An object of the present invention is to provide an interconnection structure and a method of manufacturing the same of multi-layer substrates.
Hybrid structure of A multilayer substrate includes a first multi-layer substrate (300) a second multi-layer substrate (400). First multi-layer substrate having a plurality of first metal layer (11,14,17), a plurality of first dielectric layer (10,13,16) and a plurality of via holes (1,2,3). Edge of one first metal layer, the first corresponding to the dielectric layer edges and are connected to each other, therewith the adjacent other first metal layer edge and the other of the first dielectric layer It is separated from the edge. The second multi-layer substrate having a plurality of second metal layers (21, 24, 27) and a plurality of second dielectric layer (20, 23, and 26). Edge of one second metal layer, the second the corresponding dielectric layer edges and are connected to each other, therewith the other adjacent second metal layer edge and the other second dielectric layer It is separated from the edge. Via hole provided on the end edge of the first dielectric layer, a conductive portion. Conductive portion and a second metal layer corresponding to the first metal layer are bonded together.
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