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1. 发明公开

EP4415180A1 PRESS-FIT PIN CONFIGURATIONS FOR POWER SEMICONDUCTOR MODULES 审中-公开
公开(公告)号：EP4415180A1
公开(公告)日：2024-08-14
申请号：EP24155468.2
申请日：2024-02-02
申请人： Infineon Technologies AG
发明人： Nottelmann, Regina , Herbrandt, Alexander , Hisch, Simon
IPC分类号： H01R12/58 , H01R43/16
CPC分类号： H01R12/585 , H01R43/16 , H05K1/00
摘要： A press-fit pin includes: a tip part configured to guide the press-fit pin into an opening of a circuit board; a deformable part adjoining the tip part and configured to deform upon insertion into the opening of the circuit board; an elongate part adjoining the deformable part; a base part adjoining the elongate part; and an anchoring part adjoining the base part and configured for insertion into a sleeve when a force is applied to the base part. The tip part has a proximal region adjoining the deformable part and a distal region that is narrower than the proximal region. A first sidewall of the press-fit pin is sloped, with respect to a longitudinal axis of the press-fit pin, at a first acute angle in the distal region and at a second acute angle in the proximal region. The first acute angle is greater than the second acute angle.

2. 发明公开

EP3394153A1 POLYIMIDE-BASED POLYMER THICK FILM COMPOSITIONS 有权转让
公开(公告)号：EP3394153A1
公开(公告)日：2018-10-31
申请号：EP16879952.6
申请日：2016-12-20
申请人： E. I. du Pont de Nemours and Company
发明人： SUH, Seigi , YANG, Haixin
IPC分类号： C08G69/26 , C08K3/34
CPC分类号： C08G73/1067 , C08G73/1071 , C08K3/04 , C08K3/08 , C08K3/38 , C08K2003/0806 , C08K2003/385 , C09D11/00 , C09D11/033 , C09D11/037 , C09D11/102 , C09D11/52 , C09D179/08 , H05K1/00 , H05K3/00
摘要： This invention is directed to polyimide-based polymer thick film compositions and particularly non-fluorinated polyimide-based polymer thick film compositions. These compositions are comprised of certain polyimide polymers and certain solvents. In some embodiments various functional components are added to the composition to provide compositions that can be used to form various elements of an electrical circuit

3. 发明公开

EP3128464A4 IC TAG ISSUING DEVICE 有权
公开(公告)号：EP3128464A4
公开(公告)日：2017-11-15
申请号：EP14888148
申请日：2014-07-28
申请人： SATO HOLDINGS KK
发明人： HORIE TAKASHI , WATANABE ATSUSHI
IPC分类号： G06K13/07 , G06K7/10 , G06K13/073 , G06K19/077
CPC分类号： G06K7/10198 , G06K13/07 , G06K13/073 , G06K19/07777 , H05K1/00 , H05K1/18
摘要： To provide an IC tag issuing apparatus which can execute communication processing with an IC tag at a high speed and reliably and can increase an issuance speed. An IC tag issuing apparatus for writing identification data to IC tags, the IC tags arranged in multiple rows aligned as an IC tag continuous body (1) ,and issuing the result, the IC tags issuing apparatus including second antenna units (32) arranged to face each row of the IC tags arranged in multiple rows, respectively, and functioning as a plurality of writing row antenna units for writing the identification data to the IC tags by the electromagnetic induction method and a third antenna unit (33) arranged at a downstream side in the conveyance direction of the IC tag continuous body (1) from the second antenna unit (32) and functioning as an electric-wave antenna unit for writing the identification data to the IC tags by the electric wave method and constituted to write the identification data by using the third antenna unit (33) to the IC tag in which the identification data could not be written by using the second antenna unit (32).

4. 发明公开

EP3118927A4 HIGH FREQUENCY PACKAGE 有权
公开(公告)号：EP3118927A4
公开(公告)日：2017-11-15
申请号：EP14885156
申请日：2014-03-11
申请人： MITSUBISHI ELECTRIC CORP
发明人： YASOOKA KOSUKE
IPC分类号： H01P3/08 , H01L23/00 , H01L23/13 , H01L23/498 , H01L23/552 , H01L23/66 , H05K1/00
CPC分类号： H01L23/66 , H01L23/13 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L23/552 , H01L24/16 , H01L24/81 , H01L2223/6627 , H01L2223/6683 , H01L2224/16225 , H01L2224/81815 , H01L2924/1423 , H01L2924/15151 , H01L2924/15321 , H01L2924/1579 , H05K1/00 , H05K1/0221 , H05K1/0225 , H05K1/141
摘要： A high-frequency package has: a resin substrate; a high-frequency device mounted on a side of a first surface of the resin substrate; a ground surface conductor of a ground potential formed on a second surface of the resin substrate on an opposite side to the first surface; a transmission line for a high-frequency signal formed in an inner layer of the resin substrate; and a ground via of a ground potential formed within the resin substrate. A through hole is formed in the ground surface conductor. The ground via is placed between the transmission line and the through hole.

