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1. 发明公开

EP3334259A1 PCB TRANSMISSION LINES HAVING REDUCED LOSS 审中-公开
公开(公告)号：EP3334259A1
公开(公告)日：2018-06-13
申请号：EP17205368.8
申请日：2017-12-05
申请人： Cray Inc.
发明人： BECKER, Andy
IPC分类号： H05K1/02 , H01P3/08
CPC分类号： H05K1/0224 , H01P3/026 , H01P11/003 , H05K1/0219 , H05K1/0237 , H05K1/025 , H05K3/22 , H05K2201/093 , H05K2203/0307
摘要： Signal transmission structures within a printed circuit are formed to have reduced loss by making specific accommodations to reduce the surface roughness of an adjacent power plane (14), and thereby reducing the effects of magnetically induced currents. The power plane structure will retain sufficient surface roughness to accommodate manufacturing operations, while also contributing to reduced signal transmission losses in the adjacent signal transmission structure (20, 30). The transmission structures thereby being capable of more efficiently transmitting high speed signals without undesired attenuation and loss.

2. 发明授权

EP2120352B1 HIGH-FREQUENCY PART AND COMMUNICATION DEVICE 有权转让
标题翻译：高频部分和通信设备
公开(公告)号：EP2120352B1
公开(公告)日：2017-12-20
申请号：EP07860420.4
申请日：2007-12-27
申请人： Hitachi Metals, Ltd.
发明人： KEMMOCHI, Shigeru , FUKAMACHI, Keisuke , HAGIWARA, Kazuhiro
IPC分类号： H04B1/44 , H05K1/02
CPC分类号： H04B1/44 , H01L2924/0002 , H05K1/0243 , H05K2201/093 , H05K2201/09327 , H05K2201/09781 , H01L2924/00
摘要： A high-frequency device having high-frequency-signal-treating circuits in and on a laminate substrate comprising pluralities of dielectric layers having conductor patterns, the high-frequency-signal-treating circuits having amplifier circuits and switch circuits; terminals including input and output terminals of high-frequency signals, the power supply terminals of the amplifier circuits and the power supply terminals of the switch circuits being formed on one main surface of the laminate substrate; power supply lines each having one end connected to each of the power supply terminals of the amplifier circuits and power supply lines each having one end connected to each of the power supply terminals of the switch circuits being formed on one dielectric layer to constitute a power supply line layer; a first ground electrode being arranged on the side of the main surface with respect to the power supply line layer, the first ground electrode overlapping at least part of the power supply lines in a lamination direction; a second ground electrode being arranged on the opposite side of the first ground electrode with respect to the power supply line layer, the second ground electrode overlapping at least part of the power supply lines in a lamination direction; and the high-frequency-signal-treating circuits being arranged on the opposite side of the power supply line layer with respect to the second ground electrode.

3. 发明公开

EP2651199A3 Printed circuit board 有权
标题翻译：电路板
公开(公告)号：EP2651199A3
公开(公告)日：2014-07-02
申请号：EP13162441.3
申请日：2013-04-05
申请人： Canon Kabushiki Kaisha
发明人： Murai, Yusuke , Hoshi, Sou , Yamashita, Nobuaki
IPC分类号： H05K1/02
CPC分类号： H05K1/025 , H01L2224/16225 , H05K1/0225 , H05K1/0243 , H05K1/181 , H05K2201/09263 , H05K2201/093 , H05K2201/09709
摘要： Provided is a printed circuit board 100 capable of increasing an inductance value of a power pattern and a ground pattern while keeping a low electric resistance value of the power pattern and the ground pattern. The printed circuit board includes a printed wiring board 101 including: a power layer 113 having a power pattern 131 formed therein; and a ground layer 112 having a ground pattern 121 formed therein. On the printed wiring board, an LSI 102 as a semiconductor device and an LSI 104 as a power supply member are mounted. The ground pattern has a first ground region R that overlaps the power pattern as viewed from the direction perpendicular to the surface of the printed wiring board. In the first ground region, at least one defect portion 122 is formed. In the first ground region, the defect portion forms a region 121a that is narrower than the power pattern.

