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    • 4. 发明公开
    • SEMICONDUCTOR DEVICE AND METHOD OF PREVENTING LATCH-UP IN A CHARGE PUMP CIRCUIT
    • VERFAHREN ZUR VERHINDERUNG VON LATCH-UP IN EINER LADEPUMPENSUNGHALBLEITERBAUEMENT
    • EP2909860A4
    • 2015-10-14
    • EP13848087
    • 2013-10-02
    • SEMTECH CORP
    • AEBISCHER DANIELCHEVROULET MICHEL
    • H01L27/092H01L21/8238H02M3/07
    • H01L27/0629H01L21/823892H01L27/0921H02M3/073H02M2003/078
    • A charge pump circuit includes a substrate and first well region formed in the substrate. A first transistor includes first and second conduction regions disposed in the first well region. A second well region is formed in the substrate. A third well region is formed within the second well region. A second transistor includes first and second conduction regions disposed in the third well region. The second well region and third well region are coupled to a common terminal. The common terminal receives a local potential and the first well region and second well region are commonly maintained at the local potential. The first transistor and second transistor operate within the charge pump cell. A plurality of charge pump cells can be cascaded together with an output of a first charge pump cell coupled to an input of a second charge pump cell.
    • 电荷泵电路包括基板和形成在基板中的第一阱区域。 第一晶体管包括设置在第一阱区中的第一和第二导电区。 在衬底中形成第二阱区。 在第二阱区域内形成第三阱区域。 第二晶体管包括设置在第三阱区中的第一和第二导电区域。 第二阱区域和第三阱区域耦合到公共端子。 公共端子接收局部电位,并且第一阱区域和第二阱区域通常保持在局部电位。 第一晶体管和第二晶体管在电荷泵单元内工作。 多个电荷泵单元可以与耦合到第二电荷泵单元的输入的第一电荷泵单元的输出级联在一起。
    • 5. 发明公开
    • HIGH-VOLTAGE INTEGRATED CIRCUIT DEVICE
    • 带集成电路的高压设备
    • EP2581938A4
    • 2014-12-31
    • EP12757637
    • 2012-03-13
    • FUJI ELECTRIC CO LTD
    • YAMAJI MASAHARU
    • H01L21/761G05F3/02H01L27/092
    • G05F3/02H01L21/761H01L27/0921H01L27/0922
    • A high-voltage integrated circuit device (100) comprises, in a surface layer of a p semiconductor substrate (1), an n region (3) which is a high-side floating-potential region, an n - region (4) which becomes a high-voltage junction terminating region (93), and an n - region (2) which is an L-VDD potential region. A low-side circuit portion (91) is disposed in an n - region (2). Below a pickup electrode (59) disposed in the high-voltage junction terminating region (93), a universal contact region (58) in Ohmic contact with the pickup electrode is disposed. The universal contact region (58) has a p + region (56) and an n + region (57) that are disposed in alternating contact along a surface of the p semiconductor substrate (1). By disposing the universal contact region (58) in this way, the quantity of carriers flowing into the low-side circuit portion (91) can be reduced when a negative surge voltage is input. Consequently, erroneous operation and destruction due to latchup of a logic portion of the low-side circuit portion (91) can be prevented.
    • 高电压集成电路器件(100)在p型半导体衬底(1)的表面层中包括作为高侧浮动电位区域的n区域(3),成为 高压结端接区域(93)和作为L-VDD电势区域的n区域(2)。 低侧电路部分(91)设置在n区(2)中。 在设置在高压结终止区域(93)中的拾取电极(59)的下方设置有与拾取电极欧姆接触的通用接触区域(58)。 通用接触区域(58)具有沿着p半导体衬底(1)的表面交替接触地设置的p +区域(56)和n +区域(57)。 通过以这种方式设置通用接触区域(58),当输入负浪涌电压时,流入低侧电路部分(91)的载流子的数量可以减少。 因此,可以防止由于低侧电路部分(91)的逻辑部分的闭锁而导致的错误操作和破坏。