专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

21. 发明专利

JP5376472B2 Resonator and manufacturing method thereof 有权
公开(公告)号：JP5376472B2
公开(公告)日：2013-12-25
申请号：JP2011519818
申请日：2010-06-16
申请人：学校法人立命館
发明人：健一郎鈴木 , 晃正玉野 , 光広岡田 , 昌也競
IPC分类号： H03H9/24 , H03H3/007
CPC分类号： H03H3/0072 , H03H9/1057 , H03H9/2463 , H03H2009/02519
摘要： Disclosed is an easily-producible resonator which uses torsional vibration and has a structure wherein the substrate surface and vibration member lower surface face each other with a sufficiently narrow gap in between. The resonator is provided with a base material (1) which has a flat main surface (1u), layered anchor parts (2a,2b) which are fixed to the main surface (1u), a layered vibrating imparting part (3) which is conductive, a beam-like layered vibration member (4) which is joined to the upper surface of the anchor parts (2a, 2b) with an insulating film (5) disposed therebetween and expands two-dimensionally, and a lead-out conductor (6) which is electrically connected to the vibrating imparting part (3) and extends to the outer side of the region that is covered by the vibration member when seen from above. The upper surface (3u) of the vibrating imparting part (3) faces a portion of the lower surface (4w) of the vibration member (4) with a gap (11), in between, having a distance that is approximately equal to the thickness of the insulating film (5), so that torsional vibration can be generated at at least a portion of the vibration member (4) by the generation of a potential difference between the upper surface (3u) vibrating imparting part (3) and the lower surface (4w) of the vibration member (4).

22. 发明专利

JP5227019B2 Encapsulated electrical components and a method of manufacturing the same 有权
公开(公告)号：JP5227019B2
公开(公告)日：2013-07-03
申请号：JP2007508852
申请日：2005-04-21
申请人：エプコスアクチエンゲゼルシャフトEpcos Ag
发明人：バウアークリスティアン , クリューガーハンス , シュテルツルアロイス
IPC分类号： B81B1/00 , B81B7/00 , B81C3/00 , H01L21/56 , H03H3/007 , H03H9/10
CPC分类号： H01L21/44 , B81C1/0023 , H01L2224/16225 , H03H3/0072 , H03H9/1057

23. 发明专利

JP2011189423A Mems element and oscillator 审中-公开
标题翻译： MEMS元件和振荡器
公开(公告)号：JP2011189423A
公开(公告)日：2011-09-29
申请号：JP2010055489
申请日：2010-03-12
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： INABA SHOGO
IPC分类号： B81B3/00 , H01L23/02 , H03B5/30 , H03H9/24
CPC分类号： H03H9/1057 , H01L29/84 , H03H3/0072 , H03H9/2452 , H03H2240/00
摘要： PROBLEM TO BE SOLVED: To provide a miniaturizable MEMS element by storing a first vibrator and a second vibrator in one cavity part.
SOLUTION: This MEMS element 100 includes a substrate 10, the cavity part 32 formed above the substrate 10, the first vibrator 20a stored in the cavity part 32 and the second vibrator 20b stored in the cavity part 32.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：通过将第一振动器和第二振动器存储在一个空腔部分中来提供可微型MEMS元件。解决方案：该MEMS元件100包括基板10，形成在基板10上方的空腔部分32，存储在空腔部分32中的第一振动器20a和存储在空腔部分32中的第二振动器20b。：（C）2011，JPO＆INPIT

24. 发明专利

JP4667076B2 How to implement the functional element-mounted module 有权
公开(公告)号：JP4667076B2
公开(公告)日：2011-04-06
申请号：JP2005060289
申请日：2005-03-04
申请人：ソニーケミカル&インフォメーションデバイス株式会社
发明人：吉弘米田
IPC分类号： H01L23/02 , H05K1/18 , H05K3/34
CPC分类号： H01L21/563 , H01L23/10 , H01L23/13 , H01L23/564 , H01L24/48 , H01L24/73 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73203 , H01L2224/73265 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/1461 , H01L2924/15151 , H01L2924/16152 , H01L2924/16195 , H03H9/0585 , H03H9/059 , H03H9/1057 , H05K3/303 , H05K3/341 , H05K3/3436 , H05K2201/09072 , H05K2201/09572 , H05K2201/10674 , H05K2203/1147 , Y02P70/613 , H01L2924/00 , H01L2924/00012 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： This disclosure provides a technique that prevents debonding at an interface between a functional device and a resin on reflow soldering in a functional device-mounted module requiring a hollow structure. Also disclosed is a functional device having a functional portion mounted on a substrate formed with predetermined wiring patterns, wherein the functional portion of the functional device is arranged in a receiving space, and the substrate is provided with a hole which communicates with the receiving space and a solder-introducing portion made of a metallic material compatible with solder. During solder reflowing, the functional device-mounted module is placed on a mounting substrate such that the solder-introducing portion of the functional device-mounted module contacts a solder paste, and solder is melted with heat. Water inside the receiving space is thus discharged, and solder is introduced into the hole due to surface tension, and the interior of the receiving space is sealed.

