a group consisting of amide oleate, erucic acid amide, stearic acid amide, and behen acid amide having an average grain size of 5-100 μm is made to adhere, by 10-30 mg/cm, to a part of Metallikon end face subjected to metal spray at both ends of a wound film capacitor element in the width direction, and then a metal is sprayed by means of a thermal spraying gun, thus forming a Metallikon part.
摘要翻译：要解决的问题：提供具有高可靠性的Metallikon连接的金属化薄膜电容器的制造方法。解决方案：在金属化聚合物膜电容器的制造方法中，选自脂肪酸酰胺化合物中的至少一种脂肪酸酰胺化合物，其选自酰胺油酸酯，芥酸酰胺，硬脂酸酰胺和具有平均颗粒的山嵛酸酰胺制造5-100μm的尺寸，将10-30mg / cm 2 SP SP =“POST”> 2 粘合到卷绕膜两端进行金属喷涂的Metallikon端面的一部分电容器元件，然后通过热喷枪喷射金属，从而形成Metallikon部件。版权所有（C）2013，JPO＆INPIT

5. 发明专利

JP2013087309A Copper alloy sheet with deformed cross section having low anisotropy of bending work and method for manufacturing the same 有权
标题翻译：具有弯曲工作的低均衡性的变形交叉部分的铜合金片及其制造方法
公开(公告)号：JP2013087309A
公开(公告)日：2013-05-13
申请号：JP2011226820
申请日：2011-10-14
申请人： Mitsubishi Shindoh Co Ltd , 三菱伸銅株式会社
发明人： KUMAGAI JUNICHI , ABE YOSHIO , SUKUMODA SHUNROKU , HIRANO NAOTAKE , OKAMURA TSUTOMU
IPC分类号： C22C9/00 , B21B1/08 , B21B1/42 , B21B3/00 , C22F1/00 , C22F1/08
摘要： PROBLEM TO BE SOLVED: To provide a Cu-Cr-Zr-based copper alloy sheet with a deformed cross section, which is low in anisotropy of bending work and excellent in dimensional accuracy, and to provide a method for manufacturing the same.SOLUTION: The copper alloy sheet with a deformed cross section, having a thick wall part and a thin wall part arranged in the width direction, contains by mass, 0.05-0.2% of Zr, 0.2-0.4% of Cr, and the balance Cu with inevitable impurities. In 90° W-Bending Test based on JIS H3110, as regards bendability which is represented by the ratio (R/t) of a minimum radius R at which no cracking occurs to a thickness t of the sheet, when the bendability (R/t) in the BadWay direction is defined as Rand the bendability (R/t) in the GoodWay direction is defined as R, R/Ris 0.8 to 1.7.
摘要翻译：待解决的问题：为了提供具有变形横截面的Cu-Cr-Zr系铜合金板，其弯曲加工的各向异性低，尺寸精度优异，并提供其制造方法。解决方案：具有变宽的横截面的铜合金板，具有宽度方向布置的厚壁部分和薄壁部分，其含有0.05-0.2％的Zr，0.2-0.4％的Cr和余量Cu与不可避免的杂质。在基于JIS H3110的90°W弯曲试验中，关于由不发生裂纹的最小半径R与片材厚度t的比率（R / t）表示的弯曲性，当弯曲性（R / t）在BadWay方向上被定义为R 2 ，GoodWay方向的弯曲度（R / t）定义为R 1 < SB>，R 2 / R 1 为0.8〜1.7。版权所有（C）2013，JPO＆INPIT

6. 发明专利

JP2012219349A Copper alloy strip for producing connector 有权
标题翻译：用于生产连接器的铜合金条
公开(公告)号：JP2012219349A
公开(公告)日：2012-11-12
申请号：JP2011088074
申请日：2011-04-12
申请人： Mitsubishi Shindoh Co Ltd , 三菱伸銅株式会社
发明人： KUMAGAI JUNICHI , AIDA MASAYUKI , ATSUMI ISAO , TANAKA YASUYUKI
IPC分类号： C22C9/00 , B23K20/00 , B23K20/04 , C22C5/06 , C22F1/00
摘要： PROBLEM TO BE SOLVED: To provide a copper alloy strip for producing a connector, which can produce a male terminal or a female terminal having high durability to repeated insertion-extraction and high conductivity without performing surface treatment by a metal plating film.SOLUTION: The copper alloy strip is used for producing a connector obtained by fitting a male terminal and a female terminal. A metallic material 4 for a fitted part is cladded on the surface 3 to be formed as the part at which the male terminal is fitted with the female terminal or the part at which the female terminal is fitted with the male terminal upon the fitting of the connector, wherein the metallic material 4 is configured so that width is equal to or below the width of the base material 2 of the copper alloy strip, thickness is 10 to 60 μm, and surface hardness after cladded is ≥130 Hv.
摘要翻译：解决的问题：提供一种用于制造连接器的铜合金带，其可以在不进行金属镀膜的表面处理的情况下制造具有高反复插入提取和高导电性的耐久性的阳端子或母端子。解决方案：铜合金带用于制造通过安装公端子和母端子而获得的连接器。用于装配部件的金属材料4包覆在表面3上，以形成为阳端子装配母端子的部分或母端子配合阳端子的部分，连接器，其中金属材料4被构造成使得宽度等于或低于铜合金条的基材2的宽度，厚度为10至60μm，并且包覆后的表面硬度≥130Hv。版权所有（C）2013，JPO＆INPIT

