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    • 7. 发明专利
    • Electroplating method
    • 电镀方法
    • JP2006312785A
    • 2006-11-16
    • JP2006129093
    • 2006-05-08
    • Headway Technologies Incヘッドウェイテクノロジーズ インコーポレイテッド
    • CHEN CHAO-PENGCHUDASAMA JASLAM SITUAN
    • C25D21/18C25D7/00C25D17/10
    • C25D3/20C25D5/18C25D21/12
    • PROBLEM TO BE SOLVED: To provide an electroplating method which can reduce ferric ions in an electroplating bath into ferrous ions without using a reducing agent.
      SOLUTION: When electroplating a substrate 9 with the use of a ferrous electroplating bath 11, this electroplating method includes applying an auxiliary potential in between a cathode 4 (working electrode) and a reference electrode 6 concurrently with applying an electroplating potential in between an anode 4 and a cathode 5, during an electroplating period (a period in which the substrate 9 is electroplated in the electroplating bath 11). The auxiliary potential reduces the ferric ions (Fe
      3+ ) in the electroplating bath 11 into the ferrous ions (Fe
      2+ ), while the electroplating potential electroplates the substrate 9.
      COPYRIGHT: (C)2007,JPO&INPIT
    • 要解决的问题:提供一种电镀方法,其可以在不使用还原剂的情况下将电镀浴中的铁离子还原成亚铁离子。 解决方案:当使用铁电镀浴11对基板9进行电镀时,该电镀方法包括在阴极4(工作电极)和参考电极6之间同时施加辅助电位,在其间施加电镀电位 阳极4和阴极5,在电镀期间(基板9在电镀槽11中电镀的期间)。 辅助电位将电镀槽11中的铁离子(Fe 3 + )还原成亚铁离子(Fe 2 + ),而电镀电位电镀基板9。 版权所有(C)2007,JPO&INPIT