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1. 发明专利

JP2000150548A MANUFACTURE OF SEMICONDUCTOR DEVICE 失效
公开(公告)号：JP2000150548A
公开(公告)日：2000-05-30
申请号：JP31869098
申请日：1998-11-10
申请人： HITACHI LTD , AKITA DENSHI KK
发明人： OBA TAKASHI
IPC分类号： H01L23/12 , H01L21/301 , H01L21/56
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing technique by which a sealing section having an accurate external size can be formed by preventing the burring or chipping of the sealing section. SOLUTION: A substrate sheet 9 composed of a plurality of bases 2 each carrying a plurality of connection terminals formed on one surface and a plurality of substrate dividing grooves 11 respectively formed on the other surfaces of the boundary sections of the bases 2 is constituted so that individual sealing sections 7 formed at every base 2 may be separated from each other by bending the sheet 9 from the grooves 11, in such a way that, after semiconductor chips 4 are respectively mounted on the bases 2 and electrically connected to the connection terminals and a sealing resin 13 is supplied to the sheet 9, the resin 13 is divided into parts by mounting a partitioning jig 15 on the sheet 9, and, when the resin is half cured, removing the jig 15 and forming the sealing sections 7 at every base 2. Therefore, the burring and chipping of a semiconductor device can be prevented and sealing sections having accurate outside dimensions can be formed easily, because the sealing sections 7 are not divided at the time of dividing the sheet 9.

2. 发明专利

JPH11345785A DICING METHOD AND DEVICE 失效
公开(公告)号：JPH11345785A
公开(公告)日：1999-12-14
申请号：JP15409998
申请日：1998-06-03
申请人： HITACHI LTD , AKITA DENSHI KK
发明人： SAKURADA SHINICHI , FUJITA KAZUHITO
IPC分类号： H01L21/301
摘要： PROBLEM TO BE SOLVED: To fix the thickness of the remained after cutting by dicing. SOLUTION: In a dicing method, a wafer being applied to a tape is retained on the mount surface of a chuck table 1, a rotary blade 7 is moved along the mount surface, the wafer is cut by a specific depth, at the same time, the setting position of the blade 7 is measured before cutting, and the height of the cutting position of the blade 7 is corrected from blade setting position data being obtained by measuring the setting position of the blade 7 for cutting. Also, in the method, the flatness of the mount surface of the chuck table 1 is measured, and cutting is made while the cutting depth of the blade 7 is controlled based upon measured data (flatness data) according to the measurement. By equipment for measuring flatness that is detachably, directly, or indirectly mounted to a spindle 4 for supporting a blade 2 or a member moving with the spindle 4, the flatness of the mount surface of the chuck table 1 is measured.

3. 发明专利

JPH11214605A MANUFACTURE OF SEMICONDUCTOR DEVICE AND LEAD FRAME USED IN THE MANUFACTURING METHOD 失效
公开(公告)号：JPH11214605A
公开(公告)日：1999-08-06
申请号：JP1006498
申请日：1998-01-22
申请人： HITACHI LTD , AKITA DENSHI KK
发明人： TAKAHASHI HIROYUKI
IPC分类号： H01L23/50
摘要： PROBLEM TO BE SOLVED: To reduce the cost of a semiconductor device by miniaturizing a lead frame. SOLUTION: A lead frame 10 is provided with a brim type lead frame brim constituted of an outer brim and an inner brim, a tab which is positioned in the lead frame brim and fixes a semiconductor chip, a plurality of leads 3 whose inner ends extend to the periphery of the above tab, a dam 14 linking the leads 3, a tab suspending lead which supports the tab and connected with at least the dam 14, a linkage part 15 which supports the outer end of each lead of a lead group, constituted of a plurality of the leads 3 which are arranged in parallel and stretched, and stretches along the outer brim or the inner brim, and a transformation part 21 which links the linkage part 15 and the lead frame brim, does not protrude to the direction of the lead frame brim along the linkage part 15, and can be transformed, in accordance with the movement of the lead 3 supported by the linkage part 15 to the lead frame brim center.

