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1. 发明公开

EP3214390A4 REFRIGERANT SUPPLY DEVICE, COOLING DEVICE, AND COOLING SYSTEM 有权转让
公开(公告)号：EP3214390A4
公开(公告)日：2018-08-01
申请号：EP15851419
申请日：2015-10-14
申请人： NEC PLATFORMS LTD
发明人： HOSAKA TADAO
IPC分类号： F25B41/00 , F25B23/00 , F28D15/02 , G06F1/20 , H05K7/20
CPC分类号： H05K7/20818 , F25B23/006 , F28D15/02 , F28F9/0204 , G06F1/20 , H05K7/20 , H05K7/20327
摘要： [Problem] A refrigerant supply device with a small lateral width and a capacity to supply refrigerant evenly among heat receivers disposed in multiple tiers needs to be provided. [Solution] A refrigerant supply device for distributing, by force of gravity, liquid phase refrigerant to heat receivers disposed in a plurality of tiers includes: a first conduit for supplying the refrigerant to the heat receivers; a second conduit provided in parallel with the first conduit; a first aperture provided in the first conduit for supplying the refrigerant to one of the heat receivers; a first blocking means provided below the first aperture for blocking the first conduit; a first communication opening provided above the first aperture and communicating the first conduit and the second conduit; a second communication opening provided below the first blocking means and communicating the first conduit and the second conduit; and a second blocking means provided below the second communication opening for blocking the second conduit.

2. 发明授权

EP2787801B1 RACK FOR ELECTRONIC EQUIPMENT, AND INFORMATION PROCESSING DEVICE 有权
标题翻译： GESTELLFÜRELEKTRONISCHE VORRICHTUNG UND INFORMATIONSVERARBEITUNGSVORRICHTUNG
公开(公告)号：EP2787801B1
公开(公告)日：2017-04-12
申请号：EP11876495.0
申请日：2011-12-01
申请人： Fujitsu Limited
发明人： KONDO, Masao , FUKUDA, Hiroyuki , UMEMIYA, Shigeyoshi , ENDO, Hiroshi
IPC分类号： H05K7/20 , G06F1/20
CPC分类号： H05K7/20736 , G06F1/206 , G06F2200/201 , H05K7/20818 , H05K7/20836 , Y02D10/16
摘要： [Problem] To provide an electronic device rack and an information processing apparatus capable of efficiently cooling electronic devices even when the amount of heat generated per rack reaches 30 kW or larger. [Solving Means] An electronic device rack 10 includes a plurality of panels 10a, 10b, 10c, ... surrounding a first space. Moreover, the electronic device rack 10 includes: an electronic-device housing unit 11 disposed in the first space and configured to house electronic devices 15; a heat exchanger 12 disposed in the first space at a position away from the electronic-device housing unit 11; a second space 21 provided between the electronic-device housing unit 11 and the heat exchanger 12 and isolated from the rest of the first space; and an air blower 13 configured to circulate air inside the first space through the electronic-device housing unit 11, the second space 21, and the heat exchanger 12 in the described order.
摘要翻译： [问题]即使当每个机架产生的热量达到30kW或更大时，提供一种能够有效地冷却电子设备的电子设备机架和信息处理设备。电子装置架10包括围绕第一空间的多个面板10a，10b，10c，...。此外，电子设备机架10包括：电子设备容纳单元11，其设置在第一空间中并构造成容纳电子设备15; 设置在远离电子设备壳体单元11的位置处的第一空间中的热交换器12; 设置在电子设备容纳单元11和热交换器12之间并与第一空间的其余部分隔离的第二空间21; 以及鼓风机13，其构造成以所述顺序通过电子设备容纳单元11，第二空间21和热交换器12使第一空间内的空气循环。

