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1. 发明专利

JP2013104110A Copper alloy sheet with deformed cross section having reduced anisotropy of bending and having excellent stress relaxation resistance and method for producing the same 有权
标题翻译：具有减少的弯曲的各向异性并且具有优异的应力松弛电阻的具有变形的交叉部分的铜合金片及其制造方法
公开(公告)号：JP2013104110A
公开(公告)日：2013-05-30
申请号：JP2011249945
申请日：2011-11-15
申请人： Mitsubishi Shindoh Co Ltd , 三菱伸銅株式会社
发明人： KUMAGAI JUNICHI , ABE YOSHIO , SUKUMODA SHUNROKU , HIRANO NAOTAKE , OKAMURA TSUTOMU
IPC分类号： C22C9/00 , B21B1/08 , B21D1/05 , C22F1/00 , C22F1/08 , H01B1/02 , H01B5/02 , H01B13/00
摘要： PROBLEM TO BE SOLVED: To provide a Cu-Cr-Zr based copper alloy sheet with a deformed cross section which has reduced anisotropy of bending, has satisfactory stress relaxation resistance and has excellent dimensional accuracy, and a method for producing the same.SOLUTION: In the copper alloy sheet with a deformed cross section, a thick part and a thin part are arranged in a width direction. The copper alloy sheet has a composition composed of, by mass, 0.05 to 0.2% Zr and 0.2 to 0.4% Cr, and the balance Cu with inevitable impurities. Regarding its bendability as a ratio between the minimum bend radius R at which cracks are not generated in a 90° W bending test in accordance with JIS H 3110 and the sheet thickness, t (R/t), provided that the bendability in a Bad Way direction (R/t) is defined as Rand the bendability in a Good Way direction is defined as R, R/Ris 0.8 to 1.7, and (the GOS1 of the thin part)/(the GOS2 of the thick part) observed by an EBSD method by a scanning electron microscope with a backscattered electron diffraction image system is 0.9 to 1.4.
摘要翻译：要解决的问题：为了提供具有减小的弯曲各向异性的具有变形横截面的Cu-Cr-Zr基铜合金板，具有良好的耐应力松弛性并且具有优异的尺寸精度及其制造方法。解决方案：在具有变形横截面的铜合金板中，厚度部分和薄部分沿宽度方向布置。铜合金板具有以质量计0.05〜0.2％的Zr和0.2〜0.4％的Cr，余量为Cu的不可避免的杂质。关于其弯曲性，作为在根据JIS H 3110的90°W弯曲试验中不产生裂纹的最小弯曲半径R与板厚度t（R / t）之间的比率，条件是弯曲性在Bad 方向方向（R / t）被定义为R 2 ，而Good Way方向的弯曲度被定义为R 1 R 2 / R 1 为0.8〜1.7，（薄部分的GOS1）/（厚的GOS2 部分）通过具有背散射电子衍射图像系统的扫描电子显微镜通过EBSD方法观察到为0.9〜1.4。版权所有（C）2013，JPO＆INPIT