4. 发明专利

JPH11204582A MANUFACTURE OF TAPE WITH BUMP, MANUFACTURE OF SEMICONDUCTOR CHIP, AND BUMP FORMING APPARATUS 失效
公开(公告)号：JPH11204582A
公开(公告)日：1999-07-30
申请号：JP828698
申请日：1998-01-20
申请人： HITACHI LTD , AKITA DENSHI KK
发明人： TAKASAKI HAJIME
IPC分类号： H01L21/60
摘要： PROBLEM TO BE SOLVED: To realize small size and thin type semiconductor device and easily form thin type bumps, without complicated steps. SOLUTION: In a semiconductor chip manufacturing (bump forming) technology, the top end of a metal wire 21 is molten to form a ball 23 which is compression-bonded to a band-like tape 10, the wire 21 is cut near the ball 23, bumps 4 are formed on the tape 10, the bumps 4 formed on the tape 10 are pressed up to a specified height by a pressing body to form a bump-attached tape, they are transferred and formed from the bump-attached tape to electrode pads of the semiconductor chip, whereby the bumps 4 have no restraints such as pressing, and bumps of desired height can be formed, and a small-sized, thin type semiconductor device is realizable. Since the bumps are formed without the use of complicated process such as electrolytic plating, thin type bumps can be easily formed to improve the yield and reduce the cost.

5. 发明专利

JPH11135665A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH11135665A
公开(公告)日：1999-05-21
申请号：JP29655597
申请日：1997-10-29
申请人： HITACHI LTD , AKITA DENSHI KK
发明人： SAGA TORU
IPC分类号： H01L23/12
摘要： PROBLEM TO BE SOLVED: To enhance moisture resistance of a semiconductor device. SOLUTION: This semiconductor device comprises a sealing body 2 of insulating resin, a plurality of leads 3 extending inward and outward of the encapsulating body 2, a chip support 7 located in the encapsulating body 2 continuously to a part of the leads 3, a semiconductor chip 13 bonded onto the chip support 7 in the encapsulating body 2, and a wire 14 for connecting the electrode of the semiconductor chip 13 electrically with the lead 3 in the encapsulating body 2 wherein the rear side of the chip support 7, i.e., the side opposite to the semiconductor chip bonding side, is exposed from one side of the encapsulating body 2. The surface of the chip support 7 to be bonded with the semiconductor chip is applied with an auxiliary body 12 (adhesive tape) composed of a frame-like insulator, stretching outward substantially over the entire circumference of the chip support 7 in the encapsulating body 2. The auxiliary body 12 also 10e extended on the lead 13. The surface of the chip support 7 to be bonded with the semiconductor chip is flush with the wire connecting face of the lead 3.

6. 发明专利

JP2865806B2 失效
公开(公告)号：JP2865806B2
公开(公告)日：1999-03-08
申请号：JP13383290
申请日：1990-05-25
申请人： HITACHI SEISAKUSHO KK , AKITA DENSHI KK
发明人： KINOSHITA YOSHITAKA , KOSHIBA SATORU
IPC分类号： H01L21/60 , H01L23/50 , H01L27/10
摘要： PURPOSE:To miniaturize by providing at least one out of the leads, which are connected electrically to a first bonding pad, with a part which overlaps a semiconductor pellet. CONSTITUTION:This is constituted by laying an insulating film 2 and a semiconductor pellet 4, respectively, on an inner lead 3A. Accordingly, the inner lead 3A for signal, which is electrically connected to the external terminal being arranged along the farthest side of a semiconductor pellet 1, is drawn around inside the occupied area of the semiconductor pellet 1, and by the amount equivalent to the draw-around of this inner lead 3A for signal, the size of the part 5 for sealing with resin can be reduced. Thus, a semiconductor device 10 sealed with resin of ZIP structure can be miniaturized.

7. 发明专利

JPH1154542A SEMICONDUCTOR MANUFACTURING EQUIPMENT 失效
公开(公告)号：JPH1154542A
公开(公告)日：1999-02-26
申请号：JP21285397
申请日：1997-08-07
申请人： HITACHI LTD , AKITA DENSHI KK
发明人： SHIBATA TORU
IPC分类号： H01L21/60
摘要： PROBLEM TO BE SOLVED: To enable continuously supplying many racks to a loader part and an unloader part, and increase the continuously operating hour of a semiconductor manufacturing equipment, by equipping a vertical shaft guide mechanism with a rack supply mechanism for feeding racks. SOLUTION: A loader/unloader mechanism 10 arranges a rack supply mechanism. In order to arrange the rack supply mechanism, the upper part of a vertical shaft guide 20 of a vertical guide mechanism 16 is cut off, and it is made possible to insert and supply racks 15 from the cut part to a part between the vertical shaft guide 20 and a vertical shaft main guide 21. The upper side of the vertical shaft guide 20 is cut off, and a rack supply table 52 is fixed to the cut part via a retainer. The table 52 is retained by a rotatable roller 54 fixed on the upper end of a strut 53 whose lower end is fixed to a lower receiving table 17. The rack supply mechanism is arranged in parallel above the receiving table 17, and three pieces of racks, which are not limited, are set in the rack supply mechanism.