3. 发明公开

EP2927778A4 COOLING SYSTEM FOR ELECTRONIC EQUIPMENT STORAGE DEVICE AND COOLING SYSTEM FOR ELECTRONIC EQUIPMENT STORAGE FACILITY 审中-公开
标题翻译：冷却系统的电子设备和冷却系统的存储装置中的电子设备的存储设备
公开(公告)号：EP2927778A4
公开(公告)日：2016-08-03
申请号：EP13860412
申请日：2013-12-03
申请人： NEC CORP
发明人： INABA KENICHI , YOSHIKAWA MINORU , SAKAMOTO HITOSHI , SHOUJIGUCHI AKIRA , MATSUNAGA ARIHIRO , CHIBA MASAKI
IPC分类号： G06F1/20 , F24F5/00 , F28D15/02 , F28D15/06 , H05K7/20
CPC分类号： H05K7/20818 , F28D15/0266 , F28D15/06 , G06F1/20 , H05K7/20736 , H05K7/20809
摘要： A cooling system of an electronic device storing apparatus of the present invention comprises: a rack including an electronic device and a plurality of placement shelves to place the electronic device; in the rack, a vaporizer having a refrigerant internally being mounted; outside the rack, a condensing part connected with the vaporizer by a laying pipe being installed; and a refrigerant adjustment means for adjusting a height of a refrigerant surface in the vaporizer.

4. 发明公开

EP2787801A4 RACK FOR ELECTRONIC EQUIPMENT, AND INFORMATION PROCESSING DEVICE 有权
标题翻译：框架电子设备和信息处理设备
公开(公告)号：EP2787801A4
公开(公告)日：2016-01-06
申请号：EP11876495
申请日：2011-12-01
申请人： FUJITSU LTD
发明人： KONDO MASAO , FUKUDA HIROYUKI , UMEMIYA SHIGEYOSHI , ENDO HIROSHI
IPC分类号： H05K7/20 , G06F1/20
CPC分类号： H05K7/20736 , G06F1/206 , G06F2200/201 , H05K7/20818 , H05K7/20836 , Y02D10/16
摘要： [Problem] To provide an electronic device rack and an information processing apparatus capable of efficiently cooling electronic devices even when the amount of heat generated per rack reaches 30 kW or larger. [Solving Means] An electronic device rack 10 includes a plurality of panels 10a, 10b, 10c, ... surrounding a first space. Moreover, the electronic device rack 10 includes: an electronic-device housing unit 11 disposed in the first space and configured to house electronic devices 15; a heat exchanger 12 disposed in the first space at a position away from the electronic-device housing unit 11; a second space 21 provided between the electronic-device housing unit 11 and the heat exchanger 12 and isolated from the rest of the first space; and an air blower 13 configured to circulate air inside the first space through the electronic-device housing unit 11, the second space 21, and the heat exchanger 12 in the described order.

5. 发明公开

EP2734021A1 COOLING DEVICE AND INSTRUMENT ACCOMMODATION DEVICE USING SAME 有权
标题翻译：南非国立大学教科文组织
公开(公告)号：EP2734021A1
公开(公告)日：2014-05-21
申请号：EP12815511.6
申请日：2012-07-05
申请人： NEC Corporation
发明人： INABA, Kenichi , YOSHIKAWA, Minoru , SAKAMOTO, Hitoshi , CHIBA, Masaki , MATSUNAGA, Arihiro
IPC分类号： H05K7/20 , G06F1/20
CPC分类号： H05K7/20309 , F28D15/0266 , G06F1/20 , G06F2200/201 , H05K7/20318 , H05K7/20727 , H05K7/20818
摘要： A cooling system comprising: an evaporator for evaporating a refrigerant by performing heat exchange with outside air; a condenser for condensing a gas refrigerant into a liquid refrigerant by making a refrigerant and a cooling medium perform heat exchange with each other; a gas refrigerant pipe and a liquid refrigerant pipe connecting the evaporator and the condenser; and the evaporator including: an upper part header provided in a highest position of the evaporator, and connected with the condenser by the gas refrigerant pipe, through the gas refrigerant pipe a gas refrigerant flowing; a lower part header provided in a lowest position of the evaporator, and connected with the condenser by the liquid refrigerant pipe, through the liquid refrigerant pipe a liquid refrigerant flowing; a middle header provided in an intermediate position between the upper part header and the lower part header, and connected with the condenser by the liquid refrigerant pipe, through the liquid refrigerant pipe the liquid refrigerant flowing; an upper part evaporator, arranged between the upper part header and the middle header, including an upper part steam generating tube having a first flow path for leading a refrigerant of the middle header to the upper part header while making the refrigerant of the middle header perform heat exchange with outside air and having a second flow path for leading a refrigerant of the lower part header to the upper part header while making the refrigerant of the lower part header perform heat exchange with outside air; and a lower part evaporator, arranged between the lower part header and the middle header, including a lower part steam generating tube having a third flow path inserted into the middle header while making a refrigerant of the lower part header perform heat exchange with outside air, the lower part steam generating tube communicated with the second flow path of the upper part steam generating tube.
摘要翻译：一种冷却系统，包括：用于通过与外部空气进行热交换来蒸发制冷剂的蒸发器; 冷凝器，其通过使制冷剂和冷却介质彼此进行热交换而将气态制冷剂冷凝成液体制冷剂; 连接蒸发器和冷凝器的气体制冷剂管和液体制冷剂管; 所述蒸发器包括：设置在所述蒸发器的最高位置的上部集管，并且通过所述气体制冷剂管与所述冷凝器连接，所述气体制冷剂管通过所述气体制冷剂流动; 设置在蒸发器的最低位置的下部集管，并且通过液体制冷剂管与冷凝器连接，通过液体制冷剂管流动液体制冷剂; 中间集管，设置在上部集管和下部集管之间的中间位置，并通过液体制冷剂管与冷凝器连接，通过液体制冷剂管流动液体制冷剂; 上部蒸发器，布置在上部集管和中间集管之间，包括上部蒸汽发生管，其具有用于将中间集管的制冷剂引导到上部集管的第一流动路径，同时使中间集管的制冷剂执行与外部空气进行热交换，并且具有用于将下部集管的制冷剂导向上部集管的第二流路，同时使下部集管的制冷剂与外部空气进行热交换; 以及下部蒸发器，设置在下部集管和中间集管之间，包括下部蒸汽发生管，其具有插入中间集管的第三流路，同时使下部集管的制冷剂与外部空气进行热交换，下部蒸汽发生管与上部蒸汽发生管的第二流路连通。

