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1. 发明公开

EP3388751A1 NATURAL COLD-SOURCE HEAT-DISSIPATION SYSTEM FOR VARIOUS DATA EQUIPMENT ROOMS 审中-公开
公开(公告)号：EP3388751A1
公开(公告)日：2018-10-17
申请号：EP16872226.2
申请日：2016-10-14
申请人： Guangdong Hi-1 New Materials Technology Research Institute Co., Ltd.
发明人： WANG, Wei
IPC分类号： F24F5/00 , F24F13/30 , F24F11/02
CPC分类号： H05K7/20827 , F24F1/42 , F24F5/0003 , F24F5/0035 , F24F11/83 , F24F13/30 , F28D5/00 , F28D15/0266 , F28D2021/0031 , G06F1/20 , G06F2200/201 , H05K7/20 , H05K7/20309 , H05K7/20318 , H05K7/20327 , H05K7/20345 , H05K7/20836
摘要： A natural cold-source heat-dissipation system for various data centers comprises an outdoor condenser (1), an indoor evaporator (2), and a thermal superconductive circulating device (3). An outlet of the outdoor condenser (1) is communicated with an inlet of the indoor evaporator (2) by means of the thermal superconductive circulating device (3), and an outlet of the indoor evaporator (2) is communicated with an inlet of the outdoor condenser (1) by means of a pipeline, so as to form a closed circulation system. The closed circulation system is filled with heat superconducting heat transfer working substance. The outdoor condenser (1) is an air-cooled condenser or a water-cooled condenser.

2. 发明授权

EP2438805B1 CONTAINER AIR HANDLING UNIT AND COOLING METHOD 有权转让
公开(公告)号：EP2438805B1
公开(公告)日：2018-10-10
申请号：EP10727583.6
申请日：2010-06-02
申请人： Schneider Electric IT Corporation
发明人： BEAN, John, H.
IPC分类号： H05K7/20
CPC分类号： H05K7/20745 , H05K7/20309 , H05K7/20318 , H05K7/20345 , H05K7/20354 , H05K7/2039 , H05K7/20827
摘要： A modular cooling system configured to treat IT air generated by a data center includes a frame and a plurality of cooling sub-system modules supported by the frame. The plurality of cooling sub-system modules are configured to operate in parallel to achieve total cooling effect or a lesser cooling effect with some level of redundancy within the data center. Each cooling sub-system module includes a housing configured to support cooling equipment, an air-to-air heat exchanger supported by the housing to cool IT air generated by the data center, the air-to-air heat exchanger having at least one tube configured to direct IT from one end of the air-to-air heat exchanger to an opposite end of the air-to-air heat exchanger and configured so that outdoor air circulates around the at least one tube, and a mechanical cooling system supported by the housing. The mechanical cooling system is configured to receive IT air treated by the air-to-air heat exchanger and to provide further cooling to the treated IT air. Other embodiments of the cooling system and methods of cooling are further disclosed.

3. 发明公开

EP2021898A1 LIQUID SUBMERSION COOLING SYSTEM 审中-公开
标题翻译：爱尔兰EINEFLÜSSIGKEIT的KÜHLSYSTEMMITTELS EINTAUCHEN
公开(公告)号：EP2021898A1
公开(公告)日：2009-02-11
申请号：EP07762156.3
申请日：2007-05-14
申请人： Hardcore Computer, Inc.
发明人： ATTLESEY, Chad, Daniel , KLUM, R., Daren , BERNING, Allen, James
IPC分类号： G06F1/20
CPC分类号： G06F1/20 , G06F2200/201 , H01L2924/0002 , H05K7/20236 , H05K7/20263 , H05K7/20345 , H05K7/20772 , Y10S165/908 , H01L2924/00
摘要： A portable, self-contained liquid submersion cooling system that is suitable for cooling a number of electronic devices, including cooling heat-generating components in computer systems and other systems that use electronic, heat-generating components. The electronic device includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid, and a pump for pumping the liquid into and out of the space, to and from a heat exchanger that is fixed to the housing outside the interior space. The heat exchanger includes a cooling liquid inlet, a cooling liquid outlet, and a flow path for cooling liquid therethrough from the cooling liquid inlet to the cooling liquid outlet. An air-moving device such as a fan can be used to blow air across the heat exchanger to increase heat transfer.
摘要翻译：一种便携式，独立的液体浸没冷却系统，其适用于冷却许多电子设备，包括计算机系统中的冷却发热组件和使用电子，发热组件的其他系统。电子设备包括具有内部空间的壳体，内部空间中的介电冷却液体，设置在该空间内并浸没在介电冷却液体中的发热电子部件，以及用于将液体泵入和流出的泵空间，来往和从与内部空间外部的壳体固定的热交换器。热交换器包括冷却液入口，冷却液出口和用于冷却从冷却液入口到冷却液出口的液体的流路。可以使用诸如风扇的空气移动装置将空气吹过热交换器以增加热传递。

