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1. 发明专利

JP2009173949A Base material with junction film, method of joining, and junction structure 审中-公开
标题翻译：具有连接膜的基材，接合方法和结构结构
公开(公告)号：JP2009173949A
公开(公告)日：2009-08-06
申请号：JP2009116003
申请日：2009-05-12
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： MATSUO YASUHIDE , OTSUKA KENJI , HIGUCHI KAZUHISA , WAKAMATSU KOSUKE
IPC分类号： C09J7/02 , C09J5/00 , C09J183/04 , C09J183/05
CPC分类号： C09J5/06 , B29C59/14 , B29C65/02 , B29C65/1403 , B29C65/1406 , B29C65/1432 , B29C65/1435 , B29C65/1483 , B29C65/1496 , B29C65/16 , B29C65/1606 , B29C65/1616 , B29C65/1619 , B29C65/483 , B29C65/4835 , B29C65/4845 , B29C65/5021 , B29C65/5057 , B29C65/52 , B29C65/528 , B29C66/004 , B29C66/02 , B29C66/1122 , B29C66/30223 , B29C66/348 , B29C66/45 , B29C66/71 , B29C66/712 , B29C66/72321 , B29C66/72323 , B29C66/72325 , B29C66/7234 , B29C66/73111 , B29C66/73112 , B29C66/73113 , B29C66/73343 , B29C66/8322 , B29C66/83221 , B29C66/91411 , B29C66/9161 , B29C66/919 , B29C66/954 , B29C2035/0827 , B29K2009/06 , B29K2021/00 , B29K2021/003 , B29K2023/00 , B29K2023/06 , B29K2023/083 , B29K2023/086 , B29K2023/12 , B29K2025/00 , B29K2027/06 , B29K2027/08 , B29K2027/12 , B29K2027/16 , B29K2027/18 , B29K2033/12 , B29K2055/02 , B29K2059/00 , B29K2063/00 , B29K2067/00 , B29K2067/006 , B29K2069/00 , B29K2071/00 , B29K2071/12 , B29K2075/00 , B29K2077/00 , B29K2077/10 , B29K2079/08 , B29K2079/085 , B29K2081/06 , B29K2096/005 , B29K2105/0079 , B29K2105/0085 , B29K2105/0088 , B29K2995/0027 , B29L2009/00 , B29L2031/767 , B41J2/161 , B41J2/1623 , C08J7/123 , H01L21/187 , Y10T156/10 , Y10T428/265 , Y10T428/2809 , Y10T428/2817 , Y10T428/2826 , Y10T428/2848 , Y10T428/2852 , Y10T428/31663 , B29C65/00 , B29K2081/04 , B29K2075/02 , B29K2067/06 , B29K2067/04 , B29K2067/003 , B29K2061/04 , B29K2033/08 , B29K2029/04 , B29K2025/08 , B29K2025/06 , B29K2023/18 , B29K2023/16
摘要： PROBLEM TO BE SOLVED: To provide a base material with a junction film which can be strongly and efficiently joined to an adherend with high dimensional accuracy at a low temperature, to provide a method for efficiently joining the base material with the junction film to an adherend at a low temperature, and to provide a junction structure having high reliability comprising the above base material with the junction film and an adherend strongly joined to each other with high dimensional accuracy. SOLUTION: The base material with a junction film comprises a substrate 2 (base material) and, superimposed on the substrate 2, a junction film 3 so as to be joinable with an opposite base sheet 4 (another adherend). This junction film 3 is formed by a plasma polymerization method and contains an Si skeleton of random atomic arrangement having a siloxane (Si-O) bond, and a leaving group bonded to the Si skeleton. The junction film 3 enables the leaving group to leave from the Si skeleton when irradiated with UV rays, which develops adherence to the opposite base sheet 4 on the surface 35 of the junction film 3. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有能够在低温下以高尺寸精度牢固且有效地接合到被粘物的接合膜的基材，以提供一种有效地将基材与接合膜接合的方法并且提供具有高可靠性的高结构的接合结构，其中包括具有接合膜的上述基底材料和被粘附体以高尺寸精度彼此强烈地接合。解决方案：具有接合膜的基材包括基板2（基材），并且在基板2上叠加接合膜3，以便与相对的基板4（另一个被粘物）连接。该接合膜3通过等离子体聚合法形成，并且包含具有硅氧烷（Si-O）键的随机原子排列的Si骨架和与Si骨架结合的离去基团。接合膜3使离子基团能够在用紫外线照射时从Si骨架离开，这会在接合膜3的表面35上形成与相对的基片4的粘附。版权所有（C）2009，JPO＆INPIT