7. 发明专利

JP2012172244A Copper alloy sheet with deformed cross section excellent in press workability, and method for producing the same 有权
标题翻译：具有压缩加工性优异的交叉部分的铜合金板及其制造方法
公开(公告)号：JP2012172244A
公开(公告)日：2012-09-10
申请号：JP2011038123
申请日：2011-02-24
申请人： Mitsubishi Shindoh Co Ltd , 三菱伸銅株式会社
发明人： SAKURAI TAKESHI , SUKUMODA SHUNROKU
IPC分类号： C22C9/00 , B21B1/08 , B21B3/00 , B21H8/00 , C22C9/04 , C22C9/06 , C22F1/00 , C22F1/08
摘要： PROBLEM TO BE SOLVED: To provide a copper alloy sheet with a deformed cross section, which is a Cu-Fe-P-based copper alloy plate with a deformed cross section, and high press workability, and a method for producing the same.SOLUTION: The copper alloy sheet with a deformed cross section has a thick part and a thin part arranged side by side in a width direction and has a composition comprising, by mass, 0.05-0.15% Fe, 0.015-0.050% P, 0.01-0.20% Zn and the balance being Cu and unavoidable impurities. When T1 and T2 represent the measured values for the thick part and the thin part, respectively, as measured by an EBSD method on a scanning electron microscope equipped with an electron backscattered diffraction imaging system, the ratio of orientation density of brass orientation (T1/T2) is 0.2-0.8, the ratio of orientation density of copper orientation (T1/T2) is 1.2-5.0, and the ratio of GOS (T1/T2) is 0.8-1.5.
摘要翻译：要解决的问题：为了提供具有变形横截面的铜合金板，其是具有变形横截面的Cu-Fe-P系铜合金板，并且具有高的冲压加工性，以及用于制造相同。解决方案：具有变形横截面的铜合金板具有在宽度方向上并排布置的厚部分和薄部分，并且其组成包括质量为0.05-0.15％Fe，0.015-0.050％P ，0.01-0.20％的Zn，余量为Cu和不可避免的杂质。当T1和T2分别表示在装有电子背散射衍射成像系统的扫描电子显微镜上通过EBSD方法测量的厚部分和薄部分的测量值时，黄铜取向的取向密度比（T1 / T2）为0.2-0.8，铜取向（T1 / T2）取向密度比为1.2-5.0，GOS（T1 / T2）比为0.8-1.5。版权所有（C）2012，JPO＆INPIT

8. 发明专利

JP2012156409A Light-emitting device for backlight 审中-公开
标题翻译：用于背光的发光装置
公开(公告)号：JP2012156409A
公开(公告)日：2012-08-16
申请号：JP2011015867
申请日：2011-01-28
申请人： Mitsubishi Shindoh Co Ltd , 三菱伸銅株式会社
发明人： SAKURAI TAKESHI , FUNAKI SHINICHI , SUKUMODA SHUNROKU , OMURA TAKU
IPC分类号： H01L33/48
摘要： PROBLEM TO BE SOLVED: To provide a light-emitting device for backlight which has good heat radiation characteristic, excellent in durability over a long period of use, has a low manufacturing cost, being excellent in directivity of light, and capable of properly radiating LED beam to a display part (light receiving part) which is an object.SOLUTION: The light-emitting device for backlight includes a contoured cross section plate of copper or copper alloy having a rough part of heat conductivity being 150-400 W/(m/K), on the surface of which a kind of plating is performed which is selected from a group consisting of Sn plating, Ni plating, Ag plating, Ag-Sn alloy plating, with glossiness being 80-110%, a cathode pattering circuit and an anode patterning circuit formed on the side face of a recess of the contoured cross section plate, a plurality of light emitting elements that are directly mounted on the bottom surface of the recess, and are connected in series or parallel by wiring to the cathode patterning circuit and the anode patterning circuit, and transparent resin which so seals the inside of the recess as to cover the plurality of light emitting elements.
摘要翻译：要解决的问题：为了提供一种具有良好的散热特性，长期使用的耐久性优异的背光用发光装置，制造成本低，光的方向性优异，能够将LED光束适当地照射到作为对象的显示部（光接收部）。解决方案：用于背光的发光装置包括铜或铜合金的轮廓截面板，其导热率的大部分为150-400W /（m / K），其表面上有一种进行电镀，其选自Sn镀层，Ni镀层，Ag镀层，Ag-Sn合金镀层，光泽度为80-110％，阴极图案电路和阳极图案形成电路形成在轮廓截面板的凹部，直接安装在凹部的底面上并且通过布线串联或并联连接到阴极图案形成电路和阳极图案形成电路的多个发光元件和透明树脂，因此密封凹部的内部以覆盖多个发光元件。版权所有（C）2012，JPO＆INPIT

