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61. 发明专利

JPH0436872A DESIGN BACKUP SYSTEM FOR ELECTRONIC PARTS MOUNTING PROCESS 失效
公开(公告)号：JPH0436872A
公开(公告)日：1992-02-06
申请号：JP14142790
申请日：1990-06-01
申请人： HITACHI LTD
发明人： TANAKA HIROYUKI , HONDA MICHIHARU , SERIZAWA KOJI , SAEKI JUNICHI , SATO ISAO
IPC分类号： H05K13/00 , G06F17/50
摘要： PURPOSE:To reduce the overall development cost and to obtain products of high reliability in a short time by automatizing the design backup system of the electronic parts mounting process throughout and to improve the reliability of the system to shorten the development period and reducing the labor in the trial manufacture stage. CONSTITUTION:Stored data related to a printed circuit board and various elements and temporary arrangement data of electronic parts is transferred to an analysis processing device by on-line. Electronic parts are virtually arranged on the printed circuit board on a CRT, and simulation is repeated till a desired reliability is obtained. Optimum arrangement data obtained after completion of simulation is transferred to a printed circuit board pattern design and producing device, and the printed circuit board is produced. Thus, products of high reliability are obtained in a short time because the process of simulation is performed by inline. Since the process of simulation is executed on the CRT, the trial manufacture stage is unnecessary to reduce the development design cost.

62. 发明专利

JPH03295253A MODEL SYNTHESIS FLOW ANALYSIS SYSTEM 失效
公开(公告)号：JPH03295253A
公开(公告)日：1991-12-26
申请号：JP9644290
申请日：1990-04-13
申请人： HITACHI LTD
发明人： AKASAKA SHINGO , SUGINO KAZUHIRO , IMANISHI HIROKO , SAEKI JUNICHI , NISHI KUNIHIKO
IPC分类号： H01L21/56 , G06F17/50 , H01L21/66
摘要： PURPOSE:To enable an analysis result to be displayed by a method wherein programs correspondent to flow analysis models are successively executed through a program executing means making material physical properties and flow control conditions serve as program executing conditions which are inputted through an input means. CONSTITUTION:A flow analysis and a mold cavity name X are inputted through a key board 17, whereby analysis requirements are inputted into a system. It is judged how a mold cavity is divided basing on a mold cavity shape dividing instruction from a control section. Concerning parts A-D, a part shape feature judging section 265 finds out a shape feature which conforms to conditions. An analysis program allocation section 201 picks up the shape features of the parts A-D, reads in the operating conditions of analysis programs P1, P2, and P3, and collates them with each other for conformity by the use of an inference section 21. In result, analysis programs P3(P2) and P1 and model formation method programs M3 (M2) and M1 are allotted to the split parts A(B, C) and D, and a model is formed for each of the split parts A-D. An analysis model joining section 266 forms a model as a whole.

63. 发明专利

JPH01257338A SEMICONDUCTOR RESIN-SEALING APPARATUS AND SEMICONDUCTOR RESIN-SEALING USING SAME 失效
公开(公告)号：JPH01257338A
公开(公告)日：1989-10-13
申请号：JP8397888
申请日：1988-04-07
申请人： HITACHI LTD
发明人： YOSHIDA ISAMU , SAEKI JUNICHI , KANEDA AIZO , TSUNODA SHIGEHARU , NISHI KUNIHIKO
IPC分类号： B29C45/03 , B29C45/26 , B29L31/34 , H01L21/56
摘要： PURPOSE:To easily make a resin pressure uniform and to enhance the quality of a product by installing the following: a first metal mold where a rectangular pot is installed; a second metal mold where two or more divided cylinders are arranged and installed; two or more plungers; two or more cavity rows connected in series via a gate. CONSTITUTION:A rectangular pot 2 surrounded by two short wall faces and two long wall faces which are faced to each other is installed at a first metal mold 1. Two or more divided cylinders 11 are arranged and installed at a second metal mold 10 at prescribed intervals in positions facing faces of the pot 2 of the first metal mold 1. In addition, the following are installed: two or more plungers 17 inserted into the cylinders 11; a rod 16 to drive the individual plungers 17 simultaneously upward and downward; two or more cavities 4, 6, 8 connected in series via two or more gates 3, 5, 7. By this setup, a resin can be utilized effectively; a pressure inside a flow route of the metal mold can be made uniform; the quality of a product can be enhanced.

