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81. 发明专利

JPH05164481A HEAT EXCHANGER 失效
公开(公告)号：JPH05164481A
公开(公告)日：1993-06-29
申请号：JP33323091
申请日：1991-12-17
申请人： HITACHI LTD
发明人： TERADA KOJI , HATADA TOSHIO , TANAKA TAKEO
IPC分类号： F28D1/053 , F28F1/32
摘要： PURPOSE:To enhance corrosion resistant and heat transfer properties by providing a corrugated fin between fins, since it is difficult to expect an improvement of a cross fin tube type heat exchanger adopted in the field of air conditioner heat exchangers due to their corrosion problems. CONSTITUTION:Corrugated fins 4 are mounted between a large number of plate fins 1 having a louver part laid out in parallel to each other with a span so as to reduce the load of the louver part in the plate fins 1 and increase their heat transfer areas. This construction makes it possible to enhance their corrosion resistant and heat transfer properties so that the heat exchangers may be used for a long time in a stabilized manner.

82. 发明专利

JPH05160310A ELECTRONIC DEVICE COOLED BY FLUID 失效
公开(公告)号：JPH05160310A
公开(公告)日：1993-06-25
申请号：JP32734091
申请日：1991-12-11
申请人： HITACHI LTD
发明人： NAKAJIMA TADAKATSU , KUWABARA HEIKICHI , ASHIWAKE NORIYUKI , HATSUDA TOSHIO , HATADA TOSHIO , INOUE KO , SASAKI SHIGEYUKI , OSONE YASUO , NAKAMURA SHOZO , YASUDA HIROSHI , KASAI KENICHI
IPC分类号： H01L23/44 , H01L23/473
摘要： PURPOSE:To equalize the temperatures of from high heating density elements to low heating density elements, and reduce temperature ripple by forming electronic devices into modules according to the heating densities of the elements, and using boiling heat conduction and convection heat conduction each in its proper way. CONSTITUTION:A high heating density module unit 1 consisting of a high heating density element is arranged on the downstream side of a refrigerant circulation system, and a low heating density module unit 2 consisting of a low heating density element on the upstream of the refrigerant circulation system. Refrigerant liquid, which has passed each unit 1 and 2, is heat-exchanged with a liquid cooler 4, and then, it is supplied to a pump 3 so as to cool each unit 1 and 2 again directly. Hereby, an electronic device, which is high in reliability and in which the processing operation is high speed, is provided.

83. 发明专利

JPH0536718B2 失效
公开(公告)号：JPH0536718B2
公开(公告)日：1993-05-31
申请号：JP8164582
申请日：1982-05-17
申请人： HITACHI LTD
发明人： HATADA TOSHIO , KURODA SHIGEAKI , ATSUMI AKIRA , CHIAKI TAKAO , KOKUNI KENSAKU , MINAGAWA SADATOSHI , AJIKI NAOJI
IPC分类号： F28F13/08 , F28D1/047 , F28F1/02 , F28F9/22 , F28F27/02

84. 发明专利

JPH05110277A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH05110277A
公开(公告)日：1993-04-30
申请号：JP27233091
申请日：1991-10-21
申请人： HITACHI LTD
发明人： TANAKA AKIRA , SHINOHARA KOICHI , YAMADA KAZUJI , OBA TAKAO , YAMAGIWA AKIRA , YOSHITOME HITOSHI , SHIRAI MASAYUKI , HATADA TOSHIO , KISHIMOTO MUNEHISA , HONDA MICHIHARU
IPC分类号： H01L23/36 , H01L23/367 , H01L25/10 , H05K1/02 , H05K1/14 , H05K1/18 , H05K3/00 , H05K3/36 , H05K7/20
摘要： PURPOSE:To attain the increase of working speed, miniaturization and improvement in heat dissipation by connecting and unifying a printed board for surface mounting and a thermal diffusion board, on which a semiconductor element is mounted. CONSTITUTION:A semiconductor element 1 is bonded to a heat-dissipating plate 2, the surface of which is smoothed, with adhesive. A printed board 4 for surface mounting, in which a through-hole is formed to a section, on which the semiconductor element 1 is mounted, is bonded to the heat-dissipating plate 2, on which the semiconductor device 1 is mounted. The bonding pads of the semiconductor element 1 and the bonding pads of the printed board 4 for surface mounting are connected by wires 9. The semiconductor element 1 is covered with gel in order to protect the semiconductor element 1, and covered with a cap 5. Solder paste is printed, a chip part 7 is mounted and a package 6 for a memory is mounted, and reflow soldering is conducted. A connector 8 as an insertion part is joined with the printed board 4 for surface mounting. Fins 3 are mounted on the heat dissipating plate 2, thus acquiring a module mounting type semiconductor device.