9. 发明专利

JP2012136726A Cu-Ni-Si BASED COPPER ALLOY SHEET EXCELLENT IN FATIGUE RESISTANCE AND SPRING PROPERTY AFTER BENDING WORKING, AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：铜镍硅基铜合金板在弯曲加工后耐疲劳性能和弹性好，及其制造方法
公开(公告)号：JP2012136726A
公开(公告)日：2012-07-19
申请号：JP2010288486
申请日：2010-12-24
申请人： Mitsubishi Shindoh Co Ltd , 三菱伸銅株式会社
发明人： SAKURAI TAKESHI , ABE YOSHIO , SAITO AKIRA , KAMEYAMA YOSHIHIRO
IPC分类号： C22C9/06 , C22C9/04 , C22F1/00 , C22F1/08 , H01B1/02 , H01B5/02 , H01B13/00
摘要： PROBLEM TO BE SOLVED: To provide a Cu-Ni-Si based copper alloy sheet which has excellent fatigue resistance and a spring property even if used at high temperature and high oscillation environment for a long time after bending working of a prescribed shape as a raw material as a relay movable piece, a socket terminal or the like of various electric parts.SOLUTION: The Cu-Ni-Si based copper alloy sheet includes 1.0-3.0 mass% of Ni; 1/6-1/4 concentration of Si based on Ni, and a rest consisting of Cu and inevitable impurities, wherein orientations of all pixel in a measured area of a surface are measured at 0.5 μm of a step size by an EBSD method, an area ratio of a crystal grain in which an average orientation difference among the all pixel in the crystal grain is less than 4° when a border in which an orientation difference between abutting pixel is at least 5° is made a crystal grain boundary is 45-55% of a measured area, an area average GAM of a crystal grain existing in an area to be measured is 0.8-1.6°, a number of a Ni-Si precipitated object particle in which a particle diameter exceeds 100 nm is 0.2-0.7 piece/μm, and a concentration of Si solid solved in a crystal grain is 0.1-0.4 mass%.
摘要翻译：要解决的问题：为了提供即使在规定形状的弯曲加工之后长时间在高温高振荡环境下使用的具有优异的耐疲劳性和弹性的Cu-Ni-Si基铜合金板作为各种电气部件的继电器可动件，插座端子等的原材料。解决方案：Cu-Ni-Si系铜合金板包含1.0-3.0质量％的Ni; 1 / 6-1 / 4的Si浓度，其余由Cu和不可避免的杂质组成，其中通过EBSD法测量表面的测量面积中所有像素的取向为0.5μm的步长，晶界的全部像素之间的平均取向差在邻接像素的取向差为5度以上的边界为小于4°的晶粒的面积比为45时，晶界为45 测定面积的-55％，待测区域中存在的晶粒的面积平均GAM为0.8〜1.6度，粒径超过100nm的Ni-Si析出物粒子数为0.2〜 0.7片/μm 2 ，溶解在晶粒中的Si固体的浓度为0.1-0.4质量％。版权所有（C）2012，JPO＆INPIT

10. 发明专利

JP2011208271A Cu-Fe-P BASED COPPER ALLOY STRIP MATERIAL FOR ELECTRONIC EQUIPMENT HAVING EXCELLENT RESIN ADHESION 有权
标题翻译：用于具有优异树脂粘合性的电子设备的Cu-Fe-P基铜合金材料
公开(公告)号：JP2011208271A
公开(公告)日：2011-10-20
申请号：JP2010170976
申请日：2010-07-29
申请人： Mitsubishi Shindoh Co Ltd , 三菱伸銅株式会社
发明人： SAKURAI TAKESHI , FUNAKI SHINICHI , HIRAGA MIZUHO
IPC分类号： C22C9/00 , B21B3/00 , C22F1/00 , C22F1/08 , C23C22/78 , C23F1/18 , H01B1/02 , H01B5/02 , H01L23/50
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a Cu-Fe-P based copper alloy strip material for electronic equipment having excellent resin adhesion, which is easily and homogeneously roughened with an ordinary surface treatment agent or by ordinary blackening treatment.SOLUTION: The strip material has a composition comprising, by mass, 1.5 to 2.4% Fe, 0.008 to 0.08% P and 0.01 to 0.5% Zn, and the balance Cu with inevitable impurities, and in which the orientation density in a Cube orientation measured by EBSD (Electron Back-Scatter Diffraction) within the crystal structure in the range from the surface to a depth of 10 μm is 10 to 20%, and the average crystal grain size measured by EBSD is 10 to 20 μm.
摘要翻译：要解决的问题：提供一种具有优异的树脂粘附性的电子设备的Cu-Fe-P系铜合金带材，其易于均匀地用普通的表面处理剂粗糙化或通过普通的黑化处理。解决方案：条带材料具有组合物，其含有1.5〜2.4％的Fe，0.008〜0.08％的P和0.01〜0.5％的Zn，余量为Cu与不可避免的杂质，其中通过EBSD（Electron Back- 从表面到深度10μm范围内的晶体结构内的散射衍射为10〜20％，通过EBSD测定的平均结晶粒径为10〜20μm。

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