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1. 发明专利

JP2013104110A Copper alloy sheet with deformed cross section having reduced anisotropy of bending and having excellent stress relaxation resistance and method for producing the same 有权
标题翻译：具有减少的弯曲的各向异性并且具有优异的应力松弛电阻的具有变形的交叉部分的铜合金片及其制造方法
公开(公告)号：JP2013104110A
公开(公告)日：2013-05-30
申请号：JP2011249945
申请日：2011-11-15
申请人： Mitsubishi Shindoh Co Ltd , 三菱伸銅株式会社
发明人： KUMAGAI JUNICHI , ABE YOSHIO , SUKUMODA SHUNROKU , HIRANO NAOTAKE , OKAMURA TSUTOMU
IPC分类号： C22C9/00 , B21B1/08 , B21D1/05 , C22F1/00 , C22F1/08 , H01B1/02 , H01B5/02 , H01B13/00
摘要： PROBLEM TO BE SOLVED: To provide a Cu-Cr-Zr based copper alloy sheet with a deformed cross section which has reduced anisotropy of bending, has satisfactory stress relaxation resistance and has excellent dimensional accuracy, and a method for producing the same.SOLUTION: In the copper alloy sheet with a deformed cross section, a thick part and a thin part are arranged in a width direction. The copper alloy sheet has a composition composed of, by mass, 0.05 to 0.2% Zr and 0.2 to 0.4% Cr, and the balance Cu with inevitable impurities. Regarding its bendability as a ratio between the minimum bend radius R at which cracks are not generated in a 90° W bending test in accordance with JIS H 3110 and the sheet thickness, t (R/t), provided that the bendability in a Bad Way direction (R/t) is defined as Rand the bendability in a Good Way direction is defined as R, R/Ris 0.8 to 1.7, and (the GOS1 of the thin part)/(the GOS2 of the thick part) observed by an EBSD method by a scanning electron microscope with a backscattered electron diffraction image system is 0.9 to 1.4.
摘要翻译：要解决的问题：为了提供具有减小的弯曲各向异性的具有变形横截面的Cu-Cr-Zr基铜合金板，具有良好的耐应力松弛性并且具有优异的尺寸精度及其制造方法。解决方案：在具有变形横截面的铜合金板中，厚度部分和薄部分沿宽度方向布置。铜合金板具有以质量计0.05〜0.2％的Zr和0.2〜0.4％的Cr，余量为Cu的不可避免的杂质。关于其弯曲性，作为在根据JIS H 3110的90°W弯曲试验中不产生裂纹的最小弯曲半径R与板厚度t（R / t）之间的比率，条件是弯曲性在Bad 方向方向（R / t）被定义为R 2 ，而Good Way方向的弯曲度被定义为R 1 R 2 / R 1 为0.8〜1.7，（薄部分的GOS1）/（厚的GOS2 部分）通过具有背散射电子衍射图像系统的扫描电子显微镜通过EBSD方法观察到为0.9〜1.4。版权所有（C）2013，JPO＆INPIT