85. 发明专利

JPH04259292A COOLING STRUCTURE OF SMALL-SIZED COMPUTER 失效
公开(公告)号：JPH04259292A
公开(公告)日：1992-09-14
申请号：JP2068191
申请日：1991-02-14
申请人： HITACHI LTD
发明人： KOMATSU TOSHIHIRO , HATADA TOSHIO , OBA TAKAO , KOIDE KAZUO
IPC分类号： H05K7/20 , G06F1/20
摘要： PURPOSE:To offer a compact cooling system small-sized like a notebook having good computer efficiency. CONSTITUTION:Heating elements 3 come in contact with soft thermal conductors 4 and the other sides of these thermoconductors 4 come in contact with a casing such as the base and the side of a computer 5 while the outside of the easing is provided with a ventilation path 1-1 of cooling wind.

86. 发明专利

JPH04162497A COOLING DEVICE FOR ELECTRONIC APPARATUS 失效
公开(公告)号：JPH04162497A
公开(公告)日：1992-06-05
申请号：JP28426390
申请日：1990-10-24
申请人： HITACHI LTD
发明人： KONDO YOSHIHIRO , MATSUSHIMA HITOSHI , HATADA TOSHIO , INOUE KO , KOMATSU TOSHIHIRO , OBA TAKAO , YAMAGIWA AKIRA
IPC分类号： H05K7/20 , H01L23/467
摘要： PURPOSE:To reduce and uniformize temperature distribution by colliding cooling fluid as jet with an IC chip and an LSI package from small holes, which are at the positions corresponding to the IC chip and the LSI chip and that have the open area corresponding to the calorific power of each IC chip. CONSTITUTION:A small high-performance calculator loads a plurality of substrates 1 on which a plurality of IC chips 2 and a plurality of LSI packages 7 are arranged, the calculator is provided with a fan 13 which supplies cooling fluid between the substrates 1, a jet cooling device 16 which has an air supplying duct 30 at the top and an air exit at the bottom. The substrate 1 is provided with a small fan 3, the jet cooling device 16 can be loaded and unloaded and when the group of the IC chips 2 are generating less heat, the device 16 is removed. The LSI package 7 is provided with a heat releasing fin 27 and the air supplying duct 30 is formed by bending in a series of U-shapes or in a shape of teeth of a comb. At the tooth-shaped part, a plurality of the small holes 6 are provided and the cooling fluid is collided with each LSI package 7 and the group of the IC chips 2 from the small holes 6 as jet 4.

87. 发明专利

JPH04158558A SEMICONDUCTOR PACKAGE WITH COOLING FINS AND COOLING DEVICE OF SEMICONDUCTOR 失效
公开(公告)号：JPH04158558A
公开(公告)日：1992-06-01
申请号：JP28407990
申请日：1990-10-22
申请人： HITACHI LTD
发明人： MATSUSHIMA HITOSHI , HATADA TOSHIO , KONDO YOSHIHIRO , INOUE KO , OTSUKA KANJI , SHIRAI MASAYUKI , OBA TAKAO , YAMAGIWA AKIRA
IPC分类号： H01L23/36 , H01L23/467
摘要： PURPOSE:To enable execution of efficient cooling by setting the length of one side, the thickness, the interval and the height of fins at specified values and by providing minute indentations on the surface of each fin or by forming the fin in the shape of a letter S or a zigzag. CONSTITUTION:Dimensional limits on the maximum height, width, depth, etc., of cooling fins and an aimed resistance value thereof are set, and the number of the fins, the height of the fins, the width of the fins, the depth of the fins, the thickness of each fin, etc., are determined. The air velocity at a board entrance satisfying an aimed thermal resistance value is assumed and a thermal resistance value and a pressure loss are determined. Then, it is judged whether the determined thermal resistance value satisfies the aimed value or not and whether the shape of the fin is to be altered or not, the relations of the shape of the fin with the air velocity at the board entrance and the pressure loss are plotted, and thereby the shape of the fin making them extremely small is found out. The cooling fins 1 are fitted on a semiconductor package 5 having a large number of pins 6. Since the cooling fins 1 are so optimized as to have the least pressure loss and the thermal resistance value of 1.5 deg.C/W or below, effective cooling of the semiconductor package 5 is enabled.