2. 发明专利

JP2013087309A Copper alloy sheet with deformed cross section having low anisotropy of bending work and method for manufacturing the same 有权
标题翻译：具有弯曲工作的低均衡性的变形交叉部分的铜合金片及其制造方法
公开(公告)号：JP2013087309A
公开(公告)日：2013-05-13
申请号：JP2011226820
申请日：2011-10-14
申请人： Mitsubishi Shindoh Co Ltd , 三菱伸銅株式会社
发明人： KUMAGAI JUNICHI , ABE YOSHIO , SUKUMODA SHUNROKU , HIRANO NAOTAKE , OKAMURA TSUTOMU
IPC分类号： C22C9/00 , B21B1/08 , B21B1/42 , B21B3/00 , C22F1/00 , C22F1/08
摘要： PROBLEM TO BE SOLVED: To provide a Cu-Cr-Zr-based copper alloy sheet with a deformed cross section, which is low in anisotropy of bending work and excellent in dimensional accuracy, and to provide a method for manufacturing the same.SOLUTION: The copper alloy sheet with a deformed cross section, having a thick wall part and a thin wall part arranged in the width direction, contains by mass, 0.05-0.2% of Zr, 0.2-0.4% of Cr, and the balance Cu with inevitable impurities. In 90° W-Bending Test based on JIS H3110, as regards bendability which is represented by the ratio (R/t) of a minimum radius R at which no cracking occurs to a thickness t of the sheet, when the bendability (R/t) in the BadWay direction is defined as Rand the bendability (R/t) in the GoodWay direction is defined as R, R/Ris 0.8 to 1.7.
摘要翻译：待解决的问题：为了提供具有变形横截面的Cu-Cr-Zr系铜合金板，其弯曲加工的各向异性低，尺寸精度优异，并提供其制造方法。解决方案：具有变宽的横截面的铜合金板，具有宽度方向布置的厚壁部分和薄壁部分，其含有0.05-0.2％的Zr，0.2-0.4％的Cr和余量Cu与不可避免的杂质。在基于JIS H3110的90°W弯曲试验中，关于由不发生裂纹的最小半径R与片材厚度t的比率（R / t）表示的弯曲性，当弯曲性（R / t）在BadWay方向上被定义为R 2 ，GoodWay方向的弯曲度（R / t）定义为R 1 < SB>，R 2 / R 1 为0.8〜1.7。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2012136726A Cu-Ni-Si BASED COPPER ALLOY SHEET EXCELLENT IN FATIGUE RESISTANCE AND SPRING PROPERTY AFTER BENDING WORKING, AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：铜镍硅基铜合金板在弯曲加工后耐疲劳性能和弹性好，及其制造方法
公开(公告)号：JP2012136726A
公开(公告)日：2012-07-19
申请号：JP2010288486
申请日：2010-12-24
申请人： Mitsubishi Shindoh Co Ltd , 三菱伸銅株式会社
发明人： SAKURAI TAKESHI , ABE YOSHIO , SAITO AKIRA , KAMEYAMA YOSHIHIRO
IPC分类号： C22C9/06 , C22C9/04 , C22F1/00 , C22F1/08 , H01B1/02 , H01B5/02 , H01B13/00
摘要： PROBLEM TO BE SOLVED: To provide a Cu-Ni-Si based copper alloy sheet which has excellent fatigue resistance and a spring property even if used at high temperature and high oscillation environment for a long time after bending working of a prescribed shape as a raw material as a relay movable piece, a socket terminal or the like of various electric parts.SOLUTION: The Cu-Ni-Si based copper alloy sheet includes 1.0-3.0 mass% of Ni; 1/6-1/4 concentration of Si based on Ni, and a rest consisting of Cu and inevitable impurities, wherein orientations of all pixel in a measured area of a surface are measured at 0.5 μm of a step size by an EBSD method, an area ratio of a crystal grain in which an average orientation difference among the all pixel in the crystal grain is less than 4° when a border in which an orientation difference between abutting pixel is at least 5° is made a crystal grain boundary is 45-55% of a measured area, an area average GAM of a crystal grain existing in an area to be measured is 0.8-1.6°, a number of a Ni-Si precipitated object particle in which a particle diameter exceeds 100 nm is 0.2-0.7 piece/μm, and a concentration of Si solid solved in a crystal grain is 0.1-0.4 mass%.
摘要翻译：要解决的问题：为了提供即使在规定形状的弯曲加工之后长时间在高温高振荡环境下使用的具有优异的耐疲劳性和弹性的Cu-Ni-Si基铜合金板作为各种电气部件的继电器可动件，插座端子等的原材料。解决方案：Cu-Ni-Si系铜合金板包含1.0-3.0质量％的Ni; 1 / 6-1 / 4的Si浓度，其余由Cu和不可避免的杂质组成，其中通过EBSD法测量表面的测量面积中所有像素的取向为0.5μm的步长，晶界的全部像素之间的平均取向差在邻接像素的取向差为5度以上的边界为小于4°的晶粒的面积比为45时，晶界为45 测定面积的-55％，待测区域中存在的晶粒的面积平均GAM为0.8〜1.6度，粒径超过100nm的Ni-Si析出物粒子数为0.2〜 0.7片/μm 2 ，溶解在晶粒中的Si固体的浓度为0.1-0.4质量％。版权所有（C）2012，JPO＆INPIT

