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1. 发明授权

EP2235735B1 METHOD AND APPARATUS FOR PLASMA SURFACE TREATMENT OF A MOVING SUBSTRATE 有权
标题翻译：方法和设备移动基板的等离子表面处理
公开(公告)号：EP2235735B1
公开(公告)日：2015-09-30
申请号：EP09707047.8
申请日：2009-01-29
申请人： Fujifilm Manufacturing Europe B.V.
发明人： KORNGOLD, Bruno Alexander , DE VRIES, Hindrik Willem , ALDEA, Eugen
IPC分类号： C23C16/04 , C23C16/54 , H05K1/03 , H05K3/12 , H05K3/38 , H01J37/32 , H05H1/24 , C23C14/04 , C23C14/56
CPC分类号： H05K3/125 , C23C14/042 , C23C14/562 , C23C16/042 , C23C16/545 , H01J37/3277 , H01J37/32825 , H05H1/2406 , H05H2001/2412 , H05H2001/485 , H05H2240/10 , H05K1/0393 , H05K3/1208 , H05K3/381 , H05K2203/013 , H05K2203/0557 , H05K2203/095 , H05K2203/104 , H05K2203/1173 , H05K2203/1545

2. 发明公开

EP2243341A1 A METHOD OF DEPTH ROUTING AN ELECTRONIC LAYUP AND APPARATUS FOR EFFECTING SUCH A METHOD 审中-公开
标题翻译：方法的深路由电子上篮设备用于进行这样一个过程
公开(公告)号：EP2243341A1
公开(公告)日：2010-10-27
申请号：EP08870035.6
申请日：2008-12-09
申请人： Opulent Electronics International PTE Ltd.
发明人： WEE, Kai Fook Francis
IPC分类号： H05K3/04 , H05K3/46
CPC分类号： H05K3/0044 , B24C1/00 , H05K1/056 , H05K3/0061 , H05K3/04 , H05K2203/025 , H05K2203/0557
摘要： A method of depth routing an electronic layup comprised of a dielectric sandwiched between a metal layer and a metal substrate which is then laminated. The method involves first positioning a hardened mask so that the mask is interposed between the metal layer and at least one nozzle of a sandblasting machine, the mask having at least one aperture provided therein. Thereafter, the electronic layup is sandblasted through the at least one aperture by way of the sandblasting machine. The force, size and type of abrasive applied by the sandblasting machine are sufficient to erode the metal layer and the dielectric but not the substrate.

4. 发明公开

EP2186124A1 FORMATION OF SOLDER BUMPS 有权转让
标题翻译：制造颠簸
公开(公告)号：EP2186124A1
公开(公告)日：2010-05-19
申请号：EP08787014.3
申请日：2008-08-07
申请人： Cambridge Silicon Radio Limited
发明人： STACEY, Simon, Jonathan
IPC分类号： H01L21/60
CPC分类号： H01L24/11 , H01L2224/05571 , H01L2224/05573 , H01L2224/05644 , H01L2224/11334 , H01L2224/11472 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H05K3/3478 , H05K2203/041 , H05K2203/0557 , H01L2924/00 , H01L2924/00014
摘要： A method of providing connections to a chip having contact pads on the surface thereof, comprising: locating a discrete solder element on each pad; and melting the discrete solder elements so as to cause each of them to adhere to the respective pad, thereby forming a solder bump extending from the surface of the chip; wherein the size of each discrete solder element relative to the area of the pad on which it is located is such that the height of each bump is less than 70% of the diameter of the solder element that formed it.