64. 发明专利

JPH01235340A RESIN-SEALING DEVICE FOR SEMICONDUCTOR 失效
公开(公告)号：JPH01235340A
公开(公告)日：1989-09-20
申请号：JP6055188
申请日：1988-03-16
申请人： HITACHI LTD
发明人： TSUNODA SHIGEHARU , SAEKI JUNICHI , KANEDA AIZO , YOSHIDA ISAMU
IPC分类号： B29C45/02 , B29C45/14 , B29C45/36 , B29L31/34 , H01L21/00 , H01L21/56
摘要： PURPOSE:To enhance the production efficiency and the quality of a product by installing an air vent structure at a gate part connecting an interconnection passage and a cavity. CONSTITUTION:A runner 3 is installed at two or more pots used to press and supply a resin. A first gate 4 is installed at the tip of the runner 3; a first cavity 5 is arranged at this gate 4. A second gate 6 is installed at the downstream side of the cavity 5; a second cavity 7 is connected to this gate; a third cavity 9 is connected via a third gate 8. Air vents 10 are connected to interconnection flow routes 11 between the individual pots and to the gates 4, 6, 8; they are installed up to the outside of a die. By this setup, a void to be produced when a resin flows can be discharged to the outside of the cavities and removed. By this setup, the void to be produced when the resin flows can be discharged efficiently to the outside of a flow route in the die a high-quality product can be obtained.

65. 发明专利

JPH01232733A SEMICONDUCTOR RESIN SEALING DEVICE 失效
公开(公告)号：JPH01232733A
公开(公告)日：1989-09-18
申请号：JP5825788
申请日：1988-03-14
申请人： HITACHI LTD
发明人： YOSHIDA ISAMU , MITANI MASAO , KANEDA AIZO , SAEKI JUNICHI , TSUNODA SHIGEHARU
IPC分类号： B29C45/02 , B29L31/34 , H01L21/56
摘要： PURPOSE:To notably increase the material yield of resin by a method wherein a rectangular pot composed of encircling opposite two short wall surfaces and opposite two long wall surfaces, multiple cavity rows series-connected to the bottom regions of at least one side long wall surfaces through the intermediary of gates as well as a plunger are provided. CONSTITUTION:A pot 2 is provided with both short wall surfaces taking an arc rectangular shape externally protruding to extrusion-feed a resin for molding process while the first gates 3 are provided on this pot 2. The first cavities are arranged connecting to the first gates 3. The second gates 5 are provided behind the first cavities 4 i.e. the downstream side in case of feeding resin while the second cavities 6 are arranged connecting to the second gates 5. Besides, the third cavities 8 are connected to the downstream side of the second cavities 6 through the intermediary of the third gates 7. That is, three pairs of three each of cavity rows series-conneted on both sides of the pot 2 are arranged. Furthermore, a plunger 14 connecting to a rod 13 of a molding machine with a top force 10 and a bottom force 1 closed is provided. Consequently, the flow path length can be shortened notably in one pot system.

66. 发明专利

JPS62122136A MANUFACTURING APPARATUS FOR RESIN MOLD SEMICONDUCTOR 失效
公开(公告)号：JPS62122136A
公开(公告)日：1987-06-03
申请号：JP24871585
申请日：1985-11-08
申请人： HITACHI LTD
发明人： SAEKI JUNICHI , KANEDA AIZO , OZAWA MASAKAZU , NAKAGAWA TAKASHI , NISHI KUNIHIKO
IPC分类号： B29C45/02 , B29C45/14 , B29C45/26 , B29L31/34 , H01L21/56
摘要： PURPOSE:To prevent the occurrence of defective molding due to an increase in the flow resistance of resin and thereby to improve the efficiency of use of resin by a construction wherein runners separated from each other are provided in a plurality of pots, a plurality of cavities are provided in series continuously from the end of each runner, electric parts are disposed in each cavity, and molding resin is supplied under pressure. CONSTITUTION:On a lead frame 10, a chip 12 is mounted at a position corresponding to the inside of each of first, second and third cavities 5, 7 and 9, the chip 12 is connected with the lead frame 10 by a gold wire 13, and thus electric parts to be molded are constructed. Resin 14 is passed through a runner 3, a first gate 4, the cavity 5 and a second gate 6, supplied to the cavity 7 and filled up completely to the cavity 9, and then a plunger 15 stops a pressing operation. When a prescribed time passes in this state, the resin 14 is set, a top force 11 and a bottom force 1 are opened as the plunger 15 rises, and a molded article 16 is taken out of a metal mold. The occurrence of defective molding due to an increase in the flow resistance of the resin can be prevented in this way.

