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91. 发明专利

JP2008506947A Pressure transducer having an external heater 有权
公开(公告)号：JP2008506947A
公开(公告)日：2008-03-06
申请号：JP2007521456
申请日：2005-04-25
申请人：ローズマウントインコーポレイテッド
发明人：サンド，ウェズリー・イー , シトラー，フレッド・シー , ノルト，クリスティーナ・エー , マッキンタイア，ジョン
IPC分类号： G01L21/00 , G01L19/06
CPC分类号： G01L19/0627
摘要：改良された圧力トランスデューサ（５０、７０、８０）が開示されている。トランスデューサ（５０、７０、８０）は、コネクタ、筐体、センサ部（５８）、およびセンサ部（５８）を加熱するために配置された外部ヒータ（３２、７６）を含む。いくつかの態様では、センサ部（５８）は、脆性材料からなるセンサを含み、センサ内部に充填したいかなる液も使用しない。その他の態様では、本発明は、非加熱高純度真空トランスデューサ（１０）の加熱使用に適合するキット（３０、５２、７２、８２）を含む。キット（３０、５２、７２、８２）は、コネクタ部（３６、８４）およびコネクタ部（３６、８４）に連結されたヒータ部（３２、７６）を含む。コネクタ部（３６、８４）はまた１個以上のインジケータ（５８）を含むことができる。

92. 发明专利

JP2007003449A Pressure sensor 有权
标题翻译：压力传感器
公开(公告)号：JP2007003449A
公开(公告)日：2007-01-11
申请号：JP2005186271
申请日：2005-06-27
申请人： Denso Corp , 株式会社デンソー
发明人： TANAKA HIROAKI
IPC分类号： G01L9/00
CPC分类号： G01L19/147 , G01L19/0627
摘要： PROBLEM TO BE SOLVED: To suppress fluctuation in sensor characteristic at a low temperature by deformation of a gel member for sealing a diaphragm rear face, in a pressure sensor of a diaphragm rear face sealing type.
SOLUTION: The pressure sensor comprises a sensor chip 10 that has a recessed part 13 in the rear face 12, a thin part on the front face 11 side as a diaphragm 14, and a piezoresistance 15 on the front face 11, a pedestal 20 that is joined to the rear face 12 of the sensor chip 10 and has a through hole 21 leading from the recessed part 13 to the diaphragm 14, and the gel member 30 that is filled in the through hole 21 and the recessed part 13 and protects the sensor chip 10. Pressure is introduced from the through hole 21 to the diaphragm 14 via the gel member 30, and a signal according to the pressure is outputted from the sensor chip 10. Ratio L/T of the diameter L of the through hole 21 to the thickness T of the pedestal 20 is 1
摘要翻译：要解决的问题：通过膜片后面密封型的压力传感器来抑制用于密封隔膜后表面的凝胶构件的低温下的传感器特性的波动。解决方案：压力传感器包括传感器芯片10，其在后表面12中具有凹入部分13，在作为隔膜14的正面11侧上的薄部分，以及前表面11上的压阻15，基座20，其与传感器芯片10的背面12接合，并且具有从凹部13导向隔膜14的通孔21，以及填充在通孔21和凹部13中的凝胶体30 并保护传感器芯片10.压力从通孔21经由凝胶部件30引入到膜片14，根据压力的信号从传感器芯片10输出。直径L的比率L / T 台座20的贯通孔21与台座20的厚度T在底座20中为1