25. 发明专利

JP4558855B2 The method for manufacturing a microstructure having an internal cavity 有权
公开(公告)号：JP4558855B2
公开(公告)日：2010-10-06
申请号：JP10929799
申请日：1999-04-16
申请人：アイメックImec , シーピー・クレア・コーポレイションCP Clare Corp.
发明人：エリク・ベイネ , ハリー・アー・セー・ティルマンス , ミリアム・ファン・デ・ペール
IPC分类号： B81C1/00 , B81B7/00 , G01L9/00 , G01P15/08 , G01P15/125 , H01H1/00 , H01H35/14 , H01L23/02 , H03H3/007
CPC分类号： B81C1/00293 , B81B7/0077 , G01J5/045 , G01L9/0042 , G01L9/0073 , G01P15/0802 , G01P15/125 , H01H1/0036 , H01H35/14 , H01L21/50 , H01L23/10 , H01L2224/16 , H01L2924/01025 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/01327 , H03H9/1057 , H01L2924/00
摘要： The present invention relates to a method of fabricating a microstructure having an inside cavity comprising the steps of: depositing a first layer or a first stack of layers in a substantially closed geometric configuration on a first substrate; performing an indent on the first layer or on the top layer of said first stack of layers; depositing a second layer or a second stack of layers substantially with said substantially closed geometric configuration on a second substrate; aligning and bonding said first substrate on said second substrate such that a microstructure having a cavity is formed according to said closed geometry configuration.

26. 发明专利

JP4495711B2 Function device and a method for manufacturing the same 有权
公开(公告)号：JP4495711B2
公开(公告)日：2010-07-07
申请号：JP2006292598
申请日：2006-10-27
申请人：株式会社日立製作所
发明人：英次坂本 , 直樹松嶋 , 昌平秦
IPC分类号： B81B3/00 , H01L23/10
CPC分类号： G01P15/0802 , B81B2201/0271 , B81C1/00269 , G01P1/023 , G01P15/0897 , H03H9/105 , H03H9/1057 , H03H9/173 , Y10T428/24273 , Y10T428/24322 , Y10T428/2462 , Y10T428/24826 , Y10T428/265

27. 发明专利

JP2008114363A Method of manufacturing electromechanical component on plane substrate 审中-公开
标题翻译：在平板基板上制造机电元件的方法
公开(公告)号：JP2008114363A
公开(公告)日：2008-05-22
申请号：JP2007249518
申请日：2007-09-26
申请人： Commiss Energ Atom , Stmicroelectronics Sa , コミツサリアタレネルジーアトミーク , ストミクロエレクトロニクス・ソシエテ・アノニム
发明人： CASSET FABRICE , DURAND CEDRIC , ANCEY PASCAL
IPC分类号： B81C1/00
CPC分类号： B81C1/0065 , B81B2201/0271 , B81B2207/015 , H03H3/0073 , H03H9/1057 , H03H9/2405 , H03H2009/02496
摘要： PROBLEM TO BE SOLVED: To manufacture an electromechanical component manufacturable easily, requiring low cost, and having optimum performance, in particular in terms of motion characteristics. SOLUTION: Manufacturing method according to the invention includes at least five stage, i.e. (a) a stage to form a base board 15 having one silicon region covered partially with two insulating regions, (b) a stage to form a silicon-germanium alloy sacrifice layer with selective epitaxy starting at the uncovered portion of the silicon region, (c) a stage to form a silicon layer having one mono-crystalline region arranged on the sacrifice layer and two multi-crystalline regions arranged on the insulating regions and having undergone a doping in a high concentration by the epitaxy, (d) a stage to simultaneously form a vibrational structure and a working electrode by etching the prescribed patterns in the mono-crystalline region so that a space is formed between the electrode 23 and the vibrational structure 22, and (e) a stage to remove the sacrifice layer of silicon-germanium alloy by means of selective etching. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：制造容易制造的机电部件，要求低成本，并具有最佳性能，特别是在运动特性方面。解决方案：根据本发明的制造方法包括至少五个阶段，即（a）形成具有一部分被两个绝缘区域覆盖的一个硅区域的基板15的阶段，（b）形成硅 - 在硅区的未覆盖部分开始具有选择性外延的锗合金牺牲层，（c）形成具有布置在牺牲层上的一个单晶区域和布置在绝缘区域上的两个多晶区域的硅层的阶段，以及已经通过外延进行了高浓度的掺杂，（d）通过蚀刻单晶区域中的规定图案同时形成振动结构和工作电极的阶段，使得在电极23和振动结构22和（e）通过选择性蚀刻去除硅 - 锗合金牺牲层的阶段。版权所有（C）2008，JPO＆INPIT

