专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

132. 发明专利

JP2008137106A Spectacle lens machining system 有权
标题翻译：镜面镜片加工系统
公开(公告)号：JP2008137106A
公开(公告)日：2008-06-19
申请号：JP2006325073
申请日：2006-11-30
申请人： Nidek Co Ltd , 株式会社ニデック
发明人： TAKEICHI KYOJI
IPC分类号： B24B9/14 , B24B13/005
CPC分类号： B24B9/14 , B24B13/005 , B24B51/00 , Y10T408/34
摘要： PROBLEM TO BE SOLVED: To reduce mix-up of right and left lenses in machining spectacle lenses. SOLUTION: A lens machining system includes a lens machining device for holding a lens having a fixing cup attached by a chuck shaft for machining its periphery based on lens shape data and a cup attaching device for attaching the cup to the lens. The cup is shared by a right eye lens and a left eye lens, and has a data-rewritable IC tag. The cup attaching device includes a selecting means for selecting either the right or left lens to which the cup is attached and a writing means for writing and memorizing right-or-left identification information in the IC tag based on a selection signal from the selecting means. The lens machining device includes a reading means for reading the information stored on the IC tag of the cup fixed to the lens and a setting means for setting the right or left lens to be machined based on the right-or-left identification information read by the reading means. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：减少加工眼镜镜片时左右镜片的混合。解决方案：透镜加工系统包括：透镜加工装置，用于保持透镜，该透镜具有通过卡盘轴附接的固定杯，用于基于透镜形状数据加工其周边;以及杯安装装置，用于将杯安装到透镜。杯子由右眼镜片和左眼镜片共享，并且具有数据可重写的IC标签。杯子安装装置包括：选择装置，用于选择安装有杯子的右侧或左侧透镜;以及写入装置，用于基于来自选择装置的选择信号在IC标签中写入和存储右侧或左侧识别信息。透镜加工装置包括：读取装置，用于读取存储在固定到透镜的杯子的IC标签上的信息;以及设定装置，用于基于由左侧或右侧的识别信息读取的左右的识别信息，阅读手段。版权所有（C）2008，JPO＆INPIT

134. 发明专利

JP2007027781A Polishing pad 有权
标题翻译：抛光垫
公开(公告)号：JP2007027781A
公开(公告)日：2007-02-01
申请号：JP2006248420
申请日：2006-09-13
申请人： Applied Materials Inc , アプライドマテリアルズインコーポレイテッドApplied Materials,Incorporated
发明人： BIRANG MANOOCHER , JOHANSSON NILS , GLEASON ALLAN , PYATIGORSKY GRIGORY
IPC分类号： H01L21/304 , B24B37/013 , B24B37/20 , B24B47/12 , B24B49/02 , B24B49/04 , B24B49/12 , B24B51/00 , B24D7/12 , B24D13/14 , G01B11/06
CPC分类号： B24B37/205 , B24B37/013 , B24B47/12 , B24B49/04 , B24B49/12 , B24B51/00 , G01B11/06 , G01B11/0683
摘要： PROBLEM TO BE SOLVED: To provide a polishing pad for endpoint detection capable of improving accuracy for a polishing process and using for giving useful information. SOLUTION: The polishing pad 18 has a hole 30 which is disposed in a first layer 22 made of polyurethane material and in the rear surface, and formed in a polishing surface consisting of a second layer material 20 softer than the first layer material, a transparent solid portion comprising a quartz insert inserted to the hole, and a groove which is formed on the surface opposite to the polishing surface, aligned with the transparent solid portion, and extends to the transparent solid portion. The polishing pad is used for measuring uniformity in a layer on a substrate during polishing a concerning layer in situ. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于终点检测的抛光垫，其能够提高抛光处理的精度并且用于提供有用的信息。解决方案：抛光垫18具有孔30，该孔设置在由聚氨酯材料制成的第一层22中并且在后表面中形成在由比第一层材料软的第二层材料20组成的抛光表面中，透明固体部分，其包括插入到孔中的石英插入件，以及形成在与抛光表面相对的表面上的与透明实心部分对准并且延伸到透明固体部分的凹槽。抛光垫用于在原位抛光相关层时测量基板上的层中的均匀性。版权所有（C）2007，JPO＆INPIT