93. 发明专利

JP2006266818A Pressure sensor device 有权
标题翻译：压力传感器装置
公开(公告)号：JP2006266818A
公开(公告)日：2006-10-05
申请号：JP2005084295
申请日：2005-03-23
申请人： Fuji Electric Device Technology Co Ltd , 富士電機デバイステクノロジー株式会社
发明人： KAMIYANAGI KATSUMICHI , SHINODA SHIGERU , ASHINO KIMIYASU , SAITO KAZUNORI
IPC分类号： G01L9/00 , H01L29/84
CPC分类号： G01L19/0627 , G01L19/0084 , G01L19/147 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2924/01322 , H01L2924/10253 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To reduce costs, improve long-term reliability, and improve the precision and reliability of measuring signals in a pressure sensor device. SOLUTION: A pressure sensor chip 41 including a diaphragm 45, a piezoresistive element, an amplification circuit, and various regulating circuits is connected to a pedestal member 42 so that the diaphragm 45 faces a through hole 46 of the pedestal member 42. The pedestal member 42 and a metal pipe member 43 are connected so that their through holes 46, 48 communicate with each other. A protective film 60 is formed so that the connection part between the pedestal member 42 and the metal pipe member 43 is covered. The metal pipe member 43 is glued to a resin case 44, and then a signal terminal 58 of the resin case 44 and the pressure sensor chip 41 are electrically connected through wire bonding 59, thereby forming a pressure sensor cell 100. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：降低成本，提高长期可靠性，提高压力传感器设备中测量信号的精度和可靠性。解决方案：包括隔膜45，压阻元件，放大电路和各种调节电路的压力传感器芯片41连接到基座构件42，使得隔膜45面向基座构件42的通孔46。基座构件42和金属管构件43被连接成使得它们的通孔46,48相互连通。形成保护膜60，使得基座构件42与金属管构件43之间的连接部分被覆盖。将金属管构件43胶合到树脂壳体44，然后树脂壳体44的信号端子58和压力传感器芯片41通过引线接合59电连接，从而形成压力传感器单元100.版权（C）2007，JPO＆INPIT

94. 发明专利

JP2006220456A Pressure sensor and its manufacturing method 审中-公开
标题翻译：压力传感器及其制造方法
公开(公告)号：JP2006220456A
公开(公告)日：2006-08-24
申请号：JP2005032090
申请日：2005-02-08
申请人： Denso Corp , 株式会社デンソー
发明人： WATANABE YOSHIFUMI
IPC分类号： G01L19/00
CPC分类号： G01L19/0627 , H01L2224/48137
摘要： PROBLEM TO BE SOLVED: To reduce the influence of a gel member on sensor characteristics and drips of the gel member, and achieve a structure suitable for the downsizing of a sensor in a relative pressure type pressure sensor, in which the back side of a sensor chip is sealed with the gel member. SOLUTION: The sensor chip 20, in which pressure is applied to its front side 20a and back side 20b, is fixed to a case 10 with the back side 20b facing the case 10. The case 10 is provided with a pressure introducing hole 13 for introducing pressure to the back side 20b of the sensor chip 20. In a relative pressure sensor 100, where the pressure introduction hole 13 is filled with a chip back side gel member 52 for sealing the back side 20b of the sensor chip 20, the chip back side gel member 52 has a two-layer structure, in which a first gel member 52a and a second gel member 52b are laminated, where the second gel member 52b is harder than the first gel member 52a and covers the first gel member 52a from the sensor chip 20 side. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了减少凝胶构件对凝胶构件的传感器特性和滴落的影响，并且实现适合于相对压力式压力传感器中的传感器的小型化的结构，其中背面的传感器芯片被凝胶部件密封。解决方案：将其背面20b与背面20b施加压力的传感器芯片20固定在壳体10上，背面20b与壳体10相对。壳体10设有压力引入孔13，用于将压力引入传感器芯片20的背面20b。在相对压力传感器100中，压力引入孔13填充有用于密封传感器芯片20的背面20b的芯片背面侧凝胶部件52 芯片背面凝胶部件52具有双层结构，其中第一凝胶部件52a和第二凝胶部件52b被层压，其中第二凝胶部件52b比第一凝胶部件52a硬，并且覆盖第一凝胶构件52a从传感器芯片20侧。版权所有（C）2006，JPO＆NCIPI

