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51. 发明专利

JP2016034026A 信号伝送部品および電子機器有权
标题翻译：信号传输组件和电子设备
公开(公告)号：JP2016034026A
公开(公告)日：2016-03-10
申请号：JP2015180650
申请日：2015-09-14
申请人：株式会社村田製作所
发明人：用水邦明
IPC分类号： H01L23/12 , H05K1/14 , H01P3/08 , H05K1/02
CPC分类号： H01P3/08 , H01L23/12 , H01L23/66 , H01P5/028 , H05K1/118 , H05K1/147 , H01L2924/0002 , H05K1/0251 , H05K1/0253 , H05K2201/0191 , H05K2201/058 , H05K2201/0919 , H05K2201/09445 , H05K2201/09727 , H05K2201/09845 , H05K2201/10189
摘要：【課題】外部回路基板へ容易に接続でき、接続信頼性を容易に高くでき、且つ薄型の信号伝送部品を提供する。【解決手段】信号伝送部品である信号伝送ケーブル10Cは、積層体100Cを備える。積層体100Cは、第1方向の一方端に薄厚部191Cを備え、第1方向の他方端に薄厚部192Cを備える。積層体100Cにおける薄厚部191C,192Cの間の部分は主線路部190Cとなる。薄厚部191C,192Cの厚みは、主線路部190Cの厚みよりも薄い。主線路部190Cと薄厚部191C,192Cとから構成される積層体100Cの厚さ方向の一方端の面は、連続する平坦面となっている。薄厚部191C,192Cにおける主線路部190Cとの間で段差を有する側の面には、厚さ方向に延伸する外部接続用コネクタ71C,72Cが設置されている。積層体100Cは、薄厚部191C,192Cにおいて、厚さ方向に曲げられている。【選択図】図9
摘要翻译：要解决的问题：提供能够容易地连接到外部电路板并且容易提高连接可靠性的薄型信号传输部件。解决方案：作为信号传输部件的信号传输电缆10C包括层压体100C。层叠体100C在第一方向的一端具有薄壁部191C，在第一方向具有另一端的薄壁部192C。层叠体100C的薄壁部191C，192C在其间形成主线部190C。薄部分191C和192C比主线部分190C薄。主线部分190C和薄部分191C和192C构成在厚度方向的一端具有表面的层压体100C，该表面形成连续的平坦表面。在薄部分191C和192C在薄部分191C和192C和邮件主体部分190C之间具有台阶的一侧的表面上，安装用于在厚度方向上延伸的外部连接的连接器71C和72C。层叠体100C在薄壁部191C，192C的厚度方向上弯曲

52. 发明专利

JP2014111814A Surface-treated copper foil, and laminate, printed wiring board, and copper-clad laminate made therefrom 有权
标题翻译：表面处理的铜箔和层压板，印刷电路板和铜箔层压板
公开(公告)号：JP2014111814A
公开(公告)日：2014-06-19
申请号：JP2012270728
申请日：2012-12-11
申请人： Jx Nippon Mining & Metals Corp , Jx日鉱日石金属株式会社
发明人： ARAI EITA , MIKI ATSUSHI , ARAI YASUNORI , NAKAMURO KAICHIRO
IPC分类号： C25D1/04 , C25D7/06 , C25D21/12 , G01J3/46 , G01N21/27 , H05K1/09
CPC分类号： H05K3/022 , C25D1/04 , C25D7/0614 , H05K1/028 , H05K1/0346 , H05K1/09 , H05K1/14 , H05K3/361 , H05K3/384 , H05K2201/0154 , H05K2201/0317 , H05K2201/0355 , H05K2201/05 , H05K2201/058 , Y10T29/49126 , Y10T428/12431 , Y10T428/24917 , Y10T428/31681
摘要： PROBLEM TO BE SOLVED: To provide surface-treated copper foil having good adhesion with a resin, which achieves excellent visibility when observed through the resin; and a laminate made therefrom.SOLUTION: The surface-treated copper foil is laminated to a polyimide having a ΔB(PI) of 50 or more and 65 or less before lamination to the copper foil so as to constitute a copper-clad laminate having a color difference ΔE*ab of 50 or more based on JIS Z8730 at the surface through the polyimide. The copper foil is photographed with a CCD camera through the polyimide laminated on a surface treated side. The brightness of the photographed image is measured for each observation spot along the direction perpendicular to the extending direction of the observed copper foil, so that an observation spot vs brightness graph is made. From the brightness curve extending from the end of the copper foil to a part having no copper foil in the graph, a top average Bt and a bottom average Bb are obtained. The surface-treated copper foil has a difference ΔB(ΔB=Bt-Bb) of 40 or more.
摘要翻译：要解决的问题：提供与树脂具有良好粘附性的表面处理铜箔，当通过树脂观察时可以获得良好的可见度; 和由其制成的层压体。溶液：在层压到铜箔之前，将表面处理的铜箔层压到具有50以上且65以下的Dgr。B（PI）的聚酰亚胺，以构成覆铜层压板基于JIS Z8730，通过聚酰亚胺的表面具有50以上的色差Dgr; E * ab。铜箔通过聚酰亚胺层叠在表面处理侧上的CCD照相机拍摄。对于每个观察点，沿着与观察到的铜箔的延伸方向垂直的方向测量拍摄图像的亮度，从而进行观察点与亮度图的比较。从图中的从铜箔的端部延伸到没有铜箔的部分的亮度曲线，得到顶部平均Bt和底部平均Bb。表面处理铜箔的差别在于Dgr; B（＆Dgr; B = Bt-Bb）为40以上。