5. 发明公开

EP2073258A2 Conductive ball mounting method and surplus ball removing apparatus 有权
标题翻译：安装导电球和装置用于除去多余的小珠的方法
公开(公告)号：EP2073258A2
公开(公告)日：2009-06-24
申请号：EP08170698.8
申请日：2008-12-04
申请人： Shinko Electric Industries Co., Ltd.
发明人： Sunohara, Fumio c/o Shinko Electric Industries Co., Ltd. , Iida, Kiyoaki c/o Shinko Electric Industries Co., Ltd. , Kobayashi, Masakazu c/o Shinko Electric Industries Co., Ltd. , Maruyama, Kesami c/o Shinko Electric Industries Co., Ltd.
IPC分类号： H01L21/48
CPC分类号： H05K3/3478 , B23K1/0016 , B23K3/0623 , H01L21/4853 , H01L24/742 , H01L24/97 , H01L2224/11003 , H01L2224/11005 , H01L2224/11334 , H01L2224/16225 , H01L2224/81193 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/15311 , H05K2203/0195 , H05K2203/041 , H05K2203/0557 , H01L2224/81
摘要： A conductive ball mounting method of the present invention, includes a step of, arranging a mask (40) in which an opening portion (40a) is provided, on a substrate (1) including a connection pad (C1), arranging a conductive ball (62) on the connection pad (C1) through the opening portion (40a) of the mask (40) by supplying the conductive ball (62) onto the mask (40), separating the substrate (1) and the mask (40), in the step, an extra conductive ball (62) left on the mask (40) drops through the opening portion (40a) of the mask (40), thereby a surplus ball (62a) is mounted on the substrate (1), and removing the surplus ball (62a) on the substrate (1) by making the surplus ball (62a) adhere onto an adhering head (78).
摘要翻译：本发明的导电性球的安装方法，包括在其中，配置的掩模（40）衬底的至开口部（40A）的工序设置，在（1）包括一个连接焊盘（C1），安排一个导电球（62）在通过所述掩模（40）通过提供导电球（62）到掩模（40）的开口部（40A）的连接垫（C1），分离的衬底（1）和所述掩模（40），在步骤中，额外的导电球（62）留在掩模（40）下降通过掩模（40）的开口部（40A），从而剩余球（62A）安装在基板（1）并且通过使剩余球（62A）除去在基板（1）的剩余球（62A）坚持走上秉承头（78）。

6. 发明公开

EP2031692A1 Method for creating and tuning electromagnetic bandgap structure and device 审中-公开
标题翻译：一种用于电磁带隙结构和相关装置的生成和协调过程
公开(公告)号：EP2031692A1
公开(公告)日：2009-03-04
申请号：EP08169722.9
申请日：2007-03-13
申请人： Delphi Technologies, Inc.
发明人： Berlin, Carl W. , Nair, Deepukumar M. , Walsh, Matthew R.
IPC分类号： H01P1/203
CPC分类号： H01P1/203 , H01P1/2005 , H05K1/0233 , H05K1/0236 , H05K3/4069 , H05K2201/0215 , H05K2201/086 , H05K2201/09309 , H05K2201/09609 , H05K2203/0557 , H05K2203/104 , H05K2203/171
摘要： Tuned Electromagnetic Bandgap (EBG)devices (10, 30), and a method for making and tuning tuned EBG devices (10, 30) are provided. The method includes the steps of providing first and second overlapping substrates (32, 32a), placing magnetically alignable conductive material (36) between the substrates (32, 32a), and applying a magnetic field (44, 45) in the vicinity of the magnetically alignable conductive material (36) to align at least some of the material into conductive vias (46, 47). The method further includes the steps of physically altering via characteristics of EBG devices (10, 30) to tune the bandpass and resonant frequencies of the EBG devices (10, 30).

