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1. 发明授权

EP1300487B1 Copper plating bath 有权
标题翻译：镀铜浴
公开(公告)号：EP1300487B1
公开(公告)日：2017-10-04
申请号：EP01308482.7
申请日：2001-10-04
申请人： Rohm and Haas Electronic Materials LLC
发明人： Cobley, Andrew J. , Kapeckas, Mark J. , Reddington, Erik , Sonnenberg, Wade , Gabe, David R. , Buckley, Thomas , Barstad, Leon R. , Graves, John Edward
IPC分类号： C25D3/02 , C25D3/38
CPC分类号： C25D3/02 , C25D3/38 , H05K3/241

2. 发明公开

EP2857899A4 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING WIRING BOARD 审中-公开
标题翻译：感光性树脂组合物，光敏元件，形成光漆的结构及方法制造电路板的方法
公开(公告)号：EP2857899A4
公开(公告)日：2016-10-26
申请号：EP13797586
申请日：2013-05-28
申请人： HITACHI CHEMICAL CO LTD
发明人： ITAGAKI KATSUTOSHI , SHINDOU MASANORI
IPC分类号： G03F7/004
CPC分类号： G03F7/085 , G03F7/027 , G03F7/20 , G03F7/40 , H05K3/064 , H05K3/108 , H05K3/184 , H05K3/241
摘要： Provided is a photosensitive resin composition, including: a binder polymer; a photopolymerizable compound having an ethylenically unsaturated group; a photopolymerization initiator; a benzotriazole compound; and an aliphatic diamine compound having from 8 to 30 carbon atoms.

3. 发明公开

EP3007221A4 WIRING BOARD WITH THROUGH ELECTRODE, METHOD FOR PRODUCING SAME, AND SEMICONDUCTOR DEVICE 无效
标题翻译：电路板贯穿电极法其制造和半导体元件
公开(公告)号：EP3007221A4
公开(公告)日：2016-06-15
申请号：EP14803769
申请日：2014-05-23
申请人： TOPPAN PRINTING CO LTD
发明人： YOSHIDA TOMOHIRO
IPC分类号： H01L23/15 , H01L21/48 , H01L23/13 , H01L23/498 , H05K3/10 , H05K3/14 , H05K3/18 , H05K3/46
CPC分类号： H01L23/49827 , H01L21/486 , H01L23/13 , H01L23/15 , H01L23/49822 , H01L23/49838 , H01L23/49866 , H01L24/17 , H01L2224/16146 , H01L2224/16225 , H01L2224/16235 , H01L2224/16237 , H01L2924/1511 , H01L2924/15311 , H05K1/0306 , H05K1/09 , H05K1/115 , H05K3/002 , H05K3/107 , H05K3/241 , H05K3/26 , H05K3/4644

4. 发明公开

EP2787796A4 CONDUCTIVE FILM FORMING METHOD, COPPER FINE PARTICLE-DISPERSED LIQUID, AND CIRCUIT BOARD 审中-公开
标题翻译：导电薄膜，香料颗粒分散液体和PCB的生产方法
公开(公告)号：EP2787796A4
公开(公告)日：2015-09-09
申请号：EP12862999
申请日：2012-08-13
申请人： ISHIHARA CHEMICAL CO LTD , APPLIED NANOTECH HOLDINGS INC
发明人： KAWATO YUICHI , MITA TOMOHIRO , MAEDA YUSUKE , KUDO TOMIO
IPC分类号： H05K3/12 , H05K3/18
CPC分类号： H05K1/092 , C09D11/52 , H05K1/0306 , H05K1/032 , H05K1/0346 , H05K1/0366 , H05K1/05 , H05K1/097 , H05K3/108 , H05K3/1283 , H05K3/185 , H05K3/241 , H05K3/246 , H05K3/381 , H05K2201/0129 , H05K2201/0145 , H05K2201/2072 , H05K2203/1105

5. 发明公开

EP2841628A2 VERFAHREN UND VORRICHTUNG ZUM ELEKTROLYTISCHEN ABSCHEIDEN EINES ABSCHEIDEMETALLS AUF EINEM WERKSTÜCK 有权
标题翻译： FOR A的电解分离的方法和装置ABSCHEIDEMETALLS在零件
公开(公告)号：EP2841628A2
公开(公告)日：2015-03-04
申请号：EP13716310.1
申请日：2013-04-16
申请人： Atotech Deutschland GmbH
发明人： SCHMITT, Bernd , BÖSE, Bernd , MÜCKLICH, Frank , BRITZ, Dominik , SELZNER, Christian
IPC分类号： C25D17/00 , C25D17/06 , H05K3/24
CPC分类号： C25D17/28 , C25D17/005 , C25D17/06 , H05K3/241
摘要： For improving the current transfer during the electrolytic metallization of workpieces WS, a method comprising the following method steps is proposed: (a) providing a metal depositing apparatus (17), in which the workpiece WS, at least one anode (40, 41) and a metal deposition electrolyte AE are arranged and which has a device for electric current generation (60) and at least one current feeding device (31) with in each case at least one electrical contact element (34, 35) for making electrical contact with the workpiece WS; (b) bringing the at least one electrical contact element (34, 35) into contact with the workpiece WS; and (c) feeding electric current to the workpiece WS via the at least one electrical contact element (34, 35) in order that the deposition metal deposits on the workpiece WS. Before method step (b), in a further method step (d), deposition metal is deposited on the at least one electrical contact element (34, 35).
摘要翻译：增进工件在电解金属化时产生的电流传输，提出一种方法：（a）提供金属沉积装置17，其中，所述工件，至少一个阳极40，41和一个金属沉积电解液AE被布置并且具有用于电流产生60和在每种情况下，至少一个电接触元件34，35用于与工件的电接触至少一个电流供给装置31的装置; （B）使所述至少一个电接触元件34，35与工件的接触; 和（c）将电流通过所述至少一个电接触元件34，35上的工件，为了模具DASS沉积金属沉积物在工件上。在进一步的方法步骤（d）的方法步骤（b）之前，沉积金属沉积在所述至少一个电接触元件34，第35次

