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    • 5. 发明公开
    • SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
    • 半导体集成电路器件
    • EP3032540A1
    • 2016-06-15
    • EP13891121.9
    • 2013-08-06
    • Renesas Electronics Corporation
    • NII, Koji
    • G11C11/413G11C11/41H01L21/8244H01L27/10H01L27/11
    • H01L27/1104G11C8/16G11C11/412G11C11/417H01L23/528H01L27/0207H01L27/1116H01L29/1095H01L29/41758H01L29/7851H01L2924/0002H01L2924/00
    • In a chip that processes image information or the like, a multi-port SRAM is mixed together with a logic circuit such as a digital signal processing circuit. In that case, for example, in case that the 3 port is used, the 1 port may serve as a differential write and readout port, and the 2 port may serve as a single ended readout dedicated port. However, in this configuration, it is obvious that there is a problem, in that while the occupied area of an embedded SRAM is reduced, the number of write and readout ports is limited to only one, and readout characteristics as fast as differential readout cannot be expected in single ended readout. The outline of the present application is that three differential write and readout ports are included in a memory cell structure of the embedded SRAM, an N-well region, for example, is arranged at the center of a cell, and a P-well region is arranged on both sides thereof.
    • 在处理图像信息等的芯片中,多端口SRAM与诸如数字信号处理电路的逻辑电路混合在一起。 在这种情况下,例如,在使用3端口的情况下,1端口可以用作差分写入和读出端口,并且2端口可以用作单端读出专用端口。 然而,在这种配置中,显然存在一个问题,即在嵌入式SRAM的占用面积减小的同时,写入和读出端口的数量仅限于一个,并且与差分读出一样快的读出特性不能 预计在单端读数。 本申请的概要在于,在嵌入式SRAM的存储单元结构中包含三个差分写入和读出端口,例如N阱区域被布置在单元的中心,并且P阱区域 布置在其两侧。