基本信息:
- 专利标题： Copper alloy strip for producing connector
- 专利标题（中）：用于生产连接器的铜合金条
- 申请号：JP2011088074 申请日：2011-04-12
- 公开(公告)号：JP2012219349A 公开(公告)日：2012-11-12
- 发明人： KUMAGAI JUNICHI , AIDA MASAYUKI , ATSUMI ISAO , TANAKA YASUYUKI
- 申请人： Mitsubishi Shindoh Co Ltd , 三菱伸銅株式会社
- 专利权人： Mitsubishi Shindoh Co Ltd,三菱伸銅株式会社
- 当前专利权人： Mitsubishi Shindoh Co Ltd,三菱伸銅株式会社
- 优先权： JP2011088074 2011-04-12
- 主分类号： C22C9/00
- IPC分类号： C22C9/00 ; B23K20/00 ; B23K20/04 ; C22C5/06 ; C22F1/00
摘要：
PROBLEM TO BE SOLVED: To provide a copper alloy strip for producing a connector, which can produce a male terminal or a female terminal having high durability to repeated insertion-extraction and high conductivity without performing surface treatment by a metal plating film.SOLUTION: The copper alloy strip is used for producing a connector obtained by fitting a male terminal and a female terminal. A metallic material 4 for a fitted part is cladded on the surface 3 to be formed as the part at which the male terminal is fitted with the female terminal or the part at which the female terminal is fitted with the male terminal upon the fitting of the connector, wherein the metallic material 4 is configured so that width is equal to or below the width of the base material 2 of the copper alloy strip, thickness is 10 to 60 μm, and surface hardness after cladded is ≥130 Hv.
摘要（中）：
解决的问题：提供一种用于制造连接器的铜合金带，其可以在不进行金属镀膜的表面处理的情况下制造具有高反复插入提取和高导电性的耐久性的阳端子或母端子。 解决方案：铜合金带用于制造通过安装公端子和母端子而获得的连接器。 用于装配部件的金属材料4包覆在表面3上，以形成为阳端子装配母端子的部分或母端子配合阳端子的部分， 连接器，其中金属材料4被构造成使得宽度等于或低于铜合金条的基材2的宽度，厚度为10至60μm，并且包覆后的表面硬度≥130Hv。 版权所有（C）2013，JPO＆INPIT
公开/授权文献:
- JP5701133B2 コネクタ製造用銅合金条 公开/授权日：2015-04-15