4. 发明专利

JP2012201958A Cu-Ni-Si BASED COPPER ALLOY SHEET HAVING EXCELLENT STRESS RELAXATION RESISTANCE, AND FATIGUE RESISTANCE AND SPRING PROPERTY AFTER BENDING, AND METHOD FOR PRODUCING THE SAME 有权
标题翻译：具有优异的应力松弛耐性的铜镍硅基铜合金板，弯曲后的耐疲劳性和弹簧性，及其制造方法
公开(公告)号：JP2012201958A
公开(公告)日：2012-10-22
申请号：JP2011069752
申请日：2011-03-28
申请人： Mitsubishi Shindoh Co Ltd , 三菱伸銅株式会社
发明人： SAKURAI TAKESHI , ABE YOSHIO , SAITO AKIRA , UMETSU SHUZO
IPC分类号： C22C9/06 , B21B3/00 , C22C9/04 , C22F1/00 , C22F1/08 , H01B1/02 , H01B5/02
摘要： PROBLEM TO BE SOLVED: To provide a Cu-N-Si based copper alloy sheet which has satisfactory fatigue resistance and spring properties and has excellent stress relaxation resistance even if being used in a high temperature-high vibration environment for a long time after being bent into a prescribed shape as the material for various electronic parts.SOLUTION: The Cu-Ni-Si based copper alloy sheet contains Ni of 1.0 to 3.0 mass%, Si in a concentration of 1/6 to 1/4 thereof and Cr of 0.002 to 0.4 mass%, and the balance Cu with inevitable impurities, in which the area ratio of the crystal grains with the average orientation difference between all pixels in the crystal grains measured by an EBSD method being 0.1 μm measured by Field Emission Auger Electron Spectroscopy is 0.2 to 0.7 piece/μm; the number of the Cr-Si precipitate grains with a grain size of 0.01 to 0.1 μm is 0.001 to 0.1 piece/μm, and the concentration of Si solid-soluted in the crystal grains measured by a Transmission Electron Microscope is 0.1 to 0.4 mass%.
摘要翻译：要解决的问题：提供具有令人满意的耐疲劳性和弹簧性能的Cu-N-Si基铜合金板，并且即使在长时间在高温高振动环境中使用也具有优异的耐应力松弛性在弯曲成规定形状之后，作为各种电子部件的材料。解决方案：Cu-Ni-Si系铜合金板含有1.0〜3.0质量％的Ni，浓度为1/6〜1/4的Si，0.002〜0.4质量％的Cr，余量Cu 具有不可避免的杂质，其中通过EBSD法测量的晶粒中所有像素之间的平均取向差异的晶粒的面积比为<4°是测量面积的45至55％; 存在于测量面积中的晶粒的面积平均GAM为0.8至1.6°; 通过场发射俄歇电子能谱测定的粒径>0.1μm的Ni-Si析出物颗粒的数量为0.2〜0.7片/μm 2 ; 晶粒尺寸为0.01〜0.1μm的Cr-Si析出物颗粒的数量为0.001〜0.1个/μm 2 ，固体溶解在晶体中的Si浓度通过透射电子显微镜测定的颗粒为0.1〜0.4质量％。版权所有（C）2013，JPO＆INPIT

5. 发明专利

JP2012172168A Cu-Zr-BASED COPPER ALLOY PLATE, AND METHOD FOR PRODUCING THE SAME 有权
标题翻译： Cu-Zr系铜合金板及其制造方法
公开(公告)号：JP2012172168A
公开(公告)日：2012-09-10
申请号：JP2011033097
申请日：2011-02-18
申请人： Mitsubishi Shindoh Co Ltd , 三菱伸銅株式会社
发明人： SAKURAI TAKESHI , ABE YOSHIO , HIRANO NAOI
IPC分类号： C22C9/00 , C22C9/06 , C22F1/00 , C22F1/08
CPC分类号： C22F1/08 , C22C9/00 , C22C9/06
摘要： PROBLEM TO BE SOLVED: To provide a Cu-Zr-based copper alloy plate that retains satisfactory mechanical strength and has a good balance between bending workability and spring deflection limit at a high level, and a method for producing the same.SOLUTION: This copper alloy comprises 0.05-0.2 mass% Zr and the balance being Cu and unavoidable impurities, wherein the average value of KAM values as measured by an EBSD method on a scanning electron microscope equipped with an electron backscattered diffraction imaging system is 1.5-1.8°, the R/t ratio is 0.1-0.6 wherein R represents the minimum bending radius at which no cracking occurs and t represents the thickness of the plate in a W bending test, and the spring deflection limit is 420-520 N/mm.
摘要翻译：要解决的问题：提供一种能够保持良好的机械强度并且在弯曲加工性和弹性挠度极限之间具有良好平衡的Cu-Zr系铜合金板及其制造方法。解决方案：该铜合金包含0.05-0.2质量％的Zr，余量为Cu和不可避免的杂质，其中通过EBSD法在装备有电子背散射衍射成像系统的扫描电子显微镜上测量的KAM值的平均值为1.5-1.8°，R / t比为0.1-0.6，其中R表示在W弯曲试验中不发生裂纹的最小弯曲半径，t表示板的厚度，弹簧偏转极限为420-520 N / mm 2 。版权所有（C）2012，JPO＆INPIT

