基本信息:
- 专利标题： HIGH FREQUENCY PACKAGE
- 申请号：EP14885156 申请日：2014-03-11
- 公开(公告)号：EP3118927A4 公开(公告)日：2017-11-15
- 发明人： YASOOKA KOSUKE
- 申请人： MITSUBISHI ELECTRIC CORP
- 专利权人： MITSUBISHI ELECTRIC CORP
- 当前专利权人： MITSUBISHI ELECTRIC CORP
- 优先权： JP2014056370 2014-03-11
- 主分类号： H01P3/08
- IPC分类号： H01P3/08 ; H01L23/00 ; H01L23/13 ; H01L23/498 ; H01L23/552 ; H01L23/66 ; H05K1/00
摘要：
A high-frequency package has: a resin substrate; a high-frequency device mounted on a side of a first surface of the resin substrate; a ground surface conductor of a ground potential formed on a second surface of the resin substrate on an opposite side to the first surface; a transmission line for a high-frequency signal formed in an inner layer of the resin substrate; and a ground via of a ground potential formed within the resin substrate. A through hole is formed in the ground surface conductor. The ground via is placed between the transmission line and the through hole.