4. 发明公开

EP1714536A1 THREE DIMENSIONAL PACKAGING AND COOLING OF MIXED SIGNAL, MIXED POWER DENSITY ELECTRONIC MODULES 审中-公开
标题翻译：三级封装和电子模块的带混合信号和混合功率密度冷却
公开(公告)号：EP1714536A1
公开(公告)日：2006-10-25
申请号：EP05712513.0
申请日：2005-01-26
申请人： Isothermal Systems Research, Inc.
发明人： TILTON, Donald, E. , TILTON, Charles, L.
IPC分类号： H05K7/20
CPC分类号： H01L23/4735 , H01L2924/0002 , H05K7/20345 , H01L2924/00
摘要： An integrated three dimensional packaging and cooling system for cooling an electronic component system with dissimilar power densities and interfering signals.

5. 发明公开

EP0954733A1 APPARATUS AND METHOD FOR SPRAY-COOLING AN ELECTRONIC MODULE 无效
标题翻译： DEVICE AND METHOD FOR的电子喷雾冷却单元
公开(公告)号：EP0954733A1
公开(公告)日：1999-11-10
申请号：EP97906430.0
申请日：1997-01-24
申请人： MOTOROLA, INC.
发明人： BALLARD, Gerald, W. , TUROCY, James, W. , BEISE, Thomas, R.
IPC分类号： F25D1 , F25D7 , H01L23 , H05K7
CPC分类号： H05K7/20345 , H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要： The apparatus includes a plate (10) having a first layer (12) and a second layer (14) opposed to the first layer (12). The second layer (14) includes a first substrate. A fluid distributing manifold (28) is disposed proximate the first layer (12). A nozzle housing (30) having an aperture (36) is disposed in the first fluid distributing manifold (28).

6. 发明公开

EP0817263A2 Liquid cooling system for LSI packages 失效
标题翻译： FlüssigkeitskühlsystemfürLSI-Verpackungen
公开(公告)号：EP0817263A2
公开(公告)日：1998-01-07
申请号：EP97114551.1
申请日：1991-10-11
申请人： NEC CORPORATION
发明人： Mizuno, Tsukasa , Miyazaki, Hirokazo , Umezawa, Kazuhiko
IPC分类号： H01L23/473
CPC分类号： H01L23/4735 , H01L23/427 , H01L23/4336 , H01L2224/16 , H05K7/20345 , Y10S165/908
摘要： In a liquid cooling system for a printed circuit board (1) on which integrated circuit packages (2) are mounted, heat sinks (3) are secured respectively to the packages in heat transfer contact therewith. Nozzles (8) are provided in positions corresponding to the heat sinks. A housing (5) is tightly sealed to the printed circuit board to enclose the packages, heat sinks and nozzles in a cooling chamber. A feed pump (12) pressurizes working liquid cooled by a heat exchanger (11)and supplies the pressurized liquid to the nozzles for ejecting liquid droplets to the heat sinks. A liquid suction pump (15) is connected to an outlet (9) of the housing for draining liquid coolant to the heat exchanger. A vapour suction pump (32) can be connected to a second outlet (30) of the housing for sucking vaporized coolant to the heat exchanger. The cooling chamber is maintained at a sub-atmospheric pressure to promote nucleate boiling of the working liquid by means of a pressure regulating system controlling the pumping and responsive to liquid flow. In an alternative embodiment (Figure 7) liquid is sucked in through nozzles adjacent the heat sinks.
摘要翻译：在其上安装有集成电路封装（2）的印刷电路板（1）的液体冷却系统中，散热器（3）分别固定在封装上，与其传热接触。喷嘴（8）设置在与散热器对应的位置。壳体（5）紧密地密封到印刷电路板上，以将包装，散热器和喷嘴封闭在冷却室中。供给泵（12）对由热交换器（11）冷却的工作液体加压，并将加压液体供应到用于将液滴喷射到散热器的喷嘴。液体抽吸泵（15）连接到壳体的出口（9），用于将液体冷却剂排出到热交换器。蒸汽抽吸泵（32）可以连接到壳体的第二出口（30），用于将蒸发的冷却剂吸入热交换器。冷却室保持在亚大气压下，以通过控制泵送并响应于液体流动的压力调节系统来促进工作液体的核沸腾。在替代实施例（图7）中，液体通过与散热器相邻的喷嘴被吸入。