6. 发明专利

JP2012007231A Cu-Mg-P-BASED COPPER ALLOY BAR MATERIAL AND MANUFACTURING METHOD THEREFOR 有权
标题翻译：基于Cu-Mg-P的铜合金棒材及其制造方法
公开(公告)号：JP2012007231A
公开(公告)日：2012-01-12
申请号：JP2010146895
申请日：2010-06-28
申请人： Mitsubishi Shindoh Co Ltd , 三菱伸銅株式会社
发明人： SAKURAI TAKESHI , KAMEYAMA YOSHIHIRO , ABE YOSHIO
IPC分类号： C22C9/00 , C22F1/00 , C22F1/08 , H01B1/02 , H01B5/02 , H01B13/00
摘要： PROBLEM TO BE SOLVED: To balance tensile strength, a spring deflection limit, and fatigue characteristics under completely reversed plane bending at high levels.SOLUTION: A copper alloy bar material includes a composition including, in mass%, 0.3-2% Mg, 0.001-0.1% P and the balance with Cu and unavoidable impurities. When orientations of all pixels in an area to be measured of the surface of the copper-alloy bar material are measured by an EBSD method using a scanning electron microscope provided with a backscatter electron diffraction image system with a step size of 0.5 μm, and a boundary having an orientation difference of 5° or more between adjacent pixels is defined as a crystal grain boundary, the area ratio of crystal grains having an average orientation difference of less than 4° between all the pixels in the crystal grains is 45-55% of the measured area, the area average GAM of crystal grains present in the measured area is 2.2-3.0°, the tensile strength is 641-708 N/mm, the spring deflection limit is 472-503 N/mm, and the fatigue limit under completely reversed plane bending in the number of repetitions of 1×10is 300-350 N/mm.
摘要翻译：要解决的问题：在高水平的完全反转平面弯曲下平衡拉伸强度，弹簧偏转极限和疲劳特性。解决方案：铜合金棒材料包括以质量％计含有0.3-2％Mg，0.001-0.1％P，余量为Cu和不可避免的杂质的组合物。当使用具有步长为0.5μm的后向散射电子衍射图像系统的扫描型电子显微镜的EBSD法测定铜合金棒材的表面的被测定区域中的所有像素的取向时，将相邻像素之间的取向差为5°以上的边界定义为晶体晶界，晶粒中所有像素之间的平均取向差小于4°的晶粒的面积比为45〜55％测量面积中存在的晶粒的面积平均GAM为2.2-3.0°，拉伸强度为641-708N / mm 2 ，弹簧偏转极限为472-503 N / mm 2 ，并且在完全反向平面弯曲下的疲劳极限重复次数为1×10 6 < / SP>为300-350 N / mm 2 。版权所有（C）2012，JPO＆INPIT

7. 发明专利

JP2011132564A Cu-Mg-P-BASED COPPER-ALLOY MATERIAL AND METHOD OF PRODUCING THE SAME 有权
标题翻译： Cu-Mg-P系铜合金材料及其制造方法
公开(公告)号：JP2011132564A
公开(公告)日：2011-07-07
申请号：JP2009291542
申请日：2009-12-23
申请人： Mitsubishi Shindoh Co Ltd , 三菱伸銅株式会社
发明人： SAKURAI TAKESHI , KAMEYAMA YOSHIHIRO , ABE YOSHIO
IPC分类号： C22C9/00 , C22F1/00 , C22F1/08 , H01B1/02 , H01B5/02
CPC分类号： C22C9/00 , C22F1/08
摘要： PROBLEM TO BE SOLVED: To provide a Cu-Mg-P-based copper alloy which has well-balanced and high levels of tensile strength and a spring deflection limit and to provide a method for manufacturing the same. SOLUTION: The copper-alloy material has a composition including, by mass%, 0.3-2% Mg, 0.001-0.1% P and the balance Cu with unavoidable impurities. When orientations of all pixels in an area to be measured of the surface of the copper-alloy strip material are measured with an EBSD method by a scanning electron microscope provided with a backscatter electron diffraction image system, and a boundary having an orientation difference of 5° or more between adjacent pixels is defined as a crystal grain boundary, an area ratio of crystal grains having an average orientation difference of less than 4° between all the pixels in the crystal grains is 45-55% of the measured area. The tensile strength is 641-708 N/mm 2 , and the spring deflection limit is 472-503 N/mm 2 . COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供具有良好平衡和高水平的拉伸强度和弹簧偏转极限的Cu-Mg-P系铜合金，并提供其制造方法。解决方案：铜合金材料具有以质量％计含有0.3-2％Mg，0.001-0.1％P和余量为不可避免的杂质的组成。当使用具有背散射电子衍射图像系统的扫描型电子显微镜，通过EBSD法测定铜合金带材的表面的被测定区域中的所有像素的取向，取向差为5的边界将相邻像素之间的角度定义为晶体晶界，晶粒中所有像素之间的平均取向差小于4°的晶粒的面积比为测量面积的45-55％。拉伸强度为641-708N / mm 2 ，弹簧偏转极限为472-503N / mm 2 。版权所有（C）2011，JPO＆INPIT

