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101. 发明专利

JP2007047634A Signal transmission circuit, electro-optical apparatus, and electronic device 有权
标题翻译：信号传输电路，电光设备和电子设备
公开(公告)号：JP2007047634A
公开(公告)日：2007-02-22
申请号：JP2005234047
申请日：2005-08-12
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： KASAI TOSHIYUKI
IPC分类号： G09G3/20 , G09F9/00 , G09F9/30 , G09G3/36 , H01L33/26
CPC分类号： H05K1/147 , G09G3/325 , G09G2300/0842 , G09G2300/0861 , H05K1/0231 , H05K1/142 , H05K3/222 , H05K2201/10363
摘要： PROBLEM TO BE SOLVED: To provide a highly-reliable signal transmitter circuit, an electro-optical apparatus and an electronic device that can reduce the area of the substrate for wiring and can also be used even for signal circuits requiring many signal lines and can suppress the voltage drop in the wiring. SOLUTION: This electro-optical apparatus has two or more circuits Dr1-DrN, arranged at an edge on an electro-optical substrate 1 which has pixel areas having pixel circuits. Adjacent circuits are cascade-connected by the wiring L1-Ln, respectively provided on the wiring boards F1-Fn. The wiring boards F1-Fn are disposed so as to be in contact with the ends of the electro-optical substrate 1 corresponding to the circuits Dr1-DrN. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种高可靠性的信号发送器电路，电光装置和电子装置，其可以减少用于布线的基板的面积，并且还可以用于需要许多信号线的信号电路并可以抑制布线中的电压降。解决方案：该电光装置具有布置在具有像素电路的像素区域的电光基板1的边缘上的两个或多个电路Dr1-DrN。相邻的电路通过分别设置在布线板F1-Fn上的布线L1-Ln级联连接。布线板F1-Fn设置成与电路Dr1-DrN对应的电光基板1的端部接触。版权所有（C）2007，JPO＆INPIT

102. 发明专利

JP3842201B2 Connection structure of a high-frequency circuit board, its production method and the high-frequency circuit device 有权
标题翻译：空值
公开(公告)号：JP3842201B2
公开(公告)日：2006-11-08
申请号：JP2002314505
申请日：2002-10-29
申请人：三菱電機株式会社
发明人：洋一北村 , 顯津村 , 志浩田原
IPC分类号： H01P1/04 , H01R11/01 , H01L23/12 , H01P3/08 , H01P5/02 , H05K1/02 , H05K1/14 , H05K3/34
CPC分类号： H01P1/047 , H05K1/0219 , H05K1/142 , H05K3/0061 , H05K3/3421 , H05K2201/10424

103. 发明专利

JP2005340385A Wiring circuit board and connection structure thereof 审中-公开
标题翻译：接线电路板及其连接结构
公开(公告)号：JP2005340385A
公开(公告)日：2005-12-08
申请号：JP2004155107
申请日：2004-05-25
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： OYABU KYOYA
IPC分类号： H05K1/11 , H01R33/00 , H05K1/14 , H05K3/00 , H05K3/36
CPC分类号： H05K1/142 , H01R12/61 , H05K3/0058 , H05K3/363 , H05K2201/0397 , H05K2201/058 , H05K2201/0969 , H05K2201/2009
摘要： PROBLEM TO BE SOLVED: To provide a wiring circuit board and a connection structure of the wiring circuit board that can omit electric conduction test.
SOLUTION: A 1st wiring circuit board 1 and a 2nd wiring circuit board 2 are connected by making a 1st connection terminal 13 and a 2nd connection terminal 14 abut against each other in opposite direction along their longitudinal directions, aligning the 1st connection terminal 13 and 2nd connection terminal 14, and providing solder bumps 15 successively over surfaces of the 1st connection terminal 13 and 2nd connection terminal 14. Consequently, the solder bumps 15 are not interposed in the part where the 1st connection terminal 13 and 2nd connection terminal 14 face each other, and electric connections between the 1st connection terminal 13 and 2nd connection terminal 14 by the solder bumps 15 can visually be confirmed from the appearance.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供可以省略导电测试的布线电路板和布线电路板的连接结构。解决方案：通过使第一连接端子13和第二连接端子14沿着它们的纵向彼此相反的方向彼此抵接，连接第一布线电路板1和第二布线电路板2，使第一连接端子 13和第二连接端子14，并且连续地在第一连接端子13和第二连接端子14的表面上提供焊料凸块15.因此，焊料凸块15不插入在第一连接端子13和第二连接端子14 彼此面对，并且从外观上可以从视觉上确认第一连接端子13和第二连接端子14之间通过焊料凸块15的电连接。版权所有（C）2006，JPO＆NCIPI