4. 发明公开

EP2555236A4 HIGH-FREQUENCY CIRCUIT BOARD 有权
标题翻译：高频率电路板
公开(公告)号：EP2555236A4
公开(公告)日：2013-12-25
申请号：EP11762551
申请日：2011-03-11
申请人： FURUKAWA ELECTRIC CO LTD , FURUKAWA AUTOMOTIVE SYS INC
发明人： ISHIDA YOSHIYUKI , MATUSHIMA SADAO , FUKUCHI TOSHIHIDE
IPC分类号： H05K1/02 , H01L23/498 , H01L23/552 , H01L23/66
CPC分类号： H01L23/66 , H01L23/49822 , H01L23/49827 , H01L23/552 , H01L23/642 , H01L2223/6616 , H01L2223/6627 , H01L2223/6677 , H01L2924/0002 , H05K1/0216 , H05K1/0218 , H05K1/024 , H05K1/0243 , H05K1/0251 , H05K1/115 , H05K2201/0187 , H05K2201/0367 , H05K2201/093 , H05K2201/09718 , H05K2201/09781 , H05K2201/09854 , H05K2201/10098 , H01L2924/00
摘要： A high-frequency circuit board capable of easily forming a bias line whose resonance frequency is sufficiently separated from operating frequency is provided. On a high-frequency circuit board 100, by electrically connecting a bias line 11 to a high-frequency circuit 10 using blind via holes 106 and 107, it is possible to limit the route that has a possibility of producing resonance only to the bias line connecting the ends 106a and 107a of the blind via holes 106 and 107 to the bias line 11. By adjusting the route length from the end 106a to the end 107a, it is possible to prevent production of resonance in the vicinity of the operating frequency.

5. 发明公开

EP2402959A1 FLEXIBLE CABLE AND TRANSMISSION SYSTEM 有权转让
标题翻译：灵活的KABEL- UND GETEBESYSTEM
公开(公告)号：EP2402959A1
公开(公告)日：2012-01-04
申请号：EP10761390.3
申请日：2010-03-30
申请人： Panasonic Corporation
发明人： SHIMURA, Takuma , AKITA, Takashi , SHIBATA, Osamu
IPC分类号： H01B7/08 , H01B3/28 , H01B7/17 , H01B11/00 , H01B11/06 , H04B3/02
CPC分类号： H01B7/0838 , H01B7/0861 , H01B11/1091 , H04B3/02 , H05K1/0219 , H05K1/0224 , H05K1/0245 , H05K1/0248 , H05K1/0393 , H05K2201/0715 , H05K2201/09236 , H05K2201/093 , H05K2201/09354 , H05K2201/09718
摘要： A flexible cable is provided in which a transmission characteristic can be ensured in a high frequency band, and electromagnetic noises can be suppressed. A flexible cable 11 includes a sheet-like base member (dielectric substance) 1; an adhesive (dielectric substance) 2 which bonds the base member 1 to a cover member (dielectric substance) 3; a shield member 4 which covers the cover member 3 and is bonded or printed to the cover member 3 to suppress electromagnetic noises to be radiated; and a top coating member 5 which covers the shield member 4 to protect the shield member 4. The flexible cable 11 has a differential signal wire group 7 including differential signal wires 6 through which differential signals pass and guard ground wires 9a which prevent the interference from other differential signals; a low-speed signal wire 8 through which a low-speed signal passes; a ground wire 9 used as a ground; and a shield ground wire 10 which is adapted to allow the electric potential of the shield member 4 to be identical to the electric potential of the ground, all of which are provided in the adhesive 2. The differential signal wires 6 are not covered with the shield member 4.
摘要翻译：提供一种柔性电缆，其中可以在高频带中确保传输特性，并且可以抑制电磁噪声。挠性电缆11包括片状基体（电介质）1; 将基材1与盖部件（电介质）3接合的粘合剂（电介质）2; 遮盖构件4，其覆盖盖构件3，并且被接合或印刷到盖构件3，以抑制要辐射的电磁噪声; 以及覆盖屏蔽构件4以保护屏蔽构件4的顶部涂覆构件5.柔性电缆11具有差分信号线组7，差分信号线组7包括差分信号通过的差分信号线6，并且防止接地线9a防止干扰其他差分信号; 低速信号通过的低速信号线8; 用作地面的地线9; 以及屏蔽接地线10，其适于允许屏蔽构件4的电位与地面的电位相同，所有这些都设置在粘合剂2中。差分信号线6不被覆盖屏蔽构件4。