2. 发明专利

JP2009035720A Substrate with joining film, joining method and joined product 审中-公开
标题翻译：带有接合膜的基板，接合方法和接合的产品
公开(公告)号：JP2009035720A
公开(公告)日：2009-02-19
申请号：JP2008133672
申请日：2008-05-21
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： MATSUO YASUHIDE , OTSUKA KENJI , HIGUCHI KAZUHISA , WAKAMATSU KOSUKE
IPC分类号： C09J7/02 , C09J183/04 , C09J183/05 , C09J183/08
CPC分类号： C09J5/06 , B29C59/14 , B29C65/02 , B29C65/1403 , B29C65/1406 , B29C65/1432 , B29C65/1435 , B29C65/1483 , B29C65/1496 , B29C65/16 , B29C65/1606 , B29C65/1616 , B29C65/1619 , B29C65/483 , B29C65/4835 , B29C65/4845 , B29C65/5021 , B29C65/5057 , B29C65/52 , B29C65/528 , B29C66/004 , B29C66/02 , B29C66/1122 , B29C66/30223 , B29C66/348 , B29C66/45 , B29C66/71 , B29C66/712 , B29C66/72321 , B29C66/72323 , B29C66/72325 , B29C66/7234 , B29C66/73111 , B29C66/73112 , B29C66/73113 , B29C66/73343 , B29C66/8322 , B29C66/83221 , B29C66/91411 , B29C66/9161 , B29C66/919 , B29C66/954 , B29C2035/0827 , B29K2009/06 , B29K2021/00 , B29K2021/003 , B29K2023/00 , B29K2023/06 , B29K2023/083 , B29K2023/086 , B29K2023/12 , B29K2025/00 , B29K2027/06 , B29K2027/08 , B29K2027/12 , B29K2027/16 , B29K2027/18 , B29K2033/12 , B29K2055/02 , B29K2059/00 , B29K2063/00 , B29K2067/00 , B29K2067/006 , B29K2069/00 , B29K2071/00 , B29K2071/12 , B29K2075/00 , B29K2077/00 , B29K2077/10 , B29K2079/08 , B29K2079/085 , B29K2081/06 , B29K2096/005 , B29K2105/0079 , B29K2105/0085 , B29K2105/0088 , B29K2995/0027 , B29L2009/00 , B29L2031/767 , B41J2/161 , B41J2/1623 , C08J7/123 , H01L21/187 , Y10T156/10 , Y10T428/265 , Y10T428/2809 , Y10T428/2817 , Y10T428/2826 , Y10T428/2848 , Y10T428/2852 , Y10T428/31663 , B29C65/00 , B29K2081/04 , B29K2075/02 , B29K2067/06 , B29K2067/04 , B29K2067/003 , B29K2061/04 , B29K2033/08 , B29K2029/04 , B29K2025/08 , B29K2025/06 , B29K2023/18 , B29K2023/16
摘要： PROBLEM TO BE SOLVED: To provide a substrate with a joining film which can be strongly and efficiently joined to an adherend in high dimensional accuracy, to provide a method for efficiently joining the joining film-having substrate to the adherend at low temperature, and to provide a joined product in which the joining film-having substrate and the adherend are strongly joined to each other in high dimensional accuracy and having high reliability. SOLUTION: This substrate with a joining film has a substrate 2 and a joining film 3 disposed on the substrate 2, and can be joined to a facing substrate 4 (other adherend). The joining film 3 is formed by a plasma polymerization method, and is a film containing Si skeletons having random atom structures containing siloxane (Si-O) bonds, and releasing groups bonded to the Si skeletons. The joining films 3 is irradiated with UV rays to release the releasing groups from Si skeletons, whereby adhesiveness to the facing substrate 4 can be expressed to the surface 35 of the joining film 3. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有能够以高尺寸精度牢固且有效地接合到被粘物的接合膜的基板，以提供一种在低温下有效地将接合薄膜的基板与被粘物接合的方法并且提供其中接合膜的基底和被粘物以高尺寸精度牢固地彼此接合并具有高可靠性的接合产品。＆lt; P＆gt;解决方案：具有接合膜的基板具有基板2和设置在基板2上的接合膜3，并且可以与面对基板4（其他被粘物）接合。接合薄膜3通过等离子体聚合方法形成，并且是含有具有硅氧烷（Si-O）键的无规原子结构的硅骨架和与Si骨架结合的释放基团的薄膜。用紫外线照射接合膜3以从Si骨架释放释放基团，由此可以将粘合性表达到接合膜3的表面35.版权所有（C）2009，JPO＆INPIT