7. 发明公开

EP1978794A1 METHOD AND APPARATUS FOR MOUNTING SOLDER BALL 审中-公开
标题翻译： VERFAHREN UND VORRICHTUNG ZUR MONTAGE EINER LOTKUGEL
公开(公告)号：EP1978794A1
公开(公告)日：2008-10-08
申请号：EP07707505.9
申请日：2007-01-26
申请人： IBIDEN CO., LTD.
发明人： TANNO, Katsuhiko c/o IBIDEN Co., Ltd. , KAWAMURA, Youichirou c/o IBIDEN Co., Ltd.
IPC分类号： H05K3/34 , H01L21/60
CPC分类号： H05K3/3478 , B23K3/0623 , H01L21/4853 , H01L24/11 , H01L24/742 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/11334 , H01L2224/13099 , H01L2224/16225 , H01L2224/81192 , H01L2224/81801 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H05K2203/041 , H05K2203/0557 , H05K2203/082 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： [Subject Matter]
To provide a solder-ball loading apparatus for loading microscopic solder balls onto electrodes
[Solution]
By suctioning air through loading cylinder 24 positioned above ball array mask 16, solder balls (78s) are gathered. By horizontally moving printed wiring board 10 and ball array mask 16, solder balls (78s) gathered directly under loading cylinder 24 are moved on ball array mask 16 and dropped onto electrodes 75 of multilayered printed wiring board 10 through openings (16a) of ball array mask 16.
摘要翻译： [主题]提供用于将微小焊球载入电极的焊球装载装置[解决方案]通过将吸入空气通过位于球阵列掩模16上方的加载圆筒24，聚集焊球（78s）。通过水平移动印刷电路板10和球形阵列掩模16，将直接聚集在加载圆筒24上的焊球（78s）移动到球阵列掩模16上，并通过球阵列的开口（16a）落到多层印刷线路板10的电极75上面具16。

8. 发明公开

EP1686655A1 ANISOTROPIC CONDUCTIVE SHEET, MANUFACTURING METHOD THEREOF, AND PRODUCT USING THE SAME 审中-公开
标题翻译： ANISOTROPESLEITFÄHIGESBLATT，HERSTELLUNGSVERFAHRENDAFÜRUND PRODUKT DAMIT
公开(公告)号：EP1686655A1
公开(公告)日：2006-08-02
申请号：EP04818539.1
申请日：2004-11-15
申请人： JSR Corporation
发明人： SENO, Koji, c/o JSR Corporation , HARUTA, Yuichi, c/o JSR Corporation
IPC分类号： H01R11/01
CPC分类号： H05K3/0032 , H01L2924/0002 , H01R12/714 , H01R13/2414 , H01R43/007 , H05K3/4069 , H05K2201/0133 , H05K2201/10378 , H05K2203/0557 , H01L2924/00
摘要： An anisotropically conductive sheet that can surely achieve necessary electrical connection even to an object to be connected, the arrangement pitch of electrodes to be connected of which is extremely small, a production process thereof, and applied products equipped with the anisotropically conductive sheet.
The anisotropically conductive sheet according to the present invention has an insulating sheet body formed of an elastic polymeric substance, in which a plurality of through-holes for forming conductive paths, each extending in a thickness-wise direction of the insulating sheet body, have been formed, and conductive path elements integrally provided in the respective through-holes for forming conductive paths of the insulating sheet body. The through-holes for forming conductive paths are formed by using a mask for exposure, in which a plurality of through-holes for beam transmission, the diameter of each of which becomes gradually small from one surface toward the other surface of the mask, have been formed in accordance with a pattern corresponding to a pattern of conductive path elements to be formed, and irradiating the insulating sheet body with a laser beam through the through-holes for beam transmission from the other surface side of the mask for exposure.
摘要翻译：即使对于被连接物也能够可靠地实现必要的电连接，其连接的电极的配置间距极小的各向异性导电片，其制造方法以及配备有各向异性导电片的应用物品。根据本发明的各向异性导电片具有由弹性聚合物形成的绝缘片体，其中，多个用于形成导电路径的通孔各自沿着绝缘片体的厚度方向延伸，形成的导电路径元件，一体地设置在用于形成绝缘片体的导电路径的各个通孔中。用于形成导电路径的通孔是通过使用用于曝光的掩模形成的，其中多个用于光束透射的通孔，其每个的直径从掩模的一个表面到另一个表面逐渐变小，具有根据与要形成的导电路径元件的图案对应的图案形成，并且通过激光束从用于曝光的掩模的另一表面侧通过用于光束透射的通孔照射绝缘片体。