5. 发明公开

EP3112393A1 SURFACE TREATMENT SOLUTIONS FOR GOLD AND GOLD ALLOYS 有权
标题翻译：宝贝金宝宝
公开(公告)号：EP3112393A1
公开(公告)日：2017-01-04
申请号：EP16174877.7
申请日：2016-06-16
申请人： Rohm and Haas Electronic Materials LLC
发明人： MIZUNO, Yoko , KONDO, Makoto , YOMOGIDA, Koichi , MORINAGA, Toshiyuki
IPC分类号： C08G73/02 , C08G73/06 , C25D11/24
CPC分类号： C09D5/08 , C07D233/00 , C07D233/02 , C07D333/04 , C08G59/00 , C08G73/0616 , C08K3/32 , C08K5/00 , C08K5/3462 , C08K2003/324 , C09D7/61 , C09D179/04 , C23C26/00 , C25D3/38 , C25D3/48 , C25D3/62 , C25D5/12 , C25D5/48 , C25D7/00 , C25D11/246 , H01L21/288 , H05K1/00 , H05K1/0346 , H05K3/00
摘要： A composition containing a cationic polymer obtained from a reaction product of nitrogen-containing heterocyclic compound and epihalohydrin; and a phosphorus compound. The composition can be used as a surface treatment for gold or gold alloy. The composition can seal pinholes on the surface of the gold or gold alloy.
摘要翻译：含有由含氮杂环化合物与表卤代醇反应产物得到的阳离子聚合物的组合物; 和磷化合物。该组合物可用作金或金合金的表面处理。组合物可以密封金或金合金表面上的针孔。

6. 发明公开

EP3101337A4 LED LIGHTING APPARATUS 审中-公开
标题翻译： LED-BELEUCHTUNGSVORRICHTUNG
公开(公告)号：EP3101337A4
公开(公告)日：2016-12-28
申请号：EP14880324
申请日：2014-04-23
申请人： SHANGHAI SANSI ELECTRONIC ENG CO LTD , SHANGHAI SANSI SCIENCE AND TECH DEV CO LTD , JIASHAN SANSI PHOTOELECTRIC TECH CO LTD
发明人： CHEN BISHOU , XU LI , WANG PENG , LI SHENG
IPC分类号： F21V29/00 , F21K9/232 , F21K9/66 , F21V3/02 , F21V3/04 , F21V23/00 , F21V29/506 , F21Y115/10 , H05K1/00
CPC分类号： F21V29/74 , F21K9/232 , F21K9/235 , F21K9/238 , F21V3/02 , F21V3/0409 , F21V19/003 , F21V29/506 , F21V29/83 , F21Y2115/10 , H05K1/00
摘要： An LED lighting device includes a base (1), an LED light-emitting unit (2) and a lamp shade (3), wherein the LED light-emitting unit (2) and the lamp shade (3) are arranged on the base (1); the lamp shade (3) is a solid component made of a thermally-conductive material; the lamp shade (3) covers the LED light-emitting unit (2); and the inner surface of the lamp shade (3) has a light distribution surface (31) and a thermally-conductive surface (32). The LED lighting device employs a solid material having better thermal conductivity as the lamp shade (3), therefore, heat generated by the LED light-emitting unit not only can be dissipated via the base (1), but also can be transferred outwards via the lamp shade (3), thus allowing the entire device to dissipate heat in all directions, improving the heat dissipation performance of the device, and prolonging the service life of the device; due to the improvement of the heat dissipation performance, the lighting device of higher power can be manufactured without increasing the size of the device, and the lighting brightness of the device is improved, while the use range and flexibility of the LED lighting device are improved in life and industrial use.
摘要翻译：一种LED照明装置，包括基座（1），LED发光单元（2）和灯罩（3），其中，所述LED发光单元（2）和所述灯罩（3）（1）; 灯罩（3）是由导热材料制成的固体部件; 灯罩（3）覆盖LED发光单元（2）; 并且灯罩（3）的内表面具有配光面（31）和导热面（32）。 LED照明装置使用具有较好导热性的固体材料作为灯罩（3），因此，由LED发光单元产生的热量不仅可以经由基座（1）消散，而且还可以经由灯罩（3），从而允许整个装置在各个方向散热，提高装置的散热性能，延长装置的使用寿命; 由于散热性能的提高，可以在不增加装置的尺寸的情况下制造更高功率的照明装置，并且改善了装置的照明亮度，同时改善了LED照明装置的使用范围和灵活性在生活和工业上的使用。

