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21. 发明专利

JP2011174042A Film for producing semiconductor device and method for producing semiconductor device 审中-公开
标题翻译：用于生产半导体器件的膜和用于生产半导体器件的方法
公开(公告)号：JP2011174042A
公开(公告)日：2011-09-08
申请号：JP2010270438
申请日：2010-12-03
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： SUGAO HISAKI , TANAKA SHUNPEI , MATSUMURA TAKESHI , INOUE YASUSHI
IPC分类号： C09J7/02 , C09J133/08 , C09J161/06 , C09J163/00 , C09J201/00 , H01L21/301
CPC分类号： B32B7/12 , H01L21/6836 , H01L21/78 , Y10T428/263 , Y10T428/2809
摘要： PROBLEM TO BE SOLVED: To provide a novel film for producing semiconductor devices, even when a semiconductor wafer is thin, excellent in preventing contamination of a semiconductor chip having an excellent balance of holding power during dicing the thin semiconductor wafer, peeling property when peeling the semiconductor chip obtained by dicing together with the adhesive layer thereof and low contamination property without attaching cutting debris to the semiconductor chip. SOLUTION: The film for producing semiconductor devices is used in producing the semiconductor devices and comprises a base layer, a first adhesive layer provided on the base layer, a radiation-curing type second adhesive layer provided on the first adhesive layer and cured by radiation irradiation in advance and an adhesive layer provided on the second adhesive layer. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种用于制造半导体器件的新颖膜，即使半导体晶片薄，也能够防止在半导体晶片切割期间保持功率的平衡优良的半导体芯片的污染，优良的剥离性当剥离通过与其粘合剂层切割而获得的半导体芯片时，并且低污染性而不将切屑残留在半导体芯片上。解决方案：用于制造半导体器件的膜用于制造半导体器件，并且包括基底层，设置在基底层上的第一粘合剂层，设置在第一粘合剂层上并固化的辐射固化型第二粘合剂层预先通过辐射照射和设置在第二粘合剂层上的粘合剂层。版权所有（C）2011，JPO＆INPIT

22. 发明专利

JP4460301B2 Correction tape was radiation curing 有权
公开(公告)号：JP4460301B2
公开(公告)日：2010-05-12
申请号：JP2003565731
申请日：2003-02-07
申请人：ビックコーポレイション
发明人：ピーターディーガブリエル , マイケルティーノウォック , クレッグジーブラッドリー , テレサビーホッパー
IPC分类号： B32B27/16 , B32B27/00 , B43L19/00 , C09J7/02
CPC分类号： C09J7/22 , C09J7/38 , C09J2433/00 , C09J2463/00 , C09J2463/006 , Y10T428/14 , Y10T428/1452 , Y10T428/1467 , Y10T428/1471 , Y10T428/1476 , Y10T428/28 , Y10T428/2809 , Y10T428/2848
摘要： A multilayer pressure sensitive correction tape useful for masking handwritten and/or printed characters comprising a release liner, a masking layer and a pressure sensitive adhesive layer, wherein at least one of the layers is cured by radiation. In a preferred embodiment of the invention, the masking layer and pressure sensitive adhesive layer comprise formulations of reactive monomers or oligomers which are radiation-cured after the formulations are applied to the correction tape assembly. In a more preferred embodiment of the invention the masking layer and pressure sensitive adhesive layer formulations contain no volatile solvents when these formulations are applied to the correction tape assembly. The radiation-cured layers are essentially insoluble in organic solvents and water, and the radiation-cured layers exhibit improved film toughness and improved resistance to ink "bleed through". Additionally, the present invention is directed to a process for making such a multilayer correction tape having at least one radiation cured layer.

23. 发明专利

JP2010514600A Multi-functional plastic sheet and a method of manufacturing the same 审中-公开
公开(公告)号：JP2010514600A
公开(公告)日：2010-05-06
申请号：JP2009544794
申请日：2008-01-03
申请人：インパカンパニーリミテッド
发明人：ソン、キュ−ハ
IPC分类号： B32B27/30 , B32B37/00 , B43L1/04 , C08J5/18 , G03B21/60
CPC分类号： B32B27/00 , B32B27/36 , B43L1/00 , B43L1/002 , Y10T428/24851 , Y10T428/265 , Y10T428/2809 , Y10T428/2848
摘要： Provided is a multifunctional plastic sheet that can be used not only as a writing board but also as a screen, and a manufacturing method thereof. The multifunctional plastic sheet includes a multifunctional plastic sheet, which includes a first plastic film coated with acrylate resin or treated with corona discharge; a bead-including UV coating layer formed on an upper side of the first plastic film; a second plastic film laminated with a bottom side of the first plastic film; and a permanent or removable adhesive layer formed at a bottom side of the second plastic film.