3. 发明专利

JP2010250276A Optical article and method for manufacturing the optical article 审中-公开
标题翻译：光学文章和制造光学文章的方法
公开(公告)号：JP2010250276A
公开(公告)日：2010-11-04
申请号：JP2010010706
申请日：2010-01-21
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： TAKESHITA AKIKO , KOBAYASHI SHUHO
IPC分类号： G02B5/30 , G02B5/04 , G03B21/14
CPC分类号： G02B27/286 , B29C59/14 , B29C65/483 , B29C65/5057 , B29C65/52 , B29C65/528 , B29C66/02 , B29C66/026 , B29C66/45 , B29C66/723 , B29K2069/00 , B29K2995/0026 , B29K2995/0029 , B29K2995/0034 , B29L2009/00 , B29L2011/00 , G03B21/2073 , Y10T156/10 , B29C65/00
摘要： PROBLEM TO BE SOLVED: To provide an optical article for improving its productivity, and to provide a method for manufacturing the optical article. SOLUTION: In this optical article, a polarizing separation film 13 constituted by laminating high refractive layers and low refractive layers alternately and forming the uppermost surface layer as the high refractive layer is formed in a first light transmissive member 11, and a joint layer 16 is provided between the polarizing separation film 13 and a second light transmissive member 12 and is formed by a plasma polymeric film having the same refractive index as that of the low refractive layer. Consequently, a layer composed of the polarizing separation film 13 and the joint layer 16 has the same film configuration as that of a conventional polarizing separation film, so that optical characteristics of the polarizing separation film 13 is not deteriorated. In addition, since the low refractive layer being the uppermost surface layer in the conventional film configuration is replaced with the joint layer 16 in this optical article, a process for forming the low refractive layer constituting the uppermost surface layer can be eliminated when forming the polarizing separation film and a reflective film in this manufacturing method. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于提高其生产率的光学制品，并提供一种制造该光学制品的方法。解决方案：在这种光学制品中，在第一透光构件11中形成由交替地层叠高折射层和低折射层而形成最上表面层作为高折射层的偏振分离膜13，层16设置在偏振分离膜13和第二透光构件12之间，并且由具有与低折射层相同的折射率的等离子体聚合物膜形成。因此，由偏光分离膜13和接合层16构成的层具有与以往的偏光分离膜相同的膜构造，使得偏振分离膜13的光学特性不劣化。此外，由于在该光学制品中用作为接合层16的以往的膜构造中的最上表面层的低折射率层被代替，所以当形成极化时可以消除构成最上表面层的低折射层的形成工艺分离膜和反射膜。版权所有（C）2011，JPO＆INPIT

4. 发明专利

JP2009035721A Substrate with joining film, joining method and joined product 审中-公开
标题翻译：带有接合膜的基板，接合方法和接合的产品
公开(公告)号：JP2009035721A
公开(公告)日：2009-02-19
申请号：JP2008133673
申请日：2008-05-21
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： MATSUO YASUHIDE , OTSUKA KENJI , HIGUCHI KAZUHISA , WAKAMATSU KOSUKE
IPC分类号： C09J7/02 , B41J2/16 , C09J5/02 , C09J183/04 , C09J183/05 , H01L21/02 , H01L27/12
CPC分类号： C09J5/06 , B29C59/14 , B29C65/02 , B29C65/1403 , B29C65/1406 , B29C65/1432 , B29C65/1435 , B29C65/1483 , B29C65/1496 , B29C65/16 , B29C65/1606 , B29C65/1616 , B29C65/1619 , B29C65/483 , B29C65/4835 , B29C65/4845 , B29C65/5021 , B29C65/5057 , B29C65/52 , B29C65/528 , B29C66/004 , B29C66/02 , B29C66/1122 , B29C66/30223 , B29C66/348 , B29C66/45 , B29C66/71 , B29C66/712 , B29C66/72321 , B29C66/72323 , B29C66/72325 , B29C66/7234 , B29C66/73111 , B29C66/73112 , B29C66/73113 , B29C66/73343 , B29C66/8322 , B29C66/83221 , B29C66/91411 , B29C66/9161 , B29C66/919 , B29C66/954 , B29C2035/0827 , B29K2009/06 , B29K2021/00 , B29K2021/003 , B29K2023/00 , B29K2023/06 , B29K2023/083 , B29K2023/086 , B29K2023/12 , B29K2025/00 , B29K2027/06 , B29K2027/08 , B29K2027/12 , B29K2027/16 , B29K2027/18 , B29K2033/12 , B29K2055/02 , B29K2059/00 , B29K2063/00 , B29K2067/00 , B29K2067/006 , B29K2069/00 , B29K2071/00 , B29K2071/12 , B29K2075/00 , B29K2077/00 , B29K2077/10 , B29K2079/08 , B29K2079/085 , B29K2081/06 , B29K2096/005 , B29K2105/0079 , B29K2105/0085 , B29K2105/0088 , B29K2995/0027 , B29L2009/00 , B29L2031/767 , B41J2/161 , B41J2/1623 , C08J7/123 , H01L21/187 , Y10T156/10 , Y10T428/265 , Y10T428/2809 , Y10T428/2817 , Y10T428/2826 , Y10T428/2848 , Y10T428/2852 , Y10T428/31663 , B29C65/00 , B29K2081/04 , B29K2075/02 , B29K2067/06 , B29K2067/04 , B29K2067/003 , B29K2061/04 , B29K2033/08 , B29K2029/04 , B29K2025/08 , B29K2025/06 , B29K2023/18 , B29K2023/16
摘要： PROBLEM TO BE SOLVED: To provide a substrate with a joining film which can be strongly and efficiently joined to an adherend in high dimensional accuracy, to provide a method for efficiently joining the joining film-having substrate to the adherend at low temperature, and to provide a joined product in which the joining film-having substrate and the adherend are strongly joined to each other in high dimensional accuracy and having high reliability. SOLUTION: This substrate with a joining film has a substrate 2 and a joining film 3 disposed on the substrate 2, and can be joined to a facing substrate 4 (other adherend). The joining film 3 is a film containing Si skeletons having random atom structures containing siloxane (Si-O) bonds, and releasing groups bonded to the Si skeletons, and the crystallinity of the Si skeletons is ≤45%. The joining films 3 is irradiated with UV rays to release the releasing groups from Si skeletons, whereby adhesiveness to the facing substrate 4 can be expressed to the surface 35 of the joining film 3. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有能够以高尺寸精度牢固且有效地接合到被粘物的接合膜的基板，以提供一种在低温下有效地将接合薄膜的基板与被粘物接合的方法并且提供其中接合膜的基底和被粘物以高尺寸精度牢固地彼此接合并具有高可靠性的接合产品。＆lt; P＆gt;解决方案：具有接合膜的基板具有基板2和设置在基板2上的接合膜3，并且可以与面对基板4（其他被粘物）接合。接合膜3是含有具有含有硅氧烷（Si-O）键的无规原子结构的Si骨架和与Si骨架结合的释放基团的膜，Si骨架的结晶度为≤45％以下。用紫外线照射接合膜3以从Si骨架释放释放基团，由此可以将粘合性表达到接合膜3的表面35.版权所有（C）2009，JPO＆INPIT