8. 发明专利

JP2014062288A Cu-Zr-Co COPPER ALLOY SHEET AND PRODUCTION METHOD OF THE SAME 有权
标题翻译： Cu-Zr-Co铜合金板及其生产方法
公开(公告)号：JP2014062288A
公开(公告)日：2014-04-10
申请号：JP2012207201
申请日：2012-09-20
申请人： Mitsubishi Shindoh Co Ltd , 三菱伸銅株式会社
发明人： KUMAGAI JUNICHI , ABE YOSHIO , SUKUMODA SHUNROKU , HIRANO NAOI
IPC分类号： C22C9/00 , C22C9/06 , C22F1/00 , C22F1/08
摘要： PROBLEM TO BE SOLVED: To provide a Cu-Zr-Co copper alloy sheet for electric and electronic components, having high elongation property while maintaining efficient mechanical strength.SOLUTION: The copper alloy sheet contains, by mass%, Zr of 0.05 to 0.2%, Co in the range of 0.001% to 0.3%, and the balance comprising Cu and inevitable impurities, and has a layered structure 3 constructed by laminating in a sheet thickness direction, crystal grain layers 2 in each of which a plurality of flat crystal grains 1 continue in a surface direction. In the copper alloy sheet, an average thickness of the crystal grain layer 2 observed by a transmission electron microscope is in the range of 110 to 260 nm, and the number ratio of the crystal grain having orientation difference of 10° or less between crystal grains obtained by an electron beam diffraction crystal orientation analysis observed by a scanning electron microscope to all crystal grains is 0.40 to 0.65.
摘要翻译：要解决的问题：提供一种具有高伸长率的电气和电子部件的Cu-Zr-Co铜合金板，同时保持有效的机械强度。解决方案：铜合金板以质量％计含有0.05-0.2％的Zr， Co为0.001〜0.3％的范围，余量由Cu和不可避免的杂质构成，并且具有通过在板厚方向层叠而构成的层叠结构体3，其中具有多个平坦晶粒的晶粒层2 1在表面方向继续。在铜合金板中，通过透射电子显微镜观察到的晶粒层2的平均厚度在110〜260nm的范围内，晶粒之间的取向差为10°以下的晶粒的数量比通过扫描电子显微镜观察到的电子束衍射晶体取向分析获得的全部晶粒为0.40〜0.65。