24. 发明专利

JP2010507711A Low molecular weight of the ethylene-based unsaturated compound radiation-curable mixture containing having a non-aromatic ring system 有权
公开(公告)号：JP2010507711A
公开(公告)日：2010-03-11
申请号：JP2009533878
申请日：2007-10-29
申请人：ビーエーエスエフソシエタス・ヨーロピアBasf Se
发明人：デュスターヴァルトウーヴェ , リヒトウルリケ , ヴルフディルク
IPC分类号： C08F2/44 , C08F20/10 , C08F265/06 , C09J4/02 , C09J7/00 , C09J133/06
CPC分类号： C08F290/06 , C08F265/04 , C08F265/06 , C08F290/061 , C08F299/02 , C08K5/3477 , C08L51/003 , C08L2666/02 , C09J7/385 , C09J133/08 , C09J151/003 , C09J2201/606 , C09J2433/00 , Y10T428/2809 , Y10T428/2852 , Y10T428/2891
摘要：Ａ）ラジカル重合可能な化合物を重合させることによって得られたポリマーおよびＢ）ラジカル重合可能なエチレン系不飽和基（略して重合性基）および５０００ｇ/ｍｏｌ未満の質量平均分子量Ｍ
w を有する化合物を含有する混合物において、化合物Ｂの少なくとも１０質量％が少なくとも１つの非芳香族環系を有する化合物Ｂ１であることを特徴とする、前記混合物。

25. 发明专利

JP2009035721A Substrate with joining film, joining method and joined product 审中-公开
标题翻译：带有接合膜的基板，接合方法和接合的产品
公开(公告)号：JP2009035721A
公开(公告)日：2009-02-19
申请号：JP2008133673
申请日：2008-05-21
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： MATSUO YASUHIDE , OTSUKA KENJI , HIGUCHI KAZUHISA , WAKAMATSU KOSUKE
IPC分类号： C09J7/02 , B41J2/16 , C09J5/02 , C09J183/04 , C09J183/05 , H01L21/02 , H01L27/12
CPC分类号： C09J5/06 , B29C59/14 , B29C65/02 , B29C65/1403 , B29C65/1406 , B29C65/1432 , B29C65/1435 , B29C65/1483 , B29C65/1496 , B29C65/16 , B29C65/1606 , B29C65/1616 , B29C65/1619 , B29C65/483 , B29C65/4835 , B29C65/4845 , B29C65/5021 , B29C65/5057 , B29C65/52 , B29C65/528 , B29C66/004 , B29C66/02 , B29C66/1122 , B29C66/30223 , B29C66/348 , B29C66/45 , B29C66/71 , B29C66/712 , B29C66/72321 , B29C66/72323 , B29C66/72325 , B29C66/7234 , B29C66/73111 , B29C66/73112 , B29C66/73113 , B29C66/73343 , B29C66/8322 , B29C66/83221 , B29C66/91411 , B29C66/9161 , B29C66/919 , B29C66/954 , B29C2035/0827 , B29K2009/06 , B29K2021/00 , B29K2021/003 , B29K2023/00 , B29K2023/06 , B29K2023/083 , B29K2023/086 , B29K2023/12 , B29K2025/00 , B29K2027/06 , B29K2027/08 , B29K2027/12 , B29K2027/16 , B29K2027/18 , B29K2033/12 , B29K2055/02 , B29K2059/00 , B29K2063/00 , B29K2067/00 , B29K2067/006 , B29K2069/00 , B29K2071/00 , B29K2071/12 , B29K2075/00 , B29K2077/00 , B29K2077/10 , B29K2079/08 , B29K2079/085 , B29K2081/06 , B29K2096/005 , B29K2105/0079 , B29K2105/0085 , B29K2105/0088 , B29K2995/0027 , B29L2009/00 , B29L2031/767 , B41J2/161 , B41J2/1623 , C08J7/123 , H01L21/187 , Y10T156/10 , Y10T428/265 , Y10T428/2809 , Y10T428/2817 , Y10T428/2826 , Y10T428/2848 , Y10T428/2852 , Y10T428/31663 , B29C65/00 , B29K2081/04 , B29K2075/02 , B29K2067/06 , B29K2067/04 , B29K2067/003 , B29K2061/04 , B29K2033/08 , B29K2029/04 , B29K2025/08 , B29K2025/06 , B29K2023/18 , B29K2023/16
摘要： PROBLEM TO BE SOLVED: To provide a substrate with a joining film which can be strongly and efficiently joined to an adherend in high dimensional accuracy, to provide a method for efficiently joining the joining film-having substrate to the adherend at low temperature, and to provide a joined product in which the joining film-having substrate and the adherend are strongly joined to each other in high dimensional accuracy and having high reliability. SOLUTION: This substrate with a joining film has a substrate 2 and a joining film 3 disposed on the substrate 2, and can be joined to a facing substrate 4 (other adherend). The joining film 3 is a film containing Si skeletons having random atom structures containing siloxane (Si-O) bonds, and releasing groups bonded to the Si skeletons, and the crystallinity of the Si skeletons is ≤45%. The joining films 3 is irradiated with UV rays to release the releasing groups from Si skeletons, whereby adhesiveness to the facing substrate 4 can be expressed to the surface 35 of the joining film 3. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有能够以高尺寸精度牢固且有效地接合到被粘物的接合膜的基板，以提供一种在低温下有效地将接合薄膜的基板与被粘物接合的方法并且提供其中接合膜的基底和被粘物以高尺寸精度牢固地彼此接合并具有高可靠性的接合产品。＆lt; P＆gt;解决方案：具有接合膜的基板具有基板2和设置在基板2上的接合膜3，并且可以与面对基板4（其他被粘物）接合。接合膜3是含有具有含有硅氧烷（Si-O）键的无规原子结构的Si骨架和与Si骨架结合的释放基团的膜，Si骨架的结晶度为≤45％以下。用紫外线照射接合膜3以从Si骨架释放释放基团，由此可以将粘合性表达到接合膜3的表面35.版权所有（C）2009，JPO＆INPIT