67. 发明专利

JPS6250108A METHOD FOR TRANSFER MOLDING AND MOLD DEVICE THEREOF 失效
公开(公告)号：JPS6250108A
公开(公告)日：1987-03-04
申请号：JP18966885
申请日：1985-08-30
申请人： HITACHI LTD , HITACHI KIKAI ENG
发明人： KUBOTA RYUJI , SAEKI JUNICHI , KANEDA AIZO
IPC分类号： H01L21/56 , B29C45/02 , B29C45/14 , B29C45/26 , B29K101/10 , B29L31/34
摘要： PURPOSE:To make it easy to remove moldings when the moldings are molded by a mold device where plungers are installed at the nose of a rod, by setting up removably a first plate mold having more than one penetrating hole for molding, and by pouring under pressure. CONSTITUTION:A lead frame being fit with a semiconductor device is preliminarily set between a removable top force 6 and a removable bottom force 7 and set up on the top force 5. After mold closing, molding material supplied into each pot 4A is pressed into each cavity 8 by a plurality of plungers 11, and filled to be molded. The molding material is pressed into through a gap between the spot facing part 4Aa of the pot 4A provided at the top force 4 and upper cavity 8A. Because the molding material can be directly transfered and loaded into the cavity from the pot part, the efficiency of transfer of the molding material can be increased.

68. 发明专利

JPS624328A SEMICONDUCTOR RESIN MOLDING DIE 失效
公开(公告)号：JPS624328A
公开(公告)日：1987-01-10
申请号：JP14247085
申请日：1985-07-01
申请人： HITACHI LTD , AKITA DENSHI KK
发明人： KAIDO TAKAHARU , SAEKI JUNICHI , SASAKI SHIGERU , KANEDA AIZO
IPC分类号： B29C39/10 , B29C39/26 , B29K105/20 , B29L31/34 , H01L21/56
摘要： PURPOSE:To extend the life of a semiconductor resin molding die and improve the productivity of resin-molded semiconductors by a method wherein at lest cavities and resin channels formed in an upper die and a lower die which compose the semiconductor resin molding die are coated with hard alloy films. CONSTITUTION:Lead frames on which semiconductor elements are bonded are fitted to the lower die of a semiconductor resin molding die. Resin is supplied through resin channels into cavities which are formed by tightening the upper die and the lower die together and the lead frames are molded in the resin to form resin molded semiconductors. For this purpose, at least the cavities 4 and the resin channels (pots 3, runners 6 and gates 5) of the upper die and the lower die are coated with hard alloy films 14. With this constitution, the life of the resin molding die can be extended and the productivity of the resin molded semiconductors can be improved.

69. 发明专利

JPS61229518A MOLD FOR MOLDING RESIN 失效
公开(公告)号：JPS61229518A
公开(公告)日：1986-10-13
申请号：JP7089085
申请日：1985-04-05
申请人： HITACHI LTD
发明人： SAEKI JUNICHI , SHINODA TADAO , KANEDA AIZO
IPC分类号： H01L21/56 , B29C33/10 , B29C45/34 , B29K105/20 , B29L31/34
摘要： PURPOSE:To trap void, going to flow into a cavity for product, perfectly by a method wherein a slit, provided with air suction ports, is connected to the gate of the mold for molding resin, whose runner for introducing the liquid resin is communicated with the cavity for product through the gate. CONSTITUTION:A lead frame 10 is provided on a bottom force 1B and a top force 1A is clamped to the bottom force 1B to form the cavity 5 for product. When air is sucked through the air suction port 7 and the slit 6, the liquid resin 11 in a pot 2 flows into the cavity 5 through the runner 3 and the gate 4 while the void 12 in the resin 11 flows also into the gate 4. The void 12 in the gate 4 arrives at a narrow section 4a, communicating with the slit 6, while the slit 6 is held in an evapuated condition, therefore, the void 12 is sucked and is discharged through the slit 6 and the air suction port 7. Accordingly, the liquid resin 11, including no void at all, is filled into the cavity 5.

70. 发明专利

JP2002261198A ELECTRONIC CIRCUIT DEVICE FOR AUTOMOBILE AND METHOD FOR MANUFACTURING THE PACKAGE 失效
公开(公告)号：JP2002261198A
公开(公告)日：2002-09-13
申请号：JP2001061708
申请日：2001-03-06
申请人： HITACHI LTD
发明人： KAWAKAMI KAZUHIKO , MASUDA MITSUYASU , SAEKI JUNICHI
IPC分类号： H05K5/00 , H01L23/28 , H01L23/36 , H05K5/02
摘要： PROBLEM TO BE SOLVED: To provide an inexpensive electronic circuit device for an automobile having superiority in thermal dissipation and water-resistance without delaminations and cracks between a mold resin and members due to a thermal stress. SOLUTION: The device comprises an electronic circuit 4 including a circuit board 6 on which an electronic circuit component is mounted, a leadframe 2 for mounting the electronic circuit 4, a flange portion 2c provided on a part of the leadframe 2, and a lead 2a. The circuit board, leadframe, lead and flange except a part of the lead and flange are encapsulated by a mold resin by one operation. A protrusion 7 is formed around the center on the upper surface of the leadframe 2 for supporting only the center part of the circuit board and the backside of the center part of the circuit board 6 is bonded to the protrusion 7. A plurality of through holes 2h for the resin flow are provided on the leadframe 2.

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