104. 发明专利

JP2005222747A Discharge lamp lighting device 有权
标题翻译：放电灯照明装置
公开(公告)号：JP2005222747A
公开(公告)日：2005-08-18
申请号：JP2004027559
申请日：2004-02-04
申请人： Denso Corp , 株式会社デンソー
发明人： KATO KOICHI
IPC分类号： F21V29/00 , F21V23/00 , F21Y103/00 , H05B37/02 , H05B41/04 , H05B41/288 , H05K1/02 , H05K1/14 , H05K7/02
CPC分类号： H05B41/042 , H05B41/2881 , H05K1/0254 , H05K1/0263 , H05K1/142 , Y02B20/204
摘要： PROBLEM TO BE SOLVED: To provide a discharge lamp lighting device capable of being downsized.
SOLUTION: The discharge lamp lighting device has circuits and circuit components necessary for lighting operation such as an inverter circuit 3 generating alternating current voltage, a start-up circuit 5 starting discharge of a discharge lamp 4 housed in a case 10. The circuits necessary for the lighting operation are divided into a control part with little heat radiation and a power part with large heat radiation, and at the same time, a control part circuit board 16 mounting circuits of the control part and a power part circuit board 17 mounting circuits of the power part are separately loaded in the case 10. The circuit components are arranged at an upper part of the control part circuit board 16 in the case 10, fitted to a busbar case 11. Connection pads 22 are provided on the power part circuit board 17, and the connection pads 22 and case terminals 30 fitted to the busbar case 11 are connected with each other through wires.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：解决的问题：提供能够小型化的放电灯点亮装置。解决方案：放电灯点亮装置具有产生交流电压的逆变器电路3等点亮操作所需的电路和电路元件，启动电路5开始容纳在外壳10中的放电灯4的放电。照明操作所需的电路被分为几乎没有散热的控制部分和具有大的散热的电源部分，同时，控制部分电路板16安装控制部分和电源部分电路板17的电路动力部件的安装电路分别装载到壳体10中。电路部件布置在壳体10中的控制部件电路板16的上部，安装在母线盒11上。连接焊盘22设置在电源部件电路板17以及安装在母线盒11上的连接焊盘22和壳体端子30通过电线相互连接。版权所有（C）2005，JPO＆NCIPI

105. 发明专利

JP2005167238A Tape wiring board, semiconductor chip package using it, and display panel assembly using it 有权
标题翻译：胶带接线板，使用它的半导体芯片包装和显示面板组装使用它
公开(公告)号：JP2005167238A
公开(公告)日：2005-06-23
申请号：JP2004340201
申请日：2004-11-25
申请人： Samsung Electronics Co Ltd , 三星電子株式会社
发明人： PARK SANG HO , KANG SA YOON , LEE SI-HOON
IPC分类号： H01L21/60 , G02F1/13 , G02F1/1345 , G09F9/00 , G09G3/00 , H01L21/56 , H01L21/58 , H01L23/12 , H01L23/48 , H01L23/498 , H05K1/14 , H05K3/36
CPC分类号： H01L23/49838 , G02F1/13452 , H01L21/563 , H01L23/4985 , H01L2924/0002 , H01L2924/12044 , H05K1/142 , H05K1/147 , H05K3/361 , H05K2201/09227 , H05K2201/10681 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a more small-sized tape wiring board, and to provide a semiconductor chip package using it.
SOLUTION: Input wiring 222, output wirings 223 and 224 and/or bypass wiring 225 are formed to pass through the inside of portion 226, where the semiconductor chip 241 is mounted on a base film 221. Thereby, the wiring pattern does not pass the outside of the semiconductor chip 241 along the outer contour of the base film 221, the circuit pattern is minimized, and the base film is small-sized.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供更小尺寸的胶带线路板，并提供使用它的半导体芯片封装。
解决方案：输入布线222，输出布线223和224和/或旁路布线225形成为穿过半导体芯片241安装在基膜221上的部分226的内部。由此，布线图案不沿着基膜221的外轮廓通过半导体芯片241的外部，电路图案被最小化，并且基膜是小尺寸的。版权所有（C）2005，JPO＆NCIPI