26. 发明专利

JP2009035719A Joined article and joining method 有权
标题翻译：加工文章和加工方法
公开(公告)号：JP2009035719A
公开(公告)日：2009-02-19
申请号：JP2008133671
申请日：2008-05-21
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： MATSUO YASUHIDE , OTSUKA KENJI , HIGUCHI KAZUHISA , WAKAMATSU KOSUKE
IPC分类号： C09J5/00 , C09J5/06 , C09J183/04 , C09J183/05
CPC分类号： C09J5/06 , B29C59/14 , B29C65/02 , B29C65/1403 , B29C65/1406 , B29C65/1432 , B29C65/1435 , B29C65/1483 , B29C65/1496 , B29C65/16 , B29C65/1606 , B29C65/1616 , B29C65/1619 , B29C65/483 , B29C65/4835 , B29C65/4845 , B29C65/5021 , B29C65/5057 , B29C65/52 , B29C65/528 , B29C66/004 , B29C66/02 , B29C66/1122 , B29C66/30223 , B29C66/348 , B29C66/45 , B29C66/71 , B29C66/712 , B29C66/72321 , B29C66/72323 , B29C66/72325 , B29C66/7234 , B29C66/73111 , B29C66/73112 , B29C66/73113 , B29C66/73343 , B29C66/8322 , B29C66/83221 , B29C66/91411 , B29C66/9161 , B29C66/919 , B29C66/954 , B29C2035/0827 , B29K2009/06 , B29K2021/00 , B29K2021/003 , B29K2023/00 , B29K2023/06 , B29K2023/083 , B29K2023/086 , B29K2023/12 , B29K2025/00 , B29K2027/06 , B29K2027/08 , B29K2027/12 , B29K2027/16 , B29K2027/18 , B29K2033/12 , B29K2055/02 , B29K2059/00 , B29K2063/00 , B29K2067/00 , B29K2067/006 , B29K2069/00 , B29K2071/00 , B29K2071/12 , B29K2075/00 , B29K2077/00 , B29K2077/10 , B29K2079/08 , B29K2079/085 , B29K2081/06 , B29K2096/005 , B29K2105/0079 , B29K2105/0085 , B29K2105/0088 , B29K2995/0027 , B29L2009/00 , B29L2031/767 , B41J2/161 , B41J2/1623 , C08J7/123 , H01L21/187 , Y10T156/10 , Y10T428/265 , Y10T428/2809 , Y10T428/2817 , Y10T428/2826 , Y10T428/2848 , Y10T428/2852 , Y10T428/31663 , B29C65/00 , B29K2081/04 , B29K2075/02 , B29K2067/06 , B29K2067/04 , B29K2067/003 , B29K2061/04 , B29K2033/08 , B29K2029/04 , B29K2025/08 , B29K2025/06 , B29K2023/18 , B29K2023/16
摘要： PROBLEM TO BE SOLVED: To provide a joined article which comprises two substrates strongly and efficiently joined to each other in high dimensional accuracy at low temperature and has high reliability, and to provide a method for joining two substrates, by which the two substrates can efficiently be joined to each other at low temperature. SOLUTION: This joined article 5 has two substrates 21, 22 and two joining films 31, 32 disposed between the substrates 21, 22, and is prepared by joining the two substrates 21, 22 through the two joining films 31, 32. The joining films 31, 32 in the joined article 5 contains a Si skeleton having a random atom structure containing siloxane (Si-O) bonds and releasing groups bonded to the Si skeleton. Energy is imparted to each of the joining films 31, 32 to express adhesiveness, whereby the two substrates 21, 22 are joined to each other. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种包括两个基板的接合制品，其在低温下以高尺寸精度牢固有效地接合并且具有高可靠性，并且提供了一种用于连接两个基板的方法，基板可以在低温下有效地彼此接合。
解决方案：该接合物5具有两个基板21,22和两个设置在基板21,22之间的接合膜31,32，并且通过两个接合膜31,32接合两个基板21,22而制备。接合体5中的接合薄膜31,32含有具有硅氧烷（Si-O）键的随机原子结构的硅骨架和与Si骨架结合的释放基团。赋予每个接合薄膜31,32以表示粘附性的能量，由此两个基板21,22彼此接合。版权所有（C）2009，JPO＆INPIT

