会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 12. 发明专利
    • HEAT-TREATING METHOD FOR GAAS SUBSTRATE
    • JPS60257133A
    • 1985-12-18
    • JP11072284
    • 1984-06-01
    • HITACHI LTD
    • KODERA NOBUOSHIGETA JIYUNJIKAMIYANAGI KIICHIMIYAZAKI MASARU
    • H01L29/812H01L21/265H01L21/324H01L21/338
    • PURPOSE:To enable to obtain a substrate which is especially suitable for an IC by a method wherein, after a glass thin film having SiO2 as a main ingredient and containing the spcific ratio or more of alumina, boron oxide and barium oxide is coated on one main surface of a GaAs substrate, the above is heated up to the prescribed temperature or above and at the crystalline melting point or below. CONSTITUTION:After Si ions are implanted on the surface of a GaAs substrate 1 as shown by the arrows in the disgram, a glass thin film 2, having SiO2 as main ingredient and containing Al2O3 of 12% or above, a boron oxide and a barium oxide, such as the glass 7059 manufactured by Coroning Glass Works, for example, is coated by performing an RF sputtering method using Ar ion as a medium. Then, a heat treatment is performed on the substrate 1 at the temperature of 400 deg.C or above and at the temperature of crystalline melting point or below. Through these procedures, the exfoliation of the glass layer 2 to be used to prevent the evaporation of As in the substrate 1 and the generation of cracks can be prevented, and the change in crystalline characteristics due to the application of the stress generated from the difference of thermal expansion coefficient between the substrate 1 and the layer 2, on the substrate 1 can also be prevented, thereby enabling to obtain an excellent GaAs substrate to be used for an integrated circuit. After the glass layer 2 is formed, Si ions are implanted, and the a heat treatment may be performed.
    • 13. 发明专利
    • JOSEPHSON JUNCTION ELEMENT
    • JPS58130584A
    • 1983-08-04
    • JP1166182
    • 1982-01-29
    • HITACHI LTD
    • MURAYAMA YOSHIMASAKODERA NOBUO
    • H01L39/22H03K19/195
    • PURPOSE:To ensure the switching operation at a non-latching mode by a constant circuit power source current, by connecting a Josephson junction and a negative resistor in parallel, arranging a control line along the junction with a gap being provided, and flowing a current, which does not exceed the minimum equivalent current Imin (RL, O) of the parallel circuit of the junction and the resistor, through the control line. CONSTITUTION:The Josephson junction 10 and the load resistor 11 whose resistance value is RL are connected in parallel and a closed circuit is constituted. The control line 12, through which the circuit power source current Ic flows, is arranged along the Josephson junction 10. In this constitution, a superconductive current flows through the junction 10 until the circuit power source current Ic exceeds the maximum tunnel current value Imo, and the circuit becomes a zero state. When the current Ic exceeds the value Imo, ON switching to the voltage state shown by a curve 20 from the zero voltage state is carried out. When the Ic is decreased from this state to the value lower than Imin (RL, O) value, OFF switching state is obtained.
    • 14. 发明专利
    • LOW TEMPERATURE WORKING TYPE COMPUTER
    • JPS58129616A
    • 1983-08-02
    • JP1165082
    • 1982-01-29
    • HITACHI LTD
    • KODERA NOBUOHIRANO MIKIOKAWABE USHIO
    • G11C11/44G06F1/00G06F1/18H01L39/22
    • PURPOSE:To reduce Joule heating at low temperature working and signal attenuation to discriminate connection at a room temperature by superposing a superconductive wire material to a normal conductive wire material so as to be double layers and doubling also electric connection. CONSTITUTION:Connection wiring is constituted by superposed films consisting of the superconductive wire material (thin film) 1 and the normal conductive wire material (thin film) 2. Electric connection is also doubled by the superconductive wire and the normal conductive wire. At a temperature higher than a transfer temperature, current flows mainly through the normal conductive wire material, and at a temperature lower than the transfer temperature, current flows the superconductive wire materal of which resistance is zero. In a wiring structure to connect pins on a circuit resistance is zero. In a wiring structure to connect pins on a circuit board (module board), a superconductive metallic film is formed like a disc so as to be circularly expanded around pin holes.
    • 17. 发明专利
    • SUPERCONDUCTIVE DIRECT CURRENT DRIVING LOGICAL CIRCUIT
    • JPS572129A
    • 1982-01-07
    • JP7554380
    • 1980-06-06
    • HITACHI LTD
    • KODERA NOBUOYAMASHITA KUNIO
    • H03K19/195
    • PURPOSE:To obtain a general-purpose logical gate for integrated circuit use that can be driven with a DC power source, by forming a logical circuit which can obtain the arithmetic output of both an OR logic and an NOR logic at one time. CONSTITUTION:The upper side of a basic circuit is connected to a DC power supply line P1 via a series resistance R3; and the lower side of the basic circuit is earthed via a resistance RD. At the same time, a bias input loop is provided to generate an interlinking magnetic flux simultaneously with junction switches g11 and g22. Then two magnetic field coupled input lines are disposed so as to generate an interlinking magnetic flux simultaneously with switches g11 and g12 as well as g21 and g22. Then a combination is formed so that the input magnetic flux to g11 and g22 becomes opposite to the code of the bias magnetic field. Thus an OR output is extracted from the middle point between g11 and g12, and at the same time an NOR output is extracted from the middle point between g21 and g22, respectively.