88. 发明专利

JPH01285796A HEAT-TRANSFER FIN 失效
公开(公告)号：JPH01285796A
公开(公告)日：1989-11-16
申请号：JP11245388
申请日：1988-05-11
申请人： HITACHI LTD
发明人： UEDA HIRONOBU , HATADA TOSHIO
IPC分类号： F28F1/32
摘要： PURPOSE:To enable an unreasonable air flow to be guided in the direction of a fan and to enable reduction of incurring of a pressure loss by a method wherein a fin or a louver group is inclined in the direction of a fan. CONSTITUTION:A louver is formed with chevron louver groups 3-7 having an inclination angle of theta or theta' based on a fin base plate 2. Thus, when inflow air passes a heat exchanger, the fin groups 3-7 are inclined at an inclination angle at which an air flow is delivered excellent, an air flow has no unreason able curve but is sucked in the direction of a fan, and a pressure loss can be compensated for an increase.

89. 发明专利

JPH01208698A HEAT TRANSFER FIN 失效
公开(公告)号：JPH01208698A
公开(公告)日：1989-08-22
申请号：JP3271988
申请日：1988-02-17
申请人： HITACHI LTD
发明人： HATADA TOSHIO , UEDA HIRONOBU , OUCHI TOMIHISA , SUGIMOTO SHIGEO , SHIMIZU TAMIO
IPC分类号： F28F1/32
摘要： PURPOSE:To increase occupying area in a louver and improve heat transfer coefficient, by a method wherein the length of cutting of the raised slotted parts of heat transfer fins, arranged orthogonally to heat transfer tubes arrayed in the shape of checkers, is determined so as to have the parts of the fins provided with a length longer than the minimum distance between the heat transfer tubes. CONSTITUTION:Fin collars 5 or the inserting parts of heat transfer tubes are arranged in the shape of checkers and a multitude of louvers 4 is formed on the base plate 3 of fins between the tubes. The end of a louver (raised part) 10 is curved along the periphery of the fin collars 5 so that the maximum louver length l1 becomes longer than the minimum louver length l2, determined by the minimum distance lP between respective heat transfer tubes, and the minimum distance lP. The heat transfer coefficient is increased in proportional to the increase of occupying areas in the louver while deviations are generated at the end of the louver whereby the end of the louver is hardly broken and the rigidity of the fins may be improved.

90. 发明专利

JPS6463499A HEAT RADIATION CONTROL PLANE 失效
公开(公告)号：JPS6463499A
公开(公告)日：1989-03-09
申请号：JP21783487
申请日：1987-09-02
申请人： HITACHI LTD
发明人： HATADA TOSHIO , TANAKA TAKEO , TORII TAKUJI , NAKAJIMA TAKASHI , IMANI KAZUTAKE
IPC分类号： G05D23/02 , B64G1/50
摘要： PURPOSE: To achieve light weight and simple structure, and elaborate heat radiation control by using a thin piece-grouped blade comprising elements of tongue-like thin pieces each combining a thin sheet shape memory alloy and a bias spring as opening/closing mechanisms. CONSTITUTION: When heat generation quantity of an equipment installed on a lower part of a heat radiation board 3 is small, and as temperature of the heat radiation board 3 is low, then tongue-like thin piece are kept closed, so a heat radiation rate on the surface of the thin pieces 1 is small to restrain heat radiation quantity low. As the heat generation quantity of the equipment is increased to increase temperature of the board 3 to reach a transformation point of shape memory alloy pieces 2, deformation force of shape memory alloy gets over spring force, and the tongue-like thin pieces are deformed to open, so surfaces 3, 2 of a large heat radiation rate are exposed to increase heat radiation quantity. By thus composing a heat radiation control surface of a group of the separately actuating small tongue-like thin pieces, elaborate temperature control can be performed, and a special actuatior is not required, thereby simple structure and light weight can be achieved.

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