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    • 22. 发明专利
    • JPH05295527A
    • 1993-11-09
    • JP19920991
    • 1991-08-08
    • RIKAGAKU KENKYUSHOJEOL LTD
    • HARA TAMIOHAMAGAKI MANABUAOYANAGI KATSUNOBUKOBUNA SADATOSHI
    • C23C14/32
    • PURPOSE:To develop ion plating device having the excellent efficiency of utilizing electrons by providing a reflection plate for the electrons from a plasma generator in a vapor deposition chamber of the ion plating device. CONSTITUTION:The inside of a plasma forming device 9 and the vacuum vapor deposition chamber 1 connected thereto is evacuated to a vacuum and gaseous Ar is gradually supplied from a gas supplying pipe 15 of a plasma forming device, simultaneously with which the electrons are released by energizing a hot cathode 10. A voltage is then impressed between the hot cathode 10 and a discharge electrode 12 to generate a discharge. Ar molecules are ionized by the electrons from the hot cathode 10 to generate plasma P. The electrons formed therein advance rectilinearly in the vapor deposition chamber 1. On the other hand, a raw material 3 for vapor deposition in a crucible 2 is heated and evaporated by the electrons from a filament 4 and collide against the electrons from the plasma forming device 9, by that, the raw material is ionized and a vapor deposited film is formed on a substrate 6. The electrons are partly not utilized and advance rectilinearely and, therefore, these electrons are reflected by the reflection electrode 21 to irradiate and evaporate the raw material 3 for vapor deposition in the crusible 2. The electrons are thus effectively utilized for the vapor deposition effect.
    • 23. 发明专利
    • DIGITAL ETCHING METHOD
    • JPH03110844A
    • 1991-05-10
    • JP24972589
    • 1989-09-26
    • RIKAGAKU KENKYUSHO
    • MEGURO TAKASHIHAMAGAKI MANABUHARA TAMIOAOYANAGI KATSUNOBU
    • C23F4/00G11B9/00G11B9/14H01L21/302
    • PURPOSE:To make it possible to obtain etching characteristics, which are stable and have a controllability in an atomic layer level, by a method wherein before a beam is projected, reactive gas is evacuated and the reactive gas which does not contribute to adsorption to the surfaces of solid materials is evacuated from the interior of a container. CONSTITUTION:This digital etching method is a method wherein reactive gas 2 is adsorbed to the surfaces of solid materials 1 in a container and after this gas is evacuated, an etching is controlled at an atomic layer level by repeating a process for projecting a charged particle beam or an optical beam 3. That is, by the adsorption of the gas 2 to the surfaces of the materials 1, the coupling of adsorbed solid atoms 1' with the materials 1 is weakened, then, the atoms 1' only weakened their coupling are etched through the materials 1 with the charged particle beam or the optical beam 3 which is projected. Thereby, stable etching characteristics which do not depend on the amount of the gas 2, which is fed, and the amount of the beam, which is projected, can be realized having a controllability at the atomic layer level.
    • 28. 发明专利
    • ELECTRON BEAM GENERATOR
    • JPS61153937A
    • 1986-07-12
    • JP27673884
    • 1984-12-26
    • RIKAGAKU KENKYUSHO
    • HARA TAMIOHAMATSUNE MANABUKIN HITSUGENNANBA SUSUMU
    • H01J37/077
    • PURPOSE:To prevent occurrence of anode point by arranging an electrode for shaping the plasma potential distribution near to the second accelerating electrode at the plasma region side thereby uniforming the plasma potential on the surface of second accelerating electrode. CONSTITUTION:An electron beam generator is constituted by containing first and second accelerating electrodes 1, 2, plasma potential distribution shaping electrode 3 and cathode 4 in a plasma container 5. Discharge is produced between the cathode 4 and the second accelerating electrode 2 to produce plasma thus to emit an electron beam 7 into an ion production container 8 and to produce ions which are used to eliminate the potential barrier produced in the vicinity of the opening 9 of second accelerating electrode 2 by space charges. While the third electrode 3 will correct distorsion of the plasma potential distribution thus to prevent occurrence of anode point. Consequently, discharge between the accelerating electrodes 1, 2 is prevented resulting in stable electron acceleration.