53. 发明专利

JP4963275B2 The connection structure of the printed circuit board and the wiring circuit board 有权
公开(公告)号：JP4963275B2
公开(公告)日：2012-06-27
申请号：JP2007189942
申请日：2007-07-20
申请人：日東電工株式会社
发明人：俊樹内藤 , 恭也大薮 , 壮宗田中 , 淳石井
IPC分类号： H05K1/14 , H05K1/02 , H05K1/11
CPC分类号： H05K3/363 , H05K1/056 , H05K1/117 , H05K1/142 , H05K2201/058 , H05K2201/09145 , H05K2201/09381 , H05K2203/167
摘要： A wired circuit board includes a first wired circuit board and a second wired circuit board disposed to be opposed to the first wired circuit board in the same plane. A first opposed surface of the first wired circuit board facing the second wired circuit board and a second opposed surface of the second wired circuit board facing the first wired circuit board include at least two types of interfitting surfaces extending in different directions so as to mutually interfit the first opposed surface with the second opposed surface.

54. 发明专利

JP2010518608A Interconnection structure and a method of manufacturing the same of multi-layer substrates 有权
公开(公告)号：JP2010518608A
公开(公告)日：2010-05-27
申请号：JP2009548558
申请日：2007-02-05
申请人：巨擘科技股▲ふん▼有限公司
发明人：之光楊
IPC分类号： H05K1/14 , B81C3/00 , H01L23/12 , H01L25/10 , H01L25/18 , H01L27/10 , H05K1/02 , H05K3/38 , H05K3/46
CPC分类号： H05K1/142 , H01L21/4857 , H01L23/5383 , H01L23/5385 , H01L24/19 , H01L24/82 , H01L2224/04105 , H01L2224/12105 , H01L2924/01005 , H01L2924/01006 , H01L2924/01018 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01322 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15312 , H01L2924/19107 , H05K1/117 , H05K3/0052 , H05K3/361 , H05K3/4611 , H05K2201/058 , H05K2201/091 , H05K2201/09109 , H05K2201/0919 , H01L2924/00
摘要：【課題】多層基板の間の相互接続構造及びその製造方法を提供する。
【解決手段】多層基板の間の相互接続構造は、第１の多層基板（３００）と第２の多層基板（４００）を含む。第１の多層基板は複数の第１の金属層（１１、１４、１７）、複数の第１の誘電層（１０、１３、１６）及び複数のビアホール（１、２、３）を有する。一つの第１の金属層の端縁は、それに対応する第１の誘電層の端縁と互いに接続され、それと隣接する他の第１の金属層の端縁と他の第１の誘電層の端縁から分離される。第２の多層基板は複数の第２の金属層（２１、２４、２７）及び複数の第２の誘電層（２０、２３、２６）を有する。一つの第２の金属層の端縁は、それに対応する第２の誘電層の端縁と互いに接続され、それと隣接する他の第２の金属層の端縁と他の第２の誘電層の端縁から分離される。ビアホールは第１の誘電層の端縁に設けられ、導電部を有する。第１の金属層に対応する導電部と第２の金属層は互いに接着される。
【選択図】図２