6. 发明公开

EP2681979A1 KÜHLEINRICHTUNG, INSBESONDERE KLIMATISIERUNGSEINRICHTUNG FÜR EINE COMPUTERANLAGE 有权
标题翻译：冷却装置，尤其是冷却装置的计算机系统
公开(公告)号：EP2681979A1
公开(公告)日：2014-01-08
申请号：EP12701449.6
申请日：2012-01-20
申请人： MAUL, Martin
发明人： MAUL, Martin
IPC分类号： H05K7/20
CPC分类号： H05K7/20818 , H05K7/20745 , H05K7/20827
摘要： The invention relates to a cooling device, in particular an air-conditioning unit for an electrical device, in particular a computer system, wherein the electrical device, in particular the computer system, is housed in a closed or enclosed space and the electrical device, in particular the computer system, comprises at least one frame, in particular a 19" rack, that holds at least one electrical component, in particular a computer, wherein the cooling device comprises at least one evaporator, one compressor and one condenser. The cooling device is characterised in that the compressor and the condenser are arranged outside the closed or enclosed space, preferably in an external unit, and the evaporator is arranged inside the frame, in particular the 19" rack, preferably in a lateral wall, and the evaporator is designed in a redundant configuration in a single housing.

7. 发明公开

EP2586281A2 SPACE-SAVING HIGH-DENSITY MODULAR DATA CENTER AND AN ENERGY-EFFICIENT COOLING SYSTEM 有权
标题翻译： PLTZSPARENDES，HOCHDICHTES，MODULARES DATENCENTER UND ENERGIEEFFIZIENTESKÜHLSYSTEM
公开(公告)号：EP2586281A2
公开(公告)日：2013-05-01
申请号：EP11764370.0
申请日：2011-06-23
申请人： Inertech IP LLC
发明人： KEISLING, Earl , COSTAKIS, John , McDONNELL, Gerald
IPC分类号： H05K7/20
CPC分类号： H05K7/20827 , F25B49/00 , F25D17/00 , F28D15/00 , G06F1/20 , H01L23/34 , H01L23/473 , H01L2924/0002 , H05K7/20218 , H05K7/20754 , H05K7/20763 , H05K7/20781 , H05K7/20818 , H01L2924/00
摘要： A space-saving, high-density modular data pod system and an energy-efficient cooling system are disclosed. The modular data pod system includes a central free-cooling system and a plurality of modular data pods, each of which includes a heat exchange assembly coupled to the central free-cooling system, and a distributed mechanical cooling system coupled to the heat exchange assembly. The modular data pods include a data enclosure having at least five walls arranged in the shape of a polygon, a plurality of computer racks arranged in a circular or U-shaped pattern, and a cover to create hot and cold aisles, and an air circulator configured to continuously circulate air between the hot and cold aisles. Each modular data pod also includes an auxiliary enclosure containing a shared fluid and electrical circuit section that is configured to connect to adjacent shared fluid and electrical circuit sections to form a shared fluid and electrical circuit that connects to the central free-cooling system. The auxiliary enclosure contains at least a portion of the distributed mechanical cooling system, which is configured to trim the cooling performed by the central free-cooling system.