5. 发明专利

JP2009035719A Joined article and joining method 有权
标题翻译：加工文章和加工方法
公开(公告)号：JP2009035719A
公开(公告)日：2009-02-19
申请号：JP2008133671
申请日：2008-05-21
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： MATSUO YASUHIDE , OTSUKA KENJI , HIGUCHI KAZUHISA , WAKAMATSU KOSUKE
IPC分类号： C09J5/00 , C09J5/06 , C09J183/04 , C09J183/05
CPC分类号： C09J5/06 , B29C59/14 , B29C65/02 , B29C65/1403 , B29C65/1406 , B29C65/1432 , B29C65/1435 , B29C65/1483 , B29C65/1496 , B29C65/16 , B29C65/1606 , B29C65/1616 , B29C65/1619 , B29C65/483 , B29C65/4835 , B29C65/4845 , B29C65/5021 , B29C65/5057 , B29C65/52 , B29C65/528 , B29C66/004 , B29C66/02 , B29C66/1122 , B29C66/30223 , B29C66/348 , B29C66/45 , B29C66/71 , B29C66/712 , B29C66/72321 , B29C66/72323 , B29C66/72325 , B29C66/7234 , B29C66/73111 , B29C66/73112 , B29C66/73113 , B29C66/73343 , B29C66/8322 , B29C66/83221 , B29C66/91411 , B29C66/9161 , B29C66/919 , B29C66/954 , B29C2035/0827 , B29K2009/06 , B29K2021/00 , B29K2021/003 , B29K2023/00 , B29K2023/06 , B29K2023/083 , B29K2023/086 , B29K2023/12 , B29K2025/00 , B29K2027/06 , B29K2027/08 , B29K2027/12 , B29K2027/16 , B29K2027/18 , B29K2033/12 , B29K2055/02 , B29K2059/00 , B29K2063/00 , B29K2067/00 , B29K2067/006 , B29K2069/00 , B29K2071/00 , B29K2071/12 , B29K2075/00 , B29K2077/00 , B29K2077/10 , B29K2079/08 , B29K2079/085 , B29K2081/06 , B29K2096/005 , B29K2105/0079 , B29K2105/0085 , B29K2105/0088 , B29K2995/0027 , B29L2009/00 , B29L2031/767 , B41J2/161 , B41J2/1623 , C08J7/123 , H01L21/187 , Y10T156/10 , Y10T428/265 , Y10T428/2809 , Y10T428/2817 , Y10T428/2826 , Y10T428/2848 , Y10T428/2852 , Y10T428/31663 , B29C65/00 , B29K2081/04 , B29K2075/02 , B29K2067/06 , B29K2067/04 , B29K2067/003 , B29K2061/04 , B29K2033/08 , B29K2029/04 , B29K2025/08 , B29K2025/06 , B29K2023/18 , B29K2023/16
摘要： PROBLEM TO BE SOLVED: To provide a joined article which comprises two substrates strongly and efficiently joined to each other in high dimensional accuracy at low temperature and has high reliability, and to provide a method for joining two substrates, by which the two substrates can efficiently be joined to each other at low temperature. SOLUTION: This joined article 5 has two substrates 21, 22 and two joining films 31, 32 disposed between the substrates 21, 22, and is prepared by joining the two substrates 21, 22 through the two joining films 31, 32. The joining films 31, 32 in the joined article 5 contains a Si skeleton having a random atom structure containing siloxane (Si-O) bonds and releasing groups bonded to the Si skeleton. Energy is imparted to each of the joining films 31, 32 to express adhesiveness, whereby the two substrates 21, 22 are joined to each other. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种包括两个基板的接合制品，其在低温下以高尺寸精度牢固有效地接合并且具有高可靠性，并且提供了一种用于连接两个基板的方法，基板可以在低温下有效地彼此接合。
解决方案：该接合物5具有两个基板21,22和两个设置在基板21,22之间的接合膜31,32，并且通过两个接合膜31,32接合两个基板21,22而制备。接合体5中的接合薄膜31,32含有具有硅氧烷（Si-O）键的随机原子结构的硅骨架和与Si骨架结合的释放基团。赋予每个接合薄膜31,32以表示粘附性的能量，由此两个基板21,22彼此接合。版权所有（C）2009，JPO＆INPIT