106. 发明专利

JP2004281120A Connecting structure of coaxial connector and multiple phase substrate 有权
公开(公告)号：JP2004281120A
公开(公告)日：2004-10-07
申请号：JP2003068205
申请日：2003-03-13
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： HIEDA HARUHIKO , ASAO HIDEKI
IPC分类号： H01R13/73 , H01P1/04 , H01P5/00 , H01P5/08 , H05K1/02 , H05K1/14 , H01R24/14 , H01R24/02
CPC分类号： H01R24/52 , H01P1/04 , H01P5/00 , H01P5/085 , H01R2103/00 , H05K1/0219 , H05K1/141 , H05K1/142
摘要： PROBLEM TO BE SOLVED: To provide a connecting structure of a substrate and a coaxial connector for extremely reducing a disorder of impedance resulting from a connecting portion between the coaxial connector and the substrate and extremely improving a disorder of impedance on a transmission line to assure a return-loss property excellent in a wide band.
SOLUTION: In the connecting structure of the substrate and the coaxial connector for electrically connecting a high-frequency substrate 20 and a coaxial connector 10 mounted on a conductive housing 1, an intermediate substrate 30 is disposed between the substrate 20 and the connector 10, and the substrate 20 is electrically connected to the connector 10 by the intermediate substrate 30.
COPYRIGHT: (C)2005,JPO&NCIPI

107. 发明专利

JP2004519087A Edge connection method and device between the elements of the integrated circuit 审中-公开
公开(公告)号：JP2004519087A
公开(公告)日：2004-06-24
申请号：JP2002503941
申请日：2001-06-15
申请人：株式会社アドバンテスト
发明人：セオドアコーリー
IPC分类号： H01L25/18 , G01R1/04 , G01R1/067 , G01R1/073 , H01L23/13 , H01L25/04 , H01R13/24 , H01R13/514 , H05K1/14 , H05K3/36
CPC分类号： H05K3/366 , H01L23/13 , H01L2224/48091 , H01L2924/10253 , H01R13/514 , H05K1/142 , H05K2201/048 , H05K2201/09172 , H05K2201/10446 , H05K2201/10568 , H05K2203/041 , H05K2203/049 , H05K2203/167 , H01L2924/00014 , H01L2924/00
摘要： An integrated circuit (IC) having a plurality of IC modules, each IC module having attachment surfaces to which elements of the IC are attached, and each IC module having interlocking edges adjacent to the attachment surface. The interlocking edges of adjacent IC modules are interlocked to form a structural connection between the IC modules. The interlocking edges are a plurality of teeth and recesses, which are arranged in rows. The teeth are securely received by a respective recess in an adjacent interlocking edge to create a structural connection between adjacent IC modules. In addition, the interlocking edges can be a ridge member or a ridge recess, where the ridge member or ridge recess is securely received by a respective ridge recess or ridge member of an adjacent IC module to create a structural connection between the IC modules. The interconnection edge can also be a combination of the ridge member, ridge recess, and/or the rows of teeth and recesses. The attachment surfaces of adjacent IC modules can be co-planar and non-planar, depending on the shape desired. The elements on the IC modules communicate using external pathways and/or internal pathways using conventional wire-bond techniques or using conductive layers within the IC module. The IC module is formed of conventional Si wafers. Using this configuration, an IC can be constructed that utilizes less real estate, fits in non-planar spaces in a housing, and has improved speed due to reduced pathway lengths.