9. 发明专利

JP2013095934A Cu-Fe-P-BASED COPPER ALLOY SHEET EXCELLENT IN CONDUCTIVE PROPERTY, HEAT RESISTANCE, AND SOLDER WETTABILITY, AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：导电性，耐热性和焊接湿度的Cu-Fe-P系铜合金板及其制造方法
公开(公告)号：JP2013095934A
公开(公告)日：2013-05-20
申请号：JP2011237299
申请日：2011-10-28
申请人： Mitsubishi Shindoh Co Ltd , 三菱伸銅株式会社
发明人： KUMAGAI JUNICHI , SUKUMODA SHUNROKU , ABE YOSHIO
IPC分类号： C22C9/00 , C22C9/04 , C22C9/06 , C22F1/00 , C22F1/08 , H01B1/02 , H01B5/02 , H01B13/00
摘要： PROBLEM TO BE SOLVED: To obtain a Cu-Fe-P-based copper alloy sheet suitable as a lead frame material for a semiconducting device, which has electric conductivity of 90% IACS or more, Vickers hardness of 100 or more after heated at 400°C for 1 hour, and excellent solder wettability.SOLUTION: The copper alloy sheet has composition containing 0.05-0.15 mass% of Fe, 0.015-0.05 mass% of P, 0.01-0.2 mass% of Zn, 0.0005-0.003 mass% of Pb, and 0.0005-0.0015 mass% of Ag, with the balance comprising Cu and unavoidable impurities, wherein an average value in all crystal grains within a crystalline structure of an average orientation difference in all pixels in the crystal grains as measured by EBSD method using a scanning electron microscope with an electron backscatter diffraction pattern system is 2.5-5.0°, Brass orientation density is 8.0-20.0%, Copper orientation density is 10.0-22.0%, and an average grain size is 2.0-6.0 μm.
摘要翻译：要解决的问题为了获得适合作为导电率为90％IACS以上的半导体装置的引线框架材料的Cu-Fe-P系铜合金板，维氏硬度为100以上的维氏硬度在400℃加热1小时，焊料润湿性优异。＆lt; P＆gt;解决方案：铜合金板具有Fe：0.05〜0.15质量％，P：0.015〜0.05质量％，Zn：0.01〜0.2质量％，Pb：0.0005〜0.003质量％，Pb：0.0005〜0.0015质量％的Ag，余量包含Cu和不可避免的杂质，其中通过使用具有电子反向散射的扫描电子显微镜通过EBSD方法测量的晶粒中所有像素中的平均取向差的晶体结构内的所有晶粒中的平均值衍射图系为2.5-5.0°，黄铜取向密度为8.0-20.0％，铜取向密度为10.0-22.0％，平均粒径为2.0-6.0μm。版权所有（C）2013，JPO＆INPIT

10. 发明专利

JP2011219833A Cu-Ni-Si-BASED COPPER ALLOY EXCELLENT IN PROJECTION WELDING CHARACTERISTIC AND METHOD FOR PRODUCING THE SAME 有权
标题翻译： Cu-Ni-Si基铜合金在投影焊接中的优势及其生产方法
公开(公告)号：JP2011219833A
公开(公告)日：2011-11-04
申请号：JP2010092146
申请日：2010-04-13
申请人： Mitsubishi Shindoh Co Ltd , 三菱伸銅株式会社
发明人： SAKURAI TAKESHI , ABE YOSHIO , SAITO AKIRA , KAMEYAMA YOSHIHIRO
IPC分类号： C22C9/06 , C22C9/10 , C22F1/00 , C22F1/08
摘要： PROBLEM TO BE SOLVED: To provide a Co-Ni-Si-based copper alloy which is used in an in-vehicle drive circuit or a circuit board and the like inside a motor unit and is excellent in projection welding characteristics, and to provide a method for producing the Co-Ni-Si-based copper alloy.SOLUTION: The Co-Ni-Si-based copper alloy has the composition containing 1.0-4.0 wt.% Ni, 0.1-1.0 wt.% Si, 0.3-0.7 wt.% Zn, 0.4-0.8 wt.% Sn and the balance of Cu and inevitable impurities and has 3.0-5.0° average value of GOS (Grain Orientation Spread) in a crystal structure and is measured by an EBSD (Electron Back Scatter Diffraction) method, in all grains and 15-30% ratio (Lσ/L) (wherein Lσ is the total length of special grain boundaries in crystal grain boundaries measured by the EBSD method; L is the total length of all grain boundaries).
摘要翻译：要解决的问题：提供一种用于车载驱动电路或电路板等内部的电动机单元中的Co-Ni-Si系铜合金，并且突出焊接特性优异，以提供Co-Ni-Si系铜合金的制造方法。解决方案：Co-Ni-Si基铜合金的组成包含1.0-4.0重量％的Ni，0.1-1.0重量％的Si，0.3-0.7重量％的Zn，0.4-0.8重量％的Sn 和余量的Cu和不可避免的杂质，并且在晶体结构中具有3.0-5.0°的GOS（晶粒取向扩散）的平均值，并且通过EBSD（Electron Back Scatter Diffraction）方法测量，在所有晶粒中和15-30％的比例（Lσ/ L）（其中Lσ是通过EBSD方法测量的晶粒边界中的特殊晶界的总长度; L是所有晶界的总长度）。版权所有（C）2012，JPO＆INPIT

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