6. 发明专利

JP2011074395A Bonding method, bonded body, liquid droplet jetting head and liquid droplet jetting apparatus 审中-公开
标题翻译：粘结方法，粘结体，液体喷射头和液滴喷射装置
公开(公告)号：JP2011074395A
公开(公告)日：2011-04-14
申请号：JP2010282279
申请日：2010-12-17
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： MATSUO YASUHIDE
IPC分类号： C09J5/02 , B29C65/14 , B41J2/16 , C09J183/04 , C09J183/05
CPC分类号： B41J2/161 , B05D1/62 , B05D3/065 , B05D3/142 , B29C59/14 , B29C65/02 , B29C65/1403 , B29C65/1406 , B29C65/1432 , B29C65/1483 , B29C65/1496 , B29C65/16 , B29C65/483 , B29C65/5021 , B29C65/5057 , B29C65/528 , B29C66/026 , B29C66/0322 , B29C66/034 , B29C66/1122 , B29C66/21 , B29C66/45 , B29C66/53461 , B29C66/54 , B29C66/71 , B29C66/73111 , B29C66/73112 , B29C66/73343 , B29C66/73365 , B29C66/8322 , B29C66/83221 , B29C66/91411 , B29C66/9161 , B29C66/919 , B29C66/9241 , B29C66/929 , B29C66/949 , B29C66/954 , B29C2035/0827 , B29C2035/0838 , B29C2035/0877 , B29K2023/12 , B29K2067/00 , B29K2077/00 , B29K2077/10 , B29K2081/04 , B29K2081/06 , B29L2031/767 , B41J2/14233 , B41J2/1433 , B41J2/1623 , B41J2002/14362 , C03C27/00 , C08J5/12 , C09J5/00 , C09J5/02 , Y10T428/24826 , B29C65/00 , B29K2069/00 , B29K2067/003 , B29K2033/12 , B29K2023/38
摘要： PROBLEM TO BE SOLVED: To provide a bonding method which bonds two members firmly with high dimensional-accuracy selectively in a part of region of a bonding surface, a bonded body which is obtained by bonding the two members firmly with high dimensional-accuracy selectively in a part of region of the bonding surface, a liquid droplet jetting head which is provided with the bonded body and has high reliability, and a liquid droplet jetting apparatus which is equipped with the liquid droplet jetting head. SOLUTION: The bonding method includes the processes of: forming plasma-polymerized films 301 and 302 on surfaces of two base materials 21 and 22, respectively; activating the surfaces by selectively irradiating ultraviolet rays to prescribed regions 311 and 312 of a part of the surfaces of each of plasma-polymerized films 301 and 302; and obtaining the bonded body by pasting the two base materials 21 and 22 together so as to stick the activated surfaces firmly and by bonding the two base materials 21 and 22 partially at a portion where the prescribed region 311 and the prescribed region 312 are overlapped, that is, at a bonding portion 313. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种在接合表面的一部分区域中选择性地以高尺寸精度牢固地结合两个构件的接合方法，通过将两个构件牢固地粘接在一起，选择性地在接合表面的一部分区域中的精度，设置有接合体并具有高可靠性的液滴喷射头，以及配备有液滴喷射头的液滴喷射装置。解决方案：接合方法包括分别在两个基材21和22的表面上形成等离子体聚合膜301和302的方法; 通过选择性地将紫外线照射到每个等离子体聚合膜301和302的一部分表面的规定区域311和312上来激活表面; 并且通过将两个基材21和22粘贴在一起以使得活化表面牢固地粘附并且通过将两个基材21和22部分地接合在规定区域311和规定区域312重叠的部分处来获得粘合体，也就是说，在粘结部分313。版权所有（C）2011，JPO＆INPIT