2. 发明专利

JP2013089611A Manufacturing method of metalization film capacitor 有权
标题翻译：金属化膜电容器的制造方法
公开(公告)号：JP2013089611A
公开(公告)日：2013-05-13
申请号：JP2011225518
申请日：2011-10-13
申请人： Mitsubishi Shindoh Co Ltd , 三菱伸銅株式会社
发明人： KUMAGAI JUNICHI , KOUCHI TETSUYA , DOI YASUSHI
IPC分类号： H01G4/18 , H01G4/015 , H01G4/252
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a metalization film capacitor having high reliability of Metallikon connection.SOLUTION: In the manufacturing method of a metalization polymer film capacitor, at least one kind of fatty acid amide compound selected from a group consisting of amide oleate, erucic acid amide, stearic acid amide, and behen acid amide having an average grain size of 5-100 μm is made to adhere, by 10-30 mg/cm, to a part of Metallikon end face subjected to metal spray at both ends of a wound film capacitor element in the width direction, and then a metal is sprayed by means of a thermal spraying gun, thus forming a Metallikon part.
摘要翻译：要解决的问题：提供具有高可靠性的Metallikon连接的金属化薄膜电容器的制造方法。解决方案：在金属化聚合物膜电容器的制造方法中，选自脂肪酸酰胺化合物中的至少一种脂肪酸酰胺化合物，其选自酰胺油酸酯，芥酸酰胺，硬脂酸酰胺和具有平均颗粒的山嵛酸酰胺制造5-100μm的尺寸，将10-30mg / cm 2 SP SP =“POST”> 2 粘合到卷绕膜两端进行金属喷涂的Metallikon端面的一部分电容器元件，然后通过热喷枪喷射金属，从而形成Metallikon部件。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2013087309A Copper alloy sheet with deformed cross section having low anisotropy of bending work and method for manufacturing the same 有权
标题翻译：具有弯曲工作的低均衡性的变形交叉部分的铜合金片及其制造方法
公开(公告)号：JP2013087309A
公开(公告)日：2013-05-13
申请号：JP2011226820
申请日：2011-10-14
申请人： Mitsubishi Shindoh Co Ltd , 三菱伸銅株式会社
发明人： KUMAGAI JUNICHI , ABE YOSHIO , SUKUMODA SHUNROKU , HIRANO NAOTAKE , OKAMURA TSUTOMU
IPC分类号： C22C9/00 , B21B1/08 , B21B1/42 , B21B3/00 , C22F1/00 , C22F1/08
摘要： PROBLEM TO BE SOLVED: To provide a Cu-Cr-Zr-based copper alloy sheet with a deformed cross section, which is low in anisotropy of bending work and excellent in dimensional accuracy, and to provide a method for manufacturing the same.SOLUTION: The copper alloy sheet with a deformed cross section, having a thick wall part and a thin wall part arranged in the width direction, contains by mass, 0.05-0.2% of Zr, 0.2-0.4% of Cr, and the balance Cu with inevitable impurities. In 90° W-Bending Test based on JIS H3110, as regards bendability which is represented by the ratio (R/t) of a minimum radius R at which no cracking occurs to a thickness t of the sheet, when the bendability (R/t) in the BadWay direction is defined as Rand the bendability (R/t) in the GoodWay direction is defined as R, R/Ris 0.8 to 1.7.
摘要翻译：待解决的问题：为了提供具有变形横截面的Cu-Cr-Zr系铜合金板，其弯曲加工的各向异性低，尺寸精度优异，并提供其制造方法。解决方案：具有变宽的横截面的铜合金板，具有宽度方向布置的厚壁部分和薄壁部分，其含有0.05-0.2％的Zr，0.2-0.4％的Cr和余量Cu与不可避免的杂质。在基于JIS H3110的90°W弯曲试验中，关于由不发生裂纹的最小半径R与片材厚度t的比率（R / t）表示的弯曲性，当弯曲性（R / t）在BadWay方向上被定义为R 2 ，GoodWay方向的弯曲度（R / t）定义为R 1 < SB>，R 2 / R 1 为0.8〜1.7。版权所有（C）2013，JPO＆INPIT

4. 发明专利

JP2012219349A Copper alloy strip for producing connector 有权
标题翻译：用于生产连接器的铜合金条
公开(公告)号：JP2012219349A
公开(公告)日：2012-11-12
申请号：JP2011088074
申请日：2011-04-12
申请人： Mitsubishi Shindoh Co Ltd , 三菱伸銅株式会社
发明人： KUMAGAI JUNICHI , AIDA MASAYUKI , ATSUMI ISAO , TANAKA YASUYUKI
IPC分类号： C22C9/00 , B23K20/00 , B23K20/04 , C22C5/06 , C22F1/00
摘要： PROBLEM TO BE SOLVED: To provide a copper alloy strip for producing a connector, which can produce a male terminal or a female terminal having high durability to repeated insertion-extraction and high conductivity without performing surface treatment by a metal plating film.SOLUTION: The copper alloy strip is used for producing a connector obtained by fitting a male terminal and a female terminal. A metallic material 4 for a fitted part is cladded on the surface 3 to be formed as the part at which the male terminal is fitted with the female terminal or the part at which the female terminal is fitted with the male terminal upon the fitting of the connector, wherein the metallic material 4 is configured so that width is equal to or below the width of the base material 2 of the copper alloy strip, thickness is 10 to 60 μm, and surface hardness after cladded is ≥130 Hv.
摘要翻译：解决的问题：提供一种用于制造连接器的铜合金带，其可以在不进行金属镀膜的表面处理的情况下制造具有高反复插入提取和高导电性的耐久性的阳端子或母端子。解决方案：铜合金带用于制造通过安装公端子和母端子而获得的连接器。用于装配部件的金属材料4包覆在表面3上，以形成为阳端子装配母端子的部分或母端子配合阳端子的部分，连接器，其中金属材料4被构造成使得宽度等于或低于铜合金条的基材2的宽度，厚度为10至60μm，并且包覆后的表面硬度≥130Hv。版权所有（C）2013，JPO＆INPIT