6. 发明公开

EP2207244A2 Steckverbinder und Multilayerplatine 有权
标题翻译： Anordnung aus Steckverbinder und Multilayerplatine
公开(公告)号：EP2207244A2
公开(公告)日：2010-07-14
申请号：EP09001669.2
申请日：2009-02-04
申请人： ERNI Electronics GmbH
发明人： Lappöhn, Jürgen
IPC分类号： H01R24/12
CPC分类号： H05K1/0219 , H01R12/716 , H01R12/724 , H01R13/6585 , H05K1/0237 , H05K3/308 , H05K2201/09236 , H05K2201/093 , H05K2201/09663 , H05K2201/10189 , H05K2201/1059
摘要： Die Erfindung betrifft einen mehrpoliger Steckverbinder (10a, 10b) zur Kontaktierung mit einer Multilayerplatine (40), der Signal-Kontakte (11a, 11b; 12a, 12b) aufweist, denen ein erstes und wenigstens ein zweites Abschirm-Kontaktelement (17a, 17b, 17a', 17b'; 18a, 18b, 18a', 18b') zugeordnet und benachbart zum Signal-Kontakt (11 a, 11 b; 12a, 12b) angeordnet sind. Der Steckverbinder (10a, 10b) zeichnet sich dadurch aus, dass zumindest auf der obersten Schicht (41) der Multilayerplatine (40) Ausnehmungen (54, 54', 54") vorgesehen sind, welche zur Aufnahme und Durchführung von wenigstens zwei Abschirm-Kontaktelementen (17a', 17b'; 18a, 18b) bemessen sind, die benachbarten Signal-Kontakten (11a, 11b; 12a, 12b) zugeordnet sind.
摘要翻译：多极插头连接器（10b）具有信号触头（11b，12b）。凹槽设置在多层板的上层上。凹口限制了两个屏幕接触元件（17b'，18b）的接收和执行。

7. 发明授权

EP1931189B1 Elektronische Schaltung und Verfahren zur Reduzierung von EMV-Störungen in dieser Schaltung 有权
标题翻译：电子电路和方法减少在该电路中的电磁干扰
公开(公告)号：EP1931189B1
公开(公告)日：2009-07-29
申请号：EP06025297.0
申请日：2006-12-07
申请人： Hekatron Vertriebs GmbH
发明人： Jäcklin, Samuel
IPC分类号： H05K9/00 , H05K1/02
CPC分类号： H05K9/0039 , H05K1/0225 , H05K1/0227 , H05K1/0234 , H05K2201/093 , H05K2201/09663 , H05K2201/09972 , H05K2201/10022 , H05K2201/10151

8. 发明授权

EP0954020B1 Flip chip bonding lands 有权
标题翻译：垫的倒装芯片接合
公开(公告)号：EP0954020B1
公开(公告)日：2008-10-29
申请号：EP99107191.1
申请日：1999-04-13
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： Saitoh, Tohru
IPC分类号： H01L21/60 , H01L21/56 , H05K1/02
CPC分类号： H01L24/81 , H01L21/563 , H01L23/49811 , H01L2224/1134 , H01L2224/13099 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81801 , H01L2924/00013 , H01L2924/01006 , H01L2924/01033 , H01L2924/07802 , H05K1/0271 , H05K2201/093 , H05K2201/09781 , H05K2201/10674 , H01L2924/00014 , H01L2924/00