7. 发明专利

JP2010095595A Bonding method and bonded body 审中-公开
标题翻译：结合方法和结合体
公开(公告)号：JP2010095595A
公开(公告)日：2010-04-30
申请号：JP2008266673
申请日：2008-10-15
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： NAITO NOBUHIRO , SATO MITSURU , YAMAMOTO TAKATOMO , IMAMURA MINEHIRO
IPC分类号： C09J183/04 , B41J2/045 , B41J2/055 , B41J2/16 , C09J5/02 , C09J5/06 , C09J183/06
CPC分类号： B32B7/12 , B29C35/02 , B29C35/0805 , B29C35/0866 , B29C59/14 , B29C65/14 , B29C65/1403 , B29C65/1406 , B29C65/482 , B29C65/4835 , B29C65/521 , B29C65/523 , B29C65/526 , B29C65/528 , B29C66/1122 , B29C66/45 , B29C66/71 , B29C66/731 , B29C66/73111 , B29C66/73112 , B29C66/7352 , B29C66/73921 , B29C66/73941 , B29C66/91411 , B29C66/919 , B29C66/9241 , B29C66/929 , B29C66/954 , B29C2035/0827 , B29C2035/0877 , B29K2021/00 , B29K2023/00 , B29K2023/06 , B29K2023/083 , B29K2023/086 , B29K2023/12 , B29K2025/00 , B29K2027/06 , B29K2027/08 , B29K2027/12 , B29K2027/16 , B29K2027/18 , B29K2033/04 , B29K2033/08 , B29K2033/12 , B29K2055/02 , B29K2059/00 , B29K2063/00 , B29K2067/00 , B29K2067/006 , B29K2067/06 , B29K2069/00 , B29K2071/00 , B29K2071/12 , B29K2075/00 , B29K2077/00 , B29K2077/10 , B29K2079/08 , B29K2079/085 , B29K2081/06 , B29K2083/00 , B29K2096/005 , B29K2105/0088 , B29K2995/0082 , B29L2031/767 , B32B9/04 , B32B15/04 , B32B15/18 , B32B15/20 , B32B17/06 , B32B27/06 , B32B27/36 , B41J2/14233 , B41J2/161 , B41J2/1623 , C03C23/006 , C03C27/10 , C09J5/06 , C09J183/04 , Y10T428/265 , B29K2081/04 , B29K2067/003 , B29K2031/04 , B29K2029/04 , B29K2025/06 , B29K2023/38 , B29K2023/18 , B29K2023/16 , B29K2021/006 , B29K2009/06
摘要： PROBLEM TO BE SOLVED: To provide a bonding method allowing a bonding film disposed so as to bond two base members to each other to exhibit excellent solvent resistance, and to provide a bonded body with excellent solvent resistance bonded by the bonding method. SOLUTION: The bonding method includes the steps of: preparing the first base member 21 and the second base member 22 to be bonded to each other with a bonding film interposed therebetween; supplying a liquid material containing silicone materials to at least one of the first base member 21 and the second base member 22 so as to form a liquid film; drying the liquid film so as to obtain a bonding film 3 on the at least one of the first base member 21 and the second base member 22; heating the bonding film 3 so as to cross-link the silicone materials contained in the bonding film 3 to each other; and applying energy to the bonding film 3 so as to develop adhesiveness around a surface 32 of the bonding film 3 so as to obtain a bonded body 1 in which the first base member 21 and the second base member 22 are bonded to each other with the bonding film 3 interposed therebetween. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种接合方法，其允许将两个基底构件彼此粘合而设置的接合膜显示出优异的耐溶剂性，并且通过接合方法提供具有优异的耐溶剂性的接合体。解决方案：接合方法包括以下步骤：通过介于它们之间的接合膜来制备待接合的第一基底构件21和第二基底构件22; 将含有硅酮材料的液体材料供给到第一基材21和第二基材22中的至少一个，以形成液膜; 干燥所述液膜，以在所述第一基底构件21和所述第二基底构件22中的至少一个上获得接合膜3; 加热接合膜3以使包含在接合膜3中的硅氧烷材料彼此交联; 并向接合薄膜3施加能量，以便在接合薄膜3的表面32周围产生粘附性，从而获得其中第一基底部件21和第二基底部件22彼此接合的接合体1 接合膜3。版权所有（C）2010，JPO＆INPIT