6. 发明公开

EP2803756A1 Method for depositing thick copper layers onto sintered materials 审中-公开
标题翻译： Verfahren zur Ablagerung dicker Kupferschichten auf gesinterten Materialien
公开(公告)号：EP2803756A1
公开(公告)日：2014-11-19
申请号：EP13075031.8
申请日：2013-05-13
申请人： Atotech Deutschland GmbH
发明人： Gloeden, Markus , Genth, Herko , Dambrowsky, Nina, Dr. , McNelly, Antony
IPC分类号： C25D5/10 , C25D5/54 , H05K3/24
CPC分类号： C25D3/38 , C25D5/10 , C25D5/18 , C25D5/38 , C25D5/44 , C25D5/54 , C25D21/12 , H05K1/0265 , H05K1/0306 , H05K3/241 , H05K3/246 , H05K2203/0307 , H05K2203/0723 , H05K2203/1492
摘要： The present invention relates to a method for electrodepositing a thick copper layer onto an electrically conductive, sintered layer. The thick copper layer has a high adhesion strength, is poor in defects and internal stress, and has high electrical and thermal conductivity. The thick copper layer on the sintered layer is suited for printed circuit boards for high power electronic applications.
摘要翻译：本发明涉及一种将厚铜层电沉积到导电烧结层上的方法。厚铜层具有高粘合强度，缺陷和内应力差，导电性高。烧结层上的厚铜层适用于大功率电子应用的印刷电路板。

7. 发明公开

EP2787796A1 CONDUCTIVE FILM FORMING METHOD, COPPER FINE PARTICLE-DISPERSED LIQUID, AND CIRCUIT BOARD 审中-公开
标题翻译：导电膜形成方法，铜精细颗粒分散液体和电路板
公开(公告)号：EP2787796A1
公开(公告)日：2014-10-08
申请号：EP12862999.5
申请日：2012-08-13
申请人： Ishihara Chemical Co., Ltd. , Applied Nanotech Holdings, Inc.
发明人： KAWATO, Yuichi , MITA, Tomohiro , MAEDA, Yusuke , KUDO, Tomio
IPC分类号： H05K3/12 , H05K3/18
CPC分类号： H05K1/092 , C09D11/52 , H05K1/0306 , H05K1/032 , H05K1/0346 , H05K1/0366 , H05K1/05 , H05K1/097 , H05K3/108 , H05K3/1283 , H05K3/185 , H05K3/241 , H05K3/246 , H05K3/381 , H05K2201/0129 , H05K2201/0145 , H05K2201/2072 , H05K2203/1105
摘要： An object is to provide a conductive film forming method which can form a conductive film having low electric resistance on a base material by utilizing photo sintering even when the base material has low heat resistance. A conductive film forming method is a method in which a conductive film 2 is formed on a base material 1, and the method includes the steps of forming a film 3b composed of copper particulates 4 on a base material, subjecting the film 3b to photo sintering, and applying plating to the photo-sintered film 3c. Whereby, it is possible to form a conductive film 2 on a base material 1 by lowering irradiation energy of light in photo sintering even when the base material 1 has low heat resistance. Since the conductive film 2 includes a plated layer 21, electric resistance decreases.
摘要翻译：目的在于提供一种导电膜形成方法，即使在基材的耐热性低的情况下，也能够利用光烧结在基材上形成电阻低的导电膜。导电膜形成方法是在基材1上形成导电膜2的方法，该方法包括以下步骤：在基材上形成由铜微粒4构成的膜3b，对膜3b进行光烧结并对光烧结膜3c进行电镀。由此，即使在基材1的耐热性低的情况下，通过降低光烧结时的光的照射能量，也能够在基材1上形成导电膜2。由于导电膜2包括镀层21，所以电阻降低。

8. 发明授权

EP1573094B1 DEVICE AND METHOD FOR ELECTROLYTICALLY TREATING AN AT LEAST SUPERFICIALLY ELECTRICALLY CONDUCTING WORK PIECE 有权
标题翻译：设备和Vera费处理表面至少导电部分
公开(公告)号：EP1573094B1
公开(公告)日：2013-02-13
申请号：EP03756458.0
申请日：2003-08-28
申请人： Atotech Deutschland GmbH
发明人： SCHNEIDER, Reinhard , KENNY, Stephan , KÜSSNER, Torsten , PLÖSE, Wolfgang , REENTS, Bert , STREUP, Heribert
IPC分类号： C25D17/06 , C25F7/00 , H05K3/24 , C25D17/28
CPC分类号： C25D17/28 , C25D17/06 , H05K3/241

9. 发明授权

EP1750491B9 System and method for manufacturing flexible copper clad laminate film 有权
标题翻译：系统和方法，用于生产挠性覆铜层压薄膜的
公开(公告)号：EP1750491B9
公开(公告)日：2012-03-21
申请号：EP05024159.5
申请日：2005-11-05
申请人： Korean Institute of Industrial Technology
发明人： Lee, Hong Kee , Son, Seong-Ho , Koo, Seok Bon
IPC分类号： H05K3/24 , H05K1/00 , H05K3/28 , C25D5/34 , C25D7/06
CPC分类号： H05K3/241 , B32B15/00 , C25D5/34 , C25D7/0614 , H05K1/0393 , H05K3/282 , H05K2203/0392 , H05K2203/1545

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