5. 发明专利

JP2008127668A Copper alloy for electronic equipment and lead frame material 有权
标题翻译：铜合金电子设备和引线框架材料
公开(公告)号：JP2008127668A
公开(公告)日：2008-06-05
申请号：JP2006317027
申请日：2006-11-24
申请人： Mitsubishi Shindoh Co Ltd , 三菱伸銅株式会社
发明人： MIURA MASAO , KUMAGAI JUNICHI , SAITO AKIRA , NAGAHARA KOTARO , FUNAKOSHI TADAAKI , ASAKURA KENTARO
IPC分类号： C22C9/06 , C22C9/02 , C22C9/04 , C22C9/10 , C22F1/00 , C22F1/08 , H01B1/02 , H01L23/48
摘要： PROBLEM TO BE SOLVED: To provide a copper alloy for electronic equipment having such heat resistance that its strength is not deteriorated even in a high temperature region of 500°C.
SOLUTION: The copper alloy comprises, by weight, 0.5 to 3% Ni and 0.1 to 0.9% Si. In observation with a transmission electron microscope, precipitate particles with a diameter of 10 to 50 nm are observed in an amount of ≥20 pieces per μm
2 , and further, a larger number of the precipitate particles with a diameter of 20 to 40 nm are observed than the precipitate particles with a diameter of 40 nm.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有这样的耐热性的电子设备的铜合金，即使在500℃的高温区域中其强度也不会劣化。解决方案：铜合金包含0.5〜3％的Ni和0.1〜0.9％的Si。用透射电子显微镜观察，观察到直径为10〜50nm的沉淀物，其量为≥20个/μm 2 ，此外，较大数量的具有观察到直径为20〜40nm的直径比直径<20nm，直径> 40nm的沉淀颗粒。版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2014025089A Cu-Mg-P BASED COPPER ALLOY SHEET HAVING EXCELLENT SPRING CRITICAL VALUE CHARACTERISTIC AND FATIGUE RESISTANCE AFTER BENDING, AND METHOD FOR PRODUCING THE SAME 有权
标题翻译：具有优异弹簧关键性价值特性和耐疲劳性的铜基镁基铜基合金板及其制造方法
公开(公告)号：JP2014025089A
公开(公告)日：2014-02-06
申请号：JP2012164088
申请日：2012-07-24
申请人： Mitsubishi Shindoh Co Ltd , 三菱伸銅株式会社
发明人： KUMAGAI JUNICHI , SUKUMODA SHUNROKU , SAKAI KAZUAKI
IPC分类号： C22C9/00 , B21B3/00 , C22F1/00 , C22F1/08
摘要： PROBLEM TO BE SOLVED: To provide a Cu-Mg-P based alloy sheet having excellent spring critical value properties and fatigue properties after bending, and a method for producing the same.SOLUTION: The copper alloy sheet has a composition comprising, by mass, 0.2 to 1.2% Mg and 0.001 to 0.2% P, and the balance Cu with inevitable impurities. In crystal orientation analysis by an EBSD measurement method according to the observation in SEM of the surface parallel to a rolling face, in the case the orientations of all pixels in a measurement area range are measured at the step size of 1.0 μm, and the boundary in which the orientation difference between the adjacent pixels is 15° or higher is defined as a crystal boundary, Brass orientation density is 4 to 19%, Copper orientation density is 2 to 13%, all crystal grain sizes are 10 μm, and the area ratio of the crystal grains with the crystal grain sizes of 5 μm or lower is 75% or higher.
摘要翻译：要解决的问题：提供具有优异的弹性临界值性能和弯曲后疲劳性能的Cu-Mg-P基合金板及其制造方法。解决方案：铜合金板材具有以下组成： 0.2〜1.2％的Mg和0.001〜0.2％的P，余量为Cu与不可避免的杂质。在通过EBSD测量方法进行的晶体取向分析中，根据在平行于滚动面的表面的SEM中的观察结果，在测量区域范围内的所有像素的取向以1.0μm的步长测量的情况下，其中相邻像素之间的取向差为15°以上被定义为晶体边界，黄铜取向密度为4〜19％，铜取向密度为2〜13％，全部晶粒尺寸为10μm，晶粒尺寸为5μm以下的晶粒的比例为75％以上。