9. 发明公开

EP1981317A2 Multilayer printed wiring board and manufacturing method thereof 失效
标题翻译：多层印刷线路板及其制造方法
公开(公告)号：EP1981317A2
公开(公告)日：2008-10-15
申请号：EP08011580.1
申请日：1996-12-19
申请人： IBIDEN CO., LTD.
发明人： Mori, Yoji , Kawamura, Yoichiro
IPC分类号： H05K1/11 , H05K3/46 , H05K1/02
CPC分类号： H05K1/0201 , H05K1/0224 , H05K1/0253 , H05K1/115 , H05K1/116 , H05K3/4602 , H05K2201/062 , H05K2201/093 , H05K2201/09454 , H05K2201/09536 , H05K2201/0959 , H05K2201/09627 , H05K2201/09681 , H05K2201/09727 , H05K2201/0979 , H05K2201/09881
摘要： A printed wiring board in which an opening existing around a pad which is a photovia land is arranged so that it is not overlapped with the pad, the area of an opening existing around a pad and that of another opening are equalized, the quantity of resin which is filled in each opening or is equalized throughout a printed wiring board and the quantity of resin overflowing from each opening or when resin is filled in each opening or is uniformed is provided. According to such a printed wiring board, a reliable printed wiring board wherein secure connection is enabled without causing disconnection can be realized when a circuit pattern provided on an interlayer insulating board formed on the printed wiring board and a conductor pad are connected by arranging an opening existing around a conductor pad so that it is not overlapped with the conductor pad and substantially equalizing the quantity of resin which is filled in an opening around a conductor pad and that of resin which is filled in another opening.
摘要翻译：本发明提供一种印刷线路板，该印刷线路板中，在作为光电晶体管的焊盘周围存在的开口以不与焊盘重叠的方式配置，焊盘周围的开口部的面积与其他开口的面积相等，其填充在每个开口中或者在整个印刷线路板中均匀化，并且提供从每个开口溢出的树脂量，或者当树脂被填充在每个开口中或者被均匀化时。根据这样的印刷布线板，当在印刷布线板上形成的层间绝缘板上提供的电路图案和导体焊盘通过布置开口而连接时，可以实现可靠的印刷布线板，其中可靠地连接而不会导致断开存在于导体焊盘周围，使得其不与导体焊盘重叠并且实质上均衡填充在导体焊盘周围的开口中的树脂量和填充在另一个开口中的树脂量。

10. 发明公开

EP1938674A2 SYSTEMS AND METHODS FOR ELECTROMAGNETIC NOISE SUPPRESSION USING HYBRID ELECTROMAGNETIC BANDGAP STRUCTURES 审中-公开
标题翻译：系统和电磁降噪方法采用混合电磁带隙结构
公开(公告)号：EP1938674A2
公开(公告)日：2008-07-02
申请号：EP06826319.3
申请日：2006-10-20
申请人： McKinzie, William E. III.
发明人： McKinzie, William E. III.
IPC分类号： H05K1/02
CPC分类号： H01P1/20 , H01P1/2005 , H05K1/0218 , H05K1/0231 , H05K1/0233 , H05K1/0236 , H05K1/0239 , H05K1/162 , H05K1/165 , H05K1/181 , H05K2201/093 , H05K2201/09318 , H05K2201/09609 , H05K2201/09663 , H05K2201/09672 , H05K2201/0969 , H05K2201/09718 , Y10T29/49018 , Y10T29/49117 , Y10T29/4913 , Y10T29/49155
摘要： A hybrid electromagnetic bandgap (EBG) structure for broadband suppression of noise on printed wiring boards includes an array of coplanar patches interconnected into a grid by series inductances, and a corresponding array of shunt LC networks connecting the coplanar patches to a second conductive plane. This combination of series inductances and shunt resonant vias lowers the cutoff frequency for the fundamental stopband. The series inductances and shunt capacitances may be implemented using surface mount component technology, or printed traces. Patches may also be interconnected by coplanar coupled transmission lines. The even and odd mode impedances of the coupled lines may be increased by forming slots in the second conductive plane disposed opposite to the transmission line, lowering the cutoff frequency and increasing the bandwidth of the fundamental stopband. Coplanar EBG structures may be integrated into power distribution networks of printed wiring boards for broadband suppression of electromagnetic noise.

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