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    • 23. 发明专利
    • Electroplating method and electroplating device of through hole
    • 电镀方法和通孔电镀装置
    • JP2014053594A
    • 2014-03-20
    • JP2013156314
    • 2013-07-29
    • Ebara Corp株式会社荏原製作所
    • SHIMOYAMA TADASHIARAKI YUJIKURIYAMA FUMIOFUJIKATA JUNPEI
    • H05K3/40C25D5/18C25D7/00C25D7/12C25D21/10H01L21/288H01L21/3205H01L21/768H01L23/522H05K3/42
    • C25D5/18C25D5/02C25D5/10C25D17/001C25D21/10C25D21/12H01L21/2885H01L21/76898
    • PROBLEM TO BE SOLVED: To provide an electroplating method capable of filling a through hole surely with a metal film, having no void inside, in shorter time, even if the through hole has a relatively large diameter of about 150-300 μm.SOLUTION: A first stage plating for substantially reducing the diameter of a through hole by forming a metal film of uniform thickness in the through hole, a second stage plating for closing the central part of the through hole with the metal film formed therein, by using a PR pulse current repeating a forward current and a reverse current alternately, in which the forward current value is made smaller than the current value of a plating current used for metal deposition in the first stage plating, and a third stage plating for completing the filling of the through hole with a metal film, by raising the current value of a plating current used for metal deposition equal to or higher than the forward current value of a PR pulse used in the second stage plating, are performed continuously.
    • 要解决的问题:即使通孔具有约150-300μm的相对大的直径,提供一种能够在更短的时间内确保地用金属膜填充通孔的电镀方法,其中内部没有空隙。 通过在通孔中形成均匀厚度的金属膜来大幅度减小通孔的直径的第一阶段电镀,通过使用PR来封闭通孔的中心部分的金属膜的第二阶段电镀 脉冲电流交替地重复正向电流和反向电流,其中使正向电流值小于用于第一级电镀中的金属沉积的电镀电流的电流值,以及用于完成第一级电镀的填充的第三级电镀 通过提高用于金属沉积的电镀电流的电流值等于或高于在第二级pla中使用的PR脉冲的正向电流值的通孔 连续执行。