135. 发明专利

JP2006524142A Apparatus and method for polishing a semiconductor wafer using one or more of the polishing surface 审中-公开
公开(公告)号：JP2006524142A
公开(公告)日：2006-10-26
申请号：JP2006513200
申请日：2004-04-21
申请人：イノプラインコーポレーテッド
发明人：インクウォンジェオン
IPC分类号： B24B37/34 , B24B51/00 , H01L21/304
CPC分类号： B24B37/345 , B24B51/00
摘要： An apparatus and method for polishing objects, such as semiconductor wafers, utilizes one or more polishing surfaces, multiple wafer carriers and at least one load-and-unload cup. The load-and-unload cup may be configured to move to and from the wafer carriers in a pivoting manner. The load-and-unload cup may be configured to move to and from the wafer carriers in a linear reciprocating manner. The wafer carriers may be configured to move to and from the load-and-unload cup in a pivoting manner. The wafer carriers may be configured to move to and from the load-and-unload cup in a linear reciprocating manner.

136. 发明专利

JP2006175550A Grinder 审中-公开
标题翻译：磨床
公开(公告)号：JP2006175550A
公开(公告)日：2006-07-06
申请号：JP2004371074
申请日：2004-12-22
申请人： Jtekt Corp , 株式会社ジェイテクト
发明人： WAKAZONO YOSHIO
IPC分类号： B24B49/16 , B24B5/02 , B24B41/04
CPC分类号： B24B51/00 , B24B1/00
摘要： PROBLEM TO BE SOLVED: To provide a grinder, reducing the power consumption related to a grinding wheel bearing such as racing power of a bearing part, bearing oil cooling power and bearing pump power to thereby reduce the quantity of energy consumed from the start to the end of grinding a work.
SOLUTION: The power consumption of the bearing part or the quantity of energy consumed from the start to the end of grinding a work is set to a predetermined quantity, and the outside diameter of the bearing part is determined to apply predetermined rigidity at a grinding point according to the preset value.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供研磨机，减少与诸如轴承部件的赛车功率，轴承油冷却功率和轴承泵功率之类的砂轮轴承相关的功耗，从而减少从开始结束研磨工作。
解决方案：将轴承部件的功率消耗或从工件的开始到结束的消耗的能量设定为预定量，并且确定轴承部件的外径以将预定刚度施加在根据预设值的磨削点。版权所有（C）2006，JPO＆NCIPI

137. 发明专利

JP2006513869A Modeling of the polishing process to achieve the removal of controlled materials 审中-公开
公开(公告)号：JP2006513869A
公开(公告)日：2006-04-27
申请号：JP2004568049
申请日：2003-12-23
申请人：スリーエムイノベイティブプロパティズカンパニー
发明人：エム．パームグレン，ゲイリー
IPC分类号： B24B51/00 , B23Q15/12 , B24B37/04 , B24B49/16 , G05B19/416
CPC分类号： B24B37/042 , B24B49/16 , B24B51/00
摘要：一般に、研磨作製工程の中のフィードバック制御の利用を必要とすることなく、たとえば材料の除去の量などの制御された性能変数を実現する研磨作製工程を可能する技術について記載している。たとえば、システムは、研磨材を用いて加工物を研磨するための機械および研磨材に関して実質的に一定の切削速度を実現するために、機械によって加工物に対する研磨材の適用を制御する制御装置を具備している。制御装置は、制御された材料除去を実現するために研磨材の作用力を研磨材の切削速度に関連付ける開ループ数学モデルに基づいて、１つ以上の工程変数を制御する。たとえば、モデルに基づいて、１つ以上の加工物を研磨すると同時に、一定の切削速度を実現することができるか、一定の量の材料を除去することができる。

138. 发明专利

JP3667483B2 Lens grinding apparatus 失效
标题翻译：空值
公开(公告)号：JP3667483B2
公开(公告)日：2005-07-06
申请号：JP4147697
申请日：1997-02-10
申请人：株式会社ニデック
发明人：良二柴田 , 俊昭水野
IPC分类号： G02C13/00 , B24B9/14 , B24B27/00 , B24B47/22 , B24B51/00 , G05B19/18
CPC分类号： G05B19/184 , B24B9/148 , B24B27/0046 , B24B47/225 , B24B51/00 , G02C1/10 , G05B2219/35525 , G05B2219/45157 , G05B2219/45162