28. 发明专利

JP4086023B2 Micromechanical electrostatic vibrator 有权
公开(公告)号：JP4086023B2
公开(公告)日：2008-05-14
申请号：JP2004244835
申请日：2004-08-25
申请人：セイコーエプソン株式会社
发明人：卓哉中島 , 誠古畑 , 竜児木原
IPC分类号： B81B3/00 , B81C1/00 , B81C3/00 , H02N1/00 , H02N2/00 , H03H3/007 , H03H9/00 , H03H9/02 , H03H9/10 , H03H9/24
CPC分类号： H03H9/2431 , H03H3/0072 , H03H9/02259 , H03H9/02433 , H03H9/1057 , H03H9/2436 , H03H9/2457 , H03H9/2463 , H03H2009/02496 , H03H2009/02503 , H03H2009/02519

29. 发明专利

JP2007276089A Electro-mechanical element and manufacturing method thereof, and resonator and manufacturing method thereof 审中-公开
标题翻译：电子机械元件及其制造方法及其谐振器及其制造方法
公开(公告)号：JP2007276089A
公开(公告)日：2007-10-25
申请号：JP2006109097
申请日：2006-04-11
申请人： Sony Corp , ソニー株式会社
发明人： TADA MASAHIRO , MITARAI TAKASHI , MORITA SHINYA
IPC分类号： B81B3/00 , H03H3/007 , H03H9/24 , H03H9/46
CPC分类号： H03H9/1057 , H03H9/462 , H03H2009/02511
摘要： PROBLEM TO BE SOLVED: To improve reliability on a capsulated electromechanical element.
SOLUTION: The electromechanical element is provided with an electromechanical element body 64 having lower electrodes 62 and 63 and a moving piece 35, and an over-coated film 38 sealing the electromechanical element body 64 with a space 37 held therein. Supports 52 are provided between the over-coated film 38 and the moving piece 35.
COPYRIGHT: (C)2008,JPO&INPIT

30. 发明专利

JP2016510959A 小型化された多コンポーネント部品および製造方法有权
标题翻译：多组分份数和小型化的制造方法
公开(公告)号：JP2016510959A
公开(公告)日：2016-04-11
申请号：JP2015560596
申请日：2014-01-29
申请人：エプコスアクチエンゲゼルシャフトEpcos Ag , エプコスアクチエンゲゼルシャフトEpcos Ag
发明人：グドルンヘン， , グドルンヘン， , マルセルギーゼン , マルセルギーゼン
IPC分类号： H03H9/02 , B81B7/02 , B81C3/00 , H03H7/38 , H03H9/24 , H03H9/25 , H03H9/70 , H03H9/72
CPC分类号： H05K1/181 , H03H9/0542 , H03H9/0547 , H03H9/0566 , H03H9/1007 , H03H9/1057 , H03H9/1064 , H05K3/10 , H05K3/303 , H05K3/3421
摘要：様々な回路技術との使用に適合されている、小型化された部品を提示する。部品は、支持体、および支持体上の機能構造物を含んでいる。薄膜カバーが、機能構造物を覆い、かつ薄膜カバー上に配置される回路コンポーネントのための据付台座として用いられる。回路コンポーネントは導線を介して機能構造物と接続されている。【選択図】図1
摘要翻译：它适于与各种电路技术，以提供一个小型化的零件使用。部件包括一个支撑，并且在载体上功能性结构。薄膜盖，覆盖所述功能的结构，并且被用作用于设置在所述薄膜盖的电路部件的安装基座。电路组件经由导体连接和功能结构。点域1

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式