108. 发明专利

JP3503677B2 Connection device connection method and the wiring board of the wiring board 失效
公开(公告)号：JP3503677B2
公开(公告)日：2004-03-08
申请号：JP3483797
申请日：1997-02-19
申请人：キヤノン株式会社
发明人：理一斎藤 , 育朋渡部
IPC分类号： B41J2/05 , B41J2/16 , H05K1/02 , H05K1/14 , H05K3/32 , H05K3/36
CPC分类号： H05K3/361 , B41J2/1601 , B41J2/1603 , B41J2/1623 , B41J2002/14362 , B41J2202/19 , H05K1/0269 , H05K1/142 , H05K3/323 , H05K2201/09781 , H05K2201/09918 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49155

109. 发明专利

JPS6159764A Cascaded connection structure of microwave leadless package 失效
标题翻译： MICROWAVE无铅封装的结构连接结构
公开(公告)号：JPS6159764A
公开(公告)日：1986-03-27
申请号：JP18137484
申请日：1984-08-30
申请人： Fujitsu Ltd
发明人： SUZUKI HIDETAKE
IPC分类号： H01L21/52 , H01L21/58 , H01L25/10 , H01L25/18 , H05K1/14 , H05K3/34 , H05K3/36
CPC分类号： H01L25/105 , H01L2225/1005 , H01L2924/0002 , H05K1/142 , H05K3/3478 , H05K3/36 , H01L2924/00
摘要： PURPOSE:To facilitate connection work by abutting the microwave leadless packages and engaging a metal segment with projections of strip line type terminals. CONSTITUTION:The projections 7 are formed on the strip line type terminals 5, 4, 5', 4'. The projections 7 are formed by connecting a small metal segment or lead wire to the strip line type terminal at the area 7' and then bending it. Next, the packages are abutted and connected with a metal segment 8 or 12. The segment 8 is provided with holes 9 in both sides and a solder preform 10 is fixed by the flux around the holes. After lapping the projections 7 with metal segment 8 or 11, these are heated to melt the solder for brazing.
摘要翻译：目的：通过邻接微波无引线封装并将金属段与带状端子的突起接合，便于连接工作。构成：突起7形成在带状线型端子5,5'，4'上。突起7通过将小的金属段或引线连接到区域7'处的带状端子，然后弯曲而形成。接下来，封装件与金属部分8或12邻接并连接。段8在两侧设置有孔9，并且焊料预成型件10由焊剂围绕孔固定。在用金属部分8或11研磨突起7之后，将它们加热熔化焊料以进行钎焊。

110. 发明专利

JPS59185401A High-frequency signal connection structure between printed boards 失效
标题翻译：打印板之间的高频信号连接结构
公开(公告)号：JPS59185401A
公开(公告)日：1984-10-22
申请号：JP5945083
申请日：1983-04-04
申请人： Fujitsu Ten Ltd
发明人： NAKADA KATSUYOSHI , ONISHI YASUHIDE , TANAKA KUNIJI
IPC分类号： H01P1/04 , H01P3/08 , H04B15/00 , H05K1/02 , H05K1/14
CPC分类号： H01P3/081 , H05K1/0237 , H05K1/142
摘要： PURPOSE:To reduce transmission loss and the number of parts and to facilitate connecting operation by connecting microstrip lines of two printed boards together in an abutting state. CONSTITUTION:High-frequency signal lines of the printed boards 12 and 14 are patterned on the boards 12 and 14 as microstrip lines 16 and 17, and the microstrip line 16 pierces a shield plate 11 and connected to the microstrip line 17 as if it were a single microstrip line. The shield plate 11 has an opening part 18 and a projection part 19 projecting toward the board 14 while piercing the opening part 18 is formed on the board 12. The end part of this projection part 19 abuts on the surface of the board 14 and the microstrip line 16 is extended to the abutting part 20. Further, the microstrip line 17 is extended to the abutting part 20 on the board 14, and the microstrip lines 16 and 17 contact each other through the abutting part 20.
摘要翻译：目的：减少传输损耗和部件数量，并通过将两个印刷电路板的微带线连接在一起，实现连接操作。构成：印刷电路板12和14的高频信号线作为微带线16和17在基板12和14上图案化，微带线16刺穿屏蔽板11，并连接到微带线17，如同它们一样单条微带线。屏蔽板11具有开口部18和朝向板14突出的突出部19，同时在板12上形成穿孔开口部18.该突起部19的端部抵接在板14的表面上，微带线16延伸到邻接部分20.此外，微带线17延伸到板14上的邻接部分20，并且微带线16和17通过邻接部分20彼此接触。

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