55. 发明专利

JP2010050445A Junction structure of substrate, and method of joining the substrate 审中-公开
标题翻译：基板的结构结构，以及接合基板的方法
公开(公告)号：JP2010050445A
公开(公告)日：2010-03-04
申请号：JP2009166213
申请日：2009-07-15
申请人： Panasonic Corp , パナソニック株式会社
发明人： YAMAZAKI MASAHIRO , SHIBATA YASUMASA , UEDA YASUO
IPC分类号： H05K1/14 , H05K3/36
CPC分类号： H05K3/363 , H05K3/3494 , H05K2201/056 , H05K2201/058 , H05K2201/10484 , H05K2201/10606 , H05K2203/0195 , Y10T428/1241
摘要： PROBLEM TO BE SOLVED: To provide a junction structure of substrates and a joining method which can stably join the substrates and achieve high workability during joining. SOLUTION: A second substrate 2 soldered to a first substrate 1 is elastically bent at a bent portion 9. The first substrate 1 is in contact with a portion where a joint 6 on the second substrate 2 is formed, in a direction along which the bending angle of the bent portion 9 increases. In this state, a first joint 5 on the first substrate 1 and the second joint 6 on the second substrate 2 are joined by soldering. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供基板的接合结构和能够稳定地接合基板并在接合期间实现高加工性的接合方法。焊接到第一基板1的第二基板2在弯曲部分9处弹性弯曲。第一基板1沿着沿着第二基板2的方向与形成有第二基板2的接合部6接触弯曲部分9的弯曲角度增加。在该状态下，第一基板1上的第一接头5和第二基板2上的第二接头6通过焊接接合。版权所有（C）2010，JPO＆INPIT

56. 发明专利

JP2010009707A Connection structure of flexible substrate and optical pickup device 审中-公开
标题翻译：柔性基板和光学拾取器件的连接结构
公开(公告)号：JP2010009707A
公开(公告)日：2010-01-14
申请号：JP2008169802
申请日：2008-06-30
申请人： Hitachi Media Electoronics Co Ltd , 株式会社日立メディアエレクトロニクス
发明人： NOMURA RIKA , FURUICHI HIROO , OZEKI YOSHIO , ITO KAZUHIKO , ICHIKAWA FUMIHITO
IPC分类号： G11B7/12
CPC分类号： H05K3/363 , G11B7/08582 , G11B17/056 , H05K1/0269 , H05K1/117 , H05K3/0052 , H05K3/225 , H05K3/3473 , H05K2201/058 , H05K2201/09127 , H05K2201/09381 , H05K2201/094 , H05K2201/0989 , H05K2203/166
摘要： PROBLEM TO BE SOLVED: To provide a structure for improving connection strength of a connected part and facilitating repair connection, when connecting a first flexible substrate fixed to the body of a thin optical pickup device and a second flexible substrate inserted into the connector of a drive. SOLUTION: When connecting the first flexible substrate fixed to the body of the optical pickup device and the second flexible substrate inserted into the connector of a drive side, the other end of the first flexible substrate and the other end of the second flexible substrate are connected in an overlapped manner, and a projection protruding to one side is formed in a position farthest from the other end in the connected part outermost conductor pattern of the first flexible substrate and the second flexible substrate. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种用于提高连接部分的连接强度并促进修复连接的结构，当连接固定到薄光学拾取装置的主体的第一柔性基板和插入连接器中的第二柔性基板的驱动器。解决方案：当连接固定到光学拾取装置的主体的第一柔性基板和插入驱动侧的连接器中的第二柔性基板时，第一柔性基板的另一端和第二柔性基板的另一端基板以重叠的方式连接，并且突出到一侧的突起形成在距离第一柔性基板和第二柔性基板的连接部分最外导体图案中的另一端最远的位置。版权所有（C）2010，JPO＆INPIT