7. 发明专利

JP2014005481A Cu-Ni-Si-BASED COPPER ALLOY Sn PLATED SHEET AND MANUFACTURING METHOD THEREFOR 有权
标题翻译：铜镍硅基铜合金板及其制造方法
公开(公告)号：JP2014005481A
公开(公告)日：2014-01-16
申请号：JP2012139604
申请日：2012-06-21
申请人： Mitsubishi Shindoh Co Ltd , 三菱伸銅株式会社
发明人： KUMAGAI JUNICHI , AIDA MASAYUKI , SUKUMODA SHUNROKU , SAKAI KAZUAKI , TARUYA YOSHIE , TAMAGAWA TAKASHI
IPC分类号： C22C9/06 , C22C9/04 , C22F1/00 , C22F1/08 , C25D5/50 , C25D7/00
摘要： PROBLEM TO BE SOLVED: To provide a Cu-Ni-Si-based copper alloy Sn plated sheet after a reflow treatment, having good balance of values between thermal peeling property and contact electric resistance.SOLUTION: The Cu-Ni-Si-based copper alloy Sn plated sheet comprises a copper alloy sheet consisting of 1.0 to 4.0 mass% of Ni, 0.2 to 0.9 mass% of Si, 0.3 to 1.5 mass% of Zn, 0.001 to 0.2 mass% of P and the balance Cu with inevitable impurities as a base material 2, and a plating film layer 4 after a reflow treatment consisting of a surface Sn phase 5 having thickness of 0.2 μm or less, a Sn phase 6 having thickness of 0.2 to 0.8 μm, a Sn-Cu alloy phase 7 having thickness of 0.5 to 1.4 μm, a Cu phase 8 having thickness of 0 to 0.8 μm in this order from surface to the base material. The ratio of the P concentration of the surface Sn phase (C) and that of the base material (D) (C/D) is 1.1 to 2.0, the ratio of Zn concentration in an interface layer 3 having thickness of 0.8 to 1.4 μm between the plated sheet and the base material (A) and that in the base material (B) (A/B) is 0.5 to 0.8.
摘要翻译：要解决的问题：在回流处理后提供Cu-Ni-Si系铜合金镀锡片，热剥离性能和接触电阻之间的平衡值良好。解决方案：Cu-Ni-Si系铜合金Sn镀层包括由1.0〜4.0质量％的Ni，0.2〜0.9质量％的Si，0.3〜1.5质量％的Zn，0.001〜0.2质量％的P，余量的Cu与不可避免的杂质构成的铜合金板基材2和镀膜层4，在由具有0.2μm以下的厚度的表面Sn相5，厚度为0.2〜0.8μm的Sn相6构成的回流处理后，具有Sn-Cu合金相7的Sn-Cu合金相7 厚度为0.5〜1.4μm，厚度为0〜0.8μm的Cu相8的表面依次为基材。表面Sn相（C）和基材（D）的P浓度（C / D）的比例为1.1〜2.0，厚度为0.8〜1.4μm的界面层3中的Zn浓度电镀片与基材（A）之间，基材（B）（A / B）的间隔为0.5〜0.8。

8. 发明专利

JP2013001979A Removing liquid of oxide film on surface of copper and copper-based alloy 审中-公开
标题翻译：在铜和铜基合金表面除去氧化膜的液体
公开(公告)号：JP2013001979A
公开(公告)日：2013-01-07
申请号：JP2011136252
申请日：2011-06-20
申请人： Mitsubishi Shindoh Co Ltd , 三菱伸銅株式会社 , Mitsubishi Materials Corp , 三菱マテリアル株式会社
发明人： KUMAGAI JUNICHI , TARUTANI YOSHIE , KATO NAOKI , KUBOTA KENJI
IPC分类号： C23G1/10 , C23F1/18
摘要： PROBLEM TO BE SOLVED: To provide a removing liquid of an oxide film that efficiently removes the oxide film formed on the surface of copper or copper-based alloy after being formed by heat treatment, and to provide copper or copper-based alloy that is collected by direct electrolytic treatment of a removing liquid of oxide film containing the removed oxide film and that is high in purity and handling property and can be utilized as a reproduction material.SOLUTION: The removing liquid of the oxide film on the surface of copper and copper-based alloy after being formed by heat treatment contains sulfuric acid of 100-500 g/L, at least one oxidizing agent of 1-100 g/L that is selected from a group consisting of nitric acid, hydrogen peroxide, peroxodisulfate ion, and ferric iron ion, chloride ion of 10-300 mg/L, nonionic surfactant of 0.5-300 mg/L, and copper sulfate of 10-300 g/L.
摘要翻译：要解决的问题：提供一种氧化物膜的除去液体，其在通过热处理形成之后有效地除去形成在铜或铜基合金的表面上的氧化膜，并且提供铜或铜基合金其通过直接电解处理含有除去的氧化物膜的氧化物膜的除去液而收集，并且其纯度和处理性能高，并且可以用作再生材料。解决方案：通过热处理形成铜和铜基合金表面上的氧化膜的去除液含有100-500g / L的硫酸，至少一种氧化剂为1-100g / L，选自硝酸，过氧化氢，过氧二硫酸根离子和三价铁离子，10-300mg / L的氯离子，0.5-300mg / L的非离子表面活性剂和10-300的硫酸铜 g / L。版权所有（C）2013，JPO＆INPIT