7. 发明公开

EP2926375A4 INTEGRATED CIRCUITS AND SYSTEMS AND METHODS FOR PRODUCING THE SAME 审中-公开
标题翻译：集成电路与系统和方法及其生产
公开(公告)号：EP2926375A4
公开(公告)日：2016-10-19
申请号：EP13857801
申请日：2013-11-21
申请人： INTEL CORP
发明人： NIKONOV DMITRI E , SANKMAN ROBERT L , KIM RASEONG , PAN JIN
IPC分类号： H01L29/02 , B29C67/00 , B33Y80/00
CPC分类号： H05K3/4644 , B29C64/00 , B32B27/06 , B32B2457/00 , B33Y50/02 , B33Y70/00 , B33Y80/00 , H01L27/0688 , H01L27/281 , H01L51/0004 , H05K1/00

9. 发明授权

EP2119327B1 VERFAHREN ZUM ENTFERNEN EINES TEILBEREICHS EINER FLÄCHIGEN MATERIALSCHICHT 有权
标题翻译： VERFAHREN ZUM ENTFERNEN EINES TEILBEREICHS EINERFLÄCHIGENMATERIALSCHICHT
公开(公告)号：EP2119327B1
公开(公告)日：2011-10-26
申请号：EP08700293.7
申请日：2008-01-30
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： WEIDINGER, Gerald , LEITGEB, Markus , STAHR, Johannes , WEICHSLBERGER, Günther , ZLUC, Andreas
IPC分类号： H05K1/02 , H05K3/46
CPC分类号： H05K1/00 , H05K1/183 , H05K3/4652 , H05K3/4691 , H05K2201/09127 , Y10T29/49155
摘要： The invention relates to a method for removing a part of a substantially planar material layer (2) which is connected to at least one further, substantially planar material layer (9) in a connecting step. According to the invention, a zone where the material layers (2, 9) are not directly interconnected is provided in the zone where the part (11) is later on removed, said first zone being provided by applying a material (8) that prevents the material layers to be interconnected from sticking to each other. The invention also relates to a multilayer structure and to the use of the method and to a multilayer structure especially for producing a multilayer printed circuit board.
摘要翻译：本发明涉及一种用于去除在连接步骤中连接到至少一个其它基本平坦的材料层（9）的基本平坦的材料层（2）的一部分的方法。根据本发明，其中材料层（2,9）不直接互连的区域设置在部件（11）稍后被移除的区域中，所述第一区域通过施加材料（8）来提供，所述材料防止待彼此相互连接的材料层。本发明还涉及一种多层结构以及该方法和多层结构的使用，特别是用于制造多层印刷电路板。

10. 发明公开

EP1949771A1 PROCÉDÉ POUR LA RÉALISATION D'UN CIRCUIT IMPRIMÉ À SURFACE NON DÉVELOPPA- BLE ET CIRCUIT IMPRIMÉ AINSI OBTENU. 有权
标题翻译：一种用于生产电路板不展表面上，从而生产BOARD
公开(公告)号：EP1949771A1
公开(公告)日：2008-07-30
申请号：EP06831001.0
申请日：2006-10-24
申请人： ASTRIUM SAS
发明人： DESAGULIER, Christian
IPC分类号： H05K3/02 , H05K3/24 , C25D5/00 , C25D5/08 , C25D7/06 , H01Q1/38 , H01Q3/46 , H05K1/09 , H05K3/00 , H05K3/12
CPC分类号： H05K1/00 , C25D5/02 , C25D5/06 , H01Q15/141 , H05K1/0284 , H05K1/095 , H05K3/027 , H05K3/125 , H05K3/241 , H05K3/246 , H05K2201/0347 , H05K2201/09018 , H05K2203/013 , H05K2203/0195 , Y10T29/49126 , Y10T29/49128
摘要： The invention relates to a method for producing a non-developable surface printed circuit and to the thus obtained printed circuit. According to said invention, each electrically conductive pattern (7) of a printed circuit (2) comprises a base (7E), which is arranged on the non-developable surface (6) and obtained by projecting an electrically conductive varnish, and a coating (7R), which is arranged on said base (7E) and made of an electrically well conductive material by means of buffer electrolysis.
摘要翻译：本发明涉及一种用于生产非可展曲面的印刷电路，并由此获得的印刷电路。。根据本发明，印刷电路中的每个导电图案包括至少一个基站，所有这一切都被布置在非可展表面上并通过导电清漆的投影获得的，并且涂层，所有这一切都被布置在基座上，且由的导电材料以及通过缓冲电解。

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