95. 发明专利

JP2006177859A Pressure sensor 审中-公开
标题翻译：压力传感器
公开(公告)号：JP2006177859A
公开(公告)日：2006-07-06
申请号：JP2004372941
申请日：2004-12-24
申请人： Denso Corp , 株式会社デンソー
发明人： UCHIDA KOJI , KATAYAMA NORIHIRO , HORIBA KEIJI
IPC分类号： G01L19/06
CPC分类号： G01L19/0627 , H01L2224/48247 , H01L2224/73265 , H01L2224/8592
摘要： PROBLEM TO BE SOLVED: To improve acid resistance without sacrificing a sensor characteristic, in a pressure sensor wherein a sensing element is mounted on a case and the sensing element and an electrical connection part are coated and protected by a protecting member. SOLUTION: This sensor is equipped with the sensing element 20 connected electrically to a terminal 30 insert-molded in the case 10, and the electrically-insulating protecting member 50 for coating and protecting the terminal 30 and the sensing element 20. The protecting member 50 has a structure laminating the first protecting member 51 comprising fluorine-containing rubber for coating the terminal 30 and its electrical connection part and the second protecting member 52 comprising fluorine-containing gel for coating the sensing element 20 and its electrical connection part. In addition, the third protecting member 53 having furthermore excellent acid resistance than the fluorine-containing gel is provided on the outside of the second protecting member 52 to coat the second protecting member 52. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提高耐酸性而不牺牲传感器特性，在感测元件安装在壳体上并且感测元件和电连接部分被保护构件涂覆和保护的压力传感器中。解决方案：该传感器配备有电连接到插入模制在壳体10中的端子30的感测元件20以及用于涂覆和保护端子30和感测元件20的电绝缘保护构件50。保护构件50具有将包含用于涂覆端子30的含氟橡胶的第一保护构件51及其电连接部分和包括用于涂覆感测元件20及其电连接部分的含氟凝胶的第二保护构件52的结构。另外，在第二保护部件52的外侧，设置具有比含氟凝胶更好的耐酸性的第三保护部件53，以覆盖第二保护部件52.权利要求（C）2006，JPO＆NCIPI

96. 发明专利

JP2006038538A Pressure sensor 有权
标题翻译：压力传感器
公开(公告)号：JP2006038538A
公开(公告)日：2006-02-09
申请号：JP2004216549
申请日：2004-07-23
申请人： Nagano Keiki Co Ltd , 長野計器株式会社
发明人： KANEKO YOSHIKAZU , WAKABAYASHI HIROSHI , YOKOYAMA TAKAYUKI
IPC分类号： G01L19/14 , B23K15/00
CPC分类号： G01L9/0051 , G01L19/0038 , G01L19/0627
摘要： PROBLEM TO BE SOLVED: To provide a pressure sensor of a high precision and reliability, excellent in corrosion resistance and at low cost.
SOLUTION: The pressure sensor 1 comprises the diaphragm 21, the bottom of which is thin-walled part 210 and the pressure introducing joint 10. For the diaphragm 21 the heat resistive steel of austenite precipitation hardening Fe-Ni with high mechanical strength is used, and for the pressure introducing joint 10 the comparatively inexpensive austenite stainless steel is used. The diaphragm 21 and the pressure introducing joint part 10 are integrally formed by welding. At this time the Ni content is appropriately adjusted. Therefore, the pressure sensor 1 is assured with the high precision and reliability, and also in the manufacture of the pressure sensor 1, the use amount of the heat resistant steel of austenite base precipitation hardening Fe-Ni can be saved to the necessary minimum. Because of the austenite stainless steel is excellent in corrosion resistance, the pressure sensor 1 can also measure the pressure of high corrosive fluid.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供高精度和可靠性的压力传感器，具有优异的耐腐蚀性和低成本。解决方案：压力传感器1包括隔膜21，其底部是薄壁部分210和压力引入接头10.对于隔膜21，具有高机械强度的奥氏体沉淀硬化Fe-Ni的耐热钢并且对于压力引入接头10，使用相对便宜的奥氏体不锈钢。隔膜21和压力引入接合部10通过焊接一体形成。此时，Ni含量适当调整。因此，以高精度和可靠性确保压力传感器1，并且在压力传感器1的制造中，可以将奥氏体析出硬化Fe-Ni的耐热钢的使用量节省至必要的最小值。由于奥氏体不锈钢具有优良的耐腐蚀性，所以压力传感器1还可以测量高腐蚀性液体的压力。版权所有（C）2006，JPO＆NCIPI