9. 发明专利

JP2012240117A Copper alloy sheet with deformed cross section excellent in nickel plating property and method of manufacturing the same 有权
标题翻译：镍合金材料中具有优异的交叉部分的铜合金板及其制造方法
公开(公告)号：JP2012240117A
公开(公告)日：2012-12-10
申请号：JP2011116311
申请日：2011-05-24
申请人： Mitsubishi Shindoh Co Ltd , 三菱伸銅株式会社
发明人： KUMAGAI JUNICHI , SUKUMODA SHUNROKU
IPC分类号： B21B1/08 , B21B3/00 , B21B27/02 , C22C9/00 , C22C9/04 , C22C9/06 , C22F1/00 , C22F1/08 , H01L23/50
摘要： PROBLEM TO BE SOLVED: To provide a copper alloy sheet with a deformed cross section having Ni plating property in which a thick part and a thin part are homogenous and variation of thickness is reduced.SOLUTION: The copper alloy sheet with the deformed cross section having the thick part and the thin part arranged in a width direction contains 0.05-0.15 mass% of Fe, 0.015-0.050 mass% of P, and 0.01-0.20 mass% of Zn, respectively, with the balance Cu and inevitable impurities. When the measurement value of the thick part and the measurement value of the thin part measured by an EBSD method using a scanning electron microscope with a backscatter electron diffraction image system are T1 and T2 respectively, a ratio of Brass orientation density(T1/T2) is 0.8-2.0, a ratio of Copper orientation density (T1/T2) is 0.5-1.2, and a ratio of Goss orientation density (T1/T2) is 1.0-2.5.
摘要翻译：解决的问题：为了提供具有Ni镀层特性的变形横截面的铜合金板，其中厚部分和薄部均匀，厚度变化减小。解决方案：具有厚度部分和宽度方向布置的薄壁部分的变形横截面的铜合金板含有0.05-0.15质量％的Fe，0.015-0.050质量％的P和0.01-0.20质量％的Zn，余量为Cu和不可避免的杂质。当使用具有后向散射电子衍射图像系统的扫描电子显微镜通过EBSD方法测量的厚部测量值和薄部测量值分别为T1和T2时，黄铜取向密度（T1 / T2）为0.8-2.0，铜取向密度（T1 / T2）的比例为0.5-1.2，高斯取向密度（T1 / T2）的比为1.0-2.5。版权所有（C）2013，JPO＆INPIT

10. 发明专利

JP2009057630A Sn-PLATED CONDUCTIVE MATERIAL, METHOD FOR PRODUCING THE SAME, AND ELECTRICITY CARRYING COMPONENT 审中-公开
标题翻译： Sn导电材料，其制造方法和电力承载部件
公开(公告)号：JP2009057630A
公开(公告)日：2009-03-19
申请号：JP2008185061
申请日：2008-07-16
申请人： Mitsubishi Shindoh Co Ltd , 三菱伸銅株式会社
发明人： MORO MATSUTAKE , KUMAGAI JUNICHI
IPC分类号： C23C28/02 , C25D5/10 , C25D5/12 , C25D5/50 , C25D7/00 , H01R13/03
摘要： PROBLEM TO BE SOLVED: To provide an Sn-plated conductive material which can be produced at low cost by minimizing the amount of Ag to be used and can have both heat resistance and whisker resistance, a method for producing the same, and a current-carrying component using the Sn-plated conductive material.
SOLUTION: In an Sn-plated conductive material 1, an Sn plating layer 5 composed of Sn or an Sn alloy is formed on a base material 2 composed of a conductive metal. On a cross-section along a laminating direction of the base material 2 and the Sn plating layer 5, an Ag-Sn alloy layer 6 is formed, in which Ag-Sn particles are aggregated on a surface layer portion of the Sn plating layer 5.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种可以以低成本制造的镀Sn导电材料，其最小化所使用的Ag量并且可以具有耐热性和耐晶须性两者，其制造方法和使用镀Sn导电材料的载流元件。解决方案：在镀Sn导电材料1中，在由导电金属构成的基材2上形成由Sn或Sn合金构成的Sn镀层5。在基材2和Sn镀层5的层叠方向的截面上形成有Ag-Sn合金层6，其中Ag-Sn颗粒聚集在Sn镀层5的表层部分上版权所有（C）2009，JPO＆INPIT

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