9. 发明公开

EP1667847A1 LAMINATION THROUGH A MASK 审中-公开
标题翻译：积层通过掩模
公开(公告)号：EP1667847A1
公开(公告)日：2006-06-14
申请号：EP04789254.2
申请日：2004-09-24
申请人： E.I. DUPONT DE NEMOURS AND COMPANY
发明人： METH, Jeffrey, Scott , MALAJOVICH, Irina
IPC分类号： B41M1/12
CPC分类号： H05K3/046 , B41M1/12 , B41M3/12 , B41M5/03 , B41M5/382 , B41M5/38207 , B41M5/38221 , H01L51/0004 , H01L51/0013 , H05K3/28 , H05K2203/0528 , H05K2203/0537 , H05K2203/0557 , Y10S438/942 , Y10S438/975
摘要： The present invention is a process for transfer of a pattern of material from a donor substrate to a receiver substrate by lamination. The pattern of the transferred material is defined by an aperture in a mask interposed between the donor and receiver during lamination. The technique is compatible with flexible polymer receiver substrates and is useful in fabricating thin film transistors for flexible displays.

10. 发明公开

EP1603374A1 METHOD AND DEVICE FOR MOUNTING CONDUCTIVE BALL 审中-公开
标题翻译： VERFAHREN UND EINRICHTUNG ZUM PLATZIEREN VONLEITFÄHIGENKUGELN
公开(公告)号：EP1603374A1
公开(公告)日：2005-12-07
申请号：EP04718446.0
申请日：2004-03-08
申请人： HITACHI METALS, LTD.
发明人： ITOH, Motoyuki , OCHIAI, Masanori , KAZUI, Shinichi
IPC分类号： H05K3/34 , H01L21/60 , B23K3/06
CPC分类号： H01L24/11 , B23K3/0623 , H01L21/4853 , H01L24/742 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/11005 , H01L2224/11334 , H01L2224/13099 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/3011 , H01L2924/3025 , H05K3/3478 , H05K2203/041 , H05K2203/0485 , H05K2203/0557 , H05K2203/104 , Y10T29/49204 , Y10T156/10 , H01L2924/00 , H01L2224/05599
摘要： An improved placing method and placing apparatus are provided for placing conductive balls in a predetermined pattern onto a base unit. In the placing method for placing balls having conductivity in a predetermined pattern onto one surface of the base unit, an arrangement member has one surface, another surface opposite to the one surface of the arrangement member and positioning openings, wherein the positioning openings are arranged corresponding to the pattern such that the openings are through from the one surface to the another surfaces of the arrangement member so that the balls are inserted therein. The another surface of the arrangement member is positioned opposite to the one surface of the base unit. The arrangement member has two or more line members of which the core axes are substantially aligned. The transfer device is arranged in a manner that the line members are substantially in a horizontal position to contact with the balls supplied to one surface of the arrangement member, and then the transfer device is horizontally moved with respect to the one surface of the arrangement member. Then, the balls are placed on the one surface of the base unit through the positioning openings.
摘要翻译：提供了一种改进的放置方法和放置装置，用于将预定图案中的导电球放置在基座单元上。在用于将具有预定图案的导电性的球放置在基座单元的一个表面上的布置方法中，布置构件具有一个表面，与布置构件的一个表面相对的另一表面和定位开口，其中定位开口相应地布置使得开口从配置构件的一个表面延伸到另一个表面，使得球插入其中。布置构件的另一个表面与基座单元的一个表面相对定位。布置构件具有两个或更多个线构件，其中心轴基本对齐。转印装置以这样的方式布置，使得线构件基本上处于水平位置以与供给到布置构件的一个表面的球接触，然后转印装置相对于布置构件的一个表面水平移动。然后，通过定位孔将球放置在基座单元的一个表面上。

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