27. 发明专利

JP2008231243A Adhesive sheet 有权
标题翻译：粘合片
公开(公告)号：JP2008231243A
公开(公告)日：2008-10-02
申请号：JP2007072510
申请日：2007-03-20
申请人： Lintec Corp , リンテック株式会社
发明人： KANO KEIKO , MAEDA ATSUSHI , ITO MASAHARU
IPC分类号： C09J7/02 , C09J133/00 , C09J175/16
CPC分类号： B32B27/30 , B32B27/40 , C08G18/44 , C08G18/4825 , C08G18/4854 , C08G18/672 , C08G18/73 , C08G18/755 , C08G18/765 , C08L33/08 , C08L33/14 , C09D133/08 , C09D133/14 , C09J7/385 , C09J175/16 , C09J2205/31 , C09J2433/00 , C09J2475/00 , Y10T428/2809 , C08G18/48 , C08L2666/04
摘要： PROBLEM TO BE SOLVED: To realize an adhesive sheet having an excellent adhesive force, unevenness followability to a wafer circuit surface, etc., preventing the penetration of grinding water into a wafer circuit surface in grinding and free from the troubles of the generation of an adhesive residue. SOLUTION: The adhesive sheet comprises a substrate and an energy ray-curable adhesive layer formed on the surface of the substrate. The energy ray-curable adhesive layer contains an energy ray-curable acrylic copolymer and an energy ray-curable urethane acrylate. The energy ray-curable urethane acrylate is produced by using isocyanates such as IPDI, TMDI and TMXDI and has excellent compatibility to the energy ray-curable acrylic copolymer. Consequently, the adhesive sheet can surely prevent the penetration of grinding water in the grinding process of a wafer and the generation of adhesive residue in the peeling step from the wafer, etc. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了实现具有优异的粘合力，对晶片电路表面等的不均匀性的粘合片，防止研磨水在研磨中渗透到晶片电路表面中，并且不会发生产生粘合剂残留物。解决方案：粘合片包括基材和形成在基材表面上的能量射线固化粘合剂层。能量射线固化性粘合剂层含有能量射线固化型丙烯酸共聚物和能量射线固化型聚氨酯丙烯酸酯。能量射线固化性聚氨酯丙烯酸酯是通过使用异氰酸酯如IPDI，TMDI和TMXDI制备的，并且与能量射线固化性丙烯酸共聚物具有优异的相容性。因此，粘合片可以可靠地防止研磨水在晶片的研磨过程中的渗透以及在晶片的剥离步骤中产生粘合残留物等。版权所有（C）2009，JPO＆INPIT