8. 发明专利

JPH10335561A MANUFACTURE OF SEMICONDUCTOR DEVICE AND LEAD FRAME USED IN THE METHOD 失效
公开(公告)号：JPH10335561A
公开(公告)日：1998-12-18
申请号：JP14742697
申请日：1997-06-05
申请人： HITACHI LTD , AKITA DENSHI KK
发明人： TAGUCHI ATSUHIKO , HAGIWARA TAKATOSHI
IPC分类号： H01L21/56 , H01L23/50
摘要： PROBLEM TO BE SOLVED: To prevent separation of a small piece of a lead frame or a resin block upon cutting and removing a dummy resin body and a lead frame part, by connecting the lead frame part to a support member in the dummy resin body via a connection piece and supporting the lead frame part by the support member. SOLUTION: A support member 24 and a lead frame part 9 to be cut and removed are connected with a fine connection piece 30 such that when the lead frame part 9 is cut at both ends and separated from a read frame 1, the cut lead frame part 9 is integrated with the dummy resin body formed in a dummy resin formation region 22. Further, a connection piece is provided such that it projects from a connection resin formation region 27 into an opening 23 of the dummy resin formation region 22. By this arrangement, the very small lead frame part 9 can be prevented from being solely removing from the read frame 1, and it can be discarded integrally with the dummy resin body to be removed.

9. 发明专利

JPH10242769A AMPLIFIER CIRCUIT AND ITS CONTROL METHOD, AMPLIFIER CIRCUIT MODULE AND PORTABLE TELEPHONE SET 失效
公开(公告)号：JPH10242769A
公开(公告)日：1998-09-11
申请号：JP4506797
申请日：1997-02-28
申请人： AKITA DENSHI KK
发明人： ONO TAKASHI
IPC分类号： H03G3/30 , H03F1/02
摘要： PROBLEM TO BE SOLVED: To improve the power efficiency despite of a low input level of an input signal for an amplifier circuit by using an amplifier and a power potential varying circuit which varies the power potential applied to a power terminal of the amplifier, based on the output control signal sent from the outside. SOLUTION: An attenuation amplifier 40 and an RF power amplifier 41 cascaded to a power amplifier part. The amplifier 40 functions as an amplifier circuit which varies the amplification degree of the RF input signal from the output control signal sent from an APC circuit 29. The amplifier 40 also plays a role as an attenuator. The a power potential varying circuit 31 lowers the power potential applied to the power terminal of the amplifier 41 based on the output control signal received from the circuit 29 and then improves the power efficiency via the amplifier 41 despite a low input level of the RF input signal that is inputted to the amplifier 41.

10. 发明专利

JPH10189690A PICK-UP DEVICE AND METHOD OF SEMICONDUCTOR CHIP 失效
公开(公告)号：JPH10189690A
公开(公告)日：1998-07-21
申请号：JP34713796
申请日：1996-12-26
申请人： HITACHI LTD , AKITA DENSHI KK
发明人： KUSANAGI SHIGEYO
IPC分类号： H05K13/02 , H01L21/52 , H01L21/67 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To gradually separate of a semiconductor chip from an adhesive tape starting with its one end and terminating with its other end by a method wherein the semiconductor chip is pushed up a few times in a multistage manner with a push-up means possessed of a push rod whose tip is obtuse or round. SOLUTION: A push rod 9a is moved up with the first push-up part 7 of a push mechanism 6 to push up a first spot 13 on the rear of a semiconductor chip adjacent to its corner from below an adhesive tape. Furthermore, a push rod 9b is moved up with the second push-up part 8 of the push mechanism 6 to push up a second push spot 14 on the rear of a semiconductor chip adjacent to its center from below the adhesive tape. As mentioned above, a semiconductor chip 2 is pushed up a few times in a multistage manner, whereby the semiconductor chip 2 pasted and fixed to an adhesive tape 3 can be gradually separated from the tape 3 starting from its end and terminating with its other end, so that the semiconductor chip 2 can be protected against marks and cracking formed on its rear when the semiconductor chip 2 is pushed up.

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