139. 发明专利

JP2005131724A Aspheric surface processing method, aspheric surface forming method and aspheric surface processing apparatus 审中-公开
标题翻译：二次表面处理方法，二次表面成形方法和二次表面处理装置
公开(公告)号：JP2005131724A
公开(公告)日：2005-05-26
申请号：JP2003369066
申请日：2003-10-29
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： MIYAZAWA MAKOTO
IPC分类号： B23Q15/00 , B24B13/00 , B24B13/06 , B24B51/00
CPC分类号： B24B13/0012 , B24B13/06 , B24B51/00
摘要： PROBLEM TO BE SOLVED: To provide an aspheric surface processing method, an aspheric surface forming method and an aspheric surface processing apparatus, capable of quickly grinding and cutting a work having a large recess-projection step in a high quality by a simple control method by using a conventional aspheric surface processing apparatus.
SOLUTION: This aspheric surface processing method comprises a workpiece rotating around a rotary shaft, and a rotary tool 214 relatively movable with the work in the same direction as the rotary shaft of the work and the direction orthogonal to the rotary shaft of the work. The rotary tool 214 processes the work in a nonaxial symmetric aspheric surface by moving in the specific direction at a predetermined feed pitch in a partial or whole areas up to an outer peripheral part of the work from the center of the rotary shaft of the work in the direction orthogonal to the rotary shaft of the work.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：解决的问题：提供一种非球面表面处理方法，非球面形成方法和非球面处理装置，其能够通过简单的方式快速地研磨和切割具有高质量的大凹陷步骤的工件通过使用常规的非球面处理装置的控制方法。解决方案：该非球面表面处理方法包括围绕旋转轴旋转的工件以及与工件沿与工件的旋转轴相同的方向和与工件的旋转轴正交的方向可相对移动的旋转工具214。工作。旋转工具214通过在工件的旋转轴的中心的部分或整个区域中以预定的进给间距沿着特定方向移动到工件的外周部分来处理非对称非球面中的工件，工作方向与旋转轴正交的方向。版权所有（C）2005，JPO＆NCIPI

140. 发明专利

JP2004319574A Method of manufacturing semiconductor device, method and system for automatically operating semiconductor manufacturing device, and method of automatically operating cmp device 审中-公开
公开(公告)号：JP2004319574A
公开(公告)日：2004-11-11
申请号：JP2003107658
申请日：2003-04-11
申请人： Trecenti Technologies Inc , トレセンティテクノロジーズ株式会社
发明人： TSUCHIYAMA YOJI , NISHIHARA SHINJI , AOYANAGI MASAHIRO
IPC分类号： H01L21/304 , B24B49/02 , B24B51/00 , H01L21/02
CPC分类号： B24B37/345 , B24B49/02 , B24B51/00
摘要： PROBLEM TO BE SOLVED: To rationalize a semiconductor manufacturing process in which the ratio of manual operation, such as the CMP (Chemical Mechanical Polishing) step etc., is high by reducing the number of workers, to improve the throughput of the process, to compress the investment required for the process, and to improve the efficiency of the indirect business affairs performed in the process by promoting automation in the process.
SOLUTION: Unmanned operation is realized by treating a predetermined dummy wafer before treating a product wafer by only downloading the treatment recipe 24 of the product wafer from a host computer 19 to a CMP device 11 during the course of CMP operation. In addition, the measuring step performed in the next step is omitted by changing the condition of the recipe of the unmanned CMP device 11 based on the latest data by transmitting the measured data of a film thickness measuring instrument 17 mounted on the CMP device 11 from the CMP device 11 to the host computer 19 together with treatment data, such as the polishing time etc., and taking the advantage of the treating conditions of the next step in a feedforward-like state based on the measured data of the film thickness measuring instrument 17.
COPYRIGHT: (C)2005,JPO&NCIPI

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式