7. 发明公开

EP0480750A3 Liquid cooling system for LSI packages 失效
标题翻译：用于LSI封装的液体冷却系统
公开(公告)号：EP0480750A3
公开(公告)日：1993-05-05
申请号：EP91309381.1
申请日：1991-10-11
申请人： NEC CORPORATION
发明人： Mizuno, Tsukasa, c/o NEC Corporation , Miyazaki, Hirokazo, c/o NEC Corporation , Umezawa, Kazuhiko, c/o NEC Corporation
IPC分类号： H01L23/473 , H01L23/44 , H01L23/427
CPC分类号： H01L23/4735 , H01L23/427 , H01L23/4336 , H01L2224/16 , H05K7/20345 , Y10S165/908
摘要： In a liquid cooling system for a printed circuit board (1) on which integrated circuit packages (2) are mounted, heat sinks (3) are secured respectively to the packages in heat transfer contact therewith. Nozzles (8) are provided in positions corresponding to the heat sinks. A housing (5) is tightly sealed to the printed circuit board to enclose the packages, heat sinks and nozzles in a cooling chamber. A feed pump (12) pressurizes working liquid cooled by a heat exchanger (11) and supplies the pressurized liquid to the nozzles for ejecting liquid droplets to the heat sinks. A liquid suction pump (15) is connected to an outlet (9) of the housing for draining liquid coolant to the heat exchanger. A vapour suction pump (32) can be connected to a second outlet (30) of the housing for sucking vaporized coolant to the heat exchanger. The cooling chamber is maintained at a sub-atmospheric pressure to promote nucleate boiling of the working liquid by means of a pressure regulating system controlling the pumping and responsive to liquid flow. In an alternative embodiment (Figure 7) liquid is sucked in through nozzles adjacent the heat sinks.

8. 发明公开

EP0091733A1 Cooling module for use in a circuit board array 失效
标题翻译：米特埃纳特莱特广场bra areKühlvorrichtung。
公开(公告)号：EP0091733A1
公开(公告)日：1983-10-19
申请号：EP83301309.7
申请日：1983-03-09
申请人： BICC-Vero Electronics Limited
发明人： Bell, David Leslie
IPC分类号： H05K7/20
CPC分类号： H05K7/20345
摘要： In a circuit board installation in which circuit boards 24 are slidably mounted in opposed guide rails 22 of a rack 21 in a cabinet 20, an efficient and relatively inexpensive flat cooling module 1 is slidably mounted in opposed guide rails between two circuit boards. The cooling module 1 comprises a pair of flat side walls 2 spaced apart and sealed together around their edges to form a sealed chamber 6, an inlet port (not shown) connected to a source of pressurised cooling fluid and, in each of the side walls, mutually spaced orifices 12, in which nipples 14 may be fitted, through which pressurised cooling fluid is directed towards components 25 of the adjacent circuit boards 24.
摘要翻译：在电路板安装中，电路板24可滑动地安装在机柜20中的齿条21的相对的导轨22中，有效且相对便宜的平板冷却模块1可滑动地安装在两个电路板之间的相对的导轨中。冷却模块1包括一对间隔开并围绕它们的边缘密封在一起的平坦侧壁2以形成密封室6，连接到加压冷却流体源的入口端口（未示出），并且在每个侧壁相互间隔开的孔12，其中乳头14可以被装配，加压的冷却流体通过该口连接到相邻的电路板24的部件25。

9. 发明公开

EP3162174A1 DATACENTER IMMERSED IN COOLING LIQUID 有权
标题翻译： DATACENTER浸入冷却液中
公开(公告)号：EP3162174A1
公开(公告)日：2017-05-03
申请号：EP15739707.6
申请日：2015-06-26
申请人： Microsoft Technology Licensing, LLC
发明人： JAMES, Sean , RAWLINGS, Todd Robert
IPC分类号： H05K7/14 , H05K7/20
CPC分类号： H05K7/20818 , H01L23/427 , H01L23/473 , H05K7/203 , H05K7/20327 , H05K7/20345 , H05K7/2079 , H05K7/20809
摘要： The subject disclosure is directed towards a datacenter or partial datacenter (e.g., a datacenter module) contained in a sealed container. The container may be filled with a cooling fluid, such as a dielectric fluid, to help cool the datacenter components. The container and its internal datacenter or datacenter portion may be submerged in water, in which event the fluid also helps to equalize the external water pressure.
摘要翻译：本发明涉及容纳在密封容器中的数据中心或部分数据中心（例如，数据中心模块）。容器可以填充有冷却流体，例如电介质流体，以帮助冷却数据中心部件。容器及其内部数据中心或数据中心部分可以浸没在水中，在这种情况下，流体也有助于平衡外部水压。

10. 发明授权

EP2242345B1 Method and apparatus for cooling electronic components 有权
标题翻译：方法和设备冷却电子积木
公开(公告)号：EP2242345B1
公开(公告)日：2014-09-10
申请号：EP10006953.3
申请日：2002-05-16
申请人： Cray Inc.
发明人： Pautsch, Gregory W.
IPC分类号： H05K7/20 , H01L23/473 , H01L23/433 , C08K5/04
CPC分类号： H05K7/20345 , H01L23/4735 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , Y10T29/4935 , H01L2924/00

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