摘要翻译：公开了一种节省空间的高密度模块化数据盒系统和节能冷却系统。模块化数据盒系统包括中央自由冷却系统和多个模块化数据盒，每个模块化数据盒包括耦合到中央自由冷却系统的热交换组件和耦合到热交换组件的分布式机械冷却系统。模块化数据盒包括具有布置成多边形形状的至少五个墙壁的数据外壳，以圆形或U形图案布置的多个计算机机架和用于产生热和冷通道的盖子，以及空气循环器被配置为在热通道和冷通道之间连续地循环空气。每个模块化数据盒还包括包含共享流体和电路部分的辅助外壳，其配置成连接到相邻的共享流体和电路部分，以形成连接到中央自由冷却系统的共用流体和电路。辅助外壳包含分布式机械冷却系统的至少一部分，其被配置为修剪由中央自由冷却系统执行的冷却。

8. 发明公开

EP2397019A1 AN ELECTRONIC EQUIPMENT CABINET 审中-公开
标题翻译：住房的电子器件
公开(公告)号：EP2397019A1
公开(公告)日：2011-12-21
申请号：EP09839845.6
申请日：2009-11-05
申请人： Cool Door Pty Ltd
发明人： GEE, Bernard, Michael , VOSPER, Shaun, Andrew
IPC分类号： H05K5/00 , H05K7/20
CPC分类号： H05K7/20818
摘要： There is provided an electronic equipment cabinet including a cabinet carcass (15) mounting fan cooled equipment (16) venting to the cabinet rear. A hinged front closure assembly (11) includes a frame (14) and an outer filter and perforated metal screen assembly on the outer face of the frame, and a lower condensation trap (20). The frame 14 supports an evaporator assembly (11) connected to a remote compressor/condenser assembly (not shown). The evaporator assembly includes a combined dew point sensor and thermostat (13). A non-woven filter web (19) acts a micro-droplet catcher on the inner face of the door assembly.

9. 发明公开

EP2257147A1 Kühlgerät 有权
公开(公告)号：EP2257147A1
公开(公告)日：2010-12-01
申请号：EP09011455.4
申请日：2009-09-08
申请人： Pfannenberg GmbH
发明人： Pfannenberg, Andreas
IPC分类号： H05K7/20
CPC分类号： H05K7/20836 , H05K7/20818
摘要： Bei einem Kühlgerät (100) für ein Gehäuse mit Abwärme erzeugenden Bauteilen, wie Elektronik-Schrank, Schaltschrank (10), Gehäusesysteme oder Computersysteme, soll eine effektive Kühlung bei deutlich geringerem Energieverbrauch erreicht werden. Dies wird erreicht durch ein mit vorgegebener Kühltemperatur arbeitendes passives Kühlsystem (11), und ein bei Überschreiten der vorgegebener Kühltemperatur des passiven Kühlsystems (11) einschaltbares, auf die vorgegebene Kühltemperatur herunterschaltbares aktives Kühlsystem (12), wobei beide Kühlsysteme (11, 12) in einem Kühlgerätegehäuse (13) untergebracht sind.
摘要翻译：设备（100）具有在预定冷却温度下操作的被动冷却单元（11）。当被动冷却单元的预定冷却温度超过以降低被动冷却单元的冷却温度时，主动冷却单元（12）接通。冷却单元容纳在冷却装置壳体（13）中。被动冷却单元包括具有液体冷却剂的冷却回路（K1）水或乙二醇混合物，并且主动冷却单元包括另一冷却回路（K2）与另一冷却剂即制冷剂。

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