8. 发明专利

JP2009173950A Base material with junction film, method of joining, and junction structure 审中-公开
标题翻译：具有连接膜的基材，接合方法和结构结构
公开(公告)号：JP2009173950A
公开(公告)日：2009-08-06
申请号：JP2009116004
申请日：2009-05-12
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： MATSUO YASUHIDE , OTSUKA KENJI , HIGUCHI KAZUHISA , WAKAMATSU KOSUKE
IPC分类号： C09J183/04 , B29C65/52 , B32B27/00 , C09J5/00 , C09J5/02 , C09J183/05 , C09J183/08
CPC分类号： C09J5/06 , B29C59/14 , B29C65/02 , B29C65/1403 , B29C65/1406 , B29C65/1432 , B29C65/1435 , B29C65/1483 , B29C65/1496 , B29C65/16 , B29C65/1606 , B29C65/1616 , B29C65/1619 , B29C65/483 , B29C65/4835 , B29C65/4845 , B29C65/5021 , B29C65/5057 , B29C65/52 , B29C65/528 , B29C66/004 , B29C66/02 , B29C66/1122 , B29C66/30223 , B29C66/348 , B29C66/45 , B29C66/71 , B29C66/712 , B29C66/72321 , B29C66/72323 , B29C66/72325 , B29C66/7234 , B29C66/73111 , B29C66/73112 , B29C66/73113 , B29C66/73343 , B29C66/8322 , B29C66/83221 , B29C66/91411 , B29C66/9161 , B29C66/919 , B29C66/954 , B29C2035/0827 , B29K2009/06 , B29K2021/00 , B29K2021/003 , B29K2023/00 , B29K2023/06 , B29K2023/083 , B29K2023/086 , B29K2023/12 , B29K2025/00 , B29K2027/06 , B29K2027/08 , B29K2027/12 , B29K2027/16 , B29K2027/18 , B29K2033/12 , B29K2055/02 , B29K2059/00 , B29K2063/00 , B29K2067/00 , B29K2067/006 , B29K2069/00 , B29K2071/00 , B29K2071/12 , B29K2075/00 , B29K2077/00 , B29K2077/10 , B29K2079/08 , B29K2079/085 , B29K2081/06 , B29K2096/005 , B29K2105/0079 , B29K2105/0085 , B29K2105/0088 , B29K2995/0027 , B29L2009/00 , B29L2031/767 , B41J2/161 , B41J2/1623 , C08J7/123 , H01L21/187 , Y10T156/10 , Y10T428/265 , Y10T428/2809 , Y10T428/2817 , Y10T428/2826 , Y10T428/2848 , Y10T428/2852 , Y10T428/31663 , B29C65/00 , B29K2081/04 , B29K2075/02 , B29K2067/06 , B29K2067/04 , B29K2067/003 , B29K2061/04 , B29K2033/08 , B29K2029/04 , B29K2025/08 , B29K2025/06 , B29K2023/18 , B29K2023/16
摘要： PROBLEM TO BE SOLVED: To provide a base material with a junction film which can be strongly and efficiently joined to an adherend with high dimensional accuracy at a low temperature, to provide a method for efficiently joining the base material with the junction film to an adherend at a low temperature, and to provide a junction structure having high reliability comprising the above base material with the junction film and an adherend strongly joined to each other with high dimensional accuracy. SOLUTION: The base material with a junction film comprises a base sheet 2 (base material) and, superimposed on the base sheet 2, a junction film 3 so as to be joinable with an opposite base sheet 4 (another adherend). This junction film 3 contains an Si skeleton of random atomic arrangement having a siloxane (Si-O) bond, and a leaving group bonded to the Si skeleton, wherein the Si skeleton has a crystallization degree of being not more than 45%. The junction film 3 enables the leaving group to leave from the Si skeleton when irradiated with UV rays, which develops adherence to the opposite base sheet 4 on the surface 35 of the junction film 3. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有能够在低温下以高尺寸精度牢固且有效地接合到被粘物的接合膜的基材，以提供一种有效地将基材与接合膜接合的方法并且提供具有高可靠性的高结构的接合结构，其中包括具有接合膜的上述基底材料和被粘附体以高尺寸精度彼此强烈地接合。解决方案：具有接合膜的基材包括基片2（基材），并且在基片2上叠加接合膜3，以便与相对的基片4（另一个被粘物）连接。该接合膜3含有具有硅氧烷（Si-O）键的随机原子排列的Si骨架和与Si骨架结合的离去基团，其中Si骨架的结晶度为45％以下。接合膜3使离子基团能够在用紫外线照射时从Si骨架离开，这会在接合膜3的表面35上形成与相对的基片4的粘附。版权所有（C）2009，JPO＆INPIT

9. 发明专利

JPWO2015146602A1 樹脂ゴム複合体の製造法有权
公开(公告)号：JPWO2015146602A1
公开(公告)日：2017-04-13
申请号：JP2015536338
申请日：2015-03-12
申请人： Nok株式会社 , Nok株式会社
发明人：昭寛鈴木 , 昭寛鈴木
IPC分类号： B32B25/08 , B32B27/34 , C08J7/16
CPC分类号： B32B25/08 , B29C65/483 , B29C65/528 , B29C66/00143 , B29K2607/00 , B29K2609/00 , B29K2677/00 , B29K2681/04 , B32B1/08 , B32B7/10 , B32B7/12 , B32B25/12 , B32B25/14 , B32B27/16 , B32B27/286 , B32B27/34 , B32B2250/02 , B32B2250/24 , B32B2255/10 , B32B2255/26 , B32B2581/00 , B32B2597/00 , B32B2605/00 , C08J7/123 , C08J7/16 , C08J7/18 , C08J2307/00 , C08J2323/16 , C08J2377/00 , C08J2377/06 , C08J2381/04 , C09J5/02 , C09J2400/226 , C09J2400/228 , C09J2407/006 , C09J2407/008 , C09J2409/006 , C09J2409/008 , C09J2477/006 , C09J2477/008 , C09J2481/006 , C09J2481/008
摘要：ポリアミド系樹脂成形品の表面を不活性ガスを用いて、またはポリフェニレンサルファイド系樹脂成形品の表面を活性ガスを用いてマイクロ波方式の低圧プラズマ処理を行って活性化した後、炭化水素系モノマーを用いたマイクロ波方式の低圧プラズマ処理を行い、ラジカルを有する重合膜を形成せしめた樹脂成形品に、ゴム層を形成するパーオキサイド架橋性非極性ゴム組成物を、接着剤を介さずに直接加硫接着させた樹脂ゴム複合体。この樹脂-ゴム複合体は、ドラムシール、トランスミッション用のサイドカバー用シール等の自動車部品、防震ゴム、樹脂ゴム積層ホースなどとして有効に用いられる。