97. 发明专利

JP2006035423A Micromachining type device having integrated heater 有权
标题翻译：具有集成加热器的微型设备
公开(公告)号：JP2006035423A
公开(公告)日：2006-02-09
申请号：JP2005219367
申请日：2005-07-28
申请人： Robert Bosch Gmbh , ローベルトボツシユゲゼルシヤフトミツトベシユレンクテルハフツングRobert Bosch Gmbh
发明人： MUEHLHEIM RICHARD , WEHRMANN FRANK , LEPIDIS POLICHRONIS
IPC分类号： B81C99/00
CPC分类号： B81B7/0096 , B81B7/0012 , B81B2207/115 , G01L19/0092 , G01L19/0627
摘要： PROBLEM TO BE SOLVED: To prevent generation of corrosion of a sensor element other components on a sensor chip due to diffusion of corrosive components of a medium into gel. SOLUTION: An open loop control and/or a closed loop control can be performed so that the temperatures of micromachining type constitution elements 120 and 300 and/or a passivation material 160 surrounding the micromachining type constitution elements 120 and 300 may be set by heating elements 200, 210, 220, 230, 240 and 250. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了防止传感器元件由于介质的腐蚀性成分扩散到凝胶中而导致传感器芯片上的其它部件的腐蚀。解决方案：可以执行开环控制和/或闭环控制，使得可以设置微机械加工型构造元件120和300和/或包围微加工型构造元件120和300的钝化材料160的温度通过加热元件200,210,220,230,240和250.版权所有（C）2006，JPO＆NCIPI

98. 发明专利

JP2005524847A Pressure sensor assembly 审中-公开
公开(公告)号：JP2005524847A
公开(公告)日：2005-08-18
申请号：JP2004503909
申请日：2003-04-17
申请人：ローズマウントインコーポレイテッド
发明人：シットラー，フレッド，シー． , ノード，クリスティナ，エー． , ロモ，マーク，ジー．
IPC分类号： G01L19/14 , G01L1/00 , G01L9/00 , G01L19/06
CPC分类号： G01L19/147 , G01L19/0627
摘要：圧力センサ組立体（１００）は、センサ取付けブロック（１０４）に取付けられた細長い圧力センサ（１０２）を含む。保護要素膜（１２０）は、接触するプロセス流体から圧力センサを妨げるために細長い圧力センサ（１０２）を覆う。

99. 发明专利

JP2005221453A Pressure sensor 审中-公开
标题翻译：压力传感器
公开(公告)号：JP2005221453A
公开(公告)日：2005-08-18
申请号：JP2004031687
申请日：2004-02-09
申请人： Denso Corp , 株式会社デンソー
发明人： SAKAI MINEICHI , SUZUKI YASUTOSHI
IPC分类号： G01L9/00 , G01L9/06 , G01L19/00 , G01L19/06 , H01L29/84
CPC分类号： G01L9/0054 , G01L19/0627 , G01L19/0636
摘要： PROBLEM TO BE SOLVED: To suppress to the utmost invasion of a foreign matter from a through hole, in a pressure sensor formed by bonding a semiconductor substrate having a diaphragm for pressure detection onto a glass pedestal having the through hole as a pressure introduction hole.
SOLUTION: This pressure sensor S1 is equipped with the semiconductor substrate 10 where a diaphragm 14 as a thin wall part and a thick wall part 10a positioned on its periphery are formed, the glass pedestal 20 whose one surface 21 side is bonded to the thick wall part 10a of the semiconductor substrate 10, and the through hole 23 provided on the glass pedestal 20 so as to penetrate from the other surface 22 to one surface 21, for introducing a pressure from an opening part 23a on the other surface 22 side to the diaphragm 14 of the semiconductor substrate 10. The through hole 23 has a shape having the hole diameter narrowed gradually from one surface 21 side to the other surface 22 side of the glass pedestal 20.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了抑制异物从通孔的最大侵入，在通过将具有用于压力检测的隔膜的半导体基板结合到具有通孔的玻璃基座上的压力传感器中作为压力导入孔。解决方案：该压力传感器S1配备有半导体基板10，其中形成作为薄壁部分的隔膜14和位于其周边的厚壁部分10a，其一个表面21侧结合到的玻璃基座20 半导体衬底10的厚壁部分10a和设置在玻璃基架20上的通孔23从另一个表面22穿透到一个表面21，以从另一个表面22上的开口部分23a引入压力一侧到达半导体衬底10的隔膜14.通孔23具有从玻璃基座20的一个表面21侧到另一个表面22侧逐渐变窄的孔直径的形状。（C）2005 ，JPO＆NCIPI

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