28. 发明专利

JP4112620B2 Pressure sensitive adhesives for use in low temperature conditions 失效
公开(公告)号：JP4112620B2
公开(公告)日：2008-07-02
申请号：JP53014697
申请日：1997-01-16
申请人：スリーエムカンパニー
发明人：ウィルソン，ケネス，ディー． , エバラーツ，アルバート，アイ． , ギャリック，スティーブン，ジェイ． , ピーコック，ケネス
IPC分类号： C09J7/02 , C09J133/06 , C09J133/08
CPC分类号： C09J133/08 , C08L2666/02 , C09J2201/606 , Y10T428/28 , Y10T428/2809 , Y10T428/2852 , Y10T428/2891 , Y10T442/2738 , Y10T442/2754
摘要： Acrylate copolymer pressure sensitive adhesives (PSAs) which incorporate relatively small amounts of a plasticizer are disclosed. The resulting PSAs exhibit improved low temperature performance and minimal effect on other properties, when used as adhesives for graphic marking films. The adhesive system has been found to allow the graphic marking film to be applied at temperatures as low as 20 DEG F. (-7 DEG C.) and to improve the ability of the film to be applied to a substrate without trapping air between the marking film and the substrate. The adhesive system of the marking film also demonstrates resistance to tenting around the compound curved surfaces of rivet heads and corrugations typical of truck trailer sides.

29. 发明专利

JP2008522016A Apparatus comprising a low outgassing property of the light or electron beam curable rubbery polymer 审中-公开
公开(公告)号：JP2008522016A
公开(公告)日：2008-06-26
申请号：JP2007544516
申请日：2005-11-29
申请人：コーニングインコーポレイテッド
发明人：エルコイケンダル，ケルシー , シーサウアー，デイヴィッド , サビア，ロバート , ジェイシュスタック，ポール , ケーソニ，カメル , ジーデワ，ポール
IPC分类号： C09J4/00 , C08F255/02 , C08F279/02 , C08K3/00 , C08K5/00 , C09J4/02 , C09J121/00 , C09J123/16 , C09J123/26 , C09K3/10
CPC分类号： C08L15/00 , C08C19/02 , C08F255/00 , C08F255/02 , C08F279/02 , C08F290/06 , C08K3/013 , C08K5/0025 , C08L2666/02 , C09J4/06 , C09J123/02 , Y10T428/1059 , Y10T428/1082 , Y10T428/28 , Y10T428/2809 , Y10T428/2852 , Y10T428/287 , Y10T428/2878 , Y10T428/2883 , Y10T428/2891 , Y10T428/31855 , Y10T428/31938
摘要：光または電子ビーム硬化性重合性組成物、およびその調製並びにそのような硬化材料を含有する装置が開示されている。この組成物は、光または電子ビーム硬化性末端基または側基を含有する、炭素−炭素二重結合および三重結合を完全に含まないまたは実質的に含まない、完全にまたは実質的に完全に水素化された炭化水素系材料、低アウトガス性光開始剤、随意的な粘度調節成分および随意的な充填剤を含有する。この組成物は、可視光、紫外線または電子ビーム硬化性である。この組成物は、低モジュラスの低アウトガス性ポリマー材料に硬化する。この組成物は、接着剤、シーラントまたはレンズポッティング材料として使用できる。この組成物は、深紫外線または真空紫外線を伴うリソグラフィー器具および他の光学装置に、特に、２４８ｎｍ，１９３ｎｍおよび１５７ｎｍリソグラフィー器具のためのレンズポッティング材料として、並びに高フルエンス照射の使用を伴う他の光学装置に使用するのに理想的である。

30. 发明专利

JP2008050406A Adhesive sheet for processing use 有权
标题翻译：胶粘剂加工用途
公开(公告)号：JP2008050406A
公开(公告)日：2008-03-06
申请号：JP2006225540
申请日：2006-08-22
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： SHINTANI TOSHIAKI , ASAI FUMITERU , YAMAMOTO KAZUHIKO
IPC分类号： C09J7/02 , C09D5/00 , C09D133/00 , C09J4/02 , C09J11/02
CPC分类号： H01L21/6836 , C08K5/0008 , C08L2312/06 , C09D133/08 , C09J7/50 , C09J2203/326 , C09J2427/006 , C09J2433/001 , H01L2221/68327 , Y10T428/2809
摘要： PROBLEM TO BE SOLVED: To provide an adhesive sheet for processing use, excellent in tackiness, releasability and expandability. SOLUTION: The adhesive sheet for processing use is essentially composed of a substrate and an adhesive layer, wherein the adhesive layer contains a radiation-polymerizable compound, and there is an intermediate layer based on an acrylic polymer 20°C or higher in glass transition temperature in between the substrate and the adhesive layer. COPYRIGHT: (C)2008,JPO&INPIT

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