10. 发明专利

JP2009220581A Joined article and joining method 审中-公开
标题翻译：加工文章和加工方法
公开(公告)号：JP2009220581A
公开(公告)日：2009-10-01
申请号：JP2009154911
申请日：2009-06-30
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： MATSUO YASUHIDE , OTSUKA KENJI , HIGUCHI KAZUHISA , WAKAMATSU KOSUKE
IPC分类号： B32B27/00 , C09J5/00 , H01L21/02
CPC分类号： C09J5/06 , B29C59/14 , B29C65/02 , B29C65/1403 , B29C65/1406 , B29C65/1432 , B29C65/1435 , B29C65/1483 , B29C65/1496 , B29C65/16 , B29C65/1606 , B29C65/1616 , B29C65/1619 , B29C65/483 , B29C65/4835 , B29C65/4845 , B29C65/5021 , B29C65/5057 , B29C65/52 , B29C65/528 , B29C66/004 , B29C66/02 , B29C66/1122 , B29C66/30223 , B29C66/348 , B29C66/45 , B29C66/71 , B29C66/712 , B29C66/72321 , B29C66/72323 , B29C66/72325 , B29C66/7234 , B29C66/73111 , B29C66/73112 , B29C66/73113 , B29C66/73343 , B29C66/8322 , B29C66/83221 , B29C66/91411 , B29C66/9161 , B29C66/919 , B29C66/954 , B29C2035/0827 , B29K2009/06 , B29K2021/00 , B29K2021/003 , B29K2023/00 , B29K2023/06 , B29K2023/083 , B29K2023/086 , B29K2023/12 , B29K2025/00 , B29K2027/06 , B29K2027/08 , B29K2027/12 , B29K2027/16 , B29K2027/18 , B29K2033/12 , B29K2055/02 , B29K2059/00 , B29K2063/00 , B29K2067/00 , B29K2067/006 , B29K2069/00 , B29K2071/00 , B29K2071/12 , B29K2075/00 , B29K2077/00 , B29K2077/10 , B29K2079/08 , B29K2079/085 , B29K2081/06 , B29K2096/005 , B29K2105/0079 , B29K2105/0085 , B29K2105/0088 , B29K2995/0027 , B29L2009/00 , B29L2031/767 , B41J2/161 , B41J2/1623 , C08J7/123 , H01L21/187 , Y10T156/10 , Y10T428/265 , Y10T428/2809 , Y10T428/2817 , Y10T428/2826 , Y10T428/2848 , Y10T428/2852 , Y10T428/31663 , B29C65/00 , B29K2081/04 , B29K2075/02 , B29K2067/06 , B29K2067/04 , B29K2067/003 , B29K2061/04 , B29K2033/08 , B29K2029/04 , B29K2025/08 , B29K2025/06 , B29K2023/18 , B29K2023/16
摘要： PROBLEM TO BE SOLVED: To provide a joined article which comprises two substrates strongly and efficiently joined to each other in high dimensional accuracy at a low temperature and has high reliability, and to provide a method for joining two substrates, by which the two substrates can efficiently be joined to each other at a low temperature. SOLUTION: The joined article 5 has two base plates (base substrates) 21, 22 and two joining films 31, 32 disposed between the base plates 21, 22, and is prepared by joining the two base plates 21, 22 with the two joining films 31, 32 interposed. The joining films 31, 32 in the joined article 5 contains a Si skeleton having a random atomic structure containing siloxane (Si-O) bonds and leaving groups bonded to the Si skeleton. When energy is imparted to each of the joining films 31, 32, adhesiveness is expressed, and thus the two base plates 21, 22 are joined to each other. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种包括两个基板的接合制品，其在低温下以高尺寸精度牢固且有效地接合并且具有高可靠性，并且提供了一种用于接合两个基板的方法，两个基板可以在低温下有效地彼此接合。解决方案：接合制品5具有两个基板（基底基板）21,22和设置在基板21,22之间的两个接合薄膜31,32，并且通过将两个基板21,22与插入两个接合膜31,32。接合体5中的接合薄膜31,32含有具有硅氧烷（Si-O）键和离子基团与Si骨架结合的随机原子结构的Si骨架。当赋予每个接合薄膜31,32的能量时，表现出粘合性，因此两个底板21,22彼此接合。版权所有（C）2010，JPO＆INPIT

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