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1. 发明公开

EP2801123A1 PRINTED CIRCUIT BOARD WITH REDUCED CROSS-TALK 审中-公开
标题翻译：具有降低副作用SPEAK电路板
公开(公告)号：EP2801123A1
公开(公告)日：2014-11-12
申请号：EP12864500.9
申请日：2012-11-01
申请人： Cray Inc.
发明人： KIM, Hyunjun , CONGER, Jeffrey Scott , SCOTT, Gregory Erwin
IPC分类号： H01P1/00
CPC分类号： H05K1/0225 , H05K1/0219 , H05K1/0222 , H05K1/0245 , H05K1/0298 , H05K1/114 , H05K1/115 , H05K3/4007 , H05K3/42 , H05K2201/093 , H05K2201/09336 , H05K2201/09609 , H05K2201/09618 , Y10T29/49155 , Y10T29/49165
摘要： A multi-layer printed circuit board has a number of landing pads that are configured to engage a connector secured thereto. Between the landing pads associated with different signals is at least one micro via that is electrically connected to a ground plane on an outer surface of the multi-layer printed circuit board, and a ground plane on an inner layer of the multi-layer printed circuit board.

2. 发明授权

EP1141825B1 METHOD AND SYSTEM FOR IDENTIFYING LOCATIONS TO MOVE PORTIONS OF THE COMPUTER PROGRAM 有权
标题翻译：方法和系统用于识别指向一个计算机程序的移动部件
公开(公告)号：EP1141825B1
公开(公告)日：2013-04-17
申请号：EP99968955.7
申请日：1999-12-22
申请人： Cray Inc.
发明人： CALLAHAN, Charles, David, II , KOBLENZ, Brian, D.
IPC分类号： G06F9/45
CPC分类号： G06F8/433 , G06F8/443 , G06F8/445

3. 发明公开

EP1204302A1 Flexible connector for high density circuit applications 审中-公开
标题翻译： Flexibler VerbinderfürSchaltungsanwendungen mit hoher Dichte
公开(公告)号：EP1204302A1
公开(公告)日：2002-05-08
申请号：EP01410148.9
申请日：2001-11-05
申请人： Cray Inc.
发明人： Yatskov, Alexander I. , Hellriegel, Stephen V.R.
IPC分类号： H05K1/11 , H05K3/36 , H01R12/12
CPC分类号： H01R12/62 , H05K1/11 , H05K3/243 , H05K3/28 , H05K3/365 , H05K3/4007 , H05K3/42 , H05K2201/0367 , H05K2201/0373 , H05K2201/0949
摘要： The flexible connector for high density circuit applications comprises a multi-layer flexible substrate (10) upon which are formed a plurality of contact pads (12), in a density required by a particular application. This density may exceed two hundred contact pads per square inch. Contact pads (38) of similar size and configuration are formed on the surface of another device, i.e., circuit board (40), and provision made to align the contact pads (12) of the connector with those (38) of the circuit board (40). Micro-pads (20) are formed on the surface of the contact pads (12) on the connector such, that when the connector is brought into contact with the circuit board (40), and sufficient pressure is applied, the micro-pads (20) make actual electrical contact with the pads (38) of the circuit board (40). Since the total surface area in contact, namely the sum of the surface areas of the micro-pads (20), is a small fraction of the total area of the connector, a large pressure is provided at the electrical contact interface even when low pressure is provided to the connector as a whole.
摘要翻译：用于高密度电路应用的柔性连接器包括多层柔性基板（10），其上形成有特定应用所需的密度的多个接触焊盘（12）。该密度可能超过每平方英寸200个接触垫。具有相似尺寸和结构的接触垫（38）形成在另一装置（即，电路板（40））的表面上，并且使连接器的接触焊盘（12）与电路板（38）的对准（40）。在连接器上的接触焊盘（12）的表面上形成微焊盘（20），当连接器与电路板（40）接触并施加足够的压力时，微焊盘 20）与电路板（40）的焊盘（38）实际电接触。由于接触的总表面积，即微焊盘（20）的表面积的总和是连接器总面积的一小部分，所以即使在低接触面处也提供了大的压力作为整体提供给连接器。

4. 发明公开

EP3334259A1 PCB TRANSMISSION LINES HAVING REDUCED LOSS 审中-公开
公开(公告)号：EP3334259A1
公开(公告)日：2018-06-13
申请号：EP17205368.8
申请日：2017-12-05
申请人： Cray Inc.
发明人： BECKER, Andy
IPC分类号： H05K1/02 , H01P3/08
CPC分类号： H05K1/0224 , H01P3/026 , H01P11/003 , H05K1/0219 , H05K1/0237 , H05K1/025 , H05K3/22 , H05K2201/093 , H05K2203/0307
摘要： Signal transmission structures within a printed circuit are formed to have reduced loss by making specific accommodations to reduce the surface roughness of an adjacent power plane (14), and thereby reducing the effects of magnetically induced currents. The power plane structure will retain sufficient surface roughness to accommodate manufacturing operations, while also contributing to reduced signal transmission losses in the adjacent signal transmission structure (20, 30). The transmission structures thereby being capable of more efficiently transmitting high speed signals without undesired attenuation and loss.

5. 发明公开

EP2242345A3 Method and apparatus for cooling electronic components 有权
标题翻译：用于冷却电子模块的方法和装置
公开(公告)号：EP2242345A3
公开(公告)日：2011-11-02
申请号：EP10006953.3
申请日：2002-05-16
申请人： Cray Inc.
发明人： Pautsch, Gregory W.
IPC分类号： H05K7/20 , H01L23/473 , H01L23/433 , C08K5/04
CPC分类号： H05K7/20345 , H01L23/4735 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , Y10T29/4935 , H01L2924/00
摘要： A cooling assembly comprises a first set of electronic components coupled with a substrate; a spray evaporative cooling cap assembly coupled with the first set of electronic components; a cold plate coupled with the substrate; a second set of electronic components thermally coupled with the cold plate; cooling fluid within the spray evaporative cooling cap assembly and the cold plate, the spray evaporative cooling cap assembly configured to direct the cooling fluid against a surface of the first set of electronic components; and a fluid conditioning unit associated with the spray evaporative cooling cap assembly.

6. 发明公开

EP2001152A3 Reliable message transport network 有权转让
标题翻译：网络的可靠的消息传递
公开(公告)号：EP2001152A3
公开(公告)日：2011-03-16
申请号：EP08251973.7
申请日：2008-06-06
申请人： Cray Inc.
发明人： Scott, Steven L. , Abts, Dennis C. , Alverson, Robert , Froese, Edwin
IPC分类号： H04L1/16 , H04L1/18
CPC分类号： H04L49/90 , H04L1/1607 , H04L1/1835 , H04L1/1874 , H04L1/188 , H04L2001/0096
摘要： A multiprocessor computer system comprises a sending processor node and a receiving processor node. The sending processor node is operable to send packets comprising part of a message to a receiver, to maintain a message buffer entry in the sender comprising the sent packets, to track acknowledgment from the receiver that sent packets have been received; to maintain a timer indicating the time since message data has been sent, and to resend packets not acknowledged upon the timer reaching a timeout state. The receiving processor node is operable to send acknowledgment to the sender that received packets have been received, to track packets using a received message table to track which packets comprising part of the message have been received and whether all packets in the message have been received, and to process packets once all packets in a message are received to reassemble the received message.

7. 发明公开

EP2275938A1 Memory addressing and data transfer operations 审中-公开
标题翻译： Speicheradressierungs-和Datenübertragungsoperationen
公开(公告)号：EP2275938A1
公开(公告)日：2011-01-19
申请号：EP10011354.7
申请日：2002-10-22
申请人： Cray Inc.
发明人： Bethard, Roger, A.
IPC分类号： G06F12/10
CPC分类号： G06F12/1027 , G06F12/1081
摘要： A system and method for addressing memory and transferring data, which in some embodiments include one or more processor translation look-aside buffers (TLBs) and optionally one or more I/O TLBs, and/or a block transfer engine (BTE) that optionally includes a serial cabinet-to-cabinet communications path (MLINK). In some embodiments, the processor TLBs are located within one or more common memory sections, each memory section being connected to a plurality of processors, wherein each processor TLB is associated with one of the processors. The BTE performs efficient memory-to-memory data transfers without further processor intervention. The MLINK extends the BTE functionality beyond a single cabinet.
摘要翻译：用于寻址存储器和传送数据的系统和方法，其在一些实施例中包括一个或多个处理器转换后备缓冲器（TLB）以及可选地一个或多个I / O TLB和/或块传输引擎（BTE），其可选地包括串行柜到柜通信路径（MLINK）。在一些实施例中，处理器TLB位于一个或多个公共存储器部分内，每个存储器部分连接到多个处理器，其中每个处理器TLB与处理器之一相关联。 BTE执行高效的内存到内存数据传输，无需进一步的处理器干预。 MLINK将BTE功能扩展到单个机柜之外。

8. 发明公开

EP2267771A2 Method and apparatus for cooling electronic components 审中-公开
标题翻译：维尔法赫恩和德国电力公司（Kühlungelektronischer Bauelemente）
公开(公告)号：EP2267771A2
公开(公告)日：2010-12-29
申请号：EP10075670.9
申请日：2002-05-16
申请人： Cray Inc.
发明人： Pautsch, Gregory W.
IPC分类号： H01L23/473 , H05K7/20
CPC分类号： H05K7/20345 , H01L23/4735 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , Y10T29/4935 , H01L2924/00
摘要： A cooling assembly comprises a first set of electronic components coupled with a substrate; a spray evaporative cooling cap assembly coupled with the first set of electronic components; a cold plate coupled with the substrate; a second set of electronic components thermally coupled with the cold plate; cooling fluid within the spray evaporative cooling cap assembly and the cold plate, the spray evaporative cooling cap assembly configured to direct the cooling fluid against a surface of the first set of electronic components; and a fluid conditioning unit associated with the spray evaporative cooling cap assembly.
摘要翻译：冷却组件包括与衬底耦合的第一组电子部件; 与第一组电子部件耦合的喷雾蒸发冷却帽组件; 与基板耦合的冷板; 与冷板热耦合的第二组电子部件; 所述喷雾蒸发冷却帽组件和所述冷板中的冷却流体，所述喷雾蒸发冷却帽组件构造成将所述冷却流体引向所述第一组电子部件的表面; 以及与喷雾蒸发冷却盖组件相关联的流体调节单元。

9. 发明公开

EP2242345A2 Method and apparatus for cooling electronic components 有权
标题翻译：用于冷却电子元件的方法和设备
公开(公告)号：EP2242345A2
公开(公告)日：2010-10-20
申请号：EP10006953.3
申请日：2002-05-16
申请人： Cray Inc.
发明人： Pautsch, Gregory W.
IPC分类号： H05K7/20 , H01L23/473 , H01L23/433 , C08K5/04
CPC分类号： H05K7/20345 , H01L23/4735 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , Y10T29/4935 , H01L2924/00
摘要： A cooling assembly comprises a first set of electronic components coupled with a substrate; a spray evaporative cooling cap assembly coupled with the first set of electronic components; a cold plate coupled with the substrate; a second set of electronic components thermally coupled with the cold plate; cooling fluid within the spray evaporative cooling cap assembly and the cold plate, the spray evaporative cooling cap assembly configured to direct the cooling fluid against a surface of the first set of electronic components; and a fluid conditioning unit associated with the spray evaporative cooling cap assembly.
摘要翻译：冷却组件包括与衬底耦合的第一组电子部件; 与第一组电子部件耦合的喷雾蒸发冷却帽组件; 与衬底耦合的冷板; 与冷却板热耦合的第二组电子部件; 在所述喷雾蒸发冷却帽组件和所述冷却板内冷却流体，所述喷雾蒸发冷却帽组件配置为将所述冷却流体导向所述第一组电子部件的表面; 以及与喷雾蒸发冷却帽组件相关联的流体调节单元。

10. 发明公开

EP1306763A2 Memory addressing and data transfer operations 审中-公开
标题翻译： Speicheradressierungs-和Datenübertragungsoperationen
公开(公告)号：EP1306763A2
公开(公告)日：2003-05-02
申请号：EP02257325.7
申请日：2002-10-22
申请人： Cray Inc.
发明人： Bethard, Roger A.
IPC分类号： G06F12/10
CPC分类号： G06F12/1027 , G06F12/1081
摘要： A system and method for addressing memory and transferring data, which in some embodiments include one or more processor translation look-aside buffers (TLBS) (170) and optionally one or more I/O TLBs (210), and/or a block transfer engine (BTE) (300) that optionally includes a serial cabinet-to-cabinet communications path (MLINK) (360). In some embodiments, the processor TLBs are located within one or more common memory sections (130), each memory section being connected to a plurality of processors (110), wherein each processor TLB is associated with one of the processors. The BTE performs efficient memory-to-memory data transfers without further processor intervention. The MLINK extends the BTE functionality beyond a single cabinet.
摘要翻译：用于寻址存储器和传送数据的系统和方法，其在一些实施例中包括一个或多个处理器转换后备缓冲器（TLBS）（170）和可选地一个或多个I / O TLB（210）和/或块传输引擎（BTE）（300），可选地包括串行柜到柜通信路径（MLINK）（360）。在一些实施例中，处理器TLB位于一个或多个公共存储器部分（130）内，每个存储器部分连接到多个处理器（110），其中每个处理器TLB与处理器之一相关联。 BTE执行高效的内存到内存数据传输，无需进一步的处理器干预。 MLINK将BTE功能扩展到单个机柜之外。

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