57. 发明专利

JP4331738B2 Arrangement method of the flexible printed circuit board 有权
公开(公告)号：JP4331738B2
公开(公告)日：2009-09-16
申请号：JP2006150426
申请日：2006-05-30
申请人：富士通株式会社
发明人：幸弘小村 , 光洋泉 , 洋石山
IPC分类号： G11B5/60 , G11B21/21 , G11B33/12
CPC分类号： G11B5/486 , G11B5/4846 , H05K3/363 , H05K2201/058 , H05K2201/09145 , H05K2203/167

58. 发明专利

JP2008294114A Flexible printed circuit board and liquid crystal display device 审中-公开
标题翻译：柔性印刷电路板和液晶显示装置
公开(公告)号：JP2008294114A
公开(公告)日：2008-12-04
申请号：JP2007136297
申请日：2007-05-23
申请人： Funai Electric Co Ltd , 船井電機株式会社
发明人： SAKIKUBO NORIYUKI
IPC分类号： H05K1/02 , H05K1/14
CPC分类号： H05K3/363 , H05K1/0269 , H05K2201/058 , H05K2201/09781 , H05K2201/09918 , H05K2203/166
摘要： PROBLEM TO BE SOLVED: To provide a flexible printed circuit board for easily positioning electric pads and suppressing peeling of electronic pads when the pads formed on a couple of flexible printed circuit boards are mutually bonded.
SOLUTION: On the flexible printed circuit board (FPC) 3, a first electrode pad 11 connected to a wire 21 and exposed without being covered by a protecting film is formed. The first electrode pad 11 is provided for bonding with a second electrode pad 12 of the other FPC4. A positioning pattern 31, which is formed of the same material as the first electrode pad 11 and is used as a marking for positioning the other FPC4 for connection of the first electrode pad 11 and the second electrode pad 12, is extended from the first electrode pad 11.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：当形成在一对柔性印刷电路板上的焊盘相互粘合时，提供一种用于容易定位电焊盘并抑制电子焊盘剥离的柔性印刷电路板。解决方案：在柔性印刷电路板（FPC）3上，形成连接到导线21并暴露而不被保护膜覆盖的第一电极焊盘11。第一电极焊盘11用于与另一FPC4的第二电极焊盘12接合。由与第一电极焊盘11相同的材料形成并用作定位用于连接第一电极焊盘11和第二电极焊盘12的另一FPC4的标记的定位图案31从第一电极版权所有（C）2009，JPO＆INPIT

59. 发明专利

JP2008235586A Flexible wiring material for mounting circuit component 有权
标题翻译：用于安装电路组件的柔性布线材料
公开(公告)号：JP2008235586A
公开(公告)日：2008-10-02
申请号：JP2007073228
申请日：2007-03-20
申请人： Brother Ind Ltd , ブラザー工業株式会社
发明人： KUBO TOMOYUKI
IPC分类号： H05K7/20 , B41J2/01 , B41J29/00
CPC分类号： H05K1/147 , B41J2/14209 , B41J2002/14217 , B41J2002/14225 , B41J2002/14306 , B41J2002/14419 , B41J2002/14491 , H05K1/189 , H05K3/361 , H05K2201/058 , H05K2201/10674
摘要： PROBLEM TO BE SOLVED: To reduce heat transfer of a circuit component which is mounted on a flexible wiring material to the load side.
SOLUTION: The flexible wiring material of circuit component mounting includes a first wiring material 51 which is connected with a load 32 and a second wiring material 52 which is connected with the first wiring material 51 and extends toward an external signal source side. The circuit component 53 for driving the load 32 is mounted on the first wiring material 51. The second wiring material 52 is connected with the first wiring material 51 between the mounting position of the circuit component 53 and the connecting position with the load 53 of the first wiring material 51. In this way, heat of the circuit component 53 is divided and is also transferred to the second wiring material 52 and the effect of the heat on the load 53 can be reduced.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：减少安装在柔性布线材料上的电路部件对负载侧的传热。解决方案：电路部件安装的柔性布线材料包括与负载32连接的第一布线材料51和与第一布线材料51连接并向外部信号源侧延伸的第二布线材料52。用于驱动负载32的电路部件53安装在第一布线材料51上。第二布线材料52在电路部件53的安装位置和与负载53的连接位置之间与第一布线材料51连接以这种方式，电路部件53的热量被分割并且也被转移到第二布线材料52，并且可以减少热量对负载53的影响。版权所有（C）2009，JPO＆INPIT

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