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1. 发明公开

EP0817263A3 Liquid cooling system for LSI packages 失效
标题翻译： LSI封装的液体冷却系统
公开(公告)号：EP0817263A3
公开(公告)日：1998-01-14
申请号：EP97114551.1
申请日：1991-10-11
申请人： NEC CORPORATION
发明人： Mizuno, Tsukasa , Miyazaki, Hirokazo , Umezawa, Kazuhiko
IPC分类号： H01L23/473
CPC分类号： H01L23/4735 , H01L23/427 , H01L23/4336 , H01L2224/16 , H05K7/20345 , Y10S165/908
摘要： In a liquid cooling system for a printed circuit board (1) on which integrated circuit packages (2) are mounted, heat sinks (3) are secured respectively to the packages in heat transfer contact therewith. Nozzles (8) are provided in positions corresponding to the heat sinks. A housing (5) is tightly sealed to the printed circuit board to enclose the packages, heat sinks and nozzles in a cooling chamber. A feed pump (12) pressurizes working liquid cooled by a heat exchanger (11)and supplies the pressurized liquid to the nozzles for ejecting liquid droplets to the heat sinks. A liquid suction pump (15) is connected to an outlet (9) of the housing for draining liquid coolant to the heat exchanger. A vapour suction pump (32) can be connected to a second outlet (30) of the housing for sucking vaporized coolant to the heat exchanger. The cooling chamber is maintained at a sub-atmospheric pressure to promote nucleate boiling of the working liquid by means of a pressure regulating system controlling the pumping and responsive to liquid flow. In an alternative embodiment (Figure 7) liquid is sucked in through nozzles adjacent the heat sinks.
摘要翻译：在其上安装有集成电路封装（2）的印刷电路板（1）的液体冷却系统中，散热片（3）分别固定到与其传热接触的封装上。喷嘴（8）设置在对应于散热器的位置。壳体（5）与印刷电路板紧密密封，以将封装，散热片和喷嘴封装在冷却室中。供给泵（12）对通过热交换器（11）冷却的工作液体进行加压，并将加压后的液体供给喷嘴以将液滴喷射到散热器。液体抽吸泵（15）连接到壳体的出口（9），用于将液体冷却剂排出到热交换器。蒸汽抽吸泵（32）可以连接到壳体的第二出口（30），用于将蒸发的冷却剂吸入热交换器。冷却室保持在低于大气压的压力下，借助于控制泵送并响应于液体流动的压力调节系统促进工作液体的成核沸腾。在另一个实施例中（图7），液体通过邻近散热片的喷嘴吸入。

2. 发明公开

EP0817263A2 Liquid cooling system for LSI packages 失效
标题翻译： FlüssigkeitskühlsystemfürLSI-Verpackungen
公开(公告)号：EP0817263A2
公开(公告)日：1998-01-07
申请号：EP97114551.1
申请日：1991-10-11
申请人： NEC CORPORATION
发明人： Mizuno, Tsukasa , Miyazaki, Hirokazo , Umezawa, Kazuhiko
IPC分类号： H01L23/473
CPC分类号： H01L23/4735 , H01L23/427 , H01L23/4336 , H01L2224/16 , H05K7/20345 , Y10S165/908
摘要： In a liquid cooling system for a printed circuit board (1) on which integrated circuit packages (2) are mounted, heat sinks (3) are secured respectively to the packages in heat transfer contact therewith. Nozzles (8) are provided in positions corresponding to the heat sinks. A housing (5) is tightly sealed to the printed circuit board to enclose the packages, heat sinks and nozzles in a cooling chamber. A feed pump (12) pressurizes working liquid cooled by a heat exchanger (11)and supplies the pressurized liquid to the nozzles for ejecting liquid droplets to the heat sinks. A liquid suction pump (15) is connected to an outlet (9) of the housing for draining liquid coolant to the heat exchanger. A vapour suction pump (32) can be connected to a second outlet (30) of the housing for sucking vaporized coolant to the heat exchanger. The cooling chamber is maintained at a sub-atmospheric pressure to promote nucleate boiling of the working liquid by means of a pressure regulating system controlling the pumping and responsive to liquid flow. In an alternative embodiment (Figure 7) liquid is sucked in through nozzles adjacent the heat sinks.
摘要翻译：在其上安装有集成电路封装（2）的印刷电路板（1）的液体冷却系统中，散热器（3）分别固定在封装上，与其传热接触。喷嘴（8）设置在与散热器对应的位置。壳体（5）紧密地密封到印刷电路板上，以将包装，散热器和喷嘴封闭在冷却室中。供给泵（12）对由热交换器（11）冷却的工作液体加压，并将加压液体供应到用于将液滴喷射到散热器的喷嘴。液体抽吸泵（15）连接到壳体的出口（9），用于将液体冷却剂排出到热交换器。蒸汽抽吸泵（32）可以连接到壳体的第二出口（30），用于将蒸发的冷却剂吸入热交换器。冷却室保持在亚大气压下，以通过控制泵送并响应于液体流动的压力调节系统来促进工作液体的核沸腾。在替代实施例（图7）中，液体通过与散热器相邻的喷嘴被吸入。

3. 发明授权

EP0241290B1 Cooling system for electronic components 失效
标题翻译：电子元件冷却系统
公开(公告)号：EP0241290B1
公开(公告)日：1990-07-04
申请号：EP87303101.7
申请日：1987-04-09
申请人： NEC CORPORATION
发明人： Mizuno, Tsukasa
IPC分类号： H01L23/40 , H01L23/46
CPC分类号： H01L23/473 , H01L23/4006 , H01L2023/4062 , H01L2924/0002 , Y10T29/49124 , Y10T29/49144 , H01L2924/00

4. 发明公开

EP0241290A1 Cooling system for electronic components 失效
标题翻译： Kühlungssystemfürelektronische Bauelemente。
公开(公告)号：EP0241290A1
公开(公告)日：1987-10-14
申请号：EP87303101.7
申请日：1987-04-09
申请人： NEC CORPORATION
发明人： Mizuno, Tsukasa
IPC分类号： H01L23/40 , H01L23/46
CPC分类号： H01L23/473 , H01L23/4006 , H01L2023/4062 , H01L2924/0002 , Y10T29/49124 , Y10T29/49144 , H01L2924/00
摘要： An IC substrate (3) carrying IC's (14) is fitted into a connector frame (2). Heat passes to a heat-conductive block (6), and thence to a plate (8) provided with coolant channels, by way of a flexible adhesive layer (4) and a low melting point metal or wax layer (5), these layers ensuring good, gap-free thermal contact between a substrate (3) and the block (6). The layer (5) can be melted when it is necessary to replace the substrate (3).
摘要翻译：携带IC（14）的IC基板（3）装配到连接器框架（2）中。热量通过柔性粘合剂层（4）和低熔点金属或蜡层（5）传递到导热块（6），然后传递到设置有冷却剂通道的板（8），这些层确保衬底（3）和块（6）之间的良好的无间隙热接触。当需要更